Contributions WelcomeReaders are encouraged to submit news items con-cerning the Society and its members. Please sendyour ideas/articles directly to either the Editor-in-Chief or appropriate Editor. All contact informationis listed on the back cover page. Whenever possi-ble, e-mail is the preferred form of submission.

Newsletter Deadlines

I s s u e D u e D a t eJ a n u a r y October 1stA p r i l January 1stJ u l y April 1stO c t o b e r July 1st

April 1999Vol. 6, No. 2 ISSN:1074 1879

Editor-in-Chief: Krishna Shenai

IEEE Electro nDevices Society

Ne w s l e t t e r1999 Device Research Conference (DRC)

Your Comments SolicitedYour comments are most welcome. Please write directly to the Editor-in-Chief of the Newsletter at the address given on the back cover page.

(continued on page 3)

The 57th annual Device Research Conference (DRC) will return to the Uni-versity of California at Santa Barbara this summer during June 28-30, 1999.The conference brings together scientists, engineers, and students to discussnew and exciting breakthroughs and advances in the field of device research.The DRC is sponsored by the IEEE Electron Devices Society and is coordinatedwith the Electronic Materials Conference (EMC) of the TMS.

The DRC is recognized for its casual approach while providing the confer-ence attendees with the very best in the latest device research and covering avery wide range of topics. This year’s Southern Californian setting is the perfectenvironment to get to know people, hear stimulating talks, and have late nightdiscussions. The University of California campus location provides beautifulscenery, close proximity to the beaches and inexpensive lodging. The campusis surrounded by a wide range of summer attractions in downtown Santa Bar-bara, at the downtown waterfront and in the surrounding wine country.

DRC’99 will feature sessions in all major device research areas. Theseinclude: silicon CMOS, scaled and ultra small devices, SOI, thin insulators,quantum and single electron devices, compound semiconductor FETs andHBTs, power, microwave and ultra fast devices, MEMS and optoelectronicdevices. The complete advance program will be available on the DRC HomePage starting May 1st, 1999. Last year’s program, including the late newspapers, can also be found on the web site.

Table of ContentsUpcoming Technical Meetings . . . . . . . . . . . . . . . . . . . . . .1

•1999 DRC •1999 UGIM•1999 CCD & AIS •1999 IITC

A Message from the Editor-in-Chief. . . . . . . . . . . . . . . . .2

Society News. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6• Student/Young Engineer Article• EDS “Chapter of the Year” Award• December 1998 AdCom Meeting Summary• Summary of the 1998 IEEE Regions 1-6,

7&9 Chapters Meeting• 1998 EDS Meetings Best Practices

W o r k s h o p• EDS Chapter Partners Program Activity -

Meeting with ED Beijing Chapter• Baltimore Chapter Establishes Partnership

with Local Museum• 1998 J.J. Ebers Award• 1998 Distinguished Service Award

Regional & Chapter News . . . . . . . . . . . . . . . . . . . . . . . . . .1 3EDS Meetings Calendar. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 8EDS Members Elected to the IEEE Grade of

F e l l o w. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 0

EDS invites the submission of nominations for the 1999 J.J.Ebers Award. This award is presented annually by EDS to hon-or an individual(s) who has made either a single or a series ofcontributions of recognized scientific, economic, or social sig-nificance to the broad field of electron devices. The recipient(s)is awarded a certificate and a check for $5,000, presented atthe International Electron Devices Meeting (IEDM).

Nomination forms can be requested from the EDS Execu-tive Office. The deadline for the submission of nominations forthe 1999 award is 9 July 1999. Completed nomination formsshould be sent to the Executive Office at the address given onthis page.

22

P r e s i d e n tBruce F. GriffingGE Corp. Research & DevelopmentTel: (518) 387-6207E-Mail: b.griffing@ieee.org

Vice PresidentCary Y. YangSanta Clara UniversityTel: (408) 554-6814E-Mail: c.yang@ieee.org

T r e a s u r e rLucian A. KasprzakDirect Radiography Corp.Tel: (302) 451-0230E-Mail: l.kasprzak@ieee.org

S e c r e t a r yJohn K. LowellSystems Resources Consulting, Inc.Tel: (972) 728-1234 x512E-mail: j.lowell@ieee.org

Sr. Past PresidentW. Dexter Johnston, Jr.Lucent Technologies Inc.Tel: (908) 582-7247E-Mail: w.johnston@ieee.org

Jr. Past PresidentLouis C. ParrilloMotorola, Inc.Tel: (512) 933-6802E-mail: l.parrillo@ieee.org

EDS Executive DirectorWilliam F. Van Der VortIEEE Operations Center445 Hoes LaneP.O. Box 1331Piscataway, NJ 08855-1331Tel: (732) 562-3926Fax: (732) 235-1626E-Mail: w.vandervort@ieee.org

Awards ChairH. Craig Casey, Jr.Duke UniversityTel: (919) 660-5250E-Mail: c.casey@ieee.org

Educational Activities ChairJerry M. WoodallYale UniversityTel: (203) 432-4298E-Mail: j.woodall@ieee.org

Meetings ChairJames T. ClemensLucent Technologies, Inc.Tel: (908) 582-2800E-Mail: j.clemens@ieee.org

Membership ChairT. Paul ChowRensselaer Polytechnic InstituteTel: (518) 276-2910E-Mail: p.chow@ieee.org

Publications ChairSteven J. HilleniusLucent Technologies, Inc.Tel: (908) 582-6539E-Mail: s.hillenius@ieee.org

Regions/Chapters ChairCary Y. YangSanta Clara UniversityTel: (408) 554-6814E-Mail: c.yang@ieee.org

IEEE Newsletter CoordinatorRobin EdwardsIEEE Operations Center445 Hoes LaneP.O. Box 1331Piscataway, NJ 08855-1331Tel: (732) 562-3945Fax: (732) 981-1855E-Mail: r.edwards@ieee.org

E l e c t ron Devices Society

IEEE Electron Devices Society Newsletter is published quarterly by the Electron Devices Society of the Institute of Electrical and Electronics Engineers, Inc.Headquarters: 3 Park Avenue, 17th Floor, New York, NY 10016-5997. Printed in the U.S.A. One dollar ($1.00) per member per year is included in the Society feefor each member of the Electron Devices Society. Periodicals postage paid at New York, NY and at additional mailing offices. Postmaster: Send address changesto IEEE Electron Devices Society Newsletter, IEEE, 445 Hoes Lane, P.O. Box 1331, Piscataway, NJ 08855-1331.Copyright © 1999 by IEEE: Information contained in this Newsletter may be copied without permission provided that copies are not used or distributed for directcommercial advantage, and the title of the publication and its date appear on each photocopy.

EDS ADCOM ELECTED MEMBERS-AT-LARGE

Term Expires:

1 9 9 9 2 0 0 0 * 2 0 0 1

R.G. Adde (1) I. Adesida (1) A. S. Brown (2)J.T. Clemens (1) H. S. Bennett (2) T. P. Chow (2)B.F. Griffing (2) H. Iwai (2) K. F. Galloway(1)R.P. Jindal (2) A. A. Santos (1) S. J. Hillenius (1)J.B. Kuo (2) S. C. Sun (1) C. Jagadish (1)J.K. Lowell (2) K. Tada (2) M. A. Shibib (2)I. Mojzes (2) P. K. L. Yu (1) R. Singh (1)K. Shenai (1)

Number in parenthesis represents term.* Members elected 12/98

As we areapproaching the newmillennium, we areable to witness pro-found changes in thesociety. Everything isbecoming “wireless”and “battery-operat-ed.” Our Society hasmuch to do with this

transformation and I can unequivocally claim that every EDS mem-ber is proud to be part of this global change.

After three years of dedicated service to the EDS Newsletter, Dr.Robert G. Adde has decided to step down as the Editor for Region8: Western Europe. I would like to take this opportunity to thankBob for his contributions to the EDS community. Replacing him is Dr.Christian Zardini of the University of Bordeaux, Bordeaux, France.Christian has a long list of accomplishments to his credit and will bean asset to the EDS community. It is with great pleasure that I wel-come Christian to the editorial staff and wish him all the best.

Christian Zardini was born in Issigeac(France) in 1942. He received the Diplìmed’Etudes Approfondies de Microondes from theUniversity of Bordeaux in 1965, the PhD degreefrom the University of Montpellier in 1982 andthe Habilitation Ö Diriger les Recherches fromthe University of Bordeaux in 1991.

From 1966 to 1991 he was an Assistant Pro-fessor at the University of Bordeaux, at the University of Tunis andSfax (Tunisia), and at the Ecole Nationale Supérieure d’Electron-ique et de Radioélectricité de Bordeaux (E.N.S.E.R.B). Presently,he is a Professor of Electronic Engineering at E.N.S.E.R.B. His cur-rent research interests include several aspects of the integration ofpower circuits. He manages a research team working on theseproblems at the IXL Laboratory. He has been the author or co-author of more than 90 technical publications. During his tenureat ENSERB he has supervised to completion 7 PhD students and ispresently supervising two others.

Christian Zardini

Krishna Shenai

A Message from the Editor-in-Chief

1999 EDS J.J. EBERS AWARDCALL FOR NOMINATIONS

3

The 1999 Workshop on Charge-Cou-pled Devices and Advanced Image Sen-sors, sponsored by the IEEE ElectronDevices Society, wil l be held at theKaruizawa Prince Hotel West in NaganoPrefecture, Japan, June 10-12, 1999.

The purpose of this Workshop is toprovide an opportunity for exchangingnew results in the area of Solid-StateImage Sensors in an informal atmos-phere. The Technical Program will consistof invited and contributed papers, postersessions, and a discussion session. As inthe previous workshops, emphasis will beon high quality technical content. Ampletime will be left for paper discussion. Thedeadline for receipt of abstracts was Janu-ary 18, 1999.

Papers on the following topics weres o l i c i t e d :

• CCD Device Physics: New devices ands tructures; Advanced materials;Improved models; Scaling

• Image Sensor Design and Perfor-mance: CCD image sensors; CMOSimage sensors; Active pixel sensors;New architec tures ; Smal l pixel;Large format; Low voltage and lowpower; High picture quality; Lownoise; High sensitivity; High colorreproducibility; New modes of oper-ation; CAD for design and simula-tion of image sensors

• Advanced Image Sensors: Applicationspecific image sensors; High framerate sensors; Low light level imaging;Intelligent sensors; Machine vision;New functions; Single chip camera;Sensors wi th enhanced spectra lresponse (UV, IR); High energy photonand particle sensors (X-ray, Radiation)

• Fabrication: New fabrication tech-niques; Backside thinning; Color filters;Microlens; Packaging; Testing; Reliabil-ity; Yield. Cost; Defects; Leakage cur-rent; Radiation damages; High qualitypapers addressing work in progressare also welcome.

Karuizawa is Japan’s popular summerresort in Nagano Prefecture, 130 km north-

west of Tokyo. It is approximately a onehour ride by the Bullet Train from Tokyo.The Karuizawa Prince Hotel adjoins the JRKaruizawa Station, and is a short train ridefrom this station. More information on theKaruizawa Prince Hotel can be found at:h t t p : / / w w w . p r i n c e h o t e l s . c o . j p / k a r u i z a-wa/index.html, which is written in bothEnglish and Japanese.

The Workshop will start on Thursday,June 10, 1999 at 9:00 a.m., and will endon Saturday, June 12 at 12:00 noon. TheWorkshop fee includes Thursday and Fri-day lunches, the Workshop Reception, andthe Workshop Dinner.

1999 Workshop on Charge-Coupled Devices and AdvancedImage Sensors (CCD & AIS)

Upcoming Technical Meetings

Karuizawa Prince Hotel cottages and active volcano, Mt. Asama.

(continued on page 4)

In addition to the Plenary talks, thisyear’s conference features a NovelDevices and Technology Session in whichinvited speakers will present an overviewin areas such as Molecular Electronics,MEMS/Bio-MEMS and Carbon Nan-otubes. Invited speakers will also kick off aselected number of regular sessions includ-ing the Silicon technology sessions, the III-V HEMT session and the SiC/GaN powerdevice session.

The DRC will feature two eveningevents, the newly featured poster sessionfollowed by the wine and cheese recep-tion, and the rump sessions after the con-

ference dinner. A limited number ofposters will be presented as a precursorto the wine-and-cheese reception. Therump sessions, centered on this year’sinteresting topics, will strive to inform,and provoke listeners. Beverages andsnacks will be provided to encourage thetechnical discussion among conferenceattendees.

The submission date for regularpapers has already passed, but a verylimited number of late-news papers willbe accepted for presentation. Late-newspapers must be submitted by June 21st,1999. If one wishes to present unpub-lished results at the conference, pleasesubmit one original paper and 25 copiesto Mark Rodder, 1999 DRC Technical

Program Chairman, Texas Instruments,MS 461, 13536 N. Central Expressway,Dallas, TX, 75243. For abstract guide-l ines and/or electronic submissions,please consult the DRC Home Page listedbelow.

For further information, please consult theDRC Home Page on the World Wide Webat http://ece-www.colorado.edu/~drc/ orcontact the Conference General Chair, BartVan Zeghbroeck, University of Colorado,Boulder, CO, USA; TEL: (303) 492-2809;FAX: (303) 492-2758.

Bart Van ZeghbroeckUniversity of Colorado

Boulder, CO

DRC (continued from page 1)

4

The pre-workshop tour is being plannedon June 9, 1999 at NHK (Japan Broad-casting Corporation) Science & TechnicalResearch Laboratories in the Tokyo area.When the details are determined, anannouncement will be sent to all individu-als who are registered for the Workshop.

Anyone who wishes to attend the Work-shop should pre-register due to the fact thatthe capacity of the Workshop is limited.The fee for the Workshop is:

Up-to-date information on the Workshopis available via the Workshop Web site ath t t p : / / w w w . l a b s . n e c . c o . j p / w s c c d a i / i n d e x .htm. Workshop Chairman: Nobukazu

Teranishi, Silicon Systems Research Labora-tories, NEC Corporation, M.S. 24-23120,1120 Shimokuzawa, Sagamihara, Kana-gawa 229-1198 Japan; TEL: +81-42-771-0923 FAX: +81-42-771-0878; E-Mail:ccdws@mel.cl.nec.co.jp. Technical Pro-gram Chairman: Junichi Nakamura,Advanced Technology Research Center,Olympus Optical Co., Ltd., 2-3 KuboyamaHachioji, Tokyo 192-8512 Japan; TEL:+81-426-91-8076; FAX: +81-426-91-5709; E-Mail: j_nakamura@ot.olympus.c o . j p .

Other organizing committee membersinclude: Eric R. Fossum, Photobit Corp.,Pasadena, CA, USA; Savvas Chamber-lain, DALSA Inc., Waterloo, ONT, Cana-da; Albert Theuwissen, Philips ImagingTechnology, Eindhoven, The Netherlands.

Nobukazu TeranishiSystems Research Laboratories

NEC CorporationSagamihara, Kanagawa Japan

CCD & AIS (continued from page 3)

1999 University/Government/IndustryMicroelectronics Symposium (UGIM)

The 1999 University/Government/Industry Microelectronics Symposium(UGIM) will be held in Minneapolis, MNJune 20-23, 1999. UGIM’99 will be thethirteenth in this series of biennial sym-posia that bring together educators andresearchers to discuss educational andresearch activities related to microelectron-ics programs and other microfabricationtechnologies. Past symposia have beenattended by representatives of many uni-versities that have significant programs in

microelectronics. Government agen-cies such as NSF, NIH, NIST,Sematech, SRC, DARPA and ONRparticipate regularly.University/industrial interactions,such as collaborative research activi-ties and technology transfer, havealso been strongly represented. TheUGIM Symposia are sponsored bythe Electron Devices Society of theI E E E .

UGIM Symposia are normallyhosted by universities with strongmicroelectronics research and edu-cation programs. Past symposiahave been hosted by the RochesterInstitute of Technology, University ofTexas at Austin, North CarolinaState University, and the Florida Insti-

tute of Technology. By moving the sym-posia to a different host school each time,attendees benefit from seeing how eachhost school’s education and research pro-grams are structured, as well as the make-up of the research laboratories andcleanroom facilities.

This year’s symposium is being hostedby the University of Minnesota Microtech-nology Laboratory, and will be held at theRadisson Metrodome hotel located on theUM campus. An outstanding program is

planned with about 60 presentations byindustry, government and university repre-sentatives. Traditionally, the UGIM Sym-posia embrace a broad range of topics.Papers reporting the development andprogress of educational and research pro-grams in microelectronics at various edu-cational institutions typically represent thelargest session. TCAD modeling and simu-lation of devices and circuits are usuallystrongly represented, as are papers con-cerning devices and systems. Materialsand processing papers detail results rang-ing from standard silicon processing issuesto other topics such as III-V devices andprocess equipment development. Process-ing results typically involve equipment nor-mally found at universit ies, which isbeneficial for other university attendeeswith similar interests to make use of theresults in their own research programs.Microelectromechanical systems (MEMS)focused papers have been increasing innumber, and a session devoted to allaspects of MEMS, including modeling,simulation, processing, packaging andtesting will be held. The UGIM Symposiaare traditionally a good place to report oninteractions between university microelec-tronics research programs and industry/government organizations. Typical interac-tions include collaborative research pro-jects, focused educational classes andsuccessful technology transfer of informa-tion from university research laboratoriesto industrial implementation.

As the amount of funding available fortraditional microelectronics researchdeclines, university research programs arestretching out to research areas outside thetraditional microe lectronics realm.UGIM’99 will include a special sessiondevoted to such initiatives. The sessionfocuses on the results of work applying typi-cal microelectronics processing techniquesto non-traditional microelectronics research,involving such areas as biology, medicine,biochemistry, flat panel display technologyand information storage technology.

While the technical sessions begin onMonday, June 21, on Sunday afternoon,the University of Minnesota Microtechnolo-gy Laboratory will host an open house,including tours of the cleanroom processingfacilities. Staff members will be on hand todiscuss operational details, answer ques-tions, and provide demonstrations. Aninformal discussion session is also plannedfor people responsible for managing micro-electronics laboratory facilities. Topics ofdiscussion will include common issues suchas: funding, equipment acquisition and

IEEE membs Adv. reg. before 4/30/99 Yen 46,000Reg. after 4/30/99 Yen 50,000

Non-membs Adv. reg. before 4/30/99 Yen 50,000Reg. after 4/30/99 Yen 55,000

Students Adv. reg. before 4/30/99 Yen 40,000Reg. after 4/30/99 Yen 44,000

The second annual International Inter-connect Technology Conference (IITC), anexciting new conference dedicated toadvanced interconnect technology, will beheld May 24-26, 1999 at the San Francis-co Airport Hyatt Regency Hotel, conve-niently located 20 minutes from SiliconValley or downtown San Francisco.Repeating its highly successful debut lastyear, the IITC provides a forum for profes-sionals in the semiconductor industry andacademia to present and discuss new tech-nology supporting the fabrication of inte-grated circuit interconnects andpackaging. The conference provides sever-al venues for interconnect-related topics,including short course lectures, oral andposter presentations, supplier exhibits(materials, fabrication and process charac-terization equipment, simulation tools, etc.)and exhibitor seminars describing the lat-est equipment and materials technology.

The IITC was established to provide aninternational forum for addressing inter-connect issues from a system level view-point. The ever-increasing demand forhigher integrated circuit density and per-formance has led to a crisis in connectivi-ty, and has shifted the design, cost,performance and reliability focus to inter-connects. New materials, architecturesand process technologies have arisen tomeet this challenge, and no other semi-conductor technology sector has beengrowing and changing more rapidly. TheIITC will serve a unique role as the onlyIEEE conference dedicated to the inter-connect community.

The international stature of the IITC isreflected by the broadbase support of itsorganizing committee, which consists ofthree subcommittees from North America,the Far East, and Europe. Committeemembers are well-known researchers andR&D professionals from universit ies,national labs and industrial labs through-

out the world. The committee will rateall submitted papers based on rigor-ous standards; in addition to invitedtalks on emerging technologies,approximately 40 papers wil l beaccepted for oral presentation and asimilar number for poster presentationduring the three-day conference pro-gram.

A short course addressingadvanced interconnect process, designand reliability issues will once againbe offered on the day preceding theconference (May 23).

The cost and performance of ULSIcircuits strongly depend on the capa-bility and productivity of interconnectfabrication equipment. In recognitionof this critical role, equipment suppli-er exhibits and seminars are an inte-g ra l part o f the I ITC technicalprogram and will be held on the first andsecond days of the conference.

With a vision of being the premier con-ference for leading edge interconnect tech-nology as well as future interconnectneeds, the IITC includes papers from abroad range of interconnect technologytopics. Examples include:

(1) Silicide/Salicide: silicide materials,deposition and formation processes;novel gate and source/drain structures;contact silicidation, etc.(2) Dielectrics: dielectric materials (low-k, high-k, liners, ARCs, etc.) and deposi-tion processes (vapor, CVD, spin-on,etc.); dry etch and dry cleaning tech-n i q u e s(3) Planarization: dielectric/metal CMPprocesses, equipment and metrologyissues; alternative planarization tech-n i q u e s(4) Metallization: metal depositionprocesses/equipment (PVD, CVD, elec-tro-plating) and materials characteriza-tion; metal etch/cleaning processes

(5) Process Integration: multilevel inter-connect processes; clustered processes;novel interconnect s tructures;contact/via integration; metal barrierand materials interface issues(6) Process Control/Modeling: CMP,metal/dielectric deposition and etch,PVD, CVD, electroplating(7) Reliability: metal electromigrationand stress voiding; dielectric integrityand mechanical stability; thermal effects;passivation issues; interconnect reliabili-ty prediction and modeling; plasmad a m a g e(8) Interconnect Systems: interconnectperformance modeling and high fre-quency characterization; interconnectsystem integration and advanced pack-aging concepts (flip-chip, chip-on-chip,MCM); novel architectures; advancedinterconnect concepts (RF, optical, super-c o n d u c t o r s )Given the rapid acceleration of inte-

5

(continued on page 6)

1999 International Interconnect Technology Conference (IITC)

maintenance, staffing, facilities issues, pro-cessing issues, interactions with industry,materials compatibility problems, paperlessfab facilities, intellectual property issues,maskmaking, and collaboration with otheruniversities. Attendees will have an oppor-tunity to give a short presentation describ-ing their facilities, and to share theirexperiences and knowledge with others.

The Twin Cities of Minneapolis andSaint Paul abound in opportunities for recre-ational and social activities. There are many

beautiful parks and lakes where one canswim, jog, fish or rent a canoe. Theaters, artmuseums, and restaurants of all kinds canbe found just a short drive or bus ride fromthe symposium hotel. The Twin Cities arehome to two zoos and the Minnesota Sci-ence Museum. Situated in suburban Min-neapolis is the largest fully enclosed retailand family entertainment complex, The Unit-ed States Mall of America. Here, one canshop at one of more than 400 stores andrestaurants or enjoy one of the theme park

rides, including an indoor roller coaster.For more information on the sympo-

sium, please visit the symposium website athttp://www.mtl.umn.edu/ugim99/, orcontact Greg Cibuzar, University of Min-nesota Microtechnology Laboratory, 200Union St SE, Minneapolis, MN 55455,TEL: (612) 624-8005 or E-Mail:c i b u z a r @ e c e . u m n . e d u .

Gregory T. CibuzarUniversity of Minnesota

Minneapolis, MN

As a first year graduate student studyingMicroElectro Mechanical Systems (MEMS)in silicon carbide at Cornell University, Ihave become increasingly aware of theimportance of establishing a lifelong com-mitment to research as early as possibleduring one’s education. Summer intern-ships or semester-long senior projects maybe formative experiences, but becominginvolved in ongoing, long-term researchendeavors provide the experience andskills that will be most helpful in fulfillingone’s career and professional goals.

As a high school student, I had the won-derful opportunity to work on a long-termresearch project investigating the surfaceelectronic structure of silicon under the direc-tion of a professor, who would laterbecome my undergraduate advisor. This

research extended throughout my under-graduate years. During those five years, Idesigned the experiments, purchased andbuilt the experimental apparatus, and ana-lyzed the data. Finally, I co-authored apaper that was eventually published andpresented at a professional society meeting.

Reflecting on these experiences, I findthat committing to a long-term research pro-ject was much more valuable than the typi-cal undergraduate research experience.Because it was a long-term project, timewas available to carefully design and per-form preliminary experiments so that thefinal work would be rigorously scientificallysound. Throughout the process, I learnedhow to design and build equipment andexperiments compatible with ultra-high-vacu-um technology. Furthermore, I discoveredhow to operate and troubleshoot that equip-ment in the sometimes tricky and finickyultra-high-vacuum environment. Much effortwas given to statistical data analysis includ-ing the construction of data processing algo-rithms, so that the results could be correctlyinterpreted. The project culminated in writ-ing a professional paper that has sincebeen published in Surface Science. In addi-tion to this, I also prepared a presentationthat was viewed at an American PhysicalSociety meeting. Overall, each individualpartly contributed to an extremely valuablewhole research experience that was just asimportant, if not more, than traditionalundergraduate classroom work.

Due in part to my solid foundation andcommitment to research as an undergradu-ate, I have been successful as a graduate

student in quickly establishing myself in aresearch group at Cornell University study-ing MEMS in the Electrical EngineeringDepartment. This past summer, I beganworking in the Cornell NanofabricationFacility becoming immersed in all aspects ofsemiconductor device fabrication in silicon.I am now beginning to transfer that knowl-edge into the processing of silicon carbide.Instead of spending my first couple of yearsas a graduate student taking classes withouta clear direction, I am presently heavilyinvolved in another long-term research pro-gram. This project has given me the oppor-tunity to interact with many of the professorsand research staff in various departments,and develop professional relationships withvarious industrial firms. Due to my earlyinvolvement with a research group, Ialready have a clear direction of how I wishto proceed with my thesis research andwhat I need to do to accomplish it.

In addition to research, another impor-tant aspect of attaining my professionalgoals is attending lectures sponsored bythe department and IEEE. It is very impor-tant to see what other people are doingand how the technological advances inelectrical engineering are making head-way into the scientific community and theworld. Not only does IEEE bring top profes-sionals to speak, but it also promotes excel-lence in research, and provides a forum forthe exchange of information and ideas.

Andrew AtwellCornell University,

Ithaca, NY

Society News

6

Student/Young Engineer Article

Andrew Atwell

At its December 1997 meeting, theEDS AdCom approved a “Chapter ofthe Year” Award. It is given each yearbased on the quality and quantity of theactivities and programs implemented bythe nominated chapters during the priorJuly 1-June 30 period. Nominations forthe award can only be made by EDSChapter Partners.

At the IEDM held in San Francisco inDecember 1998, the first Chapter of theYear Award was given to two co-recipi-

ents, the ED/MTT India Chapter and theED/CPMT/RL Singapore Chapter. Theyeach received a certificate and check for$500. These two winners were amongfive chapters nominated to compete forthe award. The India and Singaporechapters were nominated by their Part-ners, Renuka Jindal and Hiroshi Iwai,r e s p e c t i v e l y .

Cary Y. YangSanta Clara University

Santa Clara, CA

EDS “Chapter of the Year” Award

grated circuit technology, the last topicprovides an important forum for discussionof the interconnect crisis and potential par-adigm shifts.

Professionals involved in interconnect-related activities are strongly encouragedto participate in this exciting new confer-ence. Detailed information can beobtained from the IITC website: http://www.ieee.org/conference/iitc, or by con-tacting Wendy Walker, IITC Administra-tor, Widerkehr & Associates , TEL:301-527-0900; FAX: 301-527-0994; E-Mail: iitc@his.com. For information on sup-plier exhibits and seminars please contactDr. Chris Case at Lucent Technologies,TEL: 908-582-2941; FAX: 908-582-2300;E-Mail: christopher.j.case@lucent.com.

Robert H. HavemannTexas Instruments, Inc.

Dallas, TX

IITC (continued from page 5)

7

December 1998 AdCom Meeting Summary

The December meeting of the Adminis-trative Committee (AdCom) of the IEEEElectron Devices Society (EDS) was con-vened on December 6, 1998 at the SanFrancisco Hilton & Towers Hotel in con-junction with the International ElectronDevices Meeting.

President Bruce Griffing opened the meet-ing with comments about current issuesbefore the IEEE Technical Activities Board(TAB) that concern the EDS. The first item is aproposed, new model for financing IEEEactivities. If accepted, this model proposes totake additional money from the technical soci-eties like EDS. Needless to say, the EDS offi-cers oppose such a move and will expressthis position to TAB. The next issue is a pro-posal to project a more prominent publicimage for the IEEE as a whole. While this iscertainly welcomed, the plan suggests thatthe individuality of each technical society(including their special logos) may be sup-pressed or disappear altogether. For EDS, theso called “right-hand rule or spinning elec-tron” logo presently in use may be at risk.The last proposal which EDS supports is onethat tries to minimize the management of IEEEstaff by volunteer workers for any society.

In other TAB news, former EDS President,Mike Adler, was recently elected as VP ofTAB, for which the society offers its sincerestcongratulations. Mike commented that hewill seek to duplicate many successful EDSprojects such as globalization and increasedchapter support amongst other societiesacross the IEEE.

Bruce concluded his opening remarksby presenting recognition certificates to out-going AdCom members Cary Yang, JerryWoodall, and Shojiro Asai, and outgoingNewsletter editors Savvas Chamberlain,Chennupati Jagadish, and Imre Mojzes.Furthermore, all the EDS officers andAdCom members recognized Bill Van DerVort, EDS Executive Director, who wasawarded the IEEE Joyce E. Farrell award asthe outstanding staff member of the year.Finally, it was also announced that Meet-

ings Chair, and former AdCom member,Jim Clemens, will complete the remainingyear of elected AdCom member JuliaBrown, who announced her resignation.

Treasurer, Lu Kasprzak, reported thatincome from member fees is higher thanexpected due to many members takingadvantage of the $25 permanent member-ship option. Financially, Electron Device Let -te rs (EDL) is doing well after beingunbundled, and Transactions on ElectronD e v i c e s (T-ED) is also quite successful, eventhough the page count was higher thanexpected. Transactions on SemiconductorM a n u f a c t u r i n g (T-SM) redistributed$23,000 from surplus and EDS is doingwell financially participating in the IEEEBook Broker. EDS reserves are expected tobe $5.2 million at the close of 1998. Otherthan the possible recommendation by IEEEto raise non-member prices, no increases infees for any EDS publications are expected.

Executive Director Bill Van Der Vortinformed the AdCom of the significantadhoc activities accomplished by the Exec-utive Office since the June AdCom meeting:support of EDS chapter growth worldwide;administration of the first “Chapter of theYear” award; renewal of the membershipsand subscriptions of the subsidized chap-ters in Eastern Europe; participation inregional meetings in the US, Europe, &Asia; maintaining the EDS Home Page onthe web; and implementation of processmanagement in their daily activity. In1999, John Brews will retire as Editor-in-Chief of EDL. By September 1999, it isexpected that the Executive Office will fullyfunction as the editorial support for the neweditor-in-chief and all EDL editors. It is antici-pated that T-ED will eventually follow thischange as well. The Executive Office willadd a new staff member that will be dedi-cated to supporting EDL.

Membership Chair, Paul Chow,announced that EDS membership is currentlyat an all-time high of 12,629 members (as ofDecember 98), up 10.1% over last year.Previously, the numbers in Regions 8 & 10(Europe & Asia) have been increasing, whilemembership in 1-6, 7&9 (US, Canada &Latin America) had been dropping. Thisyear, Paul reports that membership inRegions 1-6, 7&9 is up by 8.9%, which isan encouraging sign. Recruitment at majormeetings such as the IEDM and InternationalSolid-State Circuits Conference (ISSCC),have been successful. A direct-mail cam-

paign in 1998 also resulted in 126 newmembers and although the AdCom voted torepeat the campaign in 1999, IEEE Market-ing has decided not to allow societies to par-ticipate since it is felt that societies were notgetting high enough results. Paul and hiscommittee will be working on a mail surveyto 2,000 randomly selected members togather information on member satisfaction,benefits, participation, and other opinions onthe Society. They will be aiming new recruit-ment at students and practicing engineersmore so than in the past.

Cary Yang, Regions/Chapters Chair,informed the AdCom that the “region cham-pions” initiative appears to be having apositive impact. In Region 6 alone, champi-on, Paul Yu, indicated that two new chap-ters, ED Boise and ED Seattle have beenformed, and the potential remains to formseveral new chapters in and around the LosAngeles and San Francisco areas. In addi-tion, international progress in this area isexpanding with ED Cuba, ED CINVESTAVStudent Branch, and AP/ED/MTT Portugaljoining the roster. There is also a new chap-ter in Region 1, C/ED Maine. Subsidies fornew and existing chapters were higherthan expected, and are likely to grow in thefuture. Since 1995, requests have risenfrom 9 to 47 per year. The biggest news inthis arena is the new “Chapter of the Year”Award. Out of five nominees, it wasannounced that the initial kudo goes to theED/MTT India and CPMT/ED/RL Singa-pore chapters who will share the first-timeaward. Our warmest congratulations to allthe officers and members of these twochapters for a job well done. Cary dis-cussed the recent Region 8 Chapters Meet-ing in Amsterdam (October 1998), theupcoming Region 10 Chapters Meeting inKyoto (June 1999), and the Regions 1-7&9meetings being held during the IEDM.

Ilesanmi Adesida reported for Education-al Activities Chair, Jerry Woodall. Themajor function that the Educational ActivitiesCommittee oversees is the Distinguished Lec-turer Program, which this year sponsored45 lectures, of which 15 were funded. Sub-sidy for this program was underused and itis hoped that more chapters will take advan-tage of this program. It has been very suc-cessful in Regions 8 and 10, and it is hopedthat Regions 1-7 & 9 will begin to use it. Thecommittee will endeavor to find appropriatemetrics to evaluate the program, the visits,

(continued on page 8)

John K. Lowell

8

and the lecturers to increase its attractionand quality. Increased recognition for outgo-ing lecturers is also being evaluated. Inaddition, the video lending library is beingused more frequently by chapters. IEDM-related videos were requested twenty timesthis year, while non-IEDM videos weresought six times. Two new videos were pro-posed for funding. The new ones will beentitled “MEMS Performance and Reliabili-ty” and “Dielectrics: Breakdown andWearout”. Total EDS funding for these newproductions was approved at $24,000($12,000 per video) and EDS will get a22% royalty on future sales.

Publications Chair, Steve Hillenius hada positive report. Requests for EDS journalsare as strong as ever, even though theimpact factors for EDL and T-ED are downslightly from competition with other IEEEpublications. Steve reported that “Circuitsand Devices” Magazine will no longer besupported by all Division I societies; butrather ED, LEO and CAS will be the onlymagazine sponsors. Subsequent to themeeting, James Kuo and Harold Parkswere appointed to be the EDS representa-tives to the Advisory Board. Yuan Taur ofIBM will succeed John Brews as Editor-in-Chief of Electron Device Letters. The issuewas raised about the effect of specialissues of T-ED on the impact factors. It wasdecided that there was no evidence to sup-port special issues having a major influ-ence, and that they will continue to be apart of the T-ED focus.

Meetings Chair, Jim Clemens, indicat-ed that EDS had 34 sponsored meetings,and 72 technically co-sponsored meetingsin 1998. A total of 119 meetings wereheld in 1998, up two from 1997’s total.All projected symposia for 1999 wereapproved. It was pointed out that numer-ous international meetings from Regions 8and 10 have been added to the Book Bro-ker program recently. Jim also reportedthat he will be revamping the membershipof his committee.

The Short Courses Committee is a newadhoc committee headed by Jason Woo.Their aim is to acquire or sponsor tutorialclasses aimed at practicing engineers in theareas of device technology, design and pro-cessing. It is the goal of Jason’s group tohold at least two short courses in 1999. It islikely that these will be made available tospecial events held by chapters or other spe-cial educational meetings, and may takeadvantage of the educational videos beingprepared as previously discussed as well.

Fellows Chair, Lou Parrillo, was not pre-sent, so committee member Dexter Johnstonannounced that out of 45 nominations eval-uated by EDS, 19 members were elected tothe Fellow grade. Included in this newgroup of Fellows are current elected AdCommembers: Cary Yang, Michael Melloch, Ile-sanmi Adesida and Andrew Steckl. Six oth-er EDS members who were evaluated byother societies were also elected Fellow.

Other BusinessDexter discussed the aforementioned

plan to make all IEEE publications electron-ic and web-based. The proposed proce-dure will allow anyone to access a journalor conference paper with back/forwardcitation capability, and adaptation to multi-media. A common format will be imple-mented using media standards such asLatex. Capability for peer review and edit-ing will be included. The point of con-tention is how socie ties wil l becompensated for papers originating fromtheir publications. Nevertheless, in 1999,a plan will be developed with general-pur-pose software tools targeted toward fullimplementation by 2001. This systemknown as EPIC will eventually become thevehicle for publication and access to allIEEE publications, as hard copy/printedmedia versions are phased out.

Another aspect of this evolution involvesthe EDS effort in making EDL, T-ED & IEDMdigests available together on a CD ROM.This disc is currently available to members,but EDS had also been trying to see if moreitems, particularly more conference proceed-ings, could or should be added. Steve Hille-nius reported that the current CD ROM hasspace equivalent to 4,700 printed pagesremaining. However, the current page totalfrom all 1997 100% EDS sponsored confer-ences is presently 6,652. So no additions tothe current CD will be made. In addition, anarchival project in which all EDL & T-ED jour-nals from 1954-1998 would be put on CDROM was also considered. Due to the highcosts of scanning, this project would cost$225,000 and 19 CDs. While valuable tomany members, Steve’s recommendationwas to wait until a standard DVD format isavailable. DVD format would easily fit allthe journals and conferences onto a singledisc, and scanning technology should bereduced in cost.

EDS GoalsPresident Griffing’s final remarks on the

“state of EDS” began with his discussion ofthe upcoming 50th anniversary of EDS in2002. While there will be a few projectsassociated with this celebration, amongst the

first will be the production of a booklet docu-menting and commemorating the ideas, per-sonalities, and efforts that have formed EDS’history. The IEEE History Center will obtainoral histories and other important material,then produce the booklets. EDS will alsoform a committee (possibly enlisting pastEbers Award winners) to help guide ourplanning for this important event.

Committee ReportsThe Standards Committee reported that

Standard P1005 was approved in June,and P1181, which was approved previous-ly in 1991, needs to be re-evaluated. Thecommittee for this action is in need of a newchairman to drive this effort or it will be with-drawn as a standard in March 1999.

The IEEE USA Technology Policy Com-mittee is still supporting important policiesin the US House of Representatives onissues of interest to EDS, particularly in theareas of intellectual property and sci-ence/engineering funding.

The Power Devices Technical Committee,chaired by Ayman Shibib, identified the top-ics of super junction power FETs, SOI forPower FETs, SiC technology, HF powerdevices, display driver applications and highpower modules (such as getting high voltagefrom high current IGBTs) as their importanttopics for the coming year. There is also aplan to work on a technology roadmap forpower devices as well as a liaison with thePower Electronics Society to embrace tech-nology and conferences, which lie outsidethe IEEE and in Europe. They are also estab-lishing a web site and doing reviews of allrelated technical papers.

Herb Bennett’s Compound Semiconduc-tor TC has been busy with its own technolo-gy roadmap (for compound semiconductors)and providing inputs to the IEEE Millenniumproject, and the 1999 IEEE Spectrum tech-nology forecast. There will be a continuedemphasis on meeting coordination, publica-tion for new or emerging technologies, andidentifying overlaps between compound,microwave and optoelectronic technologies.

The Optoelectronic Devices TechnicalCommittee chai red by ChennupatiJagadish is also active with the Millenniumproject, and identifying hot areas of inter-est. There will also be a report on the pastfifty years in optoelectronics, to which theywill contribute heavily.

Lu Kasprzak’s Device Reliabi li tyPhysics Technical Committee has beenactive in formulating focus on publishedpapers in the area and finding moreprominent ways of bringing them to atten-tion. One of their goals is an all-electronic

A d C o m(continued from page 7)

(continued on page 11)

One of the major missions of the IEEEand the Electron Devices Society is to pro-mote the continuing education and careerdevelopment of its membership. One of thecritical activities conducted to fulfill this mis-

sion is to sponsor technical meetings,where advanced technical information ismade available to the attendees throughworkshops, short courses, submittedpapers and, finally, the printed proceed-ings. Presently, the Electron Devices Soci-ety fully financially sponsors 34 meetings,technically co-sponsors 76 meetings andprovides cooperation support to another12 meetings, on a worldwide basis. Thedissemination of many conference pro-ceedings through the IEEE Book Broker Pro-gram makes these conference proceedingsavailable to libraries and individuals.

Because the effort that goes into runninga technical conference consists of an

extremely complex mixture of technical,administrative and financial activities, theElectron Devices Society initiated severalyears ago the Best Practices Workshop.This workshop is held annually on the Sun-day evening before the start of the Interna-tional Elect ron Devices Meeting. Inaddition, this workshop is open to andattended by the committee members of EDSsponsored and co-sponsored conferences.

During the past several years we havestriven to increase the quality of this work-shop, through the content of material pre-sented, reference material for theattendees and the inclusion of speakers,

9

Summary of the 1998 IEEE Regions 1-6, 7 & 9 Chapters MeetingThe third annual Electron Devices

Society Regions 1-6, 7 & 9 ChaptersMeeting was held on December 6,1998 at the Hilton & Towers Hotel inSan Francisco. There were 21 chapters(including a student branch chapter)represented at the meeting, with a totalattendance of 35. The meeting startedat 5:30 PM and was co-chaired byPaul Yu and Hiroshi Iwai, both ofwhom are EDS Newsletter Editors andmembers of the EDS Regions/ChaptersCommittee. This year’s meeting fea-tured three honored guests: John B.Damonte, the IEEE Region 6 Director,Loretta Arellano, the Reliability SocietyPresident, and Ralph Russell, a member ofthe Board of Governor of the Components,Packaging and Manufacturing Society.

Paul Yu welcomed everyone and brieflysummarized the previous meetings and thegoals of the meeting. This was followed byan introduction by Hiroshi Iwai, who gave aconcise overview of the various resourcesand services available to the EDS chaptersand members, including the: Chapter Sub-sidy Program; Distinguished Lecturer Pro-gram; Videotape Lending Library; STARProgram; EDS Newsletter; and ChapterPartners Program.

To help initiate an exchange of informa-tion among the chapter members represent-ed at the meeting, Hiroshi Iwai and RenukaJindal each gave a Chapter Partner Report.Hiroshi Iwai reported about the activities ofthe EDS chapter in Beijing, emphasizing theurgent need to assist the EDS membershipgrowth in China. Membership numbers arelow in view of the potential large number ofelectrical engineers in that region. It is feltthat this is because the membership fee is

too high considering their income. Theavailability of EDS conference proceedingsto the chapter was briefly discussed. RenukaJindal reported about the growth in chapteractivities in India, and stressed that EDS sup-port was vital to the formation of new chap-ters in India.

Cary Yang, Chair of the Regions/Chap-ters Committee, announced that the 1998Chapter of the Year Award was shared bythe CPMT/ED/RL Singapore Chapter andthe ED/MTT India Chapter. He also brieflyexplained the nomination and selectionprocess for the award. One participant sug-gested that the nominated Distinguished Lec-turers visi ting the chapters should beconsulted in the selection process. Other dis-cussion followed regarding the relationshipbetween the chapters and the partners. Onemember suggested that having more thanone partner per chapter could better ensuretimely assistance when needed. A series ofchapter best practices reports then followed.Many chapters mentioned their participationin the Distinguished Lecturer and Video

Lending programs. Stephen Parke, aprofessor at Boise State University, pro-vided a very detailed account of howthe Boise Chapter was recently formedwith much enthusiastic support fromboth electronic industry and academiain the region. The Baltimore Chapterreported that its chapter activities wereclosely related to the long-term projectslaunched by the chapter. The AtlantaChapter reported the growing use ofthe Internet to communicate with anddisseminate information to chaptermembers. Our guest from the CPMTSociety, Ralph Russell, shared witheveryone the main activities of chapters

of CPMT Society, especially those in Region8 and Region 10. Like EDS, the CPMTSchapters in Region 6 had been very active,resulting in a number of joint ED/CPMTchapters. It was generally agreed that themany issues facing chapters in both societiesshould be better coordinated in the future.

The meeting was highlighted with a pre-sentation by the Region 6 Director, John B.Damonte, who emphasized to the chaptersthat they should look upon the local sectionas a resource for support and assistance. Healso suggested that the local section shouldbe an additional resource for membershipinformation and coordination. There wassome discussion about how chapter meetingreports could be collected and forwarded tothe ED Society. After a short open discussionof the various reports, the meeting wasadjourned at 9:30 p.m.

Hiroshi IwaiMicroelectronics Engineering Lab

Toshiba CorporationKawasaki, Japan

From left to right: Paul Yu & Hiroshi Iwai host the Regions 1-6, 7 &9 Chapters Meeting

1998 EDS Meetings Best Practices Workshop

James T. Clemens

(continued on page 10)

A meeting with the ED Beijing Chapterand EDS AdCom was arranged with thecooperation of chapter partner, Dr. S. Asaion October 20, 1998 at The TwelfthResearch Institute, Ministry of ElectronicsIndustry, Beijing, China from 2:00 p.m. to6:30 p.m. Those in attendance included:Prof. Fu Jiang Liao, Treasurer, Beijing EDSChapter; J. Jin-Jun Feng, Secretary, BeijingEDS Chapter; Zhiwei Zhou; Qi-Lue Chen;Ren Zhi-Xiang; Hiroshi Iwai., Elected Mem-ber, EDS AdCom.

The meeting agenda included a distin-guished lecture and a description of chap-ter activ it ies by Hiroshi Iwai. Anintroduction about the Twelfth ResearchInstitute, and a report of the ED BeijingChapter was also provided by Prof. Liao.

The Twelfth Research Institute is a gov-ernmental institute under the Ministry ofElectronics Industry, formerly called theBVERI (Beijing Vacuum Research Electron-ics Institute). The chair of the Beijing Chap-ter is staying in the United States and as aresult, Prof. Liao is serving as the substitutefor this chair. In 1998, the ED BeijingChapter organized the ICMMT’98 (Inter-national Conference on Microwave andMillimeter Wave Technology) in August,held a technical meeting for discussingadvances in microelectronics in January,and invited several foreign scientists togive seminars. Presently, the Beijing Chap-ter wants to establish new internationalvacuum electronics conferences in cooper-ation with partners from other countriesdue to shrinking activity in IEDM over thepast several years.

There are various problems in the chap-ter as described in the following. As of

now, the total number of members is 59.This is relatively small considering the num-ber of total Chinese engineers engaged inelectron devices. One reason for this canbe attributed to the fact that there are otherstrong societies in China in terms of ser-vice. Another reason for low membershipis that the society and publication fees ofthe IEEE are still too high for Chinese citi-zens considering their annual income. It isalso desirable for them to pay the fees inChinese currency because of the difficultyof paying in US dollars. A final problem isthat China is too large to hold meetingswhich include all its EDS member. Thus,the Beijing Chapter presently has 2liaisons, one in Xian, the other in Nanjing.It is planning to have more liaisons innortheast and south China.

The above results were reported anddiscussed at the EDS AdCom meeting inSan Francisco on 6 December 1998. The

EDS AdCom decided on the following: theissues regarding the society and publica-tion fees would be raised by Mike Adler atthe IEEE TAB meeting; the Beijing Chaptercould request EDS to subsidize a numberof individuals for IEEE and EDS member-ships; if the Beijing Chapter wanted toobtain a copy of the proceedings from aspecific EDS sponsored conference, itwould be provided by the Executive Officefree upon request; and the Beijing Chapterwould be advised of a contact person inthe USA who would be interested in estab-lishing a vacuum electronics conference.Dr. Asai was asked to contact the BeijingChapter to advise them of the AdComd e c i s i o n s .

Hiroshi IwaiToshiba Corporation

Saiwai-ku, Kawasaki, Japan

who are well experienced in running avariety of small, medium and large techni-cal workshops and conferences.

This year, working with some of theEDS Executive Office staff, Bill Van DerVort and Amanda Ferraioli , we puttogether a revised format, and a work-shop “How To” binder. The topics cov-ered areas of: Technica l ProgramPlanning; Site Selection, Hotel Strategy,Administrative Planning; Proceedings

Preparation; Budgeting Guidelines; andPublicity Arrangements.

The Workshop was attended byapproximately 45 people and ended witha lively discussion of the experiences ofconference chairs, including Steve Hille-nius for the International Electron DevicesMeeting, Jim Hayden for the Bipolar/BiC-MOS Circuits and Technology Meeting,and Dan Fleetwood for the SemiconductorInterface Specialists Conference.

My many thanks go to all the planners,participants and attendees who made thisyear’s revised workshop the resounding

success that it was. Finally, if you areworking on or considering organizing ameeting, you should contact the EDS office(see page 2 for contact information), ormyself at j.clemens@ieee.org. Working onconferences is a highly rewarding activity,which allows one to meet and interact withvery interesting people, both within yourfield of professional work, as well as theadministrative personnel. I love it and Iknow you will too!

James T. ClemensLucent Technologies, Inc.

Murray Hill, NJ

1 0

Wo r k s h o p(continued from page 9)

EDS Chapter Partners Program Activity -Meeting with ED Beijing Chapter

Beijing Chapter Treasurer, Prof. F. J. Liao - 2nd from right, Beijing Chapter Secretary, Mr. J. J. Feng - 4th from right, H. Iwai - 1st from the right

1 1

reliability publication embracing device,materials and process issues.

The VLSI Technology Technical Commit-tee chaired by Charlie Sodini has also beenactive. They plan a joint workshop with theSemiconductor Manufacturing TC on 300-mm issues at the International Symposiumon Semiconductor Manufacturing (ISSM) inOctober of 1999. There will also be a

workshop of RF Passive Components to beheld at the ISSCC early next year as well.Beginning in January, Philip Wong of IBMwill take over as chairman of this group.

Bruce Griffing reported that there is dis-cussion in TAB regarding the possible for-mation of a Sensors Council. TAB hasapproved this area as being appropriatefor a council, but it is not yet established orc o m m i s s i o n e d .

Finally the 1998 IEDM General Chair,Pierre Worlee, indicated that while atten-

dance at the short courses and the confer-ence may be down from expectations dueto the downturn in the industry, the meet-ing should be as successful as always.

The next meeting of AdCom will be inKyoto, Japan on Sunday, 13 June 1999,concurrent with the VLSI Technology Sym-posium at the Righa Royal.

John K. LowellSystems Resources Consulting, Inc.

Addison, TX

A d C o m(continued from page 8)

In February 1998, the steering commit-tee of the newly formed Electron DevicesSociety (EDS) Baltimore Chapter (SSCSadded as a co-sponsor in May 1998) metto organize its first open meeting. It wasdecided to hold the meeting in March atthe Historical Electronics Museum (HEM) inLinthicum, Maryland, because of its prox-imity to the major employers and universi-ties of the EDS members in the area.

At the first meeting, the Chapter mem-bers had the opportunity to tour the muse-um. There were very impressive exhibits inradio and radar, a small display thatchronicled the evolution of solid statedevices, and electronics exhibits that des-perately needed to be updated. The finalexhibit was a 100-mm wafer.

EDS had periodically given monetarydonations to the HEM, but did not previous-ly have an organization in the local areathat worked with the Museum to ensure thedevelopment of exhibits that fall within theEDS field of interest. The Baltimore Chaptertook this opportunity to partner with the His-torical Electronics Museum in Linthicum,Maryland and provide an updated electrondevices exhibit that would serve as an out-reach vehicle to students and the generalpublic in the Baltimore-Washington area.

HEM Background and EducationalI n i t i a t i v e s

The Historical Electronics Museum col-

lects, preserves, and exhibits artifactsthat are significant to the history of elec-tronics. I t consists of six galleries ofexhibits as well as archives and a lend-ing library. The museum sponsors a lec-ture series on relevant topics, such as the“Discovery of the Electron” in May-October, 1998. Admission and parkingare free. Attendance doubled over thepast two years, primarily due to the risein student and non-technical visitors.The museum’s web page is ht tp://w w w . e r o l s . c o m / r a d a r m u s / .

Volunteers at the HEM provide toursand demonstrations to over 1,000 studentsin the Baltimore-Washington area. Manytake slide shows and a box of demonstra-tions to the classrooms of students whocannot afford to travel to the museum.

On May 1, 1998, an educationalgallery was opened in order to providehands-on exhibits to teach the funda-mental principles of electricity and elec-tronics. In addition, Saturday workshopsfor Boy Scout and Girl Scout troops arep r o v i d e d .

Relationship with TechnicalS o c i e t i e s

The HEM displays historical collectionsfor the Aerospace and Electronics SystemsSociety (AESS), Microwave Theory andTechniques Society (MTTS), and the Asso-ciation of Old Crows. It houses archives ofpublications for AESS and MTTS madeavailable for reference on-site. It alsoserves as the meeting site for the IEEE Balti-more Section, the Baltimore Chapters ofAES, MTT, and ED/SSC, Volunteers forMedical Engineering, and the Associationof Old Crows.

Relationship with EDSHEM relies primarily on the technical

expertise of volunteers to help design the

content of exhibits. Electron device expertisehas been historically lacking. The BaltimoreChapter decided to take on the responsibili-ty of filling this need. The chapter assists theHEM by providing technical input onupdates to existing exhibits, recommendingnew exhibits on current and future technolo-gy, and requesting and organizing dona-tions (monetary, material, time) to the HEMfrom chapter members, companies, andsocieties. The chapter leader on this projectis Vice-Chair, Anna Roesch.

Status of HEM ProjectsThe HEM is currently redesigning the

museum exhibit flow to take the visitorthrough galleries beginning with “Compo-nents: The Building Blocks of Electronics”to system applications such as “SpaceElectronics: Where Next?” The upgradedelectron devices display will be part ofthe first gallery. HEM and the BaltimoreChapter are also planning to include aSand to Silicon exhibit detailing the ICManufacturing Process. At its December1998 meeting, the Electron Devices Soci-ety approved to donate $5,000 to theHEM for this project. It is expected to becompleted by December 1999.

In the future, HEM and the BaltimoreChapter plan to design a “Teacher/Volun-teer’s Guide” for the electron device-relat-ed exhibits to enhance the learningexperience before, during, and after thevisit to the museum. This guide can bemade available to EDS for worldwide use.The Baltimore Chapter hopes to share theideas inspired by the HEM projects to oth-er EDS chapters which may be interestedin setting up similar outreach programs forstudents and the general public in theirlocal areas.

Arlene A. SantosNational Semiconductor Corp.

Ellicott City, MD

Arlene A. Santos

Baltimore Chapter Establishes Partnership with Local Museum

1 2

1998 EDS Distinguished Service Award

Dr. W. Dexter Johnston, Jr. was presentedthe 1998 EDS Distinguished Service Awardat the opening ceremony of the 1998 Inter-national Electron Devices Meeting (IEDM) onDecember 7, 1998 in San Francisco, CA.The EDS Distinguished Service Award wasestablished in 1993 to recognize and honoroutstanding service to the Electron Devices

Society and its sponsored activities. Dr. John-ston was awarded a certificate and a checkfor $2,500. He is presently a Technical Man-ager in the Optoelectronics unit of LucentTechnologies. Dexter is a Fellow of the IEEE,has published over 100 technical papersand has 20 patents.

Dr. Johnston has contributed to numer-ous activities in both EDS and the IEEE. Heserved for six years, 1983-1989, as anAssociate Editor of the Electron Device Let -t e r s. From 1990 through 1995, Dexterwas an elected EDS AdCom member, andserved as EDS Vice-President during 1992-1993, and as EDS President in 1994 and1995. During his term as Vice-Presidentand President, he was instrumental inlaunching the EDS Newsletter. In 1996and 1997, he headed the AdCom team to

establish the annual EDS MembershipDirectory. Many of his other contributionswere related to the establishment of EDSinvolvement in the IEEE on-line periodicalsprogram (OPeRA), to increasing the num-ber of women active in EDS, and he aidedin coordination of an agreement with theElectrochemical Society to jointly publishthe Electrochemical and Solid-State Letters.

Dr. Johnston has been a member of theIEEE Publications Activities Board, the TABBook Broker Committee, and Chair of theIEEE TAB Products Committee. Many ofthese IEEE activities have been to help thetransition of IEEE publishing from paper toelectronic media.

H. Craig Casey, Jr.Duke University

Durham, NC

W. Dexter Johnston, Jr.

1998 J. J. Ebers Award

The 1998 J. J. Ebers Award was present-ed to Professor B. Jayant Baliga of the Electri-cal and Computer Engineering Departmentat North Carolina State University at theopening ceremonies of the 1998 IEDM inSan Francisco, CA on December 7, 1998.This award is the highest form of recognitionby the Electron Devices Society for technicalaccomplishments. It commemorates the lifeof Jewell James Ebers, the distinguished pio-neering contributor to transistor modelingwho helped shape the understanding anddevelopment of electron devices. This awardwas established in 1971 to recognize out-standing technical contributions to electrondevices. B. Jayant Baliga was presented acertificate and a check for $2,000.

The citation for the 1998 J. J. EbersAward reads as, For fundamental and sus-tained contributions to power semiconduc-tor devices. Professor Baliga was born inMadras, India in 1948 and obtained hisB. Tech degree from the Indian Institute ofTechnology in 1969 with distinction recog-nized by receiving the Philips India andSpecial Merits Medals. He obtained his

M.S. and Ph.D. degrees in 1971 and1974 from Rensselaer Polytechnic Institute,Troy, NY, where he received the DumontPrize for pioneering work on organometal-lic epitaxial growth of III-V compounds, atechnique now widely used for manufactur-ing devices.

From 1974 to 1988, Professor Baligaperformed research and directed a groupof scientists at the GE Research Laboratoryin Schenectady, NY, where he created anew class of MOS-Bipolar discrete powerdevices. He is the inventor of the InsulatedGate Bipolar Transistor (IGBT) producedby numerous international semiconductorcompanies for widespread use in appli-ance controls, robotics, motor control,automotive ignition, electric cars, and mostrecently, a compact, portable defibrillatorfor cardiac arrest victims (estimated by theAMA to save 100,000 lives each year).Using a fundamental equation derived byBaliga in 1979, now commonly referredto as the Baliga’s Figure of Merit, enhance-ment in performance of power FETs by afactor of 2,000 times has been projectedby replacing silicon with silicon carbidemotivating a world-wide effort to developa new generation of power devices for thetwenty-first century.

In August 1988, Jay Baliga joined theElectrical and Computer EngineeringDepartment at N.C. State University,Raleigh, as a Full Professor. In 1991, heestablished an international consortium,called the Power Semiconductor ResearchCenter and presently, is serving as its

founding director. Under his tutelage, 16students have completed their Mastersdegree and 21 students their Doctoraldegree, followed by their employment inthe semiconductor industry. For these con-tributions, he was elevated in 1997 to therank of Distinguished University Professor.

Professor Jay Baliga has authored 8books, contributed chapters to 20 otherbooks, and written over 500 publications ininternational journals and conferences. Heholds 99 U.S. patents in the solid-state area,including one selected for the 1995 B.F.Goodrich Collegiate Inventors Award givenat the Inventors Hall of Fame. His honorsinclude: Fellow of the IEEE (1983) andmember of the National Academy of Engi-neering (1993); and the IEEE Newell(1991) and Liebmann (1993) Awards. Hewas selected among the 100 BrightestYoung Scientists in America by ScienceDigest Magazine (1984), and named byScientific American Magazine in 1997among the eight heroes of the semiconduc-tor revolution. He recently received the1998 O. Max Gardner Award, which rec-ognizes the faculty member within the 16universities of the North Carolina systemwho has made the greatest contribution tothe welfare of the human race.

The Electron Devices Society is pleasedto be able to recognize and honor Profes-sor B. Jayant Baliga for his outstandingcontributions to electron devices.

Dr. Alfred U. Mac RaeMac Rae Technologies

Berkeley Heights, NJ

B. Jayant Baliga

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Regional and Chapter News

USA, Canada & Latin America (Regions 1-6, 7&9)AP/ED/MTT San Diego Chapter— by Jon Roussos, Chair

The AP/ED/MTT San Diego Chapterheld 6 technical meetings in 1998. Thetopics presented were as follows: January1998: Recent Advances in Componentsfor Analog Fiber Links by Dr. Paul Yu fromthe University of California, San Diego,who is the chapter’s EDS partner; Febru-ary: Low Power Systems-on-a-Chip (SOC)Technologies by Prof. Krishna Shenai fromthe University of Illinois at Chicago, who isthe Editor-in-Chief of the EDS Newsletter;March: Millimeter Wave Packaging andInterconnect by Dr. Wolfgang Menzelfrom the University of Ulm, Germany;May: Microwave Active Filters: The Searchfor New Solutions to a Long-Standing Prob-lem by Christen Rauscher from the NavalResearch Laboratory, Washington, D.C.;September: Low Voltage Microwave Elec-tronics Mike Golio of Rockwell, Collins,Avionics and Communications Division,who is also the MTT Distinguished Lecturer.The chapter also presented its first-everone-day workshop in November of 1997.The topic was RF/Microwave ComputerAided Engineering. The Coordinator wasPaul Draxler from Qualcomm.

One lesson learned during the last twoyears is that subjects directly applicable tothe wireless phone industry attract the mostinterest. If the title of the workshop statessomething such as “.... For PCS Applica-tions,” there is a greater likelihood of hav-ing a better turn-out.

Mark H. Weichold, Editor

E u rope, Middle East &Africa (Region 8)ED/SSC Yugoslavia Chapter— by Aleksandar Jaksic

In mid-December 1998, Prof. KrishnaShenai, Director of Systems on SiliconResearch Center (SYSREC), and Director ofPower Electronics Research Laboratory(PERL), University of Illinois at Chicago, visitedthe ED/SSC Yugoslavia Chapter. The visitwas organized and sponsored by the Chap-

ter, and funding was also pro-vided from the EDS Distin-guished Lecturer Program.

Prof. Shenai held theseries of tutorials and lec-tures in Nis and Belgrade.The first tutorial was given onDecember 15, 1998, in Nisat the Faculty of ElectronicEngineering. It was a greatopportunity to find out moreabout state of the artresearch in the USA andIEEE activities. Among morethan 70 attendees were stu-dents, professors and electrical engineersfrom the Nis area, and from two othermain university and industry centers: Bel-grade and Novi Sad. Prof. Kri shnaShenai’s morning tutorial was entitled“Ultra Low Power RF Microsystems.” Afterthis 5-hour tutorial, the Yugoslavia ED/SSCChapter meeting was held. At the meeting,Prof. Shenai presented news regardingIEEE EDS activities, organizational struc-ture and publications. The second lecture,entitled “RF Microsystems and Power Elec-tronics for the Next Millennium,” was giv-en on December 16, 1998, in Belgrade,at the Institute for Chemistry, Technology,and Microelectronics. This event attractedmore than 80 people from universities ofBelgrade and Novi Sad and several insti-tutes located in Belgrade area. The lecturecovered a broad range of topics andattracted the attention of not only electricalengineers. Due to the great number ofquestions and comments, the scheduledtime for presentation was almost doubled.

During his stay in Yugoslavia, Prof.Shenai also visited the Electronic IndustryCo., the main Yugoslav manufacturer ofelectronic products. He discussed withcompany directors the possibilities of par-ticipating the segments of the companyconnected to power electronics moreactively in the world market.

MTT/ED/AP/CPMT NizhnyNovgorod Chapter— by Yuri Belov

On 30 October 1998, the MTT/ED/AP/CPMT Nizhny Novgorod Chapter heldits annual meeting at the Institute for Mea-surement Systems (NIIIS) in Nizhny Nov-gorod. The meet ing was held in

conjunction with a technical event devotedto new technologies for UHF elements pro-duction and CAD used for this purpose.

Seventeen Chapter members attendedthe event with a number of prestigiousengineering and scientific personnel of theNIIIS also attending. The large conferencehall of the institute was almost full. The firstVice-President of NIIIS, Prof. N. Tremasov,provided an introduction and revealednew perspectives of scientific investigationsoriented to civil interests, according to thestate industry conversion program. Dr. A.Kostrov, an invited speaker from theApplied Physics Institute, reported aboutrecent results of making UHF elements byarch-evaporating techniques. The Head ofthe CAD Department at NIIIS, Dr. S.Vlasov, described the use of new licensedsoftware for the UHF systems design andproduction. Very lively discussion openedafter these contributions. The finale of thetechnical event was a visit to variousexhibits and laboratories of the institute.

The second part of the event was relat-ed to current chapter issues. Yuri Belov,Chapter Chair, reported about currentproblems and future activities. Great inter-est was shown in the problem of moneytransfer for IEEE memberships and sub-scriptions, due to the crisis of the Russianbanking system. All Chapter meeting par-ticipants expressed their satisfaction withthe solution of this problem, worked outafter common efforts of the EDS ExecutiveOffice staff and the Chapter Chair. TheChapter elections were also held and Dr.Yuri Belov and Mr. Alexander Bykadorovwere re-elected as Chapter Chair and

From left: Aleksandar Jaksic, Krishna Shenai, Ninoslav Stojadinovicand Predrag Markovic.

(continued on page 12)

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Vice-Chair, respectively. The meeting wasadjourned with a small party.

MTT/ED/CPMT/COM NovosibirskC h a p t e r— by Boris Kapilevich

The 4th International Conference onActual Problems of Electronic InstrumentEngineering (APEIE’98) was he ld atNovosibirsk State Technical University Sep-tember 23-26th, 1998. A great increase ininterest in APEIE conferences could beclearly observed. While APEIE’92 hostedabout 300 participants, APEIE’98 atten-dance was about 1,000.

The 503 invited and regular paperswere presented in 15 oral sessions, eachsession addressing key problems of mod-ern electronic devices, component andmanufacturing technologies, and somerelated topics about instrumentation andmetrology in electronics. These paperswere published in Proceedings ofAPEIE’98, officially registered as an IEEEedition (IEEE Catalog Number: 98EX179).The exhibition, which was dedicated toelectronic devices and software productsdeveloped by local industry and universi-ties, was also organized in parallel to theconference. The exhibition attendance wasabout 400. The MTT/ED/CPMT/COMNovosibirsk Chapter awarded severalactive conference participants, both engi-neers and students, special diplomas forthe best papers and expositions.

The next APEIE Conference will be heldat the same location in September 2000.For further information, please contact:APEIE Secretariat, TEL: +7-3832 465061;E-Mail: Nrec@first.nstu.ru.

MTT/ED/AP/CPMT West UkraineC h a p t e r—by Mykhailo Andriychuk

The 3rd International Seminar on Directand Inverse Problems of Electromagneticand Acoustic Wave Theory (DIPED’98)was held in Tbilisi State University, Geor-gia, from November 2-5, 1998. This Semi-nar was organized jointly by the IEEEMTT/ED/EMC Republic of Georgia Chap-ter and MTT/ED/AP/CPMT West UkraineChapter, and technically co-sponsored byIEEE EDS, in cooperation with IEEE MTT,AP and CPMT societies.

The topics of the seminar were the prop-agation, diffraction and scattering of wavesin homogeneous and non-homogeneousmedia, the synthesis of radiating systemsand field transformers, and restoring theshape of radiating and scattering bodies.Thirty papers from Georgia, Ukraine, Rus-

sia, USA, Germany, Mexico, Greece andTurkey were presented in 5 oral sessionsand published in DIPED’98 Proceedings.The Best Young Speaker Awards wereannounced at the seminar closing. Therecipients of these awards were: Ms. A.Gheonjian of Tbilisi State University, Geor-gia for “Computer simulation of ESD fromcone,” Ms. O. Reshnyak of the Institute forAppl. Probl. of Mech. & Math., Lviv,Ukraine for “Closed solution of a nonlinearintegral equations arisen in the antennaarrays synthesis theory,” and A. Bidzhanovof Tbilisi State University, Georgia for“New materials design: scattering prob-lems and the method of auxiliary sources.”

DIPED is organized annually and isheld on a rotating basis in the Republic ofGeorgia and Ukraine. DIPED’99 is sched-uled to be held in Lviv, Ukraine, from Sep-tember 20-23, 1999. For furtherinformation, please contact: Dr. MykhailoI. Andriychuk, Program Committee Secre-tary, Institute for Applied Problems ofMechanics and Mathematics, 3”B” Nauko-va str., Lviv 290601, Ukraine, TEL: +38-0322-651944; Fax: +38-0322-637088;E-Mail: andr@iapmm.lviv.ua.

ED Romania Chapter— by Marian Badila

In 1998, Chapter programs werefocused on three main aspects: an effort toincrease membership by participation ofstudents in EDS activities; the utilization ofEDS IEDM videotape library; cooperationin the organization of the InternationalConference on Semiconductors (CAS’98).

About 50 students participated in thefinal step of the contest “Tudor Tanasescu-1998” - “Design of the analog integratedcircuits” and 6 student papers were pre-sented during the “Student Papers” Sectionat CAS’98. Nine prospective students, win-ners in these contests, were awarded withIEEE and EDS membership.

Five IEDM videotape short courses:“Bipolar Technology for BiCMOS VLSI,”“BiCMOS Technolo-gy and Design Tech-niques,” “AdvancedDevice Characteriza-tion and TestM e t h o d o l o g i e s , ”“Advanced SiliconProcessing Tech-niques For DeviceEngineers,” and“Trend in RF Devicesand ICs for WirelessApplications” werepresented at the

National Institute for Research and Develop-ment in Microtechnologies. Presentationsattracted a great interest in the researchcommunity. The Workshop “Advanced Pow-er MOS Technology and High TemperatureSiC PN Diodes” was organized in coopera-tion with the University PolitehnicaBucharest, Baneasa SA, IMT-Bucuresti,CNM -Spain, Cecely-Insa de Lyon-France.Three invited papers were presented to alarge audience.

CAS’98 was organized by the Nation-al Institute for Research and Developmentin Microtechnologies under the auspices ofRomanian Ministry of Research and Tech-nology, Romanian Academy, EDS and EDRomania Chapter, and ElectrochemicalSociety Inc. More than 190 people from26 countries attended this event. Fifteeninvited and 115 contributed papers, struc-tured in 19 oral and poster sessions werepresented. For the first time, CAS’98 con-tained a special session “Silicon CarbideDevices”, as well as 2 related scientificevents: the First Meeting of the EuropeanProgram INCO-COPERNICUS 9771131and a NEXUSPAN sponsored course“News Materials and Transducers forChemical Sensors” (speakers: Prof. W.Gopel and Dr. N. Barsan).

— Ninoslav Stojadinovic, Editor

ED Sweden Chapter— by Mikael Östling

During the fall of 1998, the ED SwedenChapter invited two distinguished lecturersto give interesting presentations. Dr. S. C.Sun, Taiwan Semiconductor ManufacturingCompany (TSMC) and an IEEE EDS DL,presented a lecture on interconnect technol-ogy and the use of copper metallization.He spent two intensive days with the Elec-tronics Department and also acted as thefaculty opponent to Dr. Wlodek Kaplan’sPhD thesis “The Use of Self-Aligned Ti Sili-cide in Integrated Si Technology.” In orderto reach EDS members outside of Stock-holm, we arranged a seminar at Uppsala

From left: Prof. Mikael Ostling, KTH and ED Chapter Chair; Dr. S. C. Sun; Dr.Ulf Erlesand, Mitel Semiconductors; Wlodek Kaplan, KTH; Prof. Ulf Smith,Ericsson Components; and Prof. G”ran Stemme, KTH.

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University hosted by Professor A. Rydberg.Professor Hermann Schumacher, Universityof Ulm, Germany, and an IEEE DL, wasinvited to present his talk “Si/SiGe Hetero-junction Bipolar Transistors for WirelessC o m m u n i c a t i o n s . ”

A new act iv ity for the chapter isplanned for the Spring. We intend toarrange at least two company visits peryear for our ED members.

A short course will be arranged togetherwith Prof. Krishna Shenai on RF power andwireless applications during the Summer.

— Mikael Östling, Editor

Report of the 1998 InternationalWorkshop on High PerformanceElectron Devices for Microwaveand Optoelectronic Applications— by Ali Rezazadeh

The 6th Workshop on High Perfor-mance Electron Devices For Microwaveand Optoelectronic Applications (EDMO‘98) was held in the Manchester Confer-ence Center at the University of Manches-ter Institute of Science and Technology,Manchester, UK November 23-24, 1998.This Workshop is an annual event spon-sored by King’s College London and theIEEE MTT/ED/AP/LEO UK & RI Chapter,with support from The Institute of ElectricalEngineering (UK) and The Institute ofPhysics (UK). Its purpose is to act as aforum for microwave and optoelectronicsemiconductor device designers, fabrica-tors, modelers and general users to discussthe synergy between system needs andadvanced electronic and optoelectronicdevices & circuits. It meets the needs ofsemiconductor materials, devices, circuitsand systems engineers to interact witheach other, in view of the relentless com-mercialization of advanced electronic sys-tems featuring the latest in materials anddevices research imposing ever shorter“time to market.”

EDMO‘98 attracted a favorableresponse and enjoyed a large internationalattendance with papers from Singapore,Austria, Denmark, Taiwan, Germany,Switzerland, Italy, Ukraine, The Netherlands,Finland, France, Canada, USA, SouthAfrica, Portugal and the UK. Thirty-onepapers were orally presented and thirteenpapers were arranged for poster sessions.The papers were organized in nine technicalsessions. Furthermore, eight invited speakershighlighted the current state of the art in thetopics relevant to EDMO, such as manufac-turing issues in high volume commercialHBTs, MESFETs and HEMTs. A vendors exhi-bition was also held for the purpose of

reflecting the interest ofEDMO. An award forthe best oral paper andposter were presented tothe best student papers.The 7th Workshop,EDMO’99, will be heldat King’s College, Lon-don, UK, 22-23 Novem-ber 1999. For furtherinformation, please con-tact Dr. A. A. Rezza-zadeh at the addresslisted below.

After completing athree year term ofoffice, Neil Williams isstepping down asChapter Chairman. Thenew Chairman, as ofMarch 1999, is Dr. Ali A. Rezazadeh,Reader in Microwave Photonics, Depart-ment of Electronic Engineering, Centre forOptics & Electronics, King’s College Lon-don, Strand, London, UK, WC2R 2LS.TEL/FAX: +44(0)171-873 2879; E-Mail:a l i . r e z a z a d e h @ k c l . a c . u k .

ED/MTT Egypt Chapter— by Ibrahim Salem

The EDS chapter held its workshop onTeaching Electron Devices at Egyptian Engi-neering Faculties and Institutes. Six paperswere presented: “Tailoring the suitabledose of basic electronics as a prerequisitefor ED courses,” by Prof. A. K. AboulSeoud; “Development and teaching of afirst course on lasers and photoelectronicdevices,” by Dr. A. H. Morshed; “The useof interactive learning methodology in elec-tronic courses,” by Dr. H. El Ghitani; “Atour of the I.C. laboratory Electronic DesignAutomation facility for Application SpecificI.C. prototype,” by Prof. H. F. Ragaie;“Electronic Design Automation LaboratoryExperience at Arab Academy For Science,Technology and Maritime Transport,” byProf. M. Aboul Dahab & Dr. Y. Hanafy;and “New Trends in Teaching I.C.,” by Dr.Hazem H. Ali. Two copies of the proceed-ings were supplied to EDS.

The 16th National Radio Science Con-ference was held at Ain Shams University-Faculty of Engineering on 23-25 February1999. The conference was sponsored byboth the National URSI Committee and theMTT/ED Egypt Chapter. For further infor-mation, please contact the Chapter Chair-man, Professor Ibrahim A. Salem, 17Elkobbba Street - Helioplis, Cairo - 11341,Egypt. TEL: 202-258-0256; FAX: 202-594-1270; E-Mail: isalem@brainy1.ie-eg.com.

ED Israel Chapter— by Gady Golan

The 2nd International Conference ofthe “Israel Materials Union” (AGIL-98)-Chairman Prof. Nathan Croitoru, Secre-tary: Dr. Gady Golan-was held in RamatGan, Kfar Ha-Maccabia Conference Cen-ter, from November 25th through Novem-ber 26th, 1998. This conference unitedmost of the Israeli societies in the field ofmaterials research, science and technolo-gy. The 14 participating societies includ-ed: Israel Society for Surface Finishing;Israel Vacuum Society (IVS); Israel Societyfor Crystal Growth; The Israeli Division forHydrides; The Israeli Chapter of the IEEEElectron Devices Society (IEEE-EDS); TheIsrael Society for Tribology; The IsraelChemical Society; The Israel Society forMicroscopy; The Israel Society for Poly-mers and Plastics; The Metallurgical Soci-e ty o f Is rae l; The Is rael Society forMedical Engineering and Biology; TheIsrael Physical Society; The Israel Societyof Chemical Engineers and Chemists; andThe Israeli Society for Enhancing Materi-als Engineering and Processes. The confer-ence program included topics from eachof the participating societies.

For further information, please contact theChapter Chairman or Chapter Secretary.The Chapter Chair is Professor NathanCroitoru, Tel-Aviv University, Dept. of Electri-cal Engineering - Physical Electronics, Facultyof Engineering, Tel-Aviv 69978, Israel. TEL:972-3-640-8138; FAX: 972-3-642-3508; E-Mail: croitoru@ eng.tau.ac.il. The ChapterSecretary is Dr. Gady Golan, Center forTechnological Education and The Open Uni-versity of Israel, 16 Klauzner St., P.O. Box39328, Tel Aviv 61392, Israel. TEL: 00-

(continued on page 16)

Photograph of session chairmen/organizers. From left to right: Prof GarthSwanson (King’s College London, UK), Dr. Dwight Streit (TRW, USA), Dr.Mo Missous (UMIST, UK), Dr. Bob Wallis (GEC-Marconi, UK), Dr. PeterKordos (Institute of Thin Films and Ion Technology, Julich, Germany) and D.rAli Rezazadeh (King’s College London, UK).

972-3-646-0329; FAX: 00-972-3-646-5465; E-Mail: gady@oumail.openu.ac.il.

MTT/ED/AP Turkey Chapter— by Ayhan Altintas

News and activit ies from theAP/MTT/ED Chapter in the Turkey Sectionin 1998 included: A meeting in Aprilbetween the Israel and Turkey Chapter offi-cers within the frame of the partnership pro-gram; A technical presentation on “NovelIII-V Semiconductors and Trends in High Per-formance Electronics” given by Dr. CengizBesikci of the Middle East Technical Univer-sity, Ankara, Turkey; and a Seminar on çRFMicrosystems for the Next Millennium withinthe EDS Distinguished Lecturer Program pre-sented by Dr. Krishna Shenai, Univ. of Illi-nois, at Isik University, Istanbul, Turkey.Finally, Dr. Ekmel Ozbay of Bilkent Universi-ty, Ankara, Turkey, was awarded the 1998Sedat Simavi Foundation Science Award forhis work on the development of new tech-nologies leading to the creation of photoniccrystals with electromagnetic bandgaps atthe infrared frequency bands. The SedatSimavi Science Award was named after thefounder of the Turkish Journalists Societywhich was established in 1977. It is annual-ly given to individuals who have made sig-nificant contributions to the area of naturalsciences. Dr. Ozbay is a member of theTurkey Chapter and received his Ph.D. fromStanford University, USA. He is also the1997 recipient of the Adolph Lamb Medalof the Optical Society of America.

For further information, please contactthe Chapter Chairman Professor Ayhan Alt-intas, Bilkent University, Dept. of ElectricalEngineering, Ankara 06533, Turkey. TEL:90-321-266-4000 ext. 1489; FAX: 90-312-266-4126; E-Mail: a.altintas@ieee.org.

— Terry Oxley, Editor

Asia & Pacific (Region 10)ED Beijing Chapter— by Fu J. Liao

The International Conference onMicrowave and Millimeter Wave Technolo-gy (ICMMT’98) was held August 18-20,1998 in Beijing, China. This conferencewas sponsored by the Chinese Institute ofElectronics (CIE) and technically co-spon-sored by IEEE EDS and IEEE MTTS. The EDBeijing Chapter was one of the ICMMT’98organizers. Prof. Fu J. Liao of the BeijingVacuum Electronics Research Institute, theED Beijing Chapter Co-Chair, was the Tech-nical Program Committee Chairman. Theconference had 270 attendees, and 264papers from 22 countries were accepted inthe proceedings. Fourteen invited papers

were presented at the plenary session,including: Dr. McMillan of the US Air ForceResearch Lab. on “Concealed WeaponDetection Using Microwave and MillimeterWave Sensors”; Prof. T. Itoh of UCLA, USAon “Active Integrated Antenna forMicrowave Front-End Technology”; Prof. H.Groll of Technishe Universitat Munchen,Germany on “Propagation Properties of AnIndoor-Channel at 94 GHz”; Dr. Lancasterof Birmingham University, UK on “Super-conducting air interface for mobile commu-nication base station”; Prof. Y. Kobayashiof Saitama University, Japan on “Develop-ment Trends of Microwave High Tc Super-conducting Filters”; Prof. N.C. Luhmann ofUC Davis, USA on “UC Davis Vacuum andSolid State Millimeter Wave Electronics Pro-gram”; Prof. Z.H. Feng of Tsinghua Univer-sity, China on “Smart and Spacial DivisionMultiple Sccess” and so on. ICMMT’98was the first conference of its series to beheld in China. The next Conference is inthe year 2000.

The ED Beijing Chapter had severalseminars this year. They invited Prof. Carterof Lancaster University, UK, Dr. Ghfouri-Shi-raz of University Birmingham, UK, Dr.Hiroshi Iwai of Toshiba and Dr. S.C. Sunfrom TSMC to talk about the linear amplifi-er for space communication, optical mil-limeter front-end and optical lens for mobilecommunications, CMOS technology for thenext century towards its limit and the semi-conductor industry in Taiwan, respectively.

For further information, please contactthe Chapter Co-Chair Prof. Fu J. Liao, E-M a i l : b v e r i z w @ p u b l i c 3 . b t a . n e t . c n .

ED Taipei Chapter— by S.C. Sun

The 1998 International Electron Devicesand Materials Symposia, IEDMS’98 washeld at the National Cheng Kung Universityin Tainan, Taiwan from Dec. 20 to 23,1998. The conference was organized intofour symposia and over 200 papers werepresented. Among them, 30 invited and177 of these papers were accepted forpublication. The conference was the twenty-sixth in a now annual series which was ini-tiated in 1972, and marked the seventhinternational conference in the series. Thepurpose of the conference is to bringtogether researchers in electron devicesand materials, so that those in R&D havethe opportunity to learn about the recentadvances in these fields.The keynote speak-ers for this year’s conference are: HiroshiIwai from Toshiba on “RF CMOS Technolo-gy”, I. Akasaki from Meijo University ofJapan on “Widegap Group III NitrideSemiconductors-Past, Present and Future,

and Shinji Morozumi of Hosiden andPhilips Display Corp. Japan on “EmergingHuge Market, Era of Flat PC Screen”.

— S.C. Sun, Editor

ED/MTT India Chapter— by K. S. Chari

The Chapter efforts for the period July1998 to December 1998 were as statedb e l o w :

At the invitation of the Chapter, on 18thSeptember, 98, Prof. P. J. George, Chair-man of the Department of Electronic Sci-ence, Kurukshetra University delivered thelecutre cited “Plasma Source Ion Implana-tion - A New Processing Technique”. Theevent was held in the Seminar Room, Centreof Applied Research in Electronics. IndianInstitute of Technology, Delhi. Sixty post-graduate students and members from indus-try, R&D groups attended the lecture.

Under the IEEE STAR Program, interac-tions with students were continued and abrochure for science competition and quizoutlines were worked out for the finalevent. New schools for the programme in1999 were identified and interactions withfaculty pursued.

A detailed report on the chapter activitiesfor the year was circulated to all chapter mem-bers. The Chapter executives met in the 3rdquarter and finalized various actions for work-shops and incentives for further promotion oftechnical activities and new enrollment to EDSmemberships. An active interface with theIEEE Delhi Section and the IEEE India Councilwas established. The current office bearerswere re-elected for the further period.

Best Chapter of the Year Award (1998):The ED/MTT India Chapter was selected bythe Electron Devices Society for its recentlyconstituted Chapter of the Year Award. Thechapter is the joint winner of this awardalong with the CPMT/ED/RL SingaporeChapter. This award was given to theChapter for the quality and range of activi-ties conducted during July 97 - June 98.

Chapter technical activities: The follow-ing series of talks were held: “High ElectronMobility Transistors: Dr. R Muralidharan,Solidstate Physics Laboratory, Delhi at IITDelhi on 3rd November, 98.; “Short Chan-nel CMOS Device Technologies”, Dr. Ram-gopal Rao, IIT Bombay at SemiconductorComplex, Chandigarh on 5th November,98; “Micro- Electro Mechanical Systems(MEMS) - Status and Trends” Dr. V. K. Jain,Solid-state Physics Laboratory, Delhi at Del-ton Hall, Institution of Electrical and Tele-com Engineering, Delhi on 17thNovember, 98. This lecture was co-spon-sored by the IEEE Delhi Section and IETE,Delhi; “Applications of Electron-beam Diag-

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nostics”, Dr. K S Chari and Mr. A K Balaniat Jadavpur University, Calcutta on 10thNovember, 98; “Advances in QuantumWell Intermixing Materials & Devices”, Dr.E Herbert Li, University of Hong Kong,Hong Kong at Solid-state Physics Laborato-ry, Delhi on 21st December, 98.

Short Course: “Design and Modellingof SAW Devices for IF/ RF applications” atIIT, Delhi on 11th - 13th October, 98.

Conference: “International Conference on“Photonics 98”: The Chapter has co-spon-sored and supported this conference and theshort courses held during 14th-18th Decem-ber, 98. The chapter also constituted 4awards for the best papers for the generalparticipants and student categories. The tuto-rials were attended by 180 participants andthe conference attracted about 300 partici-pants, including 100 overseas delegates.The Chapter instituted awards were receivedby [i] Dr. J Peerlings, Technische Universitaet,Germany, [ii] Dr. Perry Shum, City Universityof Hong Kong, Hong Kong (from the generalparticipants) and [iii] Ms. Sharmila Banerjee,SGSITS Indore [iv] Ms. Chitralekha Choud-huri, North Maharashtra University, Maha-rashtra (from the students category).

Membership promotion: Membershippromotion campaigns were held in thecampus of Semiconductor Complex,Chandigarh, Central Scientific InstrumentsOrganisation, Chandigar, IIT Kharagpurand Jadavpur Universi ty andSrivenkateswara College of Engineering,Perumbudur. Few technical movies werealso screened at these campuses.

— Wee Kiong Choi, Editor

Report of the 7th InternationalSymposium on SemiconductorManufacturing (ISSM’98)— by Takeshi Hattori

ISSM’98 was held in Tokyo October 7-9, 1998. More than 700 participantsattended the joint symposium sponsored bythe Ultra Clean Society, IEEE ElectronDevices Society, and SEMI. This annualsymposium has provided a highly interac-tive forum for people in the semiconductorand related industries, as well as the acad-emic community to share experiences andknowledge and to exchange opinions onsemiconductor manufacturing from a scien-tific point of view. This year, 57 and 56papers were selected for oral and posterpresentations, respectively from 180papers submitted.

This year, much emphasis was placedon the two-day poster sessions for bettercommunication between participants as aninteractive forum. In addition, 7 invitedspeakers discussed current issues such as

global manufacturing strategies, 300 mmfab and equipment, Cu metallization forlow-cost, high-performance manufacturing.The symposium covered a wide variety oftopics, such as fab design and manage-ment, information systems, yield enhance-ment, ultra clean technology, equipment/process/material optimization and innova-tion, manufacturable device structures, andenvironmental issues. This year’s notabletopics include cost and cycle-time manage-ment, environmental-friendly wafer cleaning,emission control enhancement metrologies,and environmental protection, defect reduc-tion and yield enhancement, and CMPprocess optimization.

This year, ISSM’99 will be held in SantaClara, California, October 11-13, 1999.For details, please contact the Ultra CleanSociety in Japan: TEL: 03-3815-8775; E-Mail: issm@blue.ocn.ne.jp or Meetings Plusin the U.S. TEL: 925-284-4040; E-Mail:issm@meetingsplus.com. The latest informa-tion is available on the Web home page:h t t p : / / w w w . i s s m . c o m .

Report of the 25th InternationalSymposium on CompoundSemiconductors (ISCS’98)— by Kimiyoshi Yamasaki

The 25th International Symposium onCompound Semiconductors (ISCS’98) washeld at the Nara-ken New Public Hall,Nara, Japan, from October 12 to 16,1998, co-chaired by Dr. T. Ikegami (NTT)and Dr. J. E. Bowers (Univ. of California).More than 280 people from 14 countriesparticipated, and 144 regular papers and10 late news papers selected from 221submitted papers were presented togetherwith 21 invited papers. The topics coveredthe entire spectrum of compound semicon-ductors ranging from growth to deviceapplications for GaAs, InP, GaN, SiGe,etc. The ISCS and Heinrich Welker Awardwas presented to Dr. T. Mimura (FujitsuLaboratories Ltd.) for his pioneering contri-bution to Heterostructure High ElectronMobility Transistors. In addition, the YoungScientist Award was presented to Dr. S. P.DenBaars (Univ. of California) for his con-tribution to MOCVD technology of GaNand other compound semiconductors. Dr.K. Von Klitzing (Max Plank Inst.) gave aplenary talk on Quantum Effects in Semi-conductor Nanostructures. At the specialsession, Heterostructure FET Technologiesof 21st Century was freely discussed withsnacks and drinks after an invited talk onIII-N Electronic Devices by Dr. M. A. Khan(Univ. of South Carolina).

The next symposium (ISCS’99) will beheld in Berlin, Germany, from August 22-

26, 1999, co-chaired by K. H. Ploog (PaulDrude Inst.) and Dr. G. Weimann (Fraun-hofer IAF). For more information, pleasecontact ISCS’99 Secretary, E-Mail:I S C S 9 9 @ p d i - b e r l i n . d e .

Report of the Sixth InternationalWorkshop on ComputationalElectronics (IWCE-6)— by Masato Morifuji

The Sixth International Workshop onComputational Electronics was held inIcho-Kaikan, Osaka University October 19-21, 1998. More than 100 people from 10countries attended the workshop. In addi-tion to 16 invited papers, 60 contributedpapers were presented in oral and postersessions. Various topics, which includequantum transport, optoelectronics, devicemodeling, and even biology, were present-ed and discussed in terms of a computa-tional study on electronic behavior. Thenext workshop will be held in Glasgow,UK chaired by Professor John R. Barker.For details, please contact Prof. J. R. Bark-er, University of Glasgow: E-Mail: jbarker@ e l e c . g l a . a c . u k

SSC/ED Seoul Chapter— by Chong-Gun Yu

The Awards Committee of the SSC/EDSeoul Chapter selected two s tudentpapers and awarded prizes to two stu-dents who published their papers in IEEETrans. on ED, EDL, and JSSC. The win-ners were Mr. Gab Joong Jeong fromYonsei University and Mr. Dong-YoungChang from Sogang University. The titleof Mr. Jeong’s paper, published in JSSC,Vol. 33, No. 6, pp. 910-914, June 1998was “Design of a Scalable PipelinedRAM System.” The title of Mr. Chang’spaper, published on JSSC, Vol. 33, No.8, pp. 1244-1248, August 1998 was“Design Techniques for a Low-Power Low-Cost CMOS A/D Converter.”

On February 9th, 1998, a distin-guished lecturer, Dr. Hiroshi Iwai fromToshiba, Japan, gave a technical talk on“Downsizing of CMOS toward Deep Sub-0.1 Micron and Its Limitation”. In the nearfuture, the activity plans of the Chapterinclude organizing an international confer-ence called the Asia-Pacific Conferenceon ASIC, in cooperation with severalcountries around Region 10 area.

For further information, please contact:Prof. Moon-Key Lee, Chapter Chair; TEL: +82-2-361-2867; FAX: +82-2-312-4584; E-Mail:mklee@bubble.yonsei.ac.kr; http://ieee-k o r e a . i n h a . a c . k r / s s c s - e d s - c h a p t e r .

— Hiroshi Iwai, Editor

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EDS Meetings Calendar(As of 12 March 1999)

April 12 - 16, 1999, T ULTRAFAST ELECTRON-ICS & OPTOELECTRONICS TOPICAL MEET-I N G, L o c a t i o n : Snomass, CO, C o n t a c t : J o h nBowers, T e l : (805) 893-8447, F a x : (805) 893-7990, E - M a i l : bowers@ece.ucsb.edu, D e a d l i n e :Past Due, w w w : Not Available

April 19 - 21, 1999, T INTERNATIONAL CON-FERENCE ON MODELING & SIMULATIONOF MICROSYSTEMS, SEMICONDUCTORS,SENSORS & ACTUATORS, L o c a t i o n : San JuanMariott Resort, San Juan, Puerto Rico, C o n t a c t :Sarah Wenning, T e l : (510) 847-9152, F a x : ( 5 1 0 )847-9153, E - M a i l : msm@dmtsun.epfl.ch, D e a d l i n e :Past Due, w w w :h t t p : / / w w w . i a c m . o r g / M S M 9 9

May 9 - 11, 1999, T INTERNATIONAL SYM-POSIUM ON PLASMA PROCESS-INDUCEDD A M A G E, L o c a t i o n : DoubleTree Hotel/MontereyConference Center, Monterey, CA, C o n t a c t : D e l l aMiller, T e l : (408) 737-0767, F a x : (408) 737-2403, E - M a i l : d e l l a @ t e c h n i c a l m a r k e t i n g . c o m ,D e a d l i n e : Past Due, w w w : h t t p : / / w w w .v a c u u m . o r g / n c c a v s / p 2 i d . h t m l

May 16 - 19, 1999, T IEEE CUSTOM INTE-GRATED CIRCUITS CONFERENCE, L o c a t i o n :Town & Country Hotel, San Diego, CA, C o n t a c t :Melissa Widerkehr, T e l : (301) 527-0900, F a x :(301) 527-0994, E - M a i l : w i d e r k e h r @ a o l . c o m ,D e a d l i n e : Past Due, w w w : h t t p : / / w w w . i e e e / o r g /c o n f e r e n c e / c i c c

May 16 - 20, 1999, @ IEEE INTERNATIONALCONFERENCE ON INDIUM PHOSPHIDEAND RELATED MATERIALS, L o c a t i o n : D a v o sCongress Center, Davos, Switzerland, C o n t a c t :Samantha Padilla, F a x : (732) 562-8434, E - M a i l :s.padilla@ieee.org, D e a d l i n e : Past Due, w w w :h t t p : / / w w w . i q e . e t h z . c h / i p r m 9 9 /

May 18, 1999, T WORKSHOP FOR TEACH-ING PHOTONICS AT EGYPTIAN ENGINEER-ING FACULTIES & INSTITUTES, L o c a t i o n :Academy of Scientific Research and Technology,Cairo, Egypt, C o n t a c t : Ibrahim A. Salem, T e l : 2 0 2 -258-0256, F a x : 202-594-1270, E - M a i l :isalem@brainy1.ie-eg.com, D e a d l i n e : 4 / 2 1 / 9 9 ,w w w :N o n e

May 18 - 20, 1999, T INTERNATIONAL SYM-POSIUM ON APPLICATION OF THE CON-VERSION RESEARCH RESULTS FOR

INTERNATIONAL COOPERATION, L o c a t i o n :Tomsk State University of Control Systems andRadioelectronics, Tomsk, Russia, C o n t a c t : O . V .Stoukatch, T e l : 7-3822-233183, F a x : 7 - 3 8 2 2 -526969, E - M a i l : office@tusur.ru, D e a d l i n e : P a s tDue, w w w :h t t p : / / w w w . r t s . t u s u r . r u / s i b c o n v e r s 9 9

May 23 - 26, 1999, * IEEE INTERNATIONALINTERCONNECT TECHNOLOGY CONFER-E N C E, L o c a t i o n : Hyatt Regency Hotel, San Francis-co Airport, Burlingame, CA, C o n t a c t : Widerkehr &Associates, T e l : (301) 527-0900, F a x : (301) 527-0994, E - M a i l : iitc@his.com, D e a d l i n e : Past Due,w w w :h t t p : / / w w w . i e e e . o r g / c o n f e r e n c e / i i t c

May 25 - 28, 1999, @ IEEE INTERNATIONALSYMPOSIUM ON POWER SEMICONDUCTORDEVICES & INTEGRATED CIRCUITS, L o c a t i o n :Crown Plaza Hotel, Toronto, Canada, C o n t a c t : M .Ayman Shibib, T e l : (610) 939-6576, F a x : ( 6 1 0 )939-3796, E - M a i l : a.shibib@ieee.org, D e a d l i n e :Past Due, w w w :h t t p : / / w w w . u t o r o n t o . c a / i s p s d 9 9 /

May 31 - June 4, 1999, T ADVANCED WORK-SHOP ON FRONTIERS IN ELECTRONICS, L o c a-t i o n : Hotel President, Leece, Italy, C o n t a c t : S e r g eLuryi, T e l : (516) 632-8420, F a x : (516) 632-8494, E -M a i l : sluryi@sbee.sunysb.edu, D e a d l i n e : Past Due,w w w :h t t p : / / w w w . e e . s u n y s b . e d u / ~ s e r g e / W O F E /

June 1 - 4, 1999, # INTERNATIONAL CONFER-ENCE ON ELECTRON, ION & PHOTONB E A M S, L o c a t i o n : Marriott Resort, Marco Island,FL, C o n t a c t : Mark Gesley, T e l : (510) 887-3312,F a x : (510) 786-9438, E - M a i l : g e s l e y @ e t e c . c o m ,D e a d l i n e : Past Due, w w w :h t t p : / / w w w . e i p b n . o r g

June 7 - 10, 1999, @ IEEE TRANSDUCERS -INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS & ACTUATORS, L o c a t i o n :Sendai International Center, Sendai, Japan, C o n-t a c t : TRANSDUCERS ‘99, Attn: June Echizen, T e l :81-3-3299-1371, F a x : 81-3-3299-1361, E - M a i l :tr99@twics.com, D e a d l i n e : Past Due, w w w :h t t p : / / w w w . c o m . c a s . u e c . a c . j p / t r a n s 9 9 . h t m l

June 8 - 10, 1999, T INTERNATIONAL SYMPO-SIUM ON VLSI TECHNOLOGY, SYSTEMS &A P P L I C A T I O N S, L o c a t i o n : Taipei InternationalConvention Center, Taipei, Taiwan, C o n t a c t : R a c h e lHuang, T e l : 886-3-591-7232, F a x : 8 8 6 - 3 - 5 8 2 -0056, E - M a i l : rachel@erso.itri.org.tw, D e a d l i n e :Past Due, w w w: http://surf.eng.yale.edu/~vlsi/

June 10 - 11, 1999, T ELECTRON DEVICESC O N F E R E N C E, L o c a t i o n : Consejo Superior deInvestigaciones Cientif icas Central Campus,Madrid, Spain, C o n t a c t : Jose Ignacio Robla Villal-ba, T e l : 34-1-5618806, F a x : 34-1-4117651, E -M a i l : jrobla@fresno.csic.es, D e a d l i n e : Past Due,w w w : http://www.ifa.csic.es/cde99/ cde99.htm

June 10 - 12, 1999, * IEEE INTERNATIONALWORKSHOP ON CHARGE-COUPLEDDEVICES & ADVANCED IMAGE SENSORS,L o c a t i o n : Karuizawa Prince Hotel, Karuizawa,Nagano, Japan, C o n t a c t : Nobukazu Teranishi, T e l :81-427-71-0923, F a x : 81-427-71-0878, E - M a i l :ccdws@mel.cl.nec.co.jp, D e a d l i n e : Past Due, w w w :Not Available

June 12, 1999, @ IEEE INTERNATIONALWORKSHOP ON STATISTICAL METROLOGY,L o c a t i o n : Righa Royal Hotel, Kyoto, Japan, C o n-t a c t : Naoyuki Shigyo, T e l : 81-45-890-2801, F a x :81-45-890-2890, E - M a i l : s h i g y o @ f d a e . e e c .toshiba.co.jp, D e a d l i n e : Past Due, w w w : h t t p : / /w w w . r c i s . h i r o s h i m a - u . a c . j p / i w s m

June 12 - 13, 1999, @ IEEE SILICON NANO-ELECTRONICS WORKSHOP, L o c a t i o n : R i g h aRoyal Hotel, Kyoto, Japan, C o n t a c t: ToshiroHiramoto, T e l : 81-3-3402-0873, F a x : 8 1 - 3 - 3 4 0 2 -0873, E - M a i l : h i r a m o t o @ n a n o . i i s . u - t o k y o . a c . j p ,D e a d l i n e : Past Due, w w w : h t t p : / / v l s i . i i s . u -t o k y o . a c . j p / s i - n a n o

June 13 - 15, 1999, * IEEE RADIO FREQUENCYINTEGRATED CIRCUITS SYMPOSIUM, L o c a t i o n :Marriott Hotel, Anahiem, CA, C o n t a c t : Christian Ker-marrec, T e l : (617) 937-1217, F a x : (617) 937-1051,E - M a i l : christian.kermarrec@analog.com, D e a d l i n e :Past Due, w w w : Not Available

June 14 - 16, 1999, @ IEEE SYMPOSIUM ONVLSI TECHNOLOGY, L o c a t i o n : Righa RoyalHotel, Kyoto, Japan, C o n t a c t : Phyllis Mahoney, T e l :(301) 527-0900, F a x : (301) 527-0994, E - M a i l :pwmahoney@aol.com, D e a d l i n e: Past Due, w w w :h t t p : / / i e e e . o r g / c o n f e r e n c e / v l s i

June 16 - 19, 1999, # CONFERENCE ON INSU-LATING FILMS ON SEMICONDUCTORS, L o c a-t i o n : Kloster Banz, Erlangen, Germany, C o n t a c t :Max Schultz, T e l : 49-0-9131-85-8421, F a x : 4 9 - 0 -9131-85-8423, E - M a i l : i n f o s 9 9 . p h y s i k @ r z m a i l . u n i -erlangen.de, D e a d l i n e : Past Due, www: h t t p : / /

* = Sponsorship or Co-Sponsorship Support @ = Alternates support between ‘Sponsorship/Co-Sponsorship’ and ‘Technical Co-Sponsorship’T = Technical Co-Sponsorship Support # = Cooperation Support

The complete Calendar can be found at our web site: http://www.ieee.org/organizations/society/eds/edscal.html. Please visit!

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w w w . p h y s i k . u n i - e r l a n g e n . d e / l a p / I n f o s 9 9 /i n d e x . h t m

June 17 - 19, 1999, # IEEE SYMPOSIUM ONVLSI CIRCUITS, L o c a t i o n : Righa Royal Hotel,Kyoto, Japan, C o n t a c t : Phyllis Mahoney, T e l : ( 3 0 1 )527-0900, F a x : (301) 527-0994, E - M a i l : p w m a-honey@aol.com, D e a d l i n e : Past Due, w w w :h t t p : / / i e e e . o r g / c o n f e r e n c e / v l s i

June 20 - 23, 1999, * IEEE UNIVERSITY/GOV-ERNMENT/INDUSTRY MICROELECTRONICSS Y M P O S I U M, L o c a t i o n : Radisson Metrodome,Minneapolis, MN, C o n t a c t : Greg T. Cibuzar, T e l :(612) 625-8079, F a x : (612) 625-5012, E - M a i l :cibuzar@ee.umn.edu, D e a d l i n e : Past Due, w w w :h t t p : / / w w w . m t l . u m n . e d u / u g i m 9 9

June 26, 1999, T HONG KONG ELECTRONDEVICES MEETING, L o c a t i o n : The Chinese Uni-versity of Hong Kong, Shatin, N.T., Hong Kong,Contact: J.B. Xu, T e l : 852-2609-8297, F a x : 8 5 2 -2603-5558, E - M a i l : jbxk@ee.cuhk.edu.hk, D e a d-l i n e : 4/15/99, w w w : h t t p : / / w w w . e e . c u h k . e d u .h k / e e / e d m 9 9 . h t m l

June 28 - 30, 1999, * IEEE DEVICE RESEARCHC O N F E R E N C E, L o c a t i o n : University of California atSanta Barbara, Santa Barbara, CA, Contact: M a r kRodder, T e l : (972) 995-2873, F a x : (972) 995-2770, E - M a i l : rodder@spdc.ti.com, Deadline: P a s tDue, w w w :h t t p : / / e c e - w w w . c o l o r a d o . e d u / ~ d r c /

July 4 - 7, 1999, T EUROPEAN CONFERENCEON HIGH TEMPERATURE ELECTRONICS, L o c a-t i o n : Westin Grand Hotel, Berlin, Germany, C o n t a c t :Richard Sharp, T e l : 44-1-1235-463407, F a x : 4 4 - 0 -1235-464253, E-Mail: r i c h a r d . s h a r p @ a e a t . c o . u k ,D e a d l i n e : Not Available, w w w : not available

July 4 - 8, 1999, T INTERNATIONAL MULTI-CONFERENCE ON CIRCUITS, SYSTEMS,COMMUNICATIONS AND COMPUTERS, L o c a-t i o n : Conference Center of the Hellenic Telecommu-nications Company, Athens, Greece, Contact:Nikos E. Mastorakis, T e l : 301-777-5660, F a x : 3 0 1 -777-5660, E - M a i l : mastor@ieee.org, D e a d l i n e : P a s tDue, w w w : h t t p : / / w w w . s o f t l a b . e c e . n t u a . g r / ~ m a s-tor/CSCC99. htm

July 5 - 9, 1999, T INTERNATIONAL CONFER-ENCE ON NITRIDE SEMICONDUCTORS, L o c a-t i o n : Palace of Congress, Montpellier, France,C o n t a c t : Dr. Bernard Gil, T e l : 3 3 - 4 - 6 7 - 1 4 - 3 9 - 2 4 ,F a x : 33-4-67-14-37-60, E - M a i l : g i l @ g e s . u n i v -montp2.fr, D e a d l i n e : Past Due, w w w : h t t p : / / b i l-b o t . g e s . u n i v - m o n t p 2 . f r / i c n s 3 . h t m

July 5 - 9, 1999, T IEEE INTERNATIONAL SYM-POSIUM ON THE PHYSICAL & FAILUREANALYSIS OF INTEGRATED CIRCUITS, L o c a-

t i o n : Orchard Hotel, Singapore, C o n t a c t : M.K. Rad-hakrishnan, T e l : (65) 770-5439, F a x : (65) 774-5747, E - M a i l : radha@ime.org.sg, D e a d l i n e : P a s tDue, w w w :h t t p : / / c i c f a r . e e . n u s . s g / i p f a / i p f a 9 9 . h t m l

July 6 - 8, 1999, T INTERNATIONAL MICRO-PROCESS AND NANOTECHNOLOGY CON-F E R E N C E, L o c a t i o n : Yokohama-shi Ginou BunkaKaikan, Yokohama-shi, Kanagawa, Japan, C o n t a c t :Hiroaki Masuko, T e l : 81-3-5814-5800, Fax: 8 1 - 3 -5814-5823, E - M a i l : confg5@bcasj.or.jp, D e a d l i n e :Past Due, www: h t t p : / / w w w . n a n o . e e . e s . o s a k a - u .a c . j p / m n c /

July 6 - 9, 1999, @ IEEE INTERNATIONALVACUUM MICROELECTRONICS CONFER-E N C E , L o c a t i o n : Congress Hall Darmstadt,Darmsstadt, Germany, C o n t a c t : Hans W.P. Koops,T e l : 49-6151-83-2368, F a x : 49-6151-83-8188, E -M a i l : i v m c 9 9 @ h r z p u b . t u - d a r m s t a d t . d e , Deadline:Past Due, w w w : h t t p : / / w w w . h f . e - t e c h n i k . t u - d a r m s t-d t . d e / i v m c 9 9 / i n d e x . h t m l

July 11 - 15, 1999, T INTERNATIONAL CON-FERENCE ON UNSOLVED PROBLEMS OFN O I S E, L o c a t i o n : University of Adelaide, NorthTerrace, Adelaide, Australia, C o n t a c t : D e r e kAbbott, T e l : 618-8303-5748, F a x : 6 1 8 - 8 3 0 3 -4360, E - M a i l : d a b b o t t @ e l e c e n g . a d e l a i d e . e d u . a u ,D e a d l i n e : Past Due, w w w : h t t p : / / w w w .e l e c e n g . a d e l a i d e . e d u . a u / P e r s o n a l / d a b b o t t /U p o N / u p o n h o m e . h t m l

August 2 - 5, 1999, @ INTERSOCIETY ENERGYCONVERSION ENGINEERING CONFERENCE,L o c a t i o n : Hotel Vancouver, Vancouver, BritishColumbia, Canada, C o n t a c t : Karen E. Thomson,T e l : (724) 772-7120, F a x : (724) 776-1830, E - M a i l :kthomson@sae.org, D e a d l i n e : Past Due, w w w :h t t p : / / w w w . s a e . o r g / C A L E N D A R / i e c 9 9 c f p . h t m

August 16 - 17, 1999, T IN T E R N A T I O N A LSYMPOSIUM ON LOW POWER ELECTRON-ICS AND DESIGN, L o c a t i o n : Hyatt Islandia onSan Diego’s Mission Bay, San Diego, CA, C o n t a c t :Farid N. Najm, T e l : (217) 333-7678, F a x : ( 2 1 7 )244-1946, E - M a i l : najm@uiuc.edu, D e a d l i n e : P a s tDue, w w w :h t t p : / / w w w . e e . u c l a . e d u / i s l p e d 9 9

August 22 - 26, 1999, @ IEEE INTERNATIONALSYMPOSIUM ON COMPOUND SEMICON-D U C T O R S, L o c a t i o n : Zeiss Planetarium, Berlin,Germany, C o n t a c t : ISCS ‘99 Secretary, T e l : 4 9 - 3 0 -20377-352, F a x : 49-30-20377-201, E - M a i l :ISCS99@pdi-berlin.de, D e a d l i n e : 4/12/99, w w w :h t t p : / / w w w . p d i - b e r l i n . d e / i s c s /

August 23 - 26, 1999, T I N T E R N A T I O N A LCONFERENCE ON NOISE IN PHYSICAL SYS-TEMS & 1/F FLUCTUATIONS, L o c a t i o n : H o n gKong Polytechnic University, Hong Kong, C o n t a c t :

Charles Surya, T e l : 81-2766-6220, F a x : 8 1 - 2 3 6 2 -8439, E - M a i l : ensurya@en.polyu.edu.hk, D e a d l i n e :Past Due, w w w : h t t p : / / w w w . e e . u s t . h k /i e e e _ e d s / i c n f

September, 1999, T TRANS BLACK SEAREGION SYMPOSIUM ON APPLIED ELEC-T R O M A G N E T I C S, L o c a t i o n : Tirnovo, Bulgaria,C o n t a c t : Nikolaos K. Uzunoglu, T e l : 3 0 - 1 -7723556, F a x : 30-1-7723557, E - M a i l :nuzu@cc.ece.ntua.gr, D e a d l i n e : Not Available,w w w : Not Available

September, 1999, T INTERNATIONAL CRIM-NEAN MICROWAVE CONFERENCE, L o c a t i o n :Crimea, Ukraine, C o n t a c t : Dr. Pavel P. Yermolov,T e l : 38-0692-42-42-87, F a x : 38-0692-444-768, E -M a i l : micoc@bios.nsk.su, D e a d l i n e : Not Available,w w w : Not Available

September 6 - 8, 1999, @ IEEE INTERNATION-AL CONFERENCE ON SIMULATION OFSEMICONDUCTOR PROCESSES ANDD E V I C E S, L o c a t i o n : Kyoto Research Park, Kyoto,Japan, C o n t a c t : Secretariat, c/o Business Centerfor Academic Societies Japan, T e l : 8 1 - 3 - 5 8 1 4 -5800, F a x : 81-3-5814-5823, E - M a i l :confg5@bcasj.or.jp, D e a d l i n e : Past Due, w w w :h t t p : / / w w w - e 7 . e l e . e n g . o s a k a - u . a c . j p / S I S P A D /

September 8 - 10, 1999, * I E E E / S E M IADVANCED SEMICONDUCTOR MANUFAC-TURING CONFERENCE AND WORKSHOP,L o c a t i o n : The Fairmont Copley Plaza, Boston, MA,Contact: Margaret M. Kindling, T e l : (202) 289-0440, F a x : (202) 289-0441, E - M a i l : m k i n d l i n g @semi.org, D e a d l i n e : Past Due, w w w : Not Available

September 13 - 15, 1999, T EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE,L o c a t i o n : City Campus of the Katholieke Univer-siteit, Leuven, Belgium, C o n t a c t : Herbert Gruen-bacher, T e l : 43-4242-2004-120, F a x :43-4242-2004-179, E - M a i l : hg@cti.ac.at, D e a d-l i n e : 4/9/99, www: h t t p : / / w w w . e s s d e r c . o r g

September 13 - 17, 1999, T I N T E R N A T I O N A LCONFERENCE ON ELECTROMAGNETICS INADVANCED APPLICATIONS, L o c a t i o n : T o r i n oIncontra Congress Center, Torino, Italy, C o n t a c t :P.L.E. Uslenghi, T e l : (312) 996-6059, F a x : ( 3 1 2 )413-0024, E - M a i l : uslenghi@eecs.uic.edu, D e a d-l i n e : Past Due, www: h t t p : / / w w w . p o l i t o . i t / i c e a a 9 9

September 19 - 22, 1999, * IN T E R N A T I O N A LCONFERENCE ON MICROELECTRONICS(MIEL) , L o c a t i o n : Univers i ty of Nis, Nis,Yugoslavia, C o n t a c t : Aneta Trajkovic, T e l : 3 8 1 - 1 8 -529-326, F a x : 381-18-46-180, E - M a i l : m i e l @ u n i-top.elfak.ni.ac.yu, D e a d l i n e : Past Due, w w w :h t t p : / / u n i t o p . e l f a k . n i . a c . y u / m i e l / w e l c o m e . h t m l

EDS Members Elected to the IEEE Grade of FellowEffective 1 January 1999

Masayuki Abe: For contributions to III-V compound semiconductor optoelectronic and high-speed devices.Ilesanmi Adesida: For contributions to compound semiconductor devices and circuits.Isamu Akasaki: For contributions to and leadership in research and development of group III nitride semiconductor materials

and devices.Fazal Ali: For contributions to the design and development of monolithic microwave integrated circuits (MMICs) and providing

leadership in commercial applications of the same.Constantine N. Anagnostopoulos: For contributions to Solid State Imagers and Integrated Circuits for Digital Cameras.Giorgio Baccarani: For contributions to the scaled silicon device theory.Tze-Chiang Chen: For contributions to silicon bipolar and DRAM technology development.James Anthony Dayton, Jr.: For contributions to the design of microwave devices.Mitra Dutta: For contributions to heterostructure-based optoelectronic and electronic devices.John Aiden Higgins: For contributions to development of GaAs transistor technologies for microwave and high speed

integrated circuits.Harold LaRoy Hughes: For discovery of radiation-induced oxide-trapping effects in metal-oxide-semiconductor (MOS) struc-

tures, and the hardening against such radiation effects.Yue Kuo: For contributions to thin-film transistor technology and processes.David Noel Lambeth: For scientific, educational and professional contributions in the fields of magnetism, data storage sys-

tems, and electronic devicesMichael R. Melloch: For contributions to silicon carbide device technology.Tohru Nakamura: For contributions to the development of high-speed bipolar integrated circuits.Yael Nemirovsky: For contributions to compound semiconductor devices and technology.Heiner Ryssel: For introduction of ion implantation technology into the German Semiconductor Industry.Charles Alvin Spindt: For the development of the microfabricated field-emission-cathode array and for contributions to the field

of vacuum microelectronics.Andrew Jules Steckl: For contributions to focused ion beam implantation and semiconductor device fabrication.Dwight Christopher Streit: For contributions to the development and manufacturing of heterojunction materials and devices.Ting-wei Tang: For contributions to the hydrodynamic transport modeling of semiconductor devices.George David Vendelin: For contributions to microwave and millimeter-wave monolithic integrated circuits design.Siu-Weng Simon Wong: For contributions to multi-level interconnect technology for ultra-large scale integrated circuits.Cary Y. Yang: For contributions to microelectronic education and the understanding of interfacial properties of silicon-based

d e v i c e s .Ian Alexander Young: For contributions to microprocessor circuit implementation and technology development.