Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony teardown reverse costing...

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 1

Electronic Costing & Technology Experts

www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]

April 2014 – Version 1 – Written by Romain Fraux

http://www.systemplus.fr/index.php?lang=ge&page=home.php

http://www.systemplus.fr/index.php?lang=ge&page=home.php

mailto:[email protected]


Apple iPhone 5S - Camera Module

Return to TOC


Glossary1. Overview / Introduction 4

– Executive Summary & Reverse Costing Methodology

2. Camera Module Supply Chain & Companies Profile 7– iPhone 5S Camera Module Supply Chain

– Companies Profile (Sony, LG Innotek)

3. iPhone 5S Teardown 12

4. Physical Analysis 15– Synthesis of the Physical Analysis

– Physical Analysis Methodology

– Camera Module 18

– Camera Module View & Dimensions

– Camera Module X-Ray

– Camera Module Disassembly

– CMOS Image Sensor 33

– View & Dimensions

– Pads, Tungsten Grid

– TSV Connections

– CIS Pixels

– Logic Circuit (Transistors, SRAM)

– Cross Section: Camera Module 50

– Overview

– Driver (Assembly & Process) & MLCC

– Ceramic Substrate, IR Filter & FPC

– Lenses, Housing, VCM

– Cross Section: CMOS Image Sensor 71

– Overview

– Pad Trenches

– Pixel Array Circuit

– Logic Circuit

– TSVs

5. CIS Manufacturing Process Flow 90– Global Overview

– Logic Circuit Front-End Process

– Pixel Array Circuit Front-End Process

– BSI + TSV + Microlenses Process

– CIS Wafer Fabrication Unit

6. Cost Analysis 97– Synthesis of the cost analysis

– Main steps of economic analysis

– Yields Hypotheses

– CMOS Image Sensor Cost 102

– Logic Circuit Front-End Cost

– Pixel Array Front-end Cost

– BSI & TSV Front-End Cost

– Color Filters & Microlenses Front-End Cost

– Total Front-End Cost

– Back-End: Tests & Dicing

– CIS Wafer and Die Cost

– Camera Module Assembly Cost 114

– Lens Module Cost

– VCM Actuator Cost

– Final Assembly Cost

– Camera Module Cost 119

Contact 122


Return to TOC


• This full reverse costing study has been conducted to provide insight on technology data and

manufacturing cost of the iPhone 5S camera module.

• The iPhone 5S iSight camera module holds a 8Mpixel resolution with dimensions of 8.5 x 7.8 x 5.7mm

and features 33% increase in light sensitivity compared to the previous iPhone according to Apple.

• This light sensitivity improvement is mainly due to the new CIS supplied by SONY and specifically

made for Apple which features a 1.5µm pixel size compared to 1.4µm for the previous sensor. This

rising of pixel size by keeping a similar CIS cost has been made possible by the use of the Exmor-RS

technology of SONY. This technology consists in a stacking of two separate chips: a pixel array circuit

and a logic ISP circuit. The circuits are connected together by the use of copper Through Silicon Via

(TSV), thus making a real 3D device.

• This technology offers 3 advantages: a reduction of the CIS die due to the stacking of the circuits, an

optimization of the processes for both circuits due to the separation of the pixels and the logic

transistors, and an optimization of the supply chain because logic circuits can be outsourced to

foundries.

• The camera module is equipped with “classics” 5-elements lens module and VCM auto-focus

actuator.


Return to TOC


Camera Module with Flex Top View

Camera Module with Flex Back View

Flex Marking

Camera Module with Flex Global View

Connector 2x16 Positions

Flex PCB


Return to TOC


Barrel with Lenses

Metal HousingCoil

Plastic housing #3

Ceramic Substrate

Plastic housing #1

Top Metal Cover

IR Filter

Camera Module Disassembly


Return to TOC



Return to TOC


Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated)

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

USA Office

• Jeff Edwards, Sales Associate, Yole Inc., Cell: (972) 333 0986- Email: [email protected]

Japan Office• For reports business: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.

Email: onozawa@yole,fr• For custom research: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.

Phone: (81) 362 693 457 - Cell : (81) 80 3440 6466 - Fax: (81) 362 693 448 - Email: [email protected]

European Office

• Yole Développement Headquarter, France: David Jourdan, Sales Coordination & Customer Service, Tel: +33 472 83 01 90, Email: [email protected]

Korea Office • Hailey Yang, Business Development Manager, Phone : (82) 2 2010 883 - Cell: (82) 10 4097 5810

- Fax: (82) 2 2010 8899 – Email: [email protected]





Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony teardown reverse costing...

Technology

Transcript of Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony teardown reverse costing...