Maxim Integrated MAX21000 3-Axis MEMS Gyroscope teardown reverse costing report by published Yole...

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

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Electronic Costing & Technology Experts

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June 2014 – Version 1 – Written by Romain Fraux

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Maxim MAX21000 3-Axis MEMS Gyroscope

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Glossary1. Overview / Introduction 4

– Executive Summary

– Reverse Costing Methodology

2. Company Profile 8– Maxim Integrated

– MAX21000 Characteristics

3. Physical Analysis 16– Synthesis of the Physical Analysis

– Physical Analysis Methodology

– Package 19

– Package Views & Dimensions

– Package Pin Out

– Package Opening

– Wire Bonding Process

– Package Cross-Section

– ASIC Die 34

– View, Dimensions & Marking

– Delayering

– Main Blocks Identification

– Cross-Section

– Process Characteristics

– MEMS Die 45

– View, Dimensions & Marking

– Bond Pad Opening

– Cap Removed & Cap Details

– Sensing Area Details

– Cross-Section (Sensor, Cap & Sealing)

– Process Characteristics

– Consumer 3-Axis Gyro Comparison 77

– Comparison with STMicroelectronics, Bosch Sensortec and InvenSense

4. Manufacturing Process Flow 82– Global Overview

– ASIC Front-End Process

– ASIC Wafer Fabrication Unit

– MEMS Process Flow

– MEMS Wafer Fabrication Unit

– Packaging Process Flow

– Package Assembly Unit

5. Cost Analysis 100– Main steps of economic analysis

– Yields Hypotheses

– ASIC Front-End Cost

– ASIC Back-End 0 : Probe Test & Dicing

– ASIC Wafer & Die Cost

– MEMS Front-End Cost

– MEMS Back-End 0 : Probe Test & Dicing

– MEMS Front-End Cost per process steps

– MEMS Front-End: Equipment Cost per Family

– MEMS Front-End: Material Cost per Family

– MEMS Wafer & Die Cost

– Back-End : Packaging Cost

– Back-End : Packaging Cost per Process Steps

– Back-End : Final Test Cost

– MAX21000 Component Cost

– Consumer 3-Axis Gyro Cost Comparison

6. Estimated Price Analysis 130– Manufacturer Financial Ratios

– Estimated Selling Price

Contact 135


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• This full reverse costing study has been conducted to provide insight on technology data,

manufacturing cost and selling price of the Maxim MAX21000 3-Axis Gyroscope.

• The MAX21000 is an ultra-accurate, low power consumption MEMS gyroscope assembled in

industry’s smallest and thinnest 3.0 x 3.0 x 0.9mm LGA package. It is suitable for both user interface

(UI) and optical image stabilization (OIS) applications.

• The MEMS sensor is manufactured with the PSM-X2 process jointly developed by SensorDynamics

(acquired by Maxim in 2011) and the Fraunhofer Institute for Silicon Technology.

This technology platform includes a proprietary surface micromachining process to build the

mechanical structures and a gold silicon eutectic wafer bonding allowing an hermetic

encapsulation of the gyro sensor.

• Compared with state of the art 3x3mm MEMS gyroscopes supplied by STMicroelectronics and

Bosch Sensortec, the new design developed by Maxim for this reference offers 28% to 35%

reduction in silicon area for the MEMS die, enabling a significant cost advantage. Nevertheless,

Maxim uses a fabless model for this component reducing considerably this advantage.

• Another comparison with latest generation of InvenSense Gyro using also a fabless approach lets

appear that the silicon area reduction obtained by Maxim will not be sufficient to compete with

innovating processes like the one of InvenSense or mCube.


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Die Size Evolution of MEMS Gyroscopes Source: Yole/S+C Inertial MEMS Manufacturing Trends 2014

• Upon components we

analyzed since 2010, the

MAX21000 currently offers

the smallest MEMS gyro

die area!

Gyroscope MEMS Die Size Evolution (3-axis)


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The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price


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Package Side View

• Package: LGA 16-pin

• Dimensions: 3.0 x 3.0 x 0.9mm

• Pin Pitch: 0.5mm

• Marking:

MXG3A

1329I

010FA

Package top view

Package back view

Orientation of Axes(from datasheet)


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• The die marking includes the logo of Maxim Integrated and:

VI02B-0

2012 ©Ⓜ 92

ASIC Die Marking


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MEMS Sensor MEMS Cap


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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated)

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

Europe & USA Office

• Yole Développement Headquarter, France: David Jourdan, Sales Coordination & Customer Service, Tel: +33 472 83 01 90, Email: [email protected]

Japan Office• For custom research: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.Phone: (81) 362 693 457 - Cell : (81) 80 3440 6466 - Fax: (81) 362 693 448 - Email: [email protected]• For reports business: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.

Email: [email protected]

Korea Office • Hailey Yang, Business Development Manager, Phone : (82) 2 2010 883 - Cell: (82) 10 4097 5810

- Fax: (82) 2 2010 8899 – Email: [email protected]





Maxim Integrated MAX21000 3-Axis MEMS Gyroscope teardown reverse costing report by published Yole...

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Transcript of Maxim Integrated MAX21000 3-Axis MEMS Gyroscope teardown reverse costing report by published Yole...