InvenSense MPU-9250 9-Axis MEMS IMU teardown reverse costing report by published Yole Developpement

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 1

Electronic Costing & Technology Experts

www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]

March 2014 – Version 1 – Written by Romain Fraux

http://www.systemplus.fr/index.php?lang=ge&page=home.php

http://www.systemplus.fr/index.php?lang=ge&page=home.php

mailto:[email protected]

mailto:[email protected]

InvenSense MPU-9250

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Glossary1. Overview / Introduction 4

– Executive Summary– Reverse Costing Methodology

2. Company Profile 7– InvenSense Profile– MPU-9250 Specifications

3. Physical Analysis 15– Synthesis of the Physical Analysis– Physical Analysis Methodology– Package

– Package View, Dimensions & Pin-out– Package Opening– Package Cross-Section

– MPU-6500 Die– View, Dimensions & Marking– MEMS Removed– MEMS Sensing Area– MEMS Cap– ASIC Delayering & Process– Die Cross-Section: ASIC– Die Cross-Section: MEMS (Pads Opening, Sealing)

– Die Cross-Section: Sensor (Electrical Contacts, Standoffs)

– Die Cross-Section: Sensor (Al-GE Bonding)

– Die Cross-Section: Sensor (Mobile Elements)– Die Cross-Section: Cap

– AK8963 Die– View, Dimensions & Marking– Hall Sensors– Delayering & Process– Die Cross-Section – Magnetic Concentrator Cross-Section

4. Comparison with previous generation 92

5. Manufacturing Process Flow 95– Global Overview– MPU-6500 ASIC Front-End Process– MPU-6500 MEMS Process Flow– MPU-6500 Wafer Fabrication Unit– AK8963 ASIC Front-End Process– AK8963 Magnetic Concentrator Process Flow– AK8963 Wafer Fabrication Unit– Packaging Process Flow– Package Assembly Unit

6. Cost Analysis 112– Main steps of economic analysis– Yields Hypotheses– MPU-6500 ASIC Front-End Cost– MPU-6500 MEMS Front-End Cost– MPU-6500 ASIC/MEMS Assembly Cost– MPU-6500 MEMS Front-End Cost per process steps– MPU-6500 Total Front-end Cost– MPU-6500 Back-End 0 : Probe Test & Dicing– MPU-6500 Wafer & Die Cost– AK8963 ASIC Front-End Cost– AK8963 Magnetic Concentrator Cost– AK8963 Total Front-end Cost– AK8963 Back-End 0 : Probe Test & Dicing– AK8963 Wafer & Die Cost– Back-End : Packaging Cost– Back-End : Packaging Cost per Process Steps– Back-End : Final Test & Calibration Cost– MPU-9250 Component Cost

7. Estimated Price Analysis 146– InvenSense Financial Ratios– MPU-9250 Estimated Price

Contact 150

InvenSense MPU-9250

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The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price

InvenSense MPU-9250

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• Package: QFN 24-pin

• Dimensions: 3.0 x 3.0 x 1.0mm

• Pin Pitch: 0.4mm

• Marking:

MP92

C571D1

L1339

Package top view

Package back viewPackage Side View

Orientation of Axes for Accelerometer & Gyroscope(from datasheet)

Orientation of Axes for Magnetometer(from datasheet)

InvenSense MPU-9250

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• The die marking includes:

InvenSense

2012

SCORPION-A02

ASIC Die Marking

InvenSense MPU-9250

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• The die marking includes the logo of AKM and:

6473_ _ _

2011

Magnetometer Die Marking

InvenSense MPU-9250

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InvenSense MPU-9250

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Packaging Cost

Calibration & Final Test Cost

MPU-6500

CMOS Front-End Cost

MEMS Front-End Cost

Probe Test Cost

Dicing Cost

• We perform the economicanalysis of the CMOS withthe IC Price+ tool.

• We perform the economicanalysis of the MEMS andpackaging with the MEMSCoSim+ tool.

Subcontractor

Could also be

InvenSense MPU-9250

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InvenSense MPU-9250

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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated)

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:USA Office

• Michael McLaughlin, Business Development Manager, Phone: (650) 931 2552 - Cell: (408) 839 7178Email: [email protected]

• Jeff Edwards, Sales Associate, Yole Inc., Cell: (972) 333 0986-Email: [email protected]

Japan Office• Takashi Onozawa, Sales Asia & General Manager, Yole K.K. Email: onozawa@yole,fr

European Office• Yves Devigne, Europe Business Development Manager, Cell: +33 6 75 80 08 25 -Email : [email protected]• Yole Développement Headquarter, France: David Jourdan, Sales Coordination & Customer Service,

Tel: +33 472 83 01 90, Email: [email protected]

Korea Office • Hailey Yang, Business Development Manager, Phone : (82) 2 2010 883 -Cell: (82) 10 4097 5810

Fax: (82) 2 2010 8899 Email: [email protected]

InvenSense MPU-9250 9-Axis MEMS IMU teardown reverse costing report by published Yole Developpement

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