Melexis MLX90809 Relative Pressure Sensor 2016 teardown reverse costing report published by Yole...

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

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Electronic Costing & Technology Experts

www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]

March 2016 – Version 1 – Written by Sylvain Hallereau

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Melexis MLX90809 pressure sensor

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Glossary

1. Overview / Introduction 4

– Executive Summary

– MLX90809

2. Company Profile 9

– Melexis

– X-Fab

3. Physical Analysis 14

– Physical Analysis Methodology

– Package 16

– Package

– Package Opening

– Wire Bonding

– Package Cross-Section

– pressure sensor Die 27

– Sensor Die View & Dimensions

– Pressure sensor Views

– Pressure Sensor Delayering & main Blocs

– Membrane

– Piezo-resistors

– Pressure sensor Cross-Sectio

– Sensor Die Process Characteristic

4. Sensor Manufacturing Process 49

– Sensor Die Front-End Process & Fabrication Unit

– Pressure Sensor Die Process

– Packaging Process & Fabrication unit

5. Cost Analysis 54

– Synthesis of the cost analysis

– Main steps of economic analaysis

– Yields Explanation & Hypotheses

– Sensor die 59

– CMOS Wafer Front-End Cost

– Back Side Process Wafer Cost

– Back Side Process Step Cost

– Probe Test & Dicing

– Sensor Die Wafer Cost

– Sensor Die Cost

– Packaged Component 68

– Packaging Cost

– Back End: Final Test

– Component Cost

6. Estimated Selling Price 75

Contact


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• This full reverse costing study has been conducted to provide insight on technology data,

manufacturing cost and selling price of the Melexis MLX90809 pressure Sensor.

• The MLX90809 is an integrated pressure sensor for industrial and automotive .

• The sensor has a resolution of 0 to 1 bar relative pressure with a high accuracy (+/-1.5% FSO (Full-

Span Output). It is an integrated pressure sensor. The IC and the sensor are manufactured on the

same die. The sensor uses a piezo-resistive technology and a thin silicon diaphragm.

• The sensor die is manufactured with CMOS 0.35µm technology and it is connected by mean of wire

bonding to the Package.


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The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price


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• Package: SOP 16-pin

• Dimensions: 10.3x7.5x2.4mm

• Pin Pitch: 1.27mm

Package top view Package bottom view

Package Side View

7.5mm

2.4mm

10.3mm

• Marking:

M54529 Wafer lot number

1515 Year and week of assembly

MLX90809E Reference


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XXmm

XX

mm

Die Overview PGDW: Potential Good Dies per Wafer

• Die Area: XXmm²(XX x XXmm)

• Nb of PGDW per 8-inch wafer: XXX

• Pad number: 5

– Connected: 5

Die backside


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SensorFront-End &

Back-End Cost

pressure sensor

• We perform the economic analysis of the Sensor IC Front-End, with the IC Price+ tool.

• We perform the economic analysis of the backside process sensor and the Assembly with the MEMS CoSIM+ tool.

Probe test

SensorDesign

Packaging

Packaging


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• Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimatescompleted by industry experts.

• Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on themanufacturing cost (if all parameters are cumulated)

• These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

o Consulting and Specific Analysis

– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]

– Europe: Lizzie Levenez, Europe Middle East and Africa Business Development Manager, Yole DéveloppementEmail: [email protected]

– Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.Email: [email protected]

– RoW: Jean-Christophe Eloy, President & CEO, Yole DéveloppementEmail: [email protected]

o Report business

– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]

– Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service Email: [email protected]

– Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.Email: [email protected]

– Korea: Hailey Yang, Business Development Manager, Korean OfficeEmail: [email protected]

o Financial services

– Jean-Christophe Eloy, CEO & PresidentEmail: [email protected]

o General: Email: [email protected]

Melexis MLX90809 Relative Pressure Sensor 2016 teardown reverse costing report published by Yole...

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