Bosch Sensortec BMA355 3-Axis MEMS Accelerometer teardown reverse costing report by published Yole...

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July 2014 – Version 1 – Written by Romain Fraux

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Bosch BMA355 3-Axis WLCSP Accelerometer

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Glossary1. Overview / Introduction 4

– Executive Summary– Reverse Costing Methodology

2. Company Profile 7– Bosch Sensortec– BMA355 Characteristics

3. Physical Analysis 12– Synthesis of the Physical Analysis– Physical Analysis Methodology– Package 15

– Package Views, Dimensions & Pin Out– Package Opening– Package Cross-Section

– TSV – Redistribution

– ASIC 36– View, Dimensions & Marking– Delayering– Main Blocks Identification– Process Identification

– Technology node, Capacitors, Memories– Cross-Section

– Thickness, Metal Layers– Process Characteristics

– MEMS 51– View, Dimensions & Marking– Bond Pad Opening & Bond Pad– Cap Removed & Cap Details– Sensing Area Details– Cross-Section

– Cap & Sealing– Sensor, Bond Pads

– Process Characteristics

4. Consumer 3-Axis Accelerometers Comparison 81

5. Manufacturing Process Flow 85– Global Overview– ASIC FEOL & BEOL Process– ASIC TSV Via-Middle Process Flow– ASIC Wafer Fabrication Unit– MEMS Process Flow– MEMS Wafer Fabrication Unit– Wafer-Level Packaging Process Flow & Assembly Unit

6. Cost Analysis 110– Synthesis of the cost analysis– Main steps of economic analysis– Yields Hypotheses– ASIC 115

– ASIC FEOL & BEOL Cost– ASIC TSV Cost– ASIC TSV Cost per Process Steps– ASIC Total Front-End Cost

– MEMS 120– MEMS Front-End Cost– MEMS Front-End Cost per process steps– MEMS Probe Test & Dicing Cost– MEMS Wafer & Die Cost

– Wafer-Level Packaging 129– Wafer-Level Packaging Cost– Wafer-Level Packaging Cost per process steps– Total Wafer Cost

– Back-End : Final Test & Calibration Cost– BMA355 Component Cost

7. Estimated Price Analysis 141– Manufacturer Financial Ratios– Estimated Selling Price

8. Consumer 3-Axis Accelero Cost Comparison 146

Contact 148


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• This full reverse costing study has been conducted to provide insight on technology data,

manufacturing cost and selling price of the Bosch BMA355 WLCSP 3-Axis Accelerometer.

• The BMA355 is a 12-bit digital resolution accelerometer well suited for applications requiring

extremely small form factors.

• With a size of only 1.4mm3 (1.2x1.5x0.8mm), the BMA355 is the smallest MEMS accelerometer on

the market and features 60% volume reduction compared to state of the art 2x2x0.9mm MEMS

accelerometers.

• This size reduction has been made possible by the use of a Through-Silicon Vias (TSVs) in the

ASIC enabling a WLCSP package where all the manufacturing steps are realized at the wafer-

level.

• TSVs structure let us to assume that the vias are realized after the FEOL and before the BEOL

steps, introducing the first MEMS component with TSV Via-Middle process.

• The report is including a detailed technical and cost comparison with state of the art MEMS

accelerometers from STMicroelectronics and mCube.


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The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price


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• The die marking includes the logo of Bosch and:

BAA256CB

BOSCH

2012

ASIC Die Marking


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• The die marking includes:

BOSCH

CMA332M

MEMS Die Marking


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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated)

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

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- Fax: (82) 2 2010 8899 – Email: [email protected]





Discover the first MEMS device using TSV in ASIC and WLCSP to reach the smallest size (only 1.4mm3!)

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Glossary

Introduction, Bosch Sensortec Company Profile

Physical Analysis• Package

Package Views & Dimensions Package Opening Package Cross-Section (TSV, RDL)

• ASIC Die View, Dimensions & Marking Delayering Main Blocks Identification Process Identification Cross-Section

• MEMS Die View, Dimensions & Marking Bond Pad Opening Cap Removed & Cap Details Sensing Area Details Cross-Section (Sensor, Cap & Sealing) Process Characteristics

• Consumer 3-Axis Accelerometer Comparison (Bosch Sensortec, STMicroelectronics and mCube)

Manufacturing Process Flow• Global Overview• ASIC Front-End Process & Wafer Fab Unit• MEMS Process Flow & Wafer Fab Unit• WLP Process Flow & Assembly Unit

Cost Analysis• Yields Hypotheses• ASIC FEOL & BEOL Cost• ASIC TSV Cost• ASIC TSV Cost per Process Steps• MEMS Front-End Cost• MEMS Back-End 0 : Probe Test & Dicing• MEMS Front-End Cost per process steps• MEMS Wafer & Die Cost• Wafer-Level Packaging Cost• Wafer-Level Packaging Cost per Process Steps• Back-End : Final Test & Calibration Cost• BMA355 Component Cost

Estimated Price Analysis

Consumer 3-Axis Accelero Cost Comparison(Bosch Sensortec, STMicroelectronics & mCube)

TABLE OF CONTENTS

Bosch Sensortec BMA3553-Axis MEMS Accelerometer

REVERSE COSTING ANALYSIS

REPORT BY

COMPLETE TEARDOWN WITH:

• Detailed Photos

• Precise Measurements

• Material Analysis

• Manufacturing Process Flow

• Supply Chain Evaluation

• Manufacturing Cost Analysis

• Selling Price Estimation

• Comparison with last

generation 3-Axis Acceleros

MEMS 3-Axis Accelerometer148 pagesJuly 2014Pdf file Xls file

PRICE : Full report: EUR 2,990

After being integrated in the latest Apple’s iPhone in 2013, Bosch is now thetop MEMS supplier according to Yole’s Top 30 MEMS Ranking 2014. Thisstrong growth is both due to the consumer and automotive businesses ofBosch.

With a size of only 1.4mm3 (1.2x1.5x0.8mm), the BMA355 is the smallest MEMSaccelerometer on the market and features 60% volume reduction compared tostate of the art 2x2x0.9mm MEMS accelerometers. This size reduction has beenmade possible by the use of Through-Silicon Vias (TSVs) in the ASIC, enabling aWLCSP package. All the manufacturing steps are realized at the wafer-level. Thisis the first introduction of a MEMS component with TSV Via-Middle process.

The BMA355 is a 12-bit digital resolution accelerometer well suited forapplications requiring extremely small form factors.

The report is including a detailed technical and cost comparison with state of theart MEMS accelerometers from STMicroelectronics and mCube.

Discover all the details in the report!

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Bosch Sensortec BMA355 3-Axis MEMS Accelerometer teardown reverse costing report by published Yole...

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