Toyota Prius 4 PCU Power Modules - teardown reverse costing report published by Yole Developpement

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 1

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September 2016 - Version 1 - Written by Elena Barbarini

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Toyota Prius 4 Power Module

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Glossary1. Overview / Introduction 4

– Executive Summary

– Reverse Costing Methodology

2. Company Profile 7

3. Physical Analysis 9– Synthesis of the Physical Analysis

– Module design

3.1 Generator Inverter 13

3.1.1 Module teardown

– View and dimensions and marking

– Package Opening & Cross-section

3.1.2 IGBT

– Dimension, process

– Cross-section

3.1.3 Diode Analysis


– Cross-section

3.2 Boost Converter & Motor Inverter 55

3.2.1 Module teardown

– View and dimensions and marking

– Package Opening & Cross-section

3.2.2 IGBT


– Cross-section

3.2.3 Diode Analysis


– Cross-section

4. Manufacturing Process Flow 85– Overview

– IGBT Process Flow & Fabrication unit

– Diode Process Flow & Fabrication unit

– Package Process Flow & fabrication unit

5. Cost & Price Analysis 90– Synthesis of the Cost Analysis

– Main Steps of Economic Analysis

– Yields Explanation

5.1 Cost & price Analysis Generator Inverter 93

– IGBT Wafer Cost & die cost

– Diode Wafer Cost & die cost

– Module Wafer Cost & die cost

– Module price

5.2 Cost & price Analysis Boost converter & motor inverter 113

– IGBT Wafer Cost & die cost

– Diode Wafer Cost & die cost

– Module Wafer Cost & die cost

– Module price

6. Toyota Prius vs Chevrolet Volt Power Module 133

Contact


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• This full reverse costing study has been conducted to provide insight on technology data,manufacturing cost and selling price of the IGBT power modules integrates in the PCU of the ToyotaPrius 4.

• For its latest Prius 4 Toyota designed a new PCU. The PCU is assembled with two types of powermodules, one for the motor inverter and the other for the boost converter and generator inverter.

• The module integrates the latest packaging of Toyota power card with double side cooling. Themodule allows an optimization of the modularity and scalability of the PCU’s inverters and a betterthermal dissipation thanks to the use of copper heatsink and spacers. The power cards can be placedin parallel to have a single thermal dissipation circuit in a limited space. This package includes twopairs of IGBT and FWD wire bonded and it is plastic molded.

• The report offers a deep technical analysis of the module structure and packaging and of the IGBT anddiode dies.

• Based on a complete teardown analysis, the report also provides an estimation of the production costof the package, IGBT and diode.

• Moreover the report proposes a comparison with the Chevrolet Volt Power module.


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© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 4“Toyota’s Challenge of Applying SiC Power Semiconductors to Environmentally Friendly Vehicles and its update” ISiCPEAW 2016


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• Module dimensions: 105 mm x 57 mm

Module marking

IGBT and diode of generator inverter


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Module Overview

Module marking

Pins Pins cross section


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Module: Optical view

Wire bonding

IGBT

Collector plate

Diode


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© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 8Module Cross-Section Optical view

Module Cross-Section Optical view


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IGBT Die Overview


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© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 10Die Cross-Section – Optical View


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Die Cross-Section – SEM View

Die Cross-Section – SEM View


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© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 12Die Cross-Section – SEM View


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Diode Die Overview


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Diode manufacturing1 metal layer, backside

Probe testDicing

IGBTDiode

Assembly in packageFinal test

Power Module

IGBT manufacturing1 metal layer, trench, backside

Probe testDicing


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• The wafer cost is between $xxx and$xxxaccording to yield.

• The main part of the wafer cost is due to theconsumables with xxx%. The equipment partcounts for xxxx%.


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• The dies cost is between $xxx and $xxaccording to yield.

– Silicon cost accounts for xx% of the costfor medium yield .

– The probe test, backgrinding and dicingrepresent xx% of the cost for mediumyield.

– The scrap cost (xxx% ) is the total of allthe losses during probe test and dicing formedium yield.


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• The die cost is between $xxx and $xxaccording to yield.

– Silicon cost accounts for xx% of the cost.

– The probe test, backgrinding and dicingrepresent xx% of the cost.

– The scrap cost (xx% ) is the total of all thelosses during probe test and dicing.


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• The assembled module cost is estimated between $xxx and $xxx according to yield.

• The dies cost (Silicon cost) accounts for about xxx%.

• The copper cost accounts for xxx% of the cost.

• The added value cost is $xx (x%).


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• The module manufacturer price is estimated between $xxx and $xxx.


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Chevrolet Volt IGBT & Diode

Toyota Prius IGBT & Diode

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• Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimatescompleted by industry experts.

• Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on themanufacturing cost (if all parameters are cumulated)

• These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

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Toyota Prius 4 PCU Power Modules - teardown reverse costing report published by Yole Developpement

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