Manufacturing Process of

Silicon Wafer

SiliconSilicon is a chemical

element that makes up

almost 30% of the earth’s

crust.

 Silicon is the most

common material to build

semiconductors and

microchips with despite

the fact that on its own, it

doesn’t conduct electricity

very well. 

75%

Ingot GrowthGrowing a silicon

ingot can range in

time from one week

to one month

depending on factors

such as size, quality,

and specification. 

The adding of

dopants gives the

electrical properties

needed to grow

ingot.

of silicon wafers

grow via the

Czochralski (CZ)

method,.

Slicing

The diamond edge saw is

used not only to slice the

wafers so they are slightly

thicker than the target

size but also to help

minimize damage to the

silicon wafer.

LappingAfter the wafer has been sliced, it gets lapped. The lapping

process removes saw marks and surface defects from the

wafer. It also thins the wafer out, relieving the stress

accumulated in the slicing process.

CleaningAfter lapping, the silicon

wafers go through the

process of being cleaned

and etched.

 Silicon is the most

common material to build

semiconductors and

microchips with despite

the fact that on its own, it

doesn’t conduct electricity

very well. 

Polishing

The polishing process

takes place in a clean

room where the workers

wear cleanroom suits

that cover their entire

bodies.

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