Addistion Engineering - Silicon Wafer Processing

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Visit Our Website www.addisonengineering.comSilicon Wafer ProcessingAddison Engineering has an extensive array of processing capabilities. On our silicon or yours, we can provide virtually any processing service you may need, from a simple oxide layer to completely patterned wafers. Thermal oxide Ion implant Epitaxial deposition Plasma nitride Photoresist Wafer bumping

Visit Our Website www.addisonengineering.comAbout Wafers:In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor material, such as a silicon crystal, used in the fabrication of integrated circuits and other microdevices. The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning.

Silicon Wafer Processing

Silicon Wafer ProcessingVisit Our Website www.addisonengineering.comFormation: Wafers are formed of highly pure (99.9999999% purity) nearly defect free single crystal material. One process for forming crystalline wafers is known as Czochralski growth invented by the Polish chemist Jan Czochralski. In this process, a cylindrical ingot of high purity monocrystalline semiconductor, such as silicon or germanium, is formed by pulling a seed crystal from a 'melt'.

Silicon Wafer ProcessingVisit Our Website www.addisonengineering.com

Donor impurity atoms, such as boron or phosphorus in the case of silicon, can be added to the molten intrinsic material in precise amounts in order to dope the crystal, thus changing it into n-type or p-type extrinsic semiconductor.


Thermal oxide: OxideTEOS/PETEOS oxide Gate oxide Low temperature oxide PSG glass Silicon Nitride LPCVD Low Stress Ultra-low Stress Polysilicon (undoped)


Metal deposition Evaporation Sputter Epitaxial deposition Ion implantation SOI oxidation wafer bonding Photolithography


Clean RCA clean Mechanical Ingot slicing Lap & etch Wafer thinning Wafer downsize (diameter cut-down) Wafer dicing


Wafer reclaim Laser marking Wafer bumping MEMS - Silicon machining


Thin Film Processing:LOW kBlack DiamondCoralSpin Onand moreOXIDE: CVD and ThermalThick Photoresist & PolymideHigh Energy Deep Ion ImplantNitrides (Si- and O-)


Low Stress Silicon NitrideBPSG, PSG, USGAmorphous SiliconDiamond Like CarbonPolysilicon (Doped and Undoped)METALS: PVD, CVD, ElectroplateAi, Cu, Au, Cr, Ta, Ti, TiNTiW, TaN, WN, Ni, RuCo, NiSi, TiO2, Pt


Czochralski Growth:


Grinding and Slicing:


Lapping and Etching:


Polishing and Cleaning:


Sizes Available:Silicon wafers are available in several sizes (diameters)

1 (25mm) 2 (50mm) 3 (75 mm) 4 (100mm) 5 (125mm) 6 (150mm) 8 (200mm) 12 (300mm) 18 (450mm)


Addison Engineering provides Silicon wafers that are available with a wide range of characteristics (specifications) to select from.Thank You

Addistion Engineering - Silicon Wafer Processing

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