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How to bring MEMS into a foundry? The challenge of MEMS product implementation.

Dr. Peter Merz, X-FAB MEMS BU Manager

MEMS Sensor Seminar - Sensor Roadmap: The Pathway to the next 'BigThing‘ Munich, 20.03.2014

Content

Company Confidential 3

Introduction to X-FAB

Application of MEMS

Challenge of MEMS Manufacturing

Solutions

Company Confidential 4

Key Facts

> Market leader for More than Moore foundry services

– 20 years of experience in specialty foundry services

– Flexible combination and integration of power, high-voltage, analog, sensors and non-volatile memory features

– Best-in-class design and engineering support

> Technologies interfacing the real world

– Technologies for sensors, actuators, automotive, power management and integrated optics

– Process technologies from 1.0 µm to 0.13 µm

> Global presence

– 5 wafer fab facilities in Germany (3), Malaysia and US

– Capacity: 62,000 eight inch equiv. wafer starts per month

– All production sites are automotive qualified

– 2,400 employees worldwide

- X-FAB MEMS Foundry Itzehoe has joined X-FAB group

Erfurt, Germany

Kuching, Malaysia

Dresden, Germany

Lubbock, USA

Itzehoe, Germany

MEMS

CMOS-MEMS

XFAB MEMS Foundry Service

Company Confidential 5

Itzehoe, Germany Erfurt, Germany

Dresden, Germany Kuching, Malaysia Lubbock, USA Erfurt, Germany

XMF X-FAB MEMS Foundry

CMOS integrated MEMS manufacturing

Dedicated MEMS fabrication in Itzehoe and Erfurt

Enabling the Customers by Material Capability and Capacity

Premium Quality Systems / Production Environement

MEMS Business Unit One-Stop-Shop for MEMS

Company Confidential 6

MEMS Production Sites

Site CR Space Cleanroom Size Node Main Capability

ERF CMOS-MEMS Site A CMOS 6 “ 8 “

0.6 µm CMOS DRIE, Anneal, Litho, Release, DRIE, Anneal, Litho

MEMS KOH Center

400m2 CMOS 6 “ + 8 “ 0.6 µm KOH, Fusion Bonding

MEMS Fab Erfurt

800 Pure MEMS 6 “ + 8 “ - WLP, TSV, noble metals, sputter, PECVD, MOCVD, electroplating, KOH, Litho, special resists , DRIE

ITZ MEMS Fab Itzehoe

1000 m2 500 m2

Pure MEMS 8 “

0.8 µm WLP, Noble Metals, evap.,sputter, PECVD, ALD electroplating, DRIE, KOH/TMAH, litho, special resists, ALN, PZT, HT Oxide, LPCVD Si/SiN, VPE

CMP 150 m2 CMOS 6 “ + 8 “ - CMP

DRS CMOS-MEMS 2000 m2 CMOS 8 “ 0.35 µm CMOS, Thermopiles, Microphones

KUC CMOS - CMOS 8 “ 0.35 µm 0.13 µm

CMOS, Metal MEMS

LBB CMOS - CMOS 6 “ 0.6 µm Special Processes

CMOS-MEMS CC-MEMS

LBB

DRS

ERF

KCH

CMOS-MEMS

LBB

DRS

ERF

KCH

ERF

MEMS

MFE

MFI

MEMS FAB Itzehoe (Operational 2014)

Company Confidential 7

MEMS FAB Erfurt (Operational 2015)

Company Confidential 8

Application of MEMS

Company Confidential 9

MEMS - An Essential Part of More than Moore

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MEMS

MEMS - An Essential Part of More than Moore

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MEMS Applications – Innovation & Diversification

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MEMS Applications – Innovation & Diversification

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MEMS Applications – Innovation & Diversification

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MEMS Applications – Innovation & Diversification

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MEMS Applications – Innovation & Diversification

Internet of Things – Everything is connected

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Source: Cymbet Website

MEMS Growth – Innovation & Diversification

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Established MEMS finding new market

Inertial Sensors

1. Military

2. Automotive

3. Consumer

enabling new features

Adaption

Challenge of MEMS Manufacturing

Company Confidential 19

MEMS vs. IC Technology

IC Technology Bipolar, TTL CMOS BiCMOS Analogue/Mixed Circuit ….

MEMS Technology MEMS MOEMS RF MEMS BioMEMS µFluidics ……

Sequentiel Processing

Characteristics of IC Technology (CMOS)

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Layout Schematic

Microcontroller Microprocessor

DRAM Embedded

Systems

VHDL Verilog Netlist Libray PDK

Logic

Design Generic Device Construction

Manufacturing Generic Process Modules

Formation

Similarity = Synergy

Schematic

Elementary Building Blocks Transistor, Resistor, Capacitor

Characteristics of MEMS Technology

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Sensors µMirrors Switches VarCaps

Lab on Chip

Formation Layout + Process

No Elementary Building

Blocks Available

Analytical Model

Coventor ANSYS Comsol

Technical Systems

Mechanics, Electrodynamics, Optics, Fluidics, Chemistry

1st MEMS Law: One Product – One Process – One Package

Interaction Mature IC Technology + Speciality Processes

Singular Device Construction

However there is a huge potential for optimization {Process, Design, Architecture}

Courtesy of Fraunhofer ISIT

Example: Diversity in Pressure Sensors

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Physical Principle

• Piezoresistive

• Capacitive

• Piezoelectric

• Strain Gauge

System

• Monolithic

• CMOS Integrated

• Package / Functionality

• Sensor Fusion

Technology

• Bulk Micromachining

• Surface Micromachining

• Membrane

• Ion Implant

• Glass bonding

Design

• Pressure Range

• Resolution

• Linearity

• Burst pressure

• Cost

• Reliability

• Manufacturability

2) Process Transfer Challenge: Interaction between Design Equipment Process

Example: Deep Reactive Ion Etching DRIE for Gyrometers yielding from 5% to 95% depending on equipment type

Lack of Generic MEMS Processes

DRIE Equipment A DRIE Equipment B

1) MEMS Architecture Different Technical Solutions Mechanical active material LPCVD-Si SOI / Epi Poly-Si Wafer Level Packaging Glass Frit Solder Alloy Bonding Deep Reactive Ion Etching DRIE High Rate High Precision Through Silicon Vias Pre MEMS Post MEMS Integration Level Monolithic Integration Hybrid Package

Multiphysics on Complex Systems

External Voltage

Surface Charge, Dangling

Bonds, Trapped Charges

(Oxide)

Mechanical Adhesion by

Micro Clamping

Hydrogen Bonds

Van-der-Waals Forces

Doping Level of Contact

Material

Dipol-Dipol intermoleculare

force

Dynamic

Stiction

Tribomechanical

Modelling

Energy Dissipation

Mechanical Damage

Surface Layer Damage

Wear, Abbrassion

Ionisation

Thermal Energy Impact

Boundary Layer Removal

Boundary Layer Modification

Mechanical Adhesion by

Micro clamping

Electrostatic Force

Static

Stiction

Surface Adhesion by

intermoleculare and

interatomic Forces

Capillary Force

Casimir Force

Adhesion Energy

vs.

Restoring Energy

(Momentum and

Impuls)

Physico-Electro-Chemical-Mechanical Modelling

Product Development Cycle

IC Technology MEMS Technology

Design X,Y Electrical Properties rel., er, UT, IL, UB, Imax, ...

Design X,Y, Z Electrical Properties rel., er, mr, ... Mechanical Properties E, K, n, smax, Fatigue, Creep Thermal Properties at, K + Surface Physics, Chemistry, Diffusion, Electro-Chemistry,...

MEMS Development Essentials: -> Iterative and Interactive Product Development Cycle -> MEMS Product Commercialization > 5-10 years

MEMS Product / Technology Development Path

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• Business case hopefully based on real rather than theoretical markets!

• Even more “COLT” approach here - no reproducible product

• Development partner without volume production experience

• “One product – one process” dilemma • Process development too expensive

for many new products without critical market size/potential

Generic value chain is easy – typical issues and problems can make it messy!

A feasible value chain for MEMS development, production and marketing is easily drawn! BUT!

• OEMs/customers without MEMS experience define MEMS products

• Unstructured development following the “COLT” approach (Came Out Like This)

• Process flow quality!

• R&D meets Operations!

• ROI for capacity and capability expansion not attractive for one product only

Product Specification

Process Selection /

Development

Product Development

Prototype Manufacturing

Transfer to Volume

Volume Manufacturing

Marketing & Sales

MEMS Demon

Cost Structure

~ 30-50 Mio Units / 10'000 Wafer p.a. / 30 Mio. € Invest

Depreciation > 300 $ / Wafer

Volume / Fragmentation

Main Challenges

Company Confidential 29

MEMS can be different from CMOS to boost performance

MEMS Technology is fragmented due to lack of unit cell

Principal Capability is not equal to real capability

MEMS Foundry subject may be different to CMOS Foundry

Strong and Fundamental Experience on all Levels of Development

Paths needed

XFAB Solution

Company Confidential 30

> X-FAB’s own Process Technologies with Customer Owned Tooling (COT)

Qualified, open-platform, process technologies with design rules and specifications that your designers can use to develop products

MEMS Foundry – Open-Platform COT Technologies

Inclination Sensor

Micro Fluidic Device

Micro Thermal Device

Discrete Silicon Strain Gauge

BioMEMS

Piezo-Resistive Acceleration Sensor

CUSP

Capacitive Pressure Sensor

MEMS Customer Specific (CUSP) Technology

CMOS Integrated Piezo-Resistive Strain Gauge

> Numerous customer specific projects developed for production in X-FAB

> Utilize processes such as deep silicon etching, material stress control, wafer

bonding, front-side / back-side alignment and CMOS integration.

> Applications in consumer, mobile, medical, industrial, aerospace and automotive

To deal with wide variety X-FAB: Module-Based Technology

Company Confidential 33

Substrates

Bulk Wafers

Cavity Wafer Module

SOI Wafer Module

Epi Wafers

Glass Wafers

MEMS

Elements

Low Stress Membrane

Seismic Mass

Capacitive Drive/Sense

Piezoresistive Sense

Piezoelectric Drive/Sense

Conductor

Resistors

Variable Capacitors

MEMS

Process

Anisotropic Etching

DRIE

Metal

Electroplating

Vapour Phase Etching

Thick/Spray Resist

ALD

Metal CMP

Advanced Functional Materials

Silicon-Rich Nitride

ALN

PZT

NiFe

Noble Metals

CMOS Integration

CMOS

CMOS

MEMS

ASIC as Cap Wafer

Transfer Printing

WLP / 2.5D / 3D / Assembly

Wafer Bonding

Grinding / Polishing

TSV in Si or Glass

RDL / UBM/ Bump

Chip

Singulation

Close Collaboration Required

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Company Confidential 35

> Fraunhofer ISIT

R&D Center for Microelectronics and MEMS

– 2000 m2 Clean Room for IC

– 1000m2 for MEMS

– BEOL production area / laboratory area

> Dual-Use with On-Site Production Partners

– X-FAB MEMS Foundry Itzehoe

– VishayPowerMOS Production

X-FAB Cooperation with Fraunhofer ISIT

Strategic Collaboration Throughout the Supply Chain

5 to 10 years from idea to volume production

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Important investment in resources and equipment

Foundry is crucial stakeholder

Ecosystem around foundry can add value

Product Specification

Process Selection /

Development

Product Development

Prototype Manufacturing

Transfer to Volume

Volume Manufacturing

Marketing & Sales

Powering IoT by Vibration Energy Harvesting

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Wafer-level packaged harvester

M

k

external vibration

Resonant mode Impulse mode

Strategic Collaboration 1+1 = 4

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Prototype development

Development complete/ Production transfer

Pre-production Production

2011-2013 Nov 2013 2009 - 2011 Sep 2014

Financial investment in a technology to provide a solution to power the IoT Be the volume MEMS manufacturing partner for Microgen Component companies within collaboration group can integrate the vibration energy harvesting technology in their system As a solution provider to offer the unique Vibration Energy Harvesting technology for foundry customers in combination with other X-FAB manufacturing service

X-FAB Offer

Company Confidential 39

Balanced Mix of Single Capability, Module Technology and Open

Process Platform

Strong MEMS Development Team to support

• Process Development

• Process Transfer

• Yield Improvement

Balanced Production Mix Volume vs. Costs

Strategic Alliance with Customer to form a Virtual IDM

Strategic Cooperation

• with Industrial Research to fasten commercialisation (Dual-Use)

• within Supply Chain to leverage vertical manufacuring depth

• with other parts of Industry to enlargen technology portfolio

Summary

MEMS is only at the verge of its development

MEMS applications are extremely diverse and would seriously limit the innovation when we squeeze it into standard platforms.

Typically very long trajectory from idea to revenue, therefore we offer a modular system to accelerate and de-risk the technology development

Strategic collaboration to increase success rate

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