Bosch Sensortec BMX055 9-Axis MEMS IMU teardown reverse costing report published by Yole...

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 1

Electronic Costing & Technology Experts

www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]

December 2013 – Version 1 – Written by Romain Fraux

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http://www.systemplus.fr/index.php?lang=ge&page=home.php

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Bosch BMX055 9-Axis MEMS IMU

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Glossary1. Overview / Introduction 4

– Executive Summary– Reverse Costing Methodology

2. Company Profile 7– Bosch Sensortec– BMX055 Characteristics

3. Physical Analysis 19– Synthesis of the Physical Analysis– Physical Analysis Methodology– Package

– Package Views, Dimensions & Pin Out– Package Opening– Wire Bonding Process– Package Cross-Section

– ASIC Gyro & Accelero Dies– View, Dimensions & Marking– Delayering– Main Blocks Identification– Cross-Section – Process Characteristics

– MEMS Gyro & Accelero Dies– View, Dimensions & Marking– Bond Pad Opening & Bond Pad– Cap Removed & Cap Details– Sensing Area Details– Cross-Section (Sensor, Cap & Bonding)– Process Characteristics

– Magnetometer Die– View, Dimensions & Marking– Hall sensor and fluxgate sensors– Delayering– Main Blocks Identification– Cross-Section (CMOS & Sensor)– Process Characteristics

4. Manufacturing Process Flow 137– Global Overview– ASIC Gyro & Accelero Front-End Process– MEMS Gyro & Accelero Process Flow– Magnetometer Process Flow– Wafer Fabrication Unit– Packaging Process Flow– Package Assembly Unit

5. Cost Analysis 167– Synthesis of the cost analysis– Main steps of economic analysis– Yields Hypotheses– ASIC Gyro & Accelero Front-End Cost– ASIC Gyro & Accelero Back-End 0 : Probe Test & Dicing– ASIC Gyro & Accelero Wafer & Die Cost– MEMS Gyro & Accelero Front-End Cost– MEMS Gyro & Accelero Front-End Cost per process steps– MEMS Gyro & Accelero Back-End 0 : Probe Test & Dicing– MEMS Gyro & Accelero Wafer & Die Cost– Magnetometer CMOS Front-End Cost– Magnetometer Sensor Cost– Magnetometer Sensor Cost per process steps– Magnetometer Back-End 0 : Probe Test & Dicing– Magnetometer Wafer & Die Cost– Back-End : Packaging Cost– Back-End : Packaging Cost per Process Steps– Back-End : Final Test & Calibration Cost– BMX055 Component Cost

6. Estimated Price Analysis 215– Manufacturer Financial Ratios– Estimated Selling Price

Contact 220


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The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price


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• Package is analyzed and measured.

• The package is opened to get overall dies data: dimensions, main characteristics, device markings.

– Pictures of selected area are made in order to understand the connections between the MEMS and the ASIC.

• The ASICs are separated to get overall dies data: dimensions, main blocks, pad number and pin out,die marking.

– Removal of metal layers (step by step) to measure the minimum dimensions.

– Pictures of selected areas to identify the nature of the transistors.

– SEM photographs to measure the transistors dimensions.

• The MEMS are separated to get overall dies data: dimensions, main blocks, pad number and pinout, die marking.

– SEM pictures of mechanical structures.

– Cross section of MEMS to measure thicknesses.


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• Package: LGA 20-pin

• Dimensions: 4.5 x 3.0 x 0.95mm

• Pin Pitch: 0.5mm

• Marking:

X55E

A1310

9D-C1

Package top view

Package back viewPackage Side View

Orientation of Axes(from datasheet)


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• The die marking includes the logo of Bosch and:

BAG160C

BOSCH

2012

ASIC Gyro Die Marking


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CMG

130Q

MEMS Gyro Die Marking

MEMS bond pads


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BAA255CA

BOSCH

2012

ASIC Accelero Die Marking


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• The die marking includes:

BOSCH

CMA232T

MEMS Accelero Die Marking

MEMS Accelero bond pads


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BAM150AB

BOSCH

2012

Magnetometer Die Marking


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Si wafer

•Thinning 300µm

•Pad oxide (Oxide1) deposit

Si wafer

•Buried Poly (Poly1) deposition

• Ion implantation

•Pattern & etch

Si wafer

• Sacrificial Oxide 1 (Oxide 2) deposit

•Pattern & etch

Si wafer

• Seed Layer (Poly 2) Deposition

• Ion implantation

•Pattern & Etch


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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated).

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:USA Office• Michael McLaughlin, Business Development Manager, Phone: (650) 931 2552 - Cell: (408) 839 7178 - Email: [email protected]

• Jeff Edwards, Sales Associate, Yole Inc., Cell: (972) 333 0986- Email: [email protected]

Japan Office• For custom research: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.

Phone: (81) 362 693 457 - Cell : (81) 80 3440 6466 - Fax: (81) 362 693 448 - Email: [email protected]

• For reports business: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.Email: [email protected]

European Office• Yves Devigne, Europe Business Development Manager, Cell : +33 6 75 80 08 25 - Email : [email protected]

• Yole Développement Headquarter, France: David Jourdan, Sales Coordination & Customer Service, Tel: +33 472 83 01 90, Email: [email protected]

Korea Office • Hailey Yang, Business Development Manager, Phone : (82) 2 2010 883 - Cell: (82) 10 4097 5810

- Fax: (82) 2 2010 8899 – Email: [email protected]








Bosch Sensortec BMX055 9-Axis MEMS IMU teardown reverse costing report published by Yole...

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