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How to bring MEMS into a foundry? The challenge of MEMS product implementation.
Dr. Peter Merz, X-FAB MEMS BU Manager
MEMS Sensor Seminar - Sensor Roadmap: The Pathway to the next 'BigThing‘ Munich, 20.03.2014
Content
Company Confidential 3
Introduction to X-FAB
Application of MEMS
Challenge of MEMS Manufacturing
Solutions
Company Confidential 4
Key Facts
> Market leader for More than Moore foundry services
– 20 years of experience in specialty foundry services
– Flexible combination and integration of power, high-voltage, analog, sensors and non-volatile memory features
– Best-in-class design and engineering support
> Technologies interfacing the real world
– Technologies for sensors, actuators, automotive, power management and integrated optics
– Process technologies from 1.0 µm to 0.13 µm
> Global presence
– 5 wafer fab facilities in Germany (3), Malaysia and US
– Capacity: 62,000 eight inch equiv. wafer starts per month
– All production sites are automotive qualified
– 2,400 employees worldwide
- X-FAB MEMS Foundry Itzehoe has joined X-FAB group
Erfurt, Germany
Kuching, Malaysia
Dresden, Germany
Lubbock, USA
Itzehoe, Germany
MEMS
CMOS-MEMS
XFAB MEMS Foundry Service
Company Confidential 5
Itzehoe, Germany Erfurt, Germany
Dresden, Germany Kuching, Malaysia Lubbock, USA Erfurt, Germany
XMF X-FAB MEMS Foundry
CMOS integrated MEMS manufacturing
Dedicated MEMS fabrication in Itzehoe and Erfurt
Enabling the Customers by Material Capability and Capacity
Premium Quality Systems / Production Environement
MEMS Business Unit One-Stop-Shop for MEMS
Company Confidential 6
MEMS Production Sites
Site CR Space Cleanroom Size Node Main Capability
ERF CMOS-MEMS Site A CMOS 6 “ 8 “
0.6 µm CMOS DRIE, Anneal, Litho, Release, DRIE, Anneal, Litho
MEMS KOH Center
400m2 CMOS 6 “ + 8 “ 0.6 µm KOH, Fusion Bonding
MEMS Fab Erfurt
800 Pure MEMS 6 “ + 8 “ - WLP, TSV, noble metals, sputter, PECVD, MOCVD, electroplating, KOH, Litho, special resists , DRIE
ITZ MEMS Fab Itzehoe
1000 m2 500 m2
Pure MEMS 8 “
0.8 µm WLP, Noble Metals, evap.,sputter, PECVD, ALD electroplating, DRIE, KOH/TMAH, litho, special resists, ALN, PZT, HT Oxide, LPCVD Si/SiN, VPE
CMP 150 m2 CMOS 6 “ + 8 “ - CMP
DRS CMOS-MEMS 2000 m2 CMOS 8 “ 0.35 µm CMOS, Thermopiles, Microphones
KUC CMOS - CMOS 8 “ 0.35 µm 0.13 µm
CMOS, Metal MEMS
LBB CMOS - CMOS 6 “ 0.6 µm Special Processes
CMOS-MEMS CC-MEMS
LBB
DRS
ERF
KCH
CMOS-MEMS
LBB
DRS
ERF
KCH
ERF
MEMS
MFE
MFI
MEMS FAB Itzehoe (Operational 2014)
Company Confidential 7
MEMS FAB Erfurt (Operational 2015)
Company Confidential 8
Application of MEMS
Company Confidential 9
MEMS - An Essential Part of More than Moore
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MEMS
MEMS - An Essential Part of More than Moore
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MEMS Applications – Innovation & Diversification
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MEMS Applications – Innovation & Diversification
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MEMS Applications – Innovation & Diversification
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MEMS Applications – Innovation & Diversification
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MEMS Applications – Innovation & Diversification
Internet of Things – Everything is connected
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Source: Cymbet Website
MEMS Growth – Innovation & Diversification
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Established MEMS finding new market
Inertial Sensors
1. Military
2. Automotive
3. Consumer
enabling new features
Adaption
Challenge of MEMS Manufacturing
Company Confidential 19
MEMS vs. IC Technology
IC Technology Bipolar, TTL CMOS BiCMOS Analogue/Mixed Circuit ….
MEMS Technology MEMS MOEMS RF MEMS BioMEMS µFluidics ……
Sequentiel Processing
Characteristics of IC Technology (CMOS)
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Layout Schematic
Microcontroller Microprocessor
DRAM Embedded
Systems
VHDL Verilog Netlist Libray PDK
Logic
Design Generic Device Construction
Manufacturing Generic Process Modules
Formation
Similarity = Synergy
Schematic
Elementary Building Blocks Transistor, Resistor, Capacitor
Characteristics of MEMS Technology
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Sensors µMirrors Switches VarCaps
Lab on Chip
Formation Layout + Process
No Elementary Building
Blocks Available
Analytical Model
Coventor ANSYS Comsol
Technical Systems
Mechanics, Electrodynamics, Optics, Fluidics, Chemistry
1st MEMS Law: One Product – One Process – One Package
Interaction Mature IC Technology + Speciality Processes
Singular Device Construction
However there is a huge potential for optimization {Process, Design, Architecture}
Courtesy of Fraunhofer ISIT
Example: Diversity in Pressure Sensors
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Physical Principle
• Piezoresistive
• Capacitive
• Piezoelectric
• Strain Gauge
System
• Monolithic
• CMOS Integrated
• Package / Functionality
• Sensor Fusion
Technology
• Bulk Micromachining
• Surface Micromachining
• Membrane
• Ion Implant
• Glass bonding
Design
• Pressure Range
• Resolution
• Linearity
• Burst pressure
• Cost
• Reliability
• Manufacturability
2) Process Transfer Challenge: Interaction between Design Equipment Process
Example: Deep Reactive Ion Etching DRIE for Gyrometers yielding from 5% to 95% depending on equipment type
Lack of Generic MEMS Processes
DRIE Equipment A DRIE Equipment B
1) MEMS Architecture Different Technical Solutions Mechanical active material LPCVD-Si SOI / Epi Poly-Si Wafer Level Packaging Glass Frit Solder Alloy Bonding Deep Reactive Ion Etching DRIE High Rate High Precision Through Silicon Vias Pre MEMS Post MEMS Integration Level Monolithic Integration Hybrid Package
Multiphysics on Complex Systems
External Voltage
Surface Charge, Dangling
Bonds, Trapped Charges
(Oxide)
Mechanical Adhesion by
Micro Clamping
Hydrogen Bonds
Van-der-Waals Forces
Doping Level of Contact
Material
Dipol-Dipol intermoleculare
force
Dynamic
Stiction
Tribomechanical
Modelling
Energy Dissipation
Mechanical Damage
Surface Layer Damage
Wear, Abbrassion
Ionisation
Thermal Energy Impact
Boundary Layer Removal
Boundary Layer Modification
Mechanical Adhesion by
Micro clamping
Electrostatic Force
Static
Stiction
Surface Adhesion by
intermoleculare and
interatomic Forces
Capillary Force
Casimir Force
Adhesion Energy
vs.
Restoring Energy
(Momentum and
Impuls)
Physico-Electro-Chemical-Mechanical Modelling
Product Development Cycle
IC Technology MEMS Technology
Design X,Y Electrical Properties rel., er, UT, IL, UB, Imax, ...
Design X,Y, Z Electrical Properties rel., er, mr, ... Mechanical Properties E, K, n, smax, Fatigue, Creep Thermal Properties at, K + Surface Physics, Chemistry, Diffusion, Electro-Chemistry,...
MEMS Development Essentials: -> Iterative and Interactive Product Development Cycle -> MEMS Product Commercialization > 5-10 years
MEMS Product / Technology Development Path
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• Business case hopefully based on real rather than theoretical markets!
• Even more “COLT” approach here - no reproducible product
• Development partner without volume production experience
• “One product – one process” dilemma • Process development too expensive
for many new products without critical market size/potential
Generic value chain is easy – typical issues and problems can make it messy!
A feasible value chain for MEMS development, production and marketing is easily drawn! BUT!
• OEMs/customers without MEMS experience define MEMS products
• Unstructured development following the “COLT” approach (Came Out Like This)
• Process flow quality!
• R&D meets Operations!
• ROI for capacity and capability expansion not attractive for one product only
Product Specification
Process Selection /
Development
Product Development
Prototype Manufacturing
Transfer to Volume
Volume Manufacturing
Marketing & Sales
MEMS Demon
Cost Structure
~ 30-50 Mio Units / 10'000 Wafer p.a. / 30 Mio. € Invest
Depreciation > 300 $ / Wafer
Volume / Fragmentation
Main Challenges
Company Confidential 29
MEMS can be different from CMOS to boost performance
MEMS Technology is fragmented due to lack of unit cell
Principal Capability is not equal to real capability
MEMS Foundry subject may be different to CMOS Foundry
Strong and Fundamental Experience on all Levels of Development
Paths needed
XFAB Solution
Company Confidential 30
> X-FAB’s own Process Technologies with Customer Owned Tooling (COT)
Qualified, open-platform, process technologies with design rules and specifications that your designers can use to develop products
MEMS Foundry – Open-Platform COT Technologies
Inclination Sensor
Micro Fluidic Device
Micro Thermal Device
Discrete Silicon Strain Gauge
BioMEMS
Piezo-Resistive Acceleration Sensor
CUSP
Capacitive Pressure Sensor
MEMS Customer Specific (CUSP) Technology
CMOS Integrated Piezo-Resistive Strain Gauge
> Numerous customer specific projects developed for production in X-FAB
> Utilize processes such as deep silicon etching, material stress control, wafer
bonding, front-side / back-side alignment and CMOS integration.
> Applications in consumer, mobile, medical, industrial, aerospace and automotive
To deal with wide variety X-FAB: Module-Based Technology
Company Confidential 33
Substrates
Bulk Wafers
Cavity Wafer Module
SOI Wafer Module
Epi Wafers
Glass Wafers
MEMS
Elements
Low Stress Membrane
Seismic Mass
Capacitive Drive/Sense
Piezoresistive Sense
Piezoelectric Drive/Sense
Conductor
Resistors
Variable Capacitors
MEMS
Process
Anisotropic Etching
DRIE
Metal
Electroplating
Vapour Phase Etching
Thick/Spray Resist
ALD
Metal CMP
Advanced Functional Materials
Silicon-Rich Nitride
ALN
PZT
NiFe
Noble Metals
CMOS Integration
CMOS
CMOS
MEMS
ASIC as Cap Wafer
Transfer Printing
WLP / 2.5D / 3D / Assembly
Wafer Bonding
Grinding / Polishing
TSV in Si or Glass
RDL / UBM/ Bump
Chip
Singulation
Close Collaboration Required
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Company Confidential 35
> Fraunhofer ISIT
R&D Center for Microelectronics and MEMS
– 2000 m2 Clean Room for IC
– 1000m2 for MEMS
– BEOL production area / laboratory area
> Dual-Use with On-Site Production Partners
– X-FAB MEMS Foundry Itzehoe
– VishayPowerMOS Production
X-FAB Cooperation with Fraunhofer ISIT
Strategic Collaboration Throughout the Supply Chain
5 to 10 years from idea to volume production
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Important investment in resources and equipment
Foundry is crucial stakeholder
Ecosystem around foundry can add value
Product Specification
Process Selection /
Development
Product Development
Prototype Manufacturing
Transfer to Volume
Volume Manufacturing
Marketing & Sales
Powering IoT by Vibration Energy Harvesting
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Wafer-level packaged harvester
M
k
external vibration
Resonant mode Impulse mode
Strategic Collaboration 1+1 = 4
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Prototype development
Development complete/ Production transfer
Pre-production Production
2011-2013 Nov 2013 2009 - 2011 Sep 2014
Financial investment in a technology to provide a solution to power the IoT Be the volume MEMS manufacturing partner for Microgen Component companies within collaboration group can integrate the vibration energy harvesting technology in their system As a solution provider to offer the unique Vibration Energy Harvesting technology for foundry customers in combination with other X-FAB manufacturing service
X-FAB Offer
Company Confidential 39
Balanced Mix of Single Capability, Module Technology and Open
Process Platform
Strong MEMS Development Team to support
• Process Development
• Process Transfer
• Yield Improvement
Balanced Production Mix Volume vs. Costs
Strategic Alliance with Customer to form a Virtual IDM
Strategic Cooperation
• with Industrial Research to fasten commercialisation (Dual-Use)
• within Supply Chain to leverage vertical manufacuring depth
• with other parts of Industry to enlargen technology portfolio
Summary
MEMS is only at the verge of its development
MEMS applications are extremely diverse and would seriously limit the innovation when we squeeze it into standard platforms.
Typically very long trajectory from idea to revenue, therefore we offer a modular system to accelerate and de-risk the technology development
Strategic collaboration to increase success rate
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