Radiation Tests on IHP’s SiGe Technologies for the Front-End Detector Readout in the S-LHC
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Transcript of Radiation Tests on IHP’s SiGe Technologies for the Front-End Detector Readout in the S-LHC
Radiation Tests on IHP’s SiGe Technologies for the Front-End Detector Readout in the S-LHC
M. Ullán,
S. Díez, F. Campabadal, G. Pellegrini, M. Lozano
CNM (CSIC), Barcelona
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
FrameworkIncreased luminosity at S-LHC 2 main challenges on Electronics: Instantaneous High occupancy pile up
Higher segmentation More channels Power, Services Increased shaping time Speed, Power
Integrated Radiation Degradation Charge Collection Efficiency ↓ Signal ↓ Gain, Power Gain degradation Current ↑ Power Noise degradation S/N ↓ Noise, Power
Need to find a proper technology that deals with these challenges High speed, high gain with Low power consumption Radiation degradation Cost, availability (prototyping, long term production)
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
General Aims
Evaluation of SiGe BiCMOS technologies for the readout of the
upgraded ATLAS ID Evaluate radiation hardness
Prove power saving with speed and gain
Proposal of one SiGe BiCMOS technology for the IC-FE design
Design of a prototype Front End IC.
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
IHP’s SiGe Technologies
Main200 GHz
0.13 m
Alternative
Low cost
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
Experiments
2 general experiments:
Exp 1: “first approximation” 2 technologies
Gamma irradiations up to 10 and 50 Mrads(Si)
Neutron irradiations
Exp 2: Final total dose results 3 technologies
Gamma irradiations up to 10 and 50 Mrads(Si)
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
Exp 1: Samples
2 Test chip wafer pieces with ~20 chips
2 Technologies: SGC25C (bip. module equivalent to SG25H1)
SG25H3 (Alternative technology)
Edge effects: Solved in next samples
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
Irradiation Setup
4 chips per board, 2 of each technology
2 different transistor sizes:
0.21 x 0.84 μm2
0.42 x 0.84 μm2
Biased
Pb(2 mm) – Al(2 mm) shielding box
NAYADE: “Water Well” Co60
source at Madrid (CIEMAT)
~300 rad(Si)/s up to 10 Mrad(Si)
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
IHP’s SGC25C Technology
Bip. tr. equivalent to SG25H1 technology (fT = 200 GHz)
No Annealing !
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
IHP’s SG25H3 Technology
fT = 120 GHz, Higher breakdown voltages
Annealing after 50 Mrads: 48 hours, very good recovery
Very low gains before irrad (edge wafer transistors)
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
Results Exp 1
Excess Base Current @ 0.7 V [10 Mrad(Si)]
0.E+00
5.E-01
1.E+00
2.E+00
2.E+00
3.E+00
3.E+00
4.E+00
4.E+00
5.E+00
5.E+00
C1N1
C1X1
C2N1
C2X1
C3N1
C3X1
C4N1
C4X1
C3A61
C4A61
C3A21
C3A41
C4A21
C4A41
Exc
ess
Bas
e C
urr
ent (
DIB/D
I B0)
SGC25C
SG25H3
unbiased
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
Results Exp 1
Bias Current for beta > 50 after 10 Mrad(Si)Collector Current for beta > 50 after 10 Mrad(Si)
0.0E+00
1.0E-06
2.0E-06
3.0E-06
4.0E-06
5.0E-06
6.0E-06
7.0E-06
8.0E-06
9.0E-06
1.0E-05
1.1E-05
1.2E-05
C1N1
C1X1
C2N1
C2X1
C3N1
C3X1
C4N1
C4X1
C3A61
C4A61
C3A21
C3A41
C4A21
C4A41
IC(B
eta>
50)
(A
)
SGC25C SG25H3
unbiased
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
Exp 2: Samples
3 Test chip wafer center pieces with > 20 chips
3 Technologies: SG25H1 (“Wafer D”)
SG25H3 (“Wafer I”)
SGC25VD (“Wafer V”)
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
Exp 2: Samples
target = 190
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
Exp 2: Samples
target = 190
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
Exp 2: Samples
No edge effect in the area of interestS462b (Z2)S461c (Y3)
-3 -2 -1 0 1 2 3
8
7
6
5
4
3
2
1
0105
125
145
165
185
205
185-205
165-185
145-165
125-145
105-125
-3 -2 -1 0 1 2 3
8
7
6
5
4
3
2
1
0
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
Exp 2: Samples
target = 200
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
Exp 2: Samples
target = 150
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
Heavy rad damage Transistors heavily damaged but still functional Possible damage saturation Significant beneficial annealing
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
Results Exp 2
Normalized gain f/0 @VBE = 0.7 V
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
FJ1
N
FJ2
N
FJ3
N
FJ4
N
FL
1N
FL
2N
FL
3N
FL
4N
FL
1X
FL
2X
FL
3X
FL
4X
FM
1Y
3
FM
2Y
3
FM
3Y
3
FM
4Y
4
FM
1Z
2
FM
2Z
2
FM
3Z
2
FM
4Z
2
FM
1Z
3
FM
2Z
3
FM
3Z
3
FM
4Z
3
Transistor
Be
ta N
10Mrad
10Mrad+ANN
50Mrad
50Mrad+ANN
SG25H1 SG25H3 SGB25VD
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
Results Exp 2
Normalized base current density JBf/JB0 @VBE = 0.7 V
0
2
4
6
8
10
12
14
FJ1
N
FJ2
N
FJ3
N
FJ4
N
FL
1N
FL
2N
FL
3N
FL
4N
FL
1X
FL
2X
FL
3X
FL
4X
FM
1Y
3
FM
2Y
3
FM
3Y
3
FM
4Y
4
FM
1Z
2
FM
2Z
2
FM
3Z
2
FM
4Z
2
FM
1Z
3
FM
2Z
3
FM
3Z
3
FM
4Z
3
tr
Jb N
10Mrad
10Mrad+ANN
50Mrad
50Mrad+ANN
SG25H1 SG25H3 SGB25VD
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
Results Exp 2
Collector current needed for = 50
1.E-08
1.E-07
1.E-06
1.E-05
1.E-04F
J1N
FJ2
N
FJ3
N
FJ4
N
FL
1N
FL
2N
FL
3N
FL
4N
FL
1X
FL
2X
FL
3X
FL
4X
FM
1Y
3
FM
2Y
3
FM
3Y
3
FM
4Y
4
FM
1Z
2
FM
2Z
2
FM
3Z
2
FM
4Z
2
FM
1Z
3
FM
2Z
3
FM
3Z
3
FM
4Z
3
tr
Ic(5
0)
[A]
10Mrad
10Mrad+ANN
50Mrad
50Mrad+ANN
SG25H1 SG25H3 SGB25VD
~ 3 μA
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
Exp 2: Tech. comparison
Current Gain Degradation
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
0 10 20 30 40 50 60
Gamma Dose [Mrad(Si)]
No
rmal
ized
Gai
n
SG25H1
SG25H3
SGB25VD
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
Exp 2: Tech. comparison
Collector current for = 50
1.E-07
1.E-06
1.E-05
1.E-04
10 50
Gamma Dose [Mrad(Si)]
Ic (
Bet
a =
50)
SG25H1
SG25H3
SGB25VD
No annealing
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
Other results
Annealing:Annealing Jb N
0
1
2
3
4
5
6
7
8
9
0 5 10 15 20 25Days
Jb N
FM1Y3
FM2Y3
FM1Z2
FM2Z2
FM3Z2
FM4Z2
FM1Z3
FM2Z3
FM3Z3
FM4Z3
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
Other results
Biasing:
0.00
1.00
2.00
3.00
4.00
5.00
6.00
7.00
8.00
9.00
10.00
BIASED GROUNDED FLOATING
Nor
m.
Exc
ess
J B
10 Mrad(Si)
50 Mrad(Si)
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
Conclusions
Evaluation of three different IHP’s SiGe BiCMOS technologies Results indicate that IHP’s technologies would remain functional
after S-LHC life span Not large differences in degradation among technologies,
although one can see: Higher damages in SG25H1 technology,
lower damages in SG25H3 technology
Annealing behavior studied, saturation is observed. It has been proven that device irradiations with floating terminals
produce an over-damage on the devices. Small damage differences between biasing or grounding the devices during irradiations.
Prague, June 20068th RD50 Workshop Miguel Ullán – CNM, Barcelona
Future work
100 Mrads(Si) total dose
LDRE – damage vs. dose mapping
Measure more devices/components of technologies
More statistics needed for a finer data analysis
Study emitter geometry influence
Specific TEST CHIP for irradiations is being designed
Investigate damage under n and p irradiation
Temperature influence
Compare with other SiGe technologies Choose DESIGN FE CHIP