Micro Electro Mechanical Systems (MEMS) Class Materials - Lecture 02
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Transcript of Micro Electro Mechanical Systems (MEMS) Class Materials - Lecture 02
Department of Instrumentation & Control Engineering, MIT, Manipal
Lecture #02
MEMS – An Overview
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Department of Instrumentation & Control Engineering, MIT, Manipal
Contents
1. Advantages and limitations
2. Applications
3. Visual Examples of MEMS Devices
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S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Advantages and limitations
Advantages:
� Small systems tend to move or stop more quickly due to low mechanical
inertia.
� It is thus ideal for precision movements and for rapid actuation.
� Miniaturized systems encounter less thermal distortion and mechanical
vibration due to low mass.
� Miniaturized devices are particularly suited for biomedical and aerospace
applications due to their minute sizes and weight.
� Small systems have higher dimensional stability at high temperature due
to low thermal expansion.
� Smaller size of the systems means less space requirements.
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S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Advantages and limitations
� This allows the packaging of more functional components in a single
device.
� Less material requirements mean low cost of production and transportation.
� Ready mass production in batches.
� Higher surface to volume ratio.
Limitations:
� Friction is greater than inertia. Capillary, electrostatic and atomic forces as
well as stiction at a micro-level can be significant.
� Heat dissipation is greater than heat storage and consequently thermal
transport properties could be a problem or, conversely, a great benefit.
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S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Advantages and limitations
� Fluidic or mass transport properties are extremely important. Tiny flow spaces
are prone to blockages but can conversely regulate fluid movement.
� Material properties (Young’s modulus, Poisson’s ratio, grain structure) and
mechanical theory (residual stress, wear and fatigue etc.) may be size dependent.
� Integration with on-chip circuitry is complex and device/domain specific. Lab-
on-a-chip systems components may not scale down comparably.
� Miniature device packaging and testing is not straightforward. Certain MEMS
sensors require environmental access as well as protection from other
external influences.
� Testing is not rapid and is expensive in comparison with conventional IC
devices.
� Cost – for the success of a MEMS device, it needs to leverage its IC batch
fabrication resources and be mass-produced. Hence mass-market drivers must
be found to generate the high volume production.5
• Automobile IndustryTire pressure sensor
Engine oil sensor
Combustion sensor
Fuel rail pressure sensor
• SafetyAir Bag Deployment system
Antilock braking systems
Navigation (micro gyroscope)
• Engine and power trainAirflow control
Fuel pump pressure and fuel injection control
Crankshaft positioning
• Health care IndustryDisposable blood pressure transducer (DPT)
Intrauterine pressure sensor (IUP)
Angioplasty pressure sensor
Infusion pump pressure sensor
Sphygmomanometer
Lung capacity meters
Kidney dialysis equipment
• Aerospace IndustryCockpit Instrumentation
Micro gyroscope
Micro satellite
• Industrial ProductsWater level controls
Refrigeration systems
Manufacturing process sensor
• Consumer productsSmart Toys
Sport shoes with automatic cushioning control
Washers with water level controls
Vacuum cleaning
• TelecommunicationsOptical switching and fiber-optic couplings
RF switches
Tunable resonators
Applications
6S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Applications
7S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Applications
8S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Applications
9S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Applications
10S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Applications
11S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Applications
12S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Applications
13S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Applications
14S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Applications
15S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Applications
16S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Applications
17S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Visual Examples
18S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Accelerometers
Visual Examples
19S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Micro Flying Robot
Visual Examples
20S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
World’s Smallest Car
Visual Examples
21S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Visual Examples
22S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
World’s Smallest Guitar
Visual Examples
23S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Pressure Sensors
Visual Examples
24S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
LIGAGerman words for lithography, electroplating, and molding - High Aspect Ratio
Micromachining Technique
Low cost coplanar waveguide
Visual Examples
25S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal