Micro Electro Mechanical Systems (MEMS) Class Materials - Lecture 03
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Transcript of Micro Electro Mechanical Systems (MEMS) Class Materials - Lecture 03
Department of Instrumentation & Control Engineering, MIT, Manipal
Lecture #03
MEMS & Micro Systems
1
Department of Instrumentation & Control Engineering, MIT, Manipal
Contents
1. Micro Sensors & Actuators
2. Components of Microsystems
3. Comparison of ME & MST
4. Intelligent Microsystems
5. Further
6. Successful Devices
7. Principle Science
8. Animation Demo
2
Micro Sensors & Actuators
3
� The core element in MEMS generally consists of two principalcomponents: a sensing or actuating element and signal transduction unit.
� MEMS as a microsensor:
� Micro sensors are built to sense the existence and the intensity of certainphysical, chemical or biological quantities, such as temperature, pressure,force, sound, light, nuclear radiation, magnetic flux and chemicalcompositions.
� Common sensors include biosensors, chemical sensors, optical sensors,thermal and pressure sensors.
S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Micro Sensors & Actuators
4
� MEMS as a microactuators:
� The transduction unit converts the input power supply into the form such asvoltage for a transducer, which functions as the actuating element.
� There are several ways by which microdevice components can be actuatedsuch as electrostatic forces.
S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
� A microsystem is an engineering system that contains MEMS componentsthat are designed to perform specific engineering functions.
� Usually a microsystem will be in meso-scale even though the MEMScomponents can be produced in microns.
� A microsystem includes three major components of micro sensors,actuators and a processing unit as shown in figure.
Components of Microsystems
5S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
� One popular actuation method involves electrostatic forces generated bycharged parallel conduction plates, or electrodes separated by a dielectricmaterial such as air.
� The arrangement is similar to that of capacitors.
� The application of input voltage to the plates (i.e., the electrodes in acapacitor) can result in electrostatic forces that prompt relative motion ofthese plates in normal direction of aligned plates or parallel movement formisaligned plates.
� These motions are set to accomplish the required actions. It is used in manymicroactuators such as microgripper.
Components of Microsystems
6S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Components of Microsystems
7S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
� Most microsystems are designed and constructed to perform singlefunctions. Incorporating signal processing and closed loop feedback controlsystems in a microsystem makes the integrated system as “intelligent”systems.
Intelligent Microsystems
8S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Intelligent Microsystems
9S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Microelectronics Micro system Technology
Uses Single Crystal Silicon (SCS)
die, Si compounds.
Uses SCS die and GaAs, quartz,
polymers and metals
Stationary structures May involve moving components
Primary 2D structures
Fewer components in assembly
Complex 3D structures
Many components to be assembled.
Mature IC design methodologyLack of engineering design
methodology and standards
Manufacturing techniques are
proved and well documentedDistinct Manufacturing techniques
Packaging technology is well
established
Packaging Technology is at the
infant stage.
Comparison of ME & MST
10S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
� Working Principle based on Applications
� Materials
� Process
� Basics of Mechanics
� Design of MEMS Devices
Further
11S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
� Micro Gear: A gear made with ceramics, pitch of the gears in the order of100 microns is shown in figure. Made by a process called LIGA.
Successful Devices
12S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
� Micro Motor: An electrostatic driven micromotor produced by LIGAprocess is shown in figure. All three components – the rotor (center gear),the stator, and the torque transmission gear are made of nickel. The toothedrotor’s dia is of 700 microns and the gear is 250 microns dia. The gapbetween rotor and stator is 4 microns. The height of the unit is 120 microns.
Successful Devices
13S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
� Micro Turbine: A microturbine was produced to generate power made ofnickel in 1993 as shown in figure. The unit height is 150 microns and amaximum rotational speed 1,50,000 revolutions per minute with a lifetimeup to 100 million rotations.
Successful Devices
14S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
� Micro Switch: These components are extensively used for high speedsignal transmission. Micro optical switches are used to regulate incidentlight from optical fibers to appropriate receiving optical fibers.
Successful Devices
15S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
� Principle science and engineering disciplines involved in micro systemdesign and manufacture is shown in the figure.
Principle Science
16S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Animation Demo
17S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
3D_stack Accelerometer
Demo
Accelerometer
Demo
DLP Demo
RF Switch
Demo
Coventorware
DemoCantilever Switch
Demo