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TECHNICAL DIGEST

The Fifteenth IEEE International Conference on

Micro Electro Mechanical Systems

Sponsored by:

IEEE and the

Robotics and Automation Society

2002

LAS VEGAS, NEVADA, USAJANUARY 20-24, 2002

IEEE Catalog Number: 02CH37266

ISBN: 0-7803-7185-2

0-7803-7185-2/02/$10.00 ©2002 IEEE i

Copyright and Reprint Permission: Abstracting is permitted with credit to the source. Libraries are permitted to photocopy beyond the limits of U.S. copyright law for private use of patrons those articles in this volume that carry a code at the bottom of the first page, provided the per-copy fee indicated in the code is paid through the Copyright Clearance Center, 222 Rosewood Drive, Danvers, MA 01923. For other copying, reprint or republication permission, write to IEEE Copyrights Manager, IEEE Operations Center, 445 Hoes Lane, PO Box 1331, Piscataway, NJ 08855-1331. All rights reserved. Copyright © 2002 by The Institute of Electrical and Electronics Engineers, Inc.

IEEE Catalog Number: 02CH37266 ISBN: 0-7803-7185-2 0-7803-7186-0 (Microfiche Edition) ISSN: 1084-6999

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Welcome to Las Vegas, Nevada and the 15th IEEE International Micro Electro Mechanical Systems (MEMS) Conference. The IEEE MEMS Conference series began in 1987 as the Micro Robots and Teleoperators Workshop in the USA. It was subsequently renamed the IEEE Micro Electro Mechanical Systems Workshop, and since 1999 it has been known as the IEEE International Micro Electro Mechanical Systems Conference.

An examination of the proceedings of the MEMS conferences over the years reveals not only the growth and maturation of the MEMS research but also indications of future directions. Existing thrusts in arenas such as environmental sensors, inertial sensors, and machining of silicon and metal derivatives have been supplemented with a surge of activity in optical MEMS, RF devices, NEMS, microfluidics, and biomedical microsystems, accompanied by the expanding use of unconventional organic and inorganic materials. The enthusiasm of this research community is evident from creativity and speed with which this field is evolving.

The technical program for this year’s MEMS conference offers three invited oral presentations, 41 contributed oral presentations, and 134 contributed posters. The contributed presentations were selected from a total of more than 454 submissions. The conference retains a single-session format, with oral sessions in the mornings and poster sessions in the afternoons. This year, even more so than in the past, the poster sessions are the highlights of this conference. We have made arrangements for all the posters to be on display throughout the conference, and divided their presentations into three whole-afternoon sessions to facilitate interaction with authors. All presentations at the conference are included in the Technical Digest.

Our sincere thanks to the authors of all the submitted abstracts. It is their highest quality work that serves as the foundation for the success of this conference series. The papers were selected by a technical program committee made up with equal representation from the regional divisions, which include the American sub-continents, Europe and Africa, and Asia and Australia. In order to facilitate detailed review of the large number of submitted abstracts, three sub-committees were formed to examine abstracts in different subject categories. The committee recommendations on the acceptance and declination of papers were taken as binding. We are also greatly indebted to the members of the Technical Program Committee for volunteering so much of their time and sharing their technical expertise and insight in the paper selection process, made all the more difficult by the very high standard of the submissions. We are grateful to the International Steering Committee and the Advisory Co-Chairs, Henry Baltes and Siebe Bouwstra, for generously sharing their experiences. This conference was managed by Ms. Katharine Cline and her team at Preferred Meeting Management, Inc. (PMMI). Their expertise, diligence, and commitment to this conference were evident in every stage of its preparation. We are thankful to the IEEE Robotics and Automation Society for their support of this meeting. With the climactic international events taking place at the time of this writing, we are grateful for your continued enthusiasm and support of this conference.

Best regards,

Dr. Yogesh B. Gianchandani Dr. Yu-Chong Tai University of Michigan California Institute of Technology MEMS 2002 Conference Co-Chair MEMS 2002 Conference Co-Chair

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2002 IEEE Micro Electro Mechanical Systems Conference Planning Committee

Conference General Co-Chairs:

Yogesh B. Gianchandani University of Michigan USA

Yu-Chong Tai California Institute of Technology USA

Designate Co-Chairs:

Young-Ho Cho Korea Advanced Institute of Science & Technology KOREA

Osamu Tabata Ritsumeikan University JAPAN

Advisory Co-Chairs:

Henry P. Baltes ETH Zürich SWITZERLAND

Siebe Bouwstra Coventor THE NETHERLANDS

Technical Program Committee

Tayfun Akin Middle East Technical University TURKEY



Victor M. Bright University of Colorado at Boulder USA

Young-Ho Cho Korea Advanced Inst. of Science & Technology KOREA

Kukjin Chun Seoul National University KOREA

Gary K. Fedder Carnegie Mellon University USA

Paddy French Delft University of Technology THE NETHERLANDS

Yogesh Gianchandani University of Michigan USA

Kazuhiro Hane Tohoku University JAPAN

Chih-Ming Ho University of California at Los Angeles USA

Thomas W. Kenny Stanford University USA

Sang-Wook Lee Samsung Advanced Institute of Technology KOREA

Ryo Miyake Hitachi Ltd. JAPAN

Oliver Paul Universität at Freiburg GERMANY

Kristofer S. J. Pister University of California at Berkeley USA

Ole Sigmund Technical University of Denmark DENMARK


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Technical Program Committee, continued:


Harrie A.C. Tilmans IMEC v.z.w. BELGIUM

Yitshak Zohar Hong Kong University of Science & Technology CHINA

Industrial Support Group Committee:

Advisory Members



Committee Members

Jong-Uk Bu LG Electronics Institute of Technology KOREA

Cleopatra Cabuz Honeywell Laboratories USA

Pei-Zen Chang National Taiwan University TAIWAN

Jing Cheng Tsinghua University ROC

Steve Cho Abbott Laboratories USA

Nico deRooij University of Neuchatel SWITZERLAND

Gary Fedder Carnegie Mellon University USA


John Gilbert Coventor USA

Tadashi Hattor Himeji Institute of Technology JAPAN

Michael Judy Analog Devices, Inc. USA

SukHan Lee Samsung Advanced Institute of Technology KOREA

Alex Liddle Agere Systems USA

Aric Mennon DTUDENMARK

Andy Mirza Nanovation USA

David J. Monk Motorola, Inc. USA

Andrew Oliver Sandia National Laboratory USA

Oliver Paul University of Freiburg GERMANY

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Industrial Support Group Committee, continued

Committee Members, continued

Goran Stemme Royal Institute of Technology SWEDEN


Peter Vettiger IBM Zurich Research Laboratory SWITZERLAND

Ming C. Wu University of California at Los Angeles USA

Conference Coordination:

Katharine K. Cline Shirley J. Galloway

Patricia F. Grant Preferred Meeting Management, Inc.

USA

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International Steering Committee

Co-Chairmen


Siebe Bouwstra Coventor THE NETHERLAND

Members

Young-Ho Cho Korea Advanced Institute of Science & Technology KOREA


Kaigham J. Gabriel Carnegie Mellon University USA

Yogesh B. Gianchandani University of Michigan USA

Hiroki Kuwano NIPPON Telegraph and Telephone Corporation JAPAN

Khalil Najafi University of Michigan USA

Oliver Paul University of Freiburg GERMANY

Isao Shimoyama University of Tokyo JAPAN



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MEMS 2002 Technical Program Committee

Left to right Front row (seated) Y.-C. Tai, T. Akin, Y. Zohar, K. Hane

Center: S.-W. Lee, Y.B. Gianchandani, T.W. Kenny, C.-M. Ho, O. Tabata, Y.-H. Cho

Back: K. Chun, O. Paul, G.K. Fedder, P. French, K.S.J. Pister, H.A.C. Tilmans, V.M. Bright, S. Bouwstra

Missing:H.P. Baltes, O. Sigmund, R. Miyake

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Industrial Support Group and Exhibitors

We gratefully acknowledge the support of this conference from the following companies and institutions as of the printing of December 18, 2001

Alcatel Vacuum Products, Inc. Applied MEMS, Inc.

Ardesta LLC Austriamicrosystems AG

COLIBRYS SA COMSOL, Inc.

Corning IntelliSense Coventor, Inc.

Elmicron Elsevier Science EV Group Inc.

Heidelberg Instruments Hitachi America, Ltd.

IMT – Innovative Micro Technology Integrated Sensing Systems (ISSYS), Inc.

IOP Publishing LTD Kluwer Academic Publishers

LG Electronics Inc. MEMGen Corporation MEMS Industry Group

MEMSCAP, Inc. MicroChem Corp.

microFAB Bremen GmbH MTS Systems Corporation

Oxford Instruments Pragmatic Instruments, Inc.

R&D Magazine SC Fluids

Sony Semiconductor San Antonio SpeedFam-IPEC

Stewart Technologies, Inc. Surface Technology Systems PLC

Suss MicroTec Technotrade International, INC

Tegal Corporation Trion Technology

Tronic's Microsystems Veeco Metrology Group

XACTIX, Inc. Yole Developpement

Zygo Corporation

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PROGRAM SCHEDULE

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Sunday Evening January 20, 2002

4:00 p.m. - 8:00 p.m. REGISTRATION AND WELCOME RECEPTION

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Monday Morning January 21, 2002

8:00 a.m. WELCOME ADDRESS Y.B. Gianchandani and Y.-C. Tai Conference Co-Chairmen

University of Michigan, USA and California Institute of Technology, USA

8:20 a.m. INVITED SPEAKER Convergence: Integrating Modern Biology with Modern Engineering 1

C.D. Montemagno and Hercules Neves University of California at Los Angeles, USA

SESSION 1 - BIOMEDICAL MEMS

Session Chairs: C.-M. Ho, University of California at Los Angeles, USA

R. Miyake, Hitachi Ltd., JAPAN

9:00 a.m. Electronic Fountain Pen - A Highly Integrated Stand-Alone Microdosage System 6 G. Waibel1, J. Kohnle1, R. Cernosa1, M. Storz1, M. Schmitt3, H. Ernst1, H. Sandmaier1, R. Zengerle2, and T. Strobelt1

1HSG-IMIT, GERMANY, 2University of Freiburg, GERMANY, and 3University of Stuttgart, GERMANY

9:20 a.m. Dielectrophoretic Chromatography with Cross-Flow Injection 11 H. Sano1, H. Kabata1, O. Kurosawa2, and M. Washizu1

1Kyoto University, JAPAN and 2Advance Co., JAPAN

9:40 a.m. Electrical Molecular Focusing for Laser Induced Fluorescence based 15 Single DNA Detection T.-H. Wang, P.K. Wong, and C.-M. Ho

University of California at Los Angeles, USA

10:00 a.m. BREAK

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Monday Mid-Morning January 21, 2002

SESSION 2 - MICROFLUIDIC MEMS

Session Chairs: S.-W. Lee, Samsung Advanced Institute of Technology, KOREA

Y. Zohar, Hong Kong University of Science & Technology, CHINA

10:30 a.m. Micromachined Porous Polymer for Bubble Free Electro-Osmotic Pump 19 S. Mutlu1, C. Yu2, P. Selvaganapathy1, F. Svec2, C.H. Mastrangelo1, and J.M.J. Frechet2

1University of Michigan, USA and 2University of California at Berkeley, USA

10:50 a.m. A Thermopneumatic Microfluidic System 24 C. Grosjean, X. Yang, and Y.-C. Tai California Institute of Technology, USA

11:10 a.m. Size and Shape Effects on Two-Phase Flow Instabilities in Microchannels 28 M. Lee, Y.Y. Wong, M. Wong, and Y. Zohar

Hong Kong University of Science and Technology, HONG KONG

11:30 a.m. Towards Digital Microfluidic Circuits: Creating, Transporting, Cutting and Merging Liquid Droplets by Electrowetting-Based Actuation 32 S.K. Cho, S.-K. Fan, H. Moon, and C.-J. Kim University of California at Los Angeles, USA

11:50 a.m. A Dielectrophoretic Chaotic Mixer 36 J. Deval1, P. Tabeling2, and C.-M. Ho1

1University of California at Los Angeles, USA and 2Laboratoire de Physique Statistique de l’ENS, FRANCE

12:10 p.m. A Magnetic Force Driven Chaotic Micro-Mixer 40 H. Suzuki1 and C.-M. Ho2

1University of Tokyo, JAPAN and 2University of California at Los Angeles, USA

12:30 p.m. LUNCH

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Monday Afternoon January 21, 2002

1:30 p.m. - 6:00 p.m. POSTER SESSION

BIOMEDICAL/FLUIDIC BioMEMS

MP1 Micromachined Dermabraders for Plastic Surgical Applications 44 L.A. Ferrara, A.J. Fleischman, E.C. Benzel, and S. Roy The Cleveland Clinic Foundation, USA

MP2 Pinpoint Injection of Micro Tools using Dielectrophoresis and Hydrophobic Surface for Minimally Invasive Separation of Microbe 48 F. Arai, H. Maruyama, T. Sakami, A. Ichikawa, N. Kouketsu, L. Dong, and T. Fukuda

Nagoya University, JAPAN

MP3 Controlling the Adhesion Force for Electrostatic Actuation of Microscale Mercury Drop by Physical Surface Modification 52 W. Shen, J. Kim, and C.-J. Kim University of California at Los Angeles, USA

MP4 Micromachined Electrodes for High Density Neural Stimulation Systems 56 A. Hung1, D. Zhou2, R. Greenberg2, and J.W. Judy1

1University of California at Los Angeles, USA and 2Second Sight, LLC, USA

MP5 DNA Kinetics in Microfabricated Devices 60 Y.C. Chan, R.M.S. Ma, M. Carles, N.J. Sucher, M. Wong, and Y. Zohar Hong Kong University of Science and Technology, HONG KONG

MP6 Colorimetric Resonant Reflection as a Direct Biochemical Assay Technique 64 B.T. Cunningham, P. Li, B. Lin, and J. Pepper SRU Biosystems, USA

Channels

MP7 A Novel Fabrication Method of Embedded Micro Channels Employing Simple UV Dosage Control and Antireflection Coating 69 F.G. Tseng, Y.J. Chuang, and W.K. Lin National Tsing Hua University, TAIWAN ROC

MP8 Heating Element Embedded Parylene Microcolumn for Miniature Gas Chromatograph 73 H.-S. Noh1, P.J. Hesketh1, and G.C. Frye-Mason2

1Georgia Institute of Technology, USA and 2Sandia National Laboratories, USA

MP9 A Unique Solution for Preventing Clogging of Flow Channels by Gas Bubbles 77 J. Kohnle1, G. Waibel1, R. Cernosa1, M. Storz1, H. Ernst1, H. Sandmaier1,3, T. Strobelt1, and R. Zengerle2

1HSG-IMIT, GERMANY, 2University of Freiburg, GERMANY, and 3University of Stuttgart, GERMANY

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MP10 Flexible Microchannels with Integrated Nanoporous Membranes for Filtration and Separation of Molecules and Particles 81 S. Metz1, C. Trautmann2, A. Bertsch1, and P. Renaud1

1Swiss Federal Institute of Technology, SWITZERLAND and 2Gesellschaft für Schwerionenforschung, GERMANY

MP11 Design, Fabrication and Characterization of an Integrated Micro Heat Pipe 85 M. Lee, M. Wong, and Y. Zohar Hong Kong University of Science and Technology, HONG KONG

MP12 Enhanced Nucleate Boiling in Microchannels 89 L. Zhang, E.N. Wang, J.-M. Koo, L. Jiang, K.E. Goodson, J.G. Santiago, and T.W. Kenny Stanford University, USA

MP13 Marching Velocity of Capillary Meniscuses in Microchannels 93 L.-J. Yang1, T.-J. Yao2, Y.-L. Huang1, Y. Xu2 and Y.-C. Tai2

1Tamkang University, TAIWAN ROC and 2California Institute of Technology, USA

Mixers

MP14 Enhancement of Mixing by Droplet-Based Microfluidics 97 J. Fowler, H. Moon, and C.-J. Kim University of California at Los Angeles, USA

Pumps and Valves/Liquid Handling

MP15 Flexible Parylene-Valved Skin for Adaptive Flow Control 101 N. Pornsin-Sirirak1, M. Liger1, S. Ho2, C.-M. Ho2, and Y.-C. Tai1

1California Institute of Technology, USA and 2University of California at Los Angeles, USA

MP16 A Hydrogel-Actuated Smart Microvalve with a Porous Diffusion Barrier Back-Plate for Active Flow Control 105 A. Baldi, Y. Gu, P.E. Loftness, R.A. Siegel, and B. Ziaie University of Minnesota, USA

MP17 Fabrication and Performance Testing of a Steady Thermocapillary Pump with No Moving Parts 109 M.J. DeBar1, and D. Liepmann2

1Eastman Kodak Company, USA and 2University of California at Berkeley, USA

MP18 New Bi-Directional Valve-Less Silicon Micro Pump Controlled by Driving Waveform 113 S. Hayamizu, K. Higashino, Y. Fujii, Y. Sando, and K. Yamamoto Minolta Co., Limited, JAPAN

MP19 Liquid Handling using Expandable Microspheres 117 P. Griss, H. Andersson, and G. Stemme Royal Institute of Technology, SWEDEN

MP20 Directional Ejection of Liquid Droplets through Sectoring Half-Wave-Band Sources of Self-Focusing Acoustic Transducer 121 J.W. Kwon, Q. Zou, and E.S. Kim University of Southern California, USA

MP21 Noninvasive Acoustic-Wave Microfluidic Driver 125 H. Yu and E.S. Kim University of Southern California, USA

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Fluidic Systems

MP22 Bi-Directional Control Systems for Microfluids 129 C.-P. Jen and Y.-C. Lin National Cheng Kung University, TAIWAN, ROC

MP23 A Disposable DNA Sample Preparation Microfluidic Chip for Nucleic Acid Probe Assay 133 J.-H. Kim1, B.-G. Kim1, H. Nam2, D.-E. Park1, K.-S. Yun1, J.-B. Yoon1, J. You2, and E. Yoon1

1Korea Advanced Institute of Science and Technology, KOREA and 2Catholic University of Korea, KOREA

FABRICATIONHigh Aspect Ratio Structures and Molds

MP24 A Direct Plasma Etch Approach to High Aspect Ratio Polymer Micromachining with Applications in BioMEMS and CMOS-MEMS 137 J.D. Zahn1,2, K.J. Gabriel2, and G.K. Fedder2

1Pennsylvania State University, USA and 2Carnegie Mellon University, USA

MP25 Silicon Micromachined Hollow Microneedles for Transdermal Liquid Transfer 141 J.G.E. Gardeniers1, J.W. Berenschot2, M.J. de Boer2, Y. Yeshurun3, M. Hefetz3, R. van ’t Oever1, and A. van den Berg2

1Micronit Microfluidics B.V., THE NETHERLANDS, 2University of Twente, THE NETHERLANDS, and 3NanoPass Technologies Ltd., ISRAEL

MP26 Fabrication of Out-of-Plane Curved Surfaces in Si by utilizing RIE Lag 145 T.-K.A. Chou and K. Najafi University of Michigan, USA

MP27 Micromachined Stack Component for Miniature Thermoacoustic Refrigerator 149 C. Tsai, R.-L. Chen, C.-L. Chen, and J. DeNatale Rockwell Scientific Company, USA

MP28 A New Laser Micromachining Technique using a Mixed-Mode Ablation Approach 152 X. Zhu, J.-W. Choi, R. Cole, and C.H. Ahn University of Cincinnati, USA

MP29 High Aspect Ratio Nano Fluidic Channels by Laser-Controlled Fracturing 156 A.P. Hui1, S.-J. Qin2, W.J. Li2, and M.Y. Wang2

1Applied Science and Technology Research Institute, HONG KONG and 2The Chinese University of Hong Kong, HONG KONG

MP30 Fabrication of Thick Silicon Dioxide Layers using DRIE, Oxidation and Trench Refill 160 C. Zhang and K. Najafi University of Michigan, USA

MP31 Residual Stress and Fracture of Thick Dielectric Films for Power MEMS Applications 164 X. Zhang1, K.-S. Chen2, and S.M. Spearing3

1Boston University, USA, 2National Cheng-Kung University, TAIWAN, and 3Massachusetts Institute of Technology, USA

MP32 Fabrication of High-Aspect-Ratio PZT Thick Film Structure using Sol-Gel Technique and SU-8 Photoresist 168 N. Futai, K. Matsumoto, and I. Shimoyama University of Tokyo, JAPAN

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MP33 Fabrication Process for Ultra High Aspect Ratio Polysilazane-Derived MEMS 172 T. Cross, L.-A. Liew, V.M. Bright, M.L. Dunn, J.W. Daily, and R. Raj University of Colorado, USA

MP34 Continuously-Varying, Three-Dimensional SU-8 Structures: Fabrication of Inclined Magnetic Actuators 176 Y. Choi, K. Kim, and M.G. Allen Georgia Institute of Technology, USA

MP35 3D Fabrication by Moving Mask Deep X-Ray Lithography (M2DXL) with Multiple Stages 180 O. Tabata1, N. Matsuzuka1, T.Yamaji1, S. Uemura1, and K. Yamamoto2

1Ritsumeikan University, JAPAN and 2Minolta Co. Ltd., JAPAN

Microassembly

MP36 Non-Contact Batch Micro-Assembly by Centrifugal Force 184 K.W.C. Lai1, A.P. Hui2, and W.J. Li1

1The Chinese University of Hong Kong, HONG KONG and 2Applied Science and Technology and Technology Research Institute, HONG KONG

MP37 Sequential Batch Assembly of 3-D Microstructures with Elastic Hinges by a Magnetic Field 188 E. Iwase, S. Takeuchi, and I. Shimoyama University of Tokyo, JAPAN

MP38 Self-Assembly Templates by Selective Plasma Surface Modification of Micropatterned Photoresist 192 J. Seo, E. Ertekin, M.S. Pio, and L.P. Lee University of California at Berkeley, USA

MP39 Thermo-Kinetic Actuation for Hinged Structure Batch Microassembly 196 V. Kaajakari and A. Lal University of Wisconsin at Madison, USA

CAD & THEORY

MP40 An Efficient Relaxation based DIPIE Algorithm for Computer Aided Design of Electrostatic Actuators 200 O. Bochobza-Degani, D. Elata, and Y. Nemirovsky Technion - Israel Institute of Technology, ISRAEL

MP41 Addressing the Needs of Complex MEMS Design 204 J.V. Clark1, D. Bindel1, W. Kao1, E. Zhu1, A. Kuo2, N. Zhou1, J. Nie1, J. Demmel1, Z. Bai3, S. Govindjee1, K.S.J. Pister1, M. Gu1, and A. Agogino1

1University of California at Berkeley, USA, 2University of Michigan, USA, and 3University of California at Davis, USA

MP42 Validating Fast Simulation of Air Damping in Micromachined Devices 210 X. Wang1, M. Judy2, and J. White1

1Massachusetts Institute of Technology, USA and 2Analog Devices Inc., USA

MP43 Quality Factors of MEMS Gyros and the Role of Thermoelastic Damping 214 A. Duwel1, M. Weinstein1, J. Gorman2, J. Borenstein1, and P. Ward1

1Draper Laboratory, USA and 2Massachusetts Institute of Technology, USA

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Tuesday Morning January 22, 2002

8:00 a.m. INVITED SPEAKER Saving Energy and Natural Resource by Micro-Nanomachining 220 M. Esashi Tohoku University, JAPAN

SESSION 3 - POWER MEMS

Session Chairs: T. Akin, Middle East Technical University, TURKEY

K.S.J. Pister, University of California at Berkeley, USA

8:40 a.m. Development of a Catalytic Silicon Micro-Combustor for Hydrocarbon-Fueled Power MEMS 228 C.M. Spadaccini1, X. Zhang2, C.P. Cadou3, N. Miki1, and I.A. Waitz1

1Massachusetts Institute of Technology, USA, 2Boston University, USA, and 3University of Maryland, USA

9:00 a.m. A Microfabricated Suspended-Tube Chemical Reactor for Fuel Processing 232 L.R. Arana, S.B. Schaevitz, A.J. Franz, K.F. Jensen, and M.A. Schmidt

Massachusetts Institute of Technology, USA

9:20 a.m. Electrolyte based On-Demand and Disposable Microbattery 236 K.B. Lee and L. Lin University of California at Berkeley, USA

9:40 a.m. Disposable Air-Bursting Detonators as an Alternative On-Chip Power Source 240 C.-C. Hong, J.-W. Choi, and C.H. Ahn University of Cincinnati, USA

10:00 a.m. BREAK

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Tuesday Mid-Morning January 22, 2002

SESSION 4 - ACOUSTICS AND SENSORS

Session Chairs: T.W. Kenny, Stanford University, USA

O. Tabata, Ritsumeikan University, JAPAN

10:30 a.m. CMOS Single-Chip Multisensor Gas Detection System 244 C. Hagleitner, D. Lange, N. Kerness, A. Kummer, W.H. Song, A. Hierlemann, O. Brand, and H. Baltes ETH Zurich, SWITZERLAND

10:50 a.m. LEd-SpEC: Spectroscopic Detection of Water Contaminants using Glow Discharges from Liquid Microelectrodes 248 C.G. Wilson and Y.B. Gianchandani University of Wisconsin at Madison, USA

11:10 a.m. A Double-Sided Single-Chip Wireless Pressure Sensor 252 A. DeHennis and K.D. Wise

University of Michigan, USA

11:30 a.m. Micromachined CMOS Magnetic Field Sensors with Low-Noise Signal Conditioning 256 V. Beroulle, Y. Bertrand, L. Latorre, and P. Nouet

de Robotique et de Microelectronique de Montpellier, FRANCE

11:50 a.m. Piezoelectric Microspeaker with Compressive Nitride Diaphragm 260 S.H. Yi1 and E.S. Kim2

1University of Hawaii at Manoa, USA and 2University of Southern California, USA

12:10 p.m. Characterization of Micromachined Acoustic Ejector and its Applications 264 T.-K.A. Chou, K. Najafi, M.O. Muller, L.P. Bernal, and P.D. Washabaugh


12:30 p.m. LUNCH

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Tuesday Afternoon January 22, 2002


POWER MEMS

TP1 Fabrication and Characterization of MEMS Based Wafer-Scale Palladium-Silver Alloy Membranes for Hydrogen Separation and Hydrogenation/Dehydrogenation Reactions 268 H.D. Tong1, F.C. Gielens2, J.W. Berenschot1, M.J. De Boer1, J.G.E. Garderniers3, W. Nijdam1, C.J.M. van Rijn1, and M.C. Elwenspoek1

1University of Twente, THE NETHERLANDS, 2Eindhoven University of Technology, THE NETHERLANDS, and 3Micronit Microfluidics B.V., THE NETHERLANDS

TP2 Design and Fabrication of Micromachined Internal Combustion Engine as a Power Source for Microsystems 272 D.-E. Park, D.-H. Lee, J.-B. Yoon, S. Kwon, and E. Yoon Korea Advanced Institute of Science and Technology, KOREA

TP3 A Self-Acting Thrust Bearing for High Speed Micro-Rotors 276 C.W. Wong1, X. Zhang2, S.A. Jacobson1, and A.H. Epstein1

1Massachusetts Institute of Technology, USA and 2Boston University, USA

TP4 Development of Polysilicon Igniters and Temperature Sensors for a Micro Gas Turbine Engine 280 X. Zhang1, A. Mehra2, A.A. Ayón3, and I.A. Waitz2

1Boston University, USA, 2Massachusetts Institute of Technology, USA, and 3Sony Semiconductor, USA

ACOUSTIC DEVICES

TP5 Single-Chip Condenser Miniature Microphone with a High Sensitive Circular Corrugated Diaphragm 284 J. Chen1, L. Liu1, Z. Li1, Z. Tan1, Y. Xu1, and J. Ma2

1Tsinghua University, PR CHINA and 2Chinese Academy of Sciences, PR CHINA

TP6 Design and Fabrication of an Integrated Programmable Floating-Gate Microphone 288 T. Ma, T.Y. Man, Y.C. Chan, Y. Zohar, and M. Wong The Hong Kong University of Science and Technology, HONG KONG

TP7 Digital Sound Reconstruction using Arrays of CMOS-MEMS Microspeakers 292 B.M. Diamond, J.J. Neumann, Jr., and K.J. Gabriel Carnegie Mellon University, USA

TP8 Piezoelectric Membrane Acoustic Devices 296 S.C. Ko1, Y.C. Kim2, S.S. Lee2, S.H. Choi3, and S.R. Kim3

1Electronics and Telecommunications Research Institute, SOUTH KOREA, 2Pohang University of Science and Technology, SOUTH KOREA,

and 3Samsung Advanced Institute of Technology, SOUTH KOREA

TP9 Focused High-Frequency Ultrasonic Transducers for Minimally Invasive Imaging 300 A. Fleischman1, R. Modi2, A. Nair2, G. Lockwood1, and S. Roy1

1The Cleveland Clinic Foundation, USA and 2Case Western Reserve University, USA

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MAGNETIC SENSORS

TP10 Magnetic Actuation and MOS-Transistor Sensing for CMOS-Integrated Resonators 304 D. Lange, C. Hagleitner, C. Herzog, O. Brand, and H. Baltes ETH Zurich, SWITZERLAND

TP11 Dynamic Response and Shock Resistance of Ferromagnetic Micromechanical Magnetometers 308 J.K. Yee1, H.H. Yang2, and J.W. Judy1

1University of California at Los Angeles, USA and 2IBM Almaden Research Laboratory, USA

PHYSICAL SENSORS

TP12 Six-Degree of Freedom Micro Force-Moment Sensor for Application in Geophysics 312 D.V. Dao1, T. Toriyama2, J.C. Wells1, and S. Sugiyama1

1Ritsumeikan University, JAPAN and 2New Energy and Industrial Technology Development Organization, JAPAN

TP13 Anisotropy of the Piezojunction Effect in Silicon Transistors 316 J.F. Creemer and P.J. French Delft University of Technology, THE NETHERLANDS

TP14 SU-8 Based Piezoresistive Mechanical Sensor 320 J. Thaysen1,2, A.D. Yalçinkaya2, R.K. Vestergaard2, S. Jensen2, M.W. Mortensen2, P. Vettiger3, and A. Menon2

1Cantion A/S, DENMARK, 2Technical University of Denmark, DENMARK and 3IBM Research Laboratory, SWITZERLAND

TP15 Temperature Control of CMOS Micromachined Sensors 324 H. Lakdawala and G.K. Fedder Carnegie Mellon University, USA

TP16 Combined - Pirani/Bending Membrane - Pressure Sensor 328 J.J. van Baar, R.J. Wiegerink, T.S.J. Lammerink, J.W. Berenschot, G.J.M. Krijnen, and M.C. Elwenspoek University of Twente, THE NETHERLANDS

TP17 A Surface Micromachined, Out-of-Plane Anemometer 332 J. Chen, J. Zou, and C. Liu University of Illinois at Urbana-Champaign, USA

TP18 Hybrid Mounted Micromachined Aluminium Hot-Wire for Near-Wall Turbulence Measurements 336 S. Haasl1, D. Mucha1, V. Chernoray2, T. Ebefors1, P. Enoksson1, L. Löfdahl2, and G. Stemme1

1Royal Institute of Technology, SWEDEN and 2Chalmers University of Technology, SWEDEN

TP19 Underwater Shear Stress Sensor 340 Y. Xu1, F. Jiang2, Q. Lin3, J. Clendenen4, S. Tung4, and Y.-C. Tai1

1California Institute of Technology, USA, 2Umachines Inc., USA, 3Carnegie Mellon University, USA, and 4University of Arkansas, USA

TP20 A New Type of Tactile Sensor Detecting Contact Force and Hardness of an Object 344 T. Shimizu1, M. Shikida1, K. Sato1, and K. Itoigawa2

1Nagoya University, JAPAN and 2Tokai Rika Co., Ltd., JAPAN

0-7803-7185-2/02/$10.00 ©2002 IEEE xix

TP21 An Integrated Fizeau-Type Interferometric Displacement Sensor for a Feedback-Controlled Actuation System 348 E. Higurashi and R. Sawada NTT Telecommunications Energy Laboratories, JAPAN

MICROSCOPY PROBES

TP22 Characterization of Bulk Micromachined Tunneling Tip Integrated with Positioning Actuator 352 M. Mita1, H. Toshiyoshi1, K. Kakushima1, G. Hashiguchi2, D. Kobayashi3, J. Endo4, Y. Wada4, and H. Fujita1

1University of Tokyo, JAPAN, 2Kagawa University, JAPAN, 3Tokyo Denki University, JAPAN, and 4Hitachi Ltd., JAPAN

TP23 Actuation of Atomic Force Microscope Cantilevers in Fluids using Acoustic Radiation Pressure 356 A.G. Onaran1, F.L. Degertekin1, B. Hadimioglu2, T. Sulchek3, and C.F. Quate3

1Georgia Institute of Technology, USA 2Consultant, SWEDEN, and 3Stanford University, USA

TP24 Formation of Implanted Piezoresistors under 100-nm Thick for Nanoelectromechanical Systems 360 C. Bergaud1, E. Cocheteau1, L. Bary1, R. Plana1, and B. Belier2

1Laboratoire d’Analyse et d’Architecture des Systémes du CNRS, FRANCE and 2Universté de Paris-Sud, FRANCE

PROBE CARDS

TP25 Low Contact-Force and Compliant MEMS Probe Card Utilizing Fritting Contact 364 K. Kataoka1, S. Kawamura1, T. Itoh1, T. Suga1, K. Ishikawa2, and H. Honma2

1University of Tokyo, JAPAN and 2Kanto Gakuin University, JAPAN

TP26 A Novel MEMS Silicon Probe Card 368 B.-H. Kim1, S.-J. Park1, B.L. Lee1, J.-H. Lee1,2, B.-G. Min3, S.-D. Choi3, D.-I Cho1, and K.J. Chun1

1Seoul National University, KOREA, 2WonKwang University, KOREA, and 3YeungNam University, KOREA

FABRICATION & PACKAGING Metals

TP27 Micro-Forming of Thin Film Metallic Glass by Local Laser Heating 372 H.-W. Jeong, S. Hata, and A. Shimokohbe Tokyo Institute of Technology, JAPAN

TP28 Electrochemical Etching of Shape Memory Alloy using New Electrolyte Solutions 376 T. Mineta1, Y. Haga2, and M. Esashi2

1Yamagata Research Institute of Technology, JAPAN and 2Tohoku University, JAPAN

TP29 A Sacrificial Layer Approach to Highly Laminated Magnetic Cores 380 J.-W. Park, F. Cros, and M.G. Allen Georgia Institute of Technology, USA

TP30 Selective Plating of Nickel Ceramic Composite Films for MEMS Applications 384 K.S. Teh1, Y.T. Cheng2, and C. Sambucetti2

1University of California at Berkeley, USA and 2IBM Thomas J. Watson Research Center, USA

0-7803-7185-2/02/$10.00 ©2002 IEEE xx

TP31 Conductive Interconnections through Thick Silicon Substrates for 3D Packaging 388 T. Takizawa, S. Yamamoto, K. Itoi, and T. Suemasu Fujikura Ltd., JAPAN

TP32 Leadless Sensor Packaging for High Temperature Applications 392 F. Masheeb1, S. Stefanescu1, A.A. Ned1, A.D. Kurtz1, and G. Beheim2

1Kulite Semiconductor Products, Inc., USA and 2NASA Glenn Research Center, USA

TP33 Application of Direct Selective Metal Plating 396 S. Konishi1, M. Yanada1, I. Minami1, Y. Kimura1, and S. Ikeda2

1Ritsumeikan University, JAPAN and 2Metec Kitamura Co., Ltd., JAPAN

TP34 Microfabrication of Freestanding Metal Structures Released from Graphite Substrates 400 O.V. Makarova1, C.-M. Tang1, D.C. Mancini2, N. Moldovan2, R. Divan2, D.G. Ryding2, and R.H. Lee2

1Creatv MicroTech, Inc., USA and 2Argonne National Laboratory, USA

Bonding

TP35 Field-Operable Microconnections using Automatically-Triggered Localized Solder-Bonding 403 D.F. Lemmerhirt and K.D. Wise University of Michigan, USA

TP36 A Study of Multi-Stack Silicon-Direct Wafer Bonding for MEMS Manufacturing 407 N. Miki1, X. Zhang2, R. Khanna1, A.A. Ayón3, D. Ward1, and S.M. Spearing1

1Massachusetts Institute of Technology, USA, 2Boston University, USA, and 3Sony Semiconductor, USA

TP37 Low Temperature Silicon Wafer Bonding for MEMS Applications 411 A.A. Ayón1, X. Zhang2, K. Turner3, D. Choi3, B. Miller3, S. Nagle3, and S.M. Spearing3

1Sony Semiconductor, USA, 2Boston University, USA, and 3Massachusetts Institute of Technology, USA

TP38 Ultrasonic Bonding of In/Au and Al/Al for Hermetic Sealing of MEMS Packaging 415 J. Kim, M. Chiao, and L. Lin University of California at Berkeley, USA

TP39 Silicon Wafer Bonding with an Insulator Interlayer using RF Dielectric Heating 419 A. Bayrashev and B. Ziaie University of Minnesota, USA

TP40 Long-Term Testing of Hermetic Anodically Bonded Glass-Silicon Packages 423 T.J. Harpster and K. Najafi University of Michigan, USA

Materials & Properties

TP41 Study on Ultra-Thin NEMS Cantilevers - High Yield Fabrication and Size-Effect on Young’s Modulus of Silicon 427 X. Li1, 2, T. Ono2, Y. Wang1, and M. Esashi2

1Chinese Academy of Sciences, CHINA and 2Tohoku University, JAPAN

TP42 Mechanical Characterization of Sub-Micrometer Thick DLC Films by AFM Tensile Testing for Surface Modification in MEMS 431 Y. Isono1, T. Namazu1, N. Terayama2, and T. Tanaka1

1Ritsumeikan University, JAPAN and 2Shinko Seiki Co. Ltd., JAPAN

0-7803-7185-2/02/$10.00 ©2002 IEEE xxi

TP43 Residual Stress in Thin-Film Parylene-C 435 T.A. Harder, T.-J. Yao, Q. He, C.-Y. Shih, and Y.-C. Tai California Institute of Technology, USA

TP44 Tensile, Creep and Fatigue Properties of LIGA Nickel Structures 439 H.S. Cho1, K.J. Hemker1, K. Lian2, J. Goettert2

1Johns Hopkins University, USA, and 2Louisiana State University, USA

TP45 Devices for Fatigue Testing of Electroplated Nickel (MEMS) 443 K.P. Larsen1, J.T. Ravnkilde2, M. Ginnerup1, and O. Hansen1

1Technical University of Denmark, DENMARK and 2Dicon A/S, DENMARK

TP46 Reliability of Polycrystalline Silicon under Long-Term Cyclic Loading 447 J. Bagdahn and W.N. Sharpe, Jr. Johns Hopkins University, USA

TP47 Influence of RTA Parameters on Residual Stress and Stress Gradient of Multilayered LPCVD Polysilicon Film 451 E. Yoshikawa, M. Tsugai, M. Horikawa, H. Otani, and S. Hamada Mitsubishi Electric Corporation, JAPAN

TP48 Atomic Layer Deposition of Conformal Dielectric and Protective Coatings for Released Micro-Electromechanical Devices 455 N. Hoivik, J. Elam, R. Linderman, V.M. Bright, S. George, and Y.-C. Lee University of Colorado, USA

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Wednesday Morning January 23, 2002

8:00 a.m. INVITED SPEAKERCMOS MEMS - Present and Future 459

H. Baltes, O. Brand, A. Hierlemann, D. Lange, C. Hagleitner ETH Zurich, SWITZERLAND

SESSION 5 - TECHNOLOGY/MATERIAL/PACKAGING

Session Chairs: Y.-H. Cho, Korea Advanced Institute of Science & Technology, KOREA

H.A.C. Tilmans, IMEC, vzw, BELGIUM

8:40 a.m. Novel, Side Opened Out-of-Plane Microneedles for Microfluidic Transdermal Interfacing 467 P. Griss and G. Stemme Royal Institute of Technology, SWEDEN

9:00 a.m. Photo-Patternable Gelatin as Protection Layers in Surface Micromachinings 471 L.-J. Yang1, W.Z. Lin1, T.-J. Yao2, and Y.-C. Tai2

1Tamkang University, TAIWAN ROC and 2California Institute of Technology, USA

9:20 a.m. Micro Flow Patterns on Demand using Surface-Chemistry Technology 475 W.L.W. Hau, D.W. Trau, N.J. Sucher, M. Wong, and Y. Zohar

Hong Kong University of Science and Technology, HONG KONG

9:40 a.m. Nanostructured Surfaces for Dramatic Reduction of Flow Resistance in Droplet-Based Microfluidics 479 J. Kim and C.-J. Kim University of California at Los Angeles, USA

10:00 a.m. BREAK

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Wednesday Mid-Morning January 23, 2002

SESSION 6 - OPTICAL MEMS

Session Chairs: K. Hane, Tohoku University, JAPAN

O. Paul, University at Freiburg, GERMANY

10:30 a.m. Stacked Two Dimensional Micro-Lens Scanner for Micro Confocal Imaging Array 483 S. Kwon and L.P. Lee University of California at Berkeley, USA

10:50 a.m. An All-Polymer Thin-Film Scanning Optical Filter for 3D-Image Displays 487 K. Hoshino, A. Nakai, and I. Shimoyama

University of Tokyo, JAPAN

11:10 a.m. An Integrated Micro-Optical System for Laser-to-Fiber Active Alignment 491 K. Ishikawa, J. Zhang, A. Tuantranont, V.M. Bright, and Y.-C. Lee

University of Colorado, USA

11:30 a.m. A SCS CMOS Micromirror for Optical Coherence Tomographic Imaging 495 H. Xie1, Y. Pan2, and G.K. Fedder1

1Carnegie Mellon University, USA and 2University of Pittsburgh, USA

11:50 a.m. A Solder Self-Assembled Large Angular Displacement Torsional Electrostatic Micromirror 499 B. McCarthy, V.M. Bright, and J.A. Neff University of Colorado, USA

12:10 p.m. Multi-Cell-Line Micro Flow Cytometers with Buried SU-8/SOG Optical Waveguide 503 G.-B. Lee, C.-H. Lin, and G.-L. Chang National Cheng Kung University, TAIWAN, ROC

12:30 p.m. LUNCH

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Wednesday Afternoon January 23, 2002


OPTICAL DEVICES

WP1 A Micro Lens Actuator for Optical Flying Head 507 S. Hata1, Y. Yamada1, J. Ichihara2, and A. Shimokohbe1

1Tokyo Institute of Technology, JAPAN and 2Fujitsu Laboratories Ltd., JAPAN

WP2 A Novel High-Speed Piezoelectric Deformable Varifocal Mirror for Optical Applications 511 M.J. Mescher1, M.L. Vladimer1, and J.J. Bernstein2

1Charles Stark Draper Laboratory, USA and 2IntelliSense Corp., USA

WP3 Micro-Replication of Optical Lenses in Glass using a Novel Sol Gel Technology 516 A. Sayah, V.K. Parashar, and M.A.M. Gijs Swiss Federal Institute of Technology, SWITZERLAND

WP4 Microlens Fabrication by the Modified LIGA Process 520 S.-K. Lee, K.-C. Lee, and S.S. Lee Pohang University of Science and Technology, KOREA

WP5 A Stereoscopic Display with a Vibrating Microlens Array 524 A. Nakai, K. Matsumoto, and I. Shimoyama University of Tokyo, JAPAN

WP6 Electrostatic Digital Micromirror using Interdigitated Cantilevers 528 J.-W. Jeon, B.-I. Kim, J.-H. Kim, H.-K. Lee, J.-B. Yoon, E. Yoon, and K.S. Lim Korea Advanced Institute of Science and Technology, KOREA

WP7 A Rotational Comb-Driven Micromirror with Large Deflection Angle and Low Drive Voltage 532 O. Tsuboi, Y. Mizuno, N. Koma, H. Soneda, H. Okuda, S. Ueda, I. Sawaki, and F. Yamagishi Fujitsu Laboratories Ltd., JAPAN

WP8 Digitally Positioned Micromirror for Open-Loop Controlled Applications 536 J. Zhang, Y.C. Lee, V.M. Bright, and J. Neff University of Colorado, USA

WP9 A Low-Voltage Two-Axis Electromagnetically Actuated Micromirror with Bulk Silicon Mirror Plates and Torsion Bars 540 I.-J. Cho, K.-S. Yun, H.-K. Lee, J.-B. Yoon, and E. Yoon Korea Advanced Institute of Science and Technology, KOREA

WP10 A Scanning Micromirror with Angular Comb Drive Actuation 544 P.R. Patterson1, D. Hah1, H. Nguyen1, H. Toshiyoshi2, R.-M. Chao1, and M.C. Wu1

1University of California at Los Angeles, USA and 2University of Tokyo, JAPAN

WP11 2D Micro Scanner Actuated by Sol-Gel Derived Double Layered PZT 548 J. Tsaur, L. Zhang, R. Maeda, and S. Matsumoto National Institute of Advanced Science and Technology, JAPAN

0-7803-7185-2/02/$10.00 ©2002 IEEE xxv

WP12 Product Development of a MEMS Optical Scanner for a Laser Scanning Microscope 552 H. Miyajima, N. Asaoka, T. Isokawa, M. Ogata, Y. Aoki, M. Imai, O. Fujimori, M. Katashiro, and K. Matsumoto Olympus Optical Co., Ltd., JAPAN

WP13 Assembled Corner-Cube Retroreflector Quadruplet 556 L. Zhou, K.S.J. Pister, and J.M. Kahn University of California at Berkeley, USA

WP14 A Highly Dense MEMS Optical Switch Array Integrated with Planar Lightwave Circuit 560 T. Kanie, M. Katayama, M. Shiozaki, T. Komiya, K. Saitoh, and M. Nishimura Sumitomo Electric Industries, Ltd., JAPAN

WP15 Tunable Thermo-Optic Filter for WDM Applications 564 D. Hohlfeld, M. Epmeier, and H. Zappe University of Freiburg, GERMANY

WP16 Conformal Grating ElectroMechanical System (GEMS) for High-Speed Digital Light Modulation 568 M.W. Kowarz, J.C. Brazas, Jr., and J.G. Phalen Eastman Kodak Company, USA

WP17 A Novel Integrated Optical Dissolved Oxygen Sensor for Cell Culture and Micro Total Analysis Systems 574 D.A. Chang-Yen1, and B.K. Gale2

1Louisiana Tech University, USA and 2University of Utah, USA

WP18 160 x 120 Pixels Optically Readable Bimaterial Infrared Detector 578 T. Ishizuya, J. Suzuki, K. Akagawa, and T. Kazama Nikon Corporation, JAPAN

ACTUATORS

WP19 Compact Copper/Epoxy-Based Electromagnetic Scanner for Scanning Probe Applications 582 H. Rothuizen, M. Despont, U. Drechsler, G. Genolet, W. Häberle, M. Lutwyche, R. Stutz, and P. Vettiger IBM Zurich Research Laboratory, SWITZERLAND

WP20 Characterization of a Micromachined Inchworm Motor with Thermoelastic Linkage Actuators 586 H.N. Kwon and J.H. Lee K-JIST, KOREA

WP21 Development of SiCN Ceramic Thermal Actuators 590 L.-A. Liew, V.M. Bright, M.L. Dunn, J.W. Daily, and R. Raj University of Colorado, USA

WP22 Nonlinearly Modulated Digital Microactuators for Nano-Precision Digital Motion Generation 594 W.C. Lee, Y.-H. Jin, and Y.-H. Cho Korea Advanced Institute of Science and Technology, KOREA

WP23 Novel Electrostatic Repulsion Forces in MEMS Applications by Nonvolatile Charge Injection 598 Z. Liu, M. Kim, N. Shen, and E.C. Kan Cornell University, USA

0-7803-7185-2/02/$10.00 ©2002 IEEE xxvi

WP24 Vertical Motion Microactuator based on the Concept of ECLIA (Electrostatic Controlled Linear Inchiworm Actuator) 602 S. Konishi, K. Yoshifuji, M. Munechika, and G. Kawaguchi Ritsumeikan University, JAPAN

WP25 A Large Stepwise Motion Electrostatic Actuator for a Wireless Microrobot 606 P. Basset1, A. Kaiser1, P. Bigotte1, D. Collard2, and, L. Buchaillot1

1IEMN, FRANCE and 2University of Tokyo, JAPAN

WP26 High Speed, Large Motion Electrostatic Artificial Eyelid 610 S. Goodwin-Johansson1, M. Davidson2, D. Dausch1, P.H. Holloway2, and G. McGuire1

1MCNC, USA and 2University of Florida, USA

WP27 Dielectric Charging Effects on Parylene Electrostatic Actuators 614 T.-J. Yao, K. Walsh, and Y.-C. Tai California Institute of Technology, USA

INERTIAL SENSORS

WP28 Design Considerations for Bulk Micromachined 6H-SiC High-g Piezoresistive Accelerometers 618 R.S. Okojie1, A.R. Atwell2, K.T. Kornegay2, S.L. Roberson3, and A. Beliveau4

1NASA Glenn Research Center, USA, 2Cornell University, USA, 3Air Force Research Laboratory, USA, and 4Applied Research Associates, USA

WP29 A Hybrid Silicon-on-Glass (SOG) Lateral Micro-Accelerometer with CMOS Readout Circuitry 623 J. Chae, H. Kulah, and K. Najafi University of Michigan, USA

WP30 A Few deg/hr Resolvable Low Noise Lateral Microgyroscope 627 H.-T. Lim, J.-W. Song, J.-G. Lee, and Y.-K. Kim Seoul National University, KOREA

WP31 A Copper CMOS-MEMS Z-Axis Gyroscope 631 H. Luo, X. Zhu, H. Lakdawala, L.R. Carley, and G.K. Fedder Carnegie Mellon University, USA

RF/WIRELESS

WP32 All-Dielectric Micromachined Calorimeter for High-Resolution Microwave Power Measurement 635 A. Jander, J. Moreland, and P. Kabos National Institute of Standards and Technology, USA

WP33 Micro-Power Wireless Transmitter for High-Temperature MEMS Sensing and Communication Applications 641 M. Suster, D.J. Young, and W.H. Ko Case Western Reserve University, USA

WP34 Low-Voltage Lateral-Contact Microrelays for RF Applications 645 Y. Wang1,2, Z. Li1,3, D.T. McCormick1,2, and N.C. Tien1

1University of California at Davis, USA, 2Cornell University, USA, and 3Peking University, CHINA

0-7803-7185-2/02/$10.00 ©2002 IEEE xxvii

WP35 Reducing Silicon-Substrate Parasitics of On-Chip Transformers 649 H. Jiang1, Z. Li1,2,3, and N.C. Tien1,2

1University of California at Berkeley, USA, 2University of California at Davis, USA, and 3Peking University, CHINA

WP36 A High Performance MEMS Transformer for Silicon RF ICs 653 Y.-S. Choi, J.-B. Yoon, B.-I. Kim, and E. Yoon Korea Advanced Institute of Science and Technology, KOREA

WP37 CVD Polycrystalline Diamond High-Q Micromechanical Resonators 657 J. Wang1, J.E. Butler2, D.S.Y. Hsu2, and C.T.-C. Nguyen1

1University of Michigan, USA and 2Naval Research Laboratory, USA

WP38 A Novel Process for Fabricating Slender and Compliant Suspended Poly-Si Micro-Mechanical Structures with Sub-Micron Gap Spacing 661 S. Pamidighantam1, W. Laureyn1, A. Salah2, A. Verbist1, and H.A.C. Tilmans1

1IMEC, vcw, BELGIUM and 1Cairo University, EGYPT

WP39 High-Frequency High-Q Micro-Mechanical Resonators in Thick Epipoly Technology with Post-Process Gap Adjustment 665 D. Galayko1, A. Kaiser1, B. Legrand1, D. Collard1,2, L. Bouchaillot1, and C. Combi3

1IEMN, FRANCE, 2University of Tokyo, JAPAN, and 3St Microelectronics, ITALY

WP40 A High Q, Large Tuning Range, Tunable Capacitor for RF Applications 669 R.L. Borwick, III, P.A. Stupar, J. DeNatale, R. Anderson, C. Tsai, and K. Garrett Rockwell Scientific Company, USA

WP41 3-D Lithography and Metal Surface Micromachining for RF and Microwave MEMS 673 J.-B. Yoon, B.-I. Kim, Y.-S. Choi, and E. Yoon Korea Advanced Institute of Science and Technology, KOREA

WP42 Investigation of the Hermeticity of BCB-Sealed Cavities for Housing (RF-) MEMS Devices 677 A. Jourdain, P. De Moor, S. Pamidighantam, and H.A.C. Tilmans IMEC, vzw, BELGIUM

WP43 A Novel Low-Loss Wafer-Level Packaging of the RF-MEMS Devices 681 Y.-K. Park1,4, H.-W. Park1, D.-J. Lee1, J.-H. Park2, I.-S. Song3, C.-W. Kim3, C.-M Song3, Y.-H. Lee1, C.-J. Kim4, and B.-K. Ju1

1Korea Institute of Science and Technology, KOREA, 2Korea University, KOREA, 3Samsung Advanced Institute of Technology, KOREA, and 4University of Seoul, KOREA

0-7803-7185-2/02/$10.00 ©2002 IEEE xxviii

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Thursday Morning January 24, 2002

SESSION 7 - ACTUATORS

Session Chairs: G.K. Fedder, Carnegie Mellon University, USA

P. French, Delft University of Technology, THE NETHERLANDS

8:00 a.m. Recording on PZT and AgInSbTe Thin Films for Probe-Based Data Storage 685 D.W. Lee, T. Ono, and M. Esashi

Tohoku University, JAPAN

8:20 a.m. A Self-Actuating PZT Cantilever Integrated with Piezoresistor Sensor for AFM with High Speed Parallel Operation 689 Y.-S. Kim, H.-J. Nam, S.-M. Cho, D.-C. Kim, and J.-U. Bu

LG Electronics Institute of Technology, KOREA

8:40 a.m. A Novel Single-Layer Bi-Directional Out-of-Plane Electrothermal Microactuator 693 W.-C. Chen, J. Hsieh, and W. Fang

National Tsing Hua University, TAIWAN

9:00 a.m. A High Frequency Resonant Scanner using Thermal Actuation 698 M. Sinclair

Microsoft, USA

9:20 a.m. A Multi-Channel Micro Valve for Micro Pneumatic Artificial Muscle 702 Y.K. Lee1 and I. Shimoyama2

1Samsung Electronics Co., Ltd., KOREA and 2University of Tokyo, JAPAN

9:40 a.m. A Tunable and Highly-Parallel Picoliter-Dispenser based on Direct Liquid Displacement 706 B. de Heij1, C. Steinert1, H. Sandmaier2, and R. Zengerle1

1University of Freiburg, GERMANY and 2HSG-IMIT, GERMANY

10:00 a.m. BREAK

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Thursday Mid-Morning January 24, 2002

SESSION 8 - PHYSICAL/MECHANICAL SENSORS

Session Chairs: V.M. Bright, University of Colorado at Boulder, USA

K. Chun, Seoul National University, KOREA

10:30 a.m. Electrostatically Levitated Spherical 3-Axis Accelerometer 710 R. Toda1, N. Takeda1, T. Murakoshi2, S. Nakamura2, and M. Esashi3

1Ball Semiconducter Inc., USA, 2Tokimec Inc., JAPAN, and 3Tohoku University, JAPAN

10:50 a.m. Self-Balanced High-Resolution Capacitive Microaccelerometers using Branched Finger Electrodes with High-Amplitude Sense Voltage 714 K.-H. Han and Y.-H. Cho

Korea Advanced Institute of Science and Technology, KOREA

11:10 a.m. A Single-Crystal Silicon Vibrating Ring Gyroscope 718 G. He and K. Najafi


11:30 a.m. An Integrated Microelectromechanical Resonant Output Gyroscope 722 A.A. Seshia1, R.T. Howe1, and S. Montague2

2University of California at Berkeley, USA and 2Sandia National Laboratories, USA

11:50 a.m. Selective Polysilicon Deposition for Frequency Tuning of MEMS Resonators 727 D. Joachim1 and L. Lin2

1University of Michigan, USA and 2University of California at Berkeley, USA

12:10 p.m. Stiffness-Compensated Temperature-Insensitive Micromechanical Resonators 731 W.-T. Hsu, and C.T.-C. Nguyen


12:30 p.m. CONFERENCE WRAP-UP Y.B. Gianchandani and Y.-C. Tai

12:40 p.m. Adjourns

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AUTHOR INDEX

Agogino, A. - 204 Ahn, C.H. - 152, 240 Akagawa, K. - 578 Allen, M.G. - 176, 380 Anderson, R. - 669 Andersson, H. - 117 Aoki, Y. - 552 Arai, F. - 48 Arana, L.R. - 232 Asaoka, N. - 552 Atwell, A.R. - 618 Ayón, A.A. - 280, 407, 411

van Baar, J.J. - 328 Bagdahn, J. - 447 Bai, Z. - 204 Baldi, A. - 105 Baltes, H. - 244, 304, 459 Bary, L. - 360 Basset, P. - 606 Bayrashev, A. - 419 Beheim, G. - 392 Belier, B. - 360 Beliveau, A. - 618 Benzel, E.C. - 44 Berenschot, J.W. - 141, 268, 328 van den Berg, A. - 141 Bergaud, C. - 360 Bernal, L.P. - 264 Bernstein, J.J. - 511 Beroulle, V. - 256 Bertrand, Y. - 256 Bertsch, A. - 81 Bigotte, P. - 606 Bindel, D. - 204 Bochobza-Degani, O. - 200 Borenstein, J. - 214 Borwick III, R.L. - 669Brand, O. - 244, 304, 459 Brazas, Jr., J.C. - 568 Bright, V.M. - 172, 455, 491, 499, 536, 590 Bu, J.-U. - 689 Buchaillot, L. - 606, 665 Butler, J.E. - 657

Cadou, C.P. - 228 Carles, M. - 60 Carley, L.R. - 631 Cernosa, R. - 6, 77 Chae, J. - 623 Chan, Y.C. - 60, 288 Chang, G.-L. - 503 Chang-Yen, D.A. - 574 Chao, R.-M. - 544 Chen, C.-L. - 149 Chen, J. - 284

Chen, J. - 332 Chen, K.-S. - 164 Chen, R.-L. - 149 Chen, W.-C. - 693 Cheng, Y.T. - 384 Chernoray, V. - 336 Chiao, M. - 415 Cho, D.-I. - 368 Cho, H.S. - 439 Cho, I.-J. - 540 Cho, S.K. - 32 Cho, S.-M. - 689 Cho, Y.-H. - 594, 714 Choi, D. - 411 Choi, J.-W. - 152, 240 Choi, S.-D. - 368 Choi, S.H. - 296 Choi, Y. - 176 Choi, Y.-S. - 653, 673 Chou, T.-K.A. - 145, 264 Chuang, Y.J. - 69 Chun, K.J. - 368 Clark, J.V. - 204 Clendenen, J. - 340 Cocheteau, E. - 360 Cole, R. - 152 Collard, D. - 606, 665 Combi, C. - 665 Creemer, J.F. - 316 Cros, F. - 380 Cross, T. - 172 Cunningham, B.T. - 64

Daily, J.W. - 172, 590 Dao, D.V. - 312 Dausch, D. - 610 Davidson, M. - 610 de Boer, M.J. - 141, 268 de Heij, B. - 706 De Moor, P. - 677 DeBar, M.J. - 109 Degertekin, F.L. - 356 DeHennis, A. - 252 Demmel, J. - 204 DeNatale, J. - 149, 669 Despont, M. - 582 Deval, J. - 36 Diamond, B.M. - 292 Divan, R - 400 Dong, L. - 48 Drechsler, U. - 582 Dunn, M.L. - 172, 590 Duwel, A. - 214

Ebefors, T. - 336 Elam, J. - 455

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Elata, D. - 200 Elwenspoek, M.C. - 268, 328 Endo, J. - 352 Enoksson, P. - 336 Epmeier, M. - 564 Epstein, A.H. - 276 Ernst, H. - 6, 77 Ertekin, E. - 192 Esashi, M. - 220, 376, 427, 685, 710

Fan, S.-K. - 32 Fang, W. - 693 Fedder, G.K. - 137, 324, 495, 631 Ferrara, L.A. - 44 Fleischman, A.J. - 44, 300 Fowler, J. - 97 Franz, A.J. - 232 Frechet, J.M.J. - 19 French, P.J. - 316 Frye-Mason, G.C. - 73 Fujii, Y. - 113 Fujimori, O. - 552 Fujita, H. - 352 Fukuda, T. - 48 Futai, N. - 168

Gabriel, K.J. - 137, 292 Galayko, D. - 665 Gale, B.K. - 574 Gardeniers, J.G.E. - 141, 268 Garrett, K. - 669 Genolet, G. - 582 George, S. - 455 Gianchandani, Y.B. - 248 Gielens, F.C. - 268 Gijs, M.A.M. - 516 Ginnerup, M. - 443 Goettert, J. - 439 Goodson, K.E. - 89 Goodwin-Johansson, S. - 610 Gorman, J. - 214 Govindjee, S. - 204 Greenberg, R. - 56 Griss, P. - 117, 467 Grosjean, C. - 24 Gu, M. - 204 Gu, Y. - 105

Haasl, S. - 336 Häberle, W. - 582 Hadimioglu, B. - 356 Haga, Y. - 376 Hagleitner, C. - 244, 304, 459 Hah, D. - 544 Hamada, S. - 451 Han, K.-H. - 714 Hansen, O. - 443 Harder, T.A. - 435 Harpster, T.J. - 423

Hashiguchi, G. - 352 Hata, S. - 372, 507 Hau, W.L.W. - 475 Hayamizu, S. - 113 He, G. - 718 He, Q. - 435 Hefetz, M. - 141 Hemker, K.J. - 439 Herzog, C. - 304 Hesketh, P.J. - 73 Hierlemann, A. - 244, 459 Higashino, K. - 113 Higurashi, E. - 348 Ho, C.-M. - 15, 36, 40, 101 Ho, S. - 101 Hohlfeld, D. - 564 Hoivik, N. - 455 Holloway, P.H. - 610 Hong, C.-C. - 240 Honma, H. - 364 Horikawa, M. - 451 Hoshino, K. - 487 Howe, R.T. - 722 Hsieh, J. - 693 Hsu, D.S.Y. - 657 Hsu, W.-T. - 731 Huang, Y.-L. - 93 Hui, A.P. - 156, 184 Hung, A. - 56

Ichihara, J. - 507 Ichikawa, A. - 48 Ikeda, S. - 396 Imai, M. - 552 Ishikawa, K. - 364, 491 Ishizuya, T. - 578 Isokawa, T. - 552 Isono, Y. - 431 Itoh, T. - 364 Itoi, K. - 388 Itoigawa, K. - 344 Iwase, E. - 188

Jacobson, S.A. - 276 Jander, A. - 635 Jen, C.-P. - 129 Jensen, K.F. - 232 Jensen, S. - 320 Jeon, J.-W. - 528 Jeong, H.-W. - 372 Jiang, F. - 340 Jiang, H. - 649 Jiang, L. - 89 Jin, Y.-H. - 594 Joachim, D. - 727 Jourdain, A. - 677 Ju, B.-K. - 681 Judy, J.W. - 56, 308 Judy, M. - 210

0-7803-7185-2/02/$10.00 ©2002 IEEE xxxii

Kaajakari, V. - 196 Kabata, H. - 11 Kabos, P. - 635 Kahn, J.M. - 556 Kaiser, A. - 606, 665 Kakushima, K. - 352 Kan, E.C. - 598 Kanie, T. - 560 Kao, W. - 204 Kataoka, K. - 364 Katashiro, M. - 552 Katayama, M. - 560 Kawaguchi, G. - 602 Kawamura, S. - 364 Kazama, T. - 578 Kenny, T.W. - 89 Kerness, N. - 244 Khanna, R. - 407 Kim, B.-G. - 133 Kim, B.-H. - 368 Kim, B.-I. - 528, 653, 673 Kim, C.-J. - 32, 52, 97, 479, 681 Kim, C.-W. - 681 Kim, D.-C. - 689 Kim, E.S. - 121, 125, 260 Kim, J. - 52, 479 Kim, J. - 415 Kim, J.H. - 133 Kim, J.-H. - 528 Kim, K. - 176 Kim, M. - 598 Kim, S.R. - 296 Kim, Y.C. - 296 Kim, Y.-K. - 627 Kim, Y.-S. - 689 Kimura, Y. - 396 Ko, S.C. - 296 Ko, W.H. - 641 Kobayashi, D. - 352 Kohnle, J. - 6, 77 Koma, N. - 532 Komiya, T. - 560 Konishi, S. - 396, 602 Koo, J.-M. - 89 Kornegay, K.T. - 618 Kouketsu, N. - 48 Kowarz, M.W. - 568 Krijnen, G.J.M. - 328 Kulah, H. - 623 Kummer, A. - 244 Kuo, A. - 204 Kurosawa, O. - 11 Kurtz, A.D. - 392 Kwon, H.N. - 586 Kwon, J.W. - 121 Kwon, S. - 272, 483

Lai, K.W.C. - 184 Lakdawala, H. - 324, 631

Lal, A. - 196 Lammerink, T.S.J. - 328 Lange, D. - 244, 304, 459 Larsen, K.P. - 443 Latorre, L. - 256 Laureyn, W. - 661 Lee, B.L. - 368 Lee, D.-H. - 272 Lee, D.-J. - 681 Lee, D.W. - 685 Lee, G.-B. - 503 Lee, H.-K. - 528, 540 Lee, J.-G. - 627 Lee, J.-H. - 368 Lee, J.H. - 586 Lee, K.B. - 236 Lee, K.-C. - 520 Lee, L.P. - 192, 483 Lee, M. - 28, 85 Lee, R.H. - 400 Lee, S.-K. - 520 Lee, S.S. - 296, 520 Lee, W.C. - 594 Lee, Y.-H. - 681 Lee, Y.K. - 702 Lee, Y.-C. - 455, 491, 536 Legrand, B. - 665 Lemmerhirt, D.F. - 403 Li, P. - 64 Li, W.J. - 156, 184 Li, X. - 427 Li, Z. - 284 Li, Z. - 645, 649 Lian, K. - 439 Liepmann, D. - 109 Liew, L.-A. - 172, 590 Liger, M. - 101 Lim, H.-T. - 627 Lim, K.S. - 528 Lin, B. - 64 Lin, C.-H. - 503 Lin, L. - 236, 415, 727 Lin, Q. - 340 Lin, W.K. - 69 Lin, W.Z. - 471 Lin, Y.-C. - 129 Linderman, R. - 455 Liu, C. - 332 Liu, L. - 284 Liu, Z. - 598 Lockwood, G. - 300 Löfdahl, L. - 336 Loftness, P.E. - 105 Luo, H. - 631 Lutwyche, M. - 582

Ma, J. - 284 Ma, R.M.S. - 60 Ma, T. - 288

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Maeda, R. - 548 Makarova, O.V. - 400 Man, T.Y. - 288 Mancini, D.C. - 400 Maruyama, H. - 48 Masheeb, F. - 392 Mastrangelo, C.H. - 19 Matsumoto, K. - 168, 524, 552 Matsumoto, S. - 548 Matsuzuka, N. - 180 McCarthy, B. - 499 McCormick, D.T. - 645 McGuire, G. - 610 Mehra, A. - 280 Menon, A. - 320 Mescher, M.J. - 511 Metz, S. - 81 Miki, N. - 228, 407 Miller, B. - 411 Min, B.-G. - 368 Minami, I. - 396 Mineta, T. - 376 Mita, M. - 352 Miyajima, H. - 552 Mizuno, Y. - 532 Modi, R. - 300 Moldovan, N. - 400 Montague, S. - 722 Montemagno, C.D. - 1 Moon, H. - 32, 97 Moreland, J. - 635 Mortensen, M.W. - 320 Mucha, D. - 336 Muller, M.O. - 264 Munechika, M. - 602 Murakoshi, T. - 710 Mutlu, S. - 19

Nagle, S. - 411 Nair, A. - 300 Najafi, K. - 145, 160, 264, 423, 623, 718 Nakai, A. - 487, 524 Nakamura, S. - 710 Nam, H. - 133 Nam, H.-J. - 689 Namazu, T. - 431 Ned, A.A. - 392 Neff, J.A. - 499, 536 Nemirovsky, Y. - 200 Neumann, Jr., J.J. – 292 Neves, H. - 1 Nguyen, C.T.-C. - 657, 731 Nguyen, H. - 544 Nie, J. - 204 Nijdam, W. - 268 Nishimura, M. - 560 Noh, H.-S. - 73 Nouet, P. - 256

van 't Oever, R. - 141 Ogata, M. - 552 Okojie, R.S. - 618 Okuda, H. - 532 Onaran, A.G. - 356 Ono, T. - 427, 685 Otani, H. - 451

Pamidighantam, S. - 661, 677 Pan, Y. - 495 Parashar, V.K. - 516 Park, D.-E. - 133, 272 Park, H.-W. - 681 Park, J.-H. - 681 Park, J.-W. - 380 Park, S.-J. - 368 Park, Y.-K. - 681 Patterson, P.R. - 544 Pepper, J. - 64 Phalen, J.G. - 568 Pio, M.S. - 192 Pister, K.S.J. - 204, 556 Plana, R. - 360 Pornsin-Sirirak, N. - 101

Qin, J.S. - 156 Quate, C.F. - 356

Raj, R. - 172, 590 Ravnkilde, J.T. - 443 Renaud, P. - 81 van Rijn, C.J.M. - 268 Roberson, S. - 618 Rothuizen, H. - 582 Roy, S. - 44, 300 Ryding, D.G. - 400

Saitoh, K. - 560 Sakami, T. - 48 Salah, A. - 661 Sambucetti, C. - 384 Sandmaier, H. - 6, 77, 706 Sando, Y. - 113 Sano, H. - 11 Santiago, J.G. - 89 Sato, K. - 344 Sawada, R. - 348 Sawaki, I. - 532 Sayah, A. - 516 Schaevitz, S.B. - 232 Schmidt, M.A. - 232 Schmitt, M. - 6 Selvaganapathy, P. - 19 Seo, J. - 192 Seshia, A.A. - 722 Sharpe, Jr., W.N. - 447 Shen, N. - 598 Shen, W. - 52 Shih, C.-Y. - 435

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Shikida, M. - 344 Shimizu, T. - 344 Shimokohbe, A. - 372, 507 Shimoyama, I. - 168, 188, 487, 524, 702 Shiozaki, M. - 560 Siegel, R.A. - 105 Sinclair, M. - 698 Soneda, H. - 532 Song, C.-M. - 681 Song, I.-S. - 681 Song, J.-W. - 627 Song, W.H. - 244 Spadaccini, C.M. - 228 Spearing, S.M. - 164, 407, 411 Stefanescu, S. - 392 Steinert, C. - 706 Stemme, G. - 117, 336, 467 Storz, M. - 6, 77 Strobelt, T. - 6, 77 Stupar, P.A. - 669 Stutz, R. - 582 Sucher, N.J. - 60, 475 Suemasu, T. - 388 Suga, T. - 364 Sugiyama, S. - 312 Sulchek, T. - 356 Suster, M. - 641 Suzuki, H. - 40 Suzuki, J. - 578 Svec, F. - 19

Tabata, O. - 180 Tabeling, P. - 36 Tai, Y.-C. - 24, 93, 101, 340, 435, 471, 614 Takeda, N. - 710 Takeuchi, S. - 188 Takizawa, T. - 388 Tan, Z. - 284 Tanaka, T. - 431 Tang, C.-M. - 400 Teh, K.S. - 384 Terayama, N. - 431 Thaysen, J. - 320 Tien, N.C. - 645, 649 Tilmans, H.A.C. - 661, 677 Toda, R. - 710 Tong, H.D. - 268 Toriyama, T. - 312 Toshiyoshi, H. - 352, 544 Trau, D.W. - 475 Trautmann, C. - 81 Tsai, C. - 149, 669 Tsaur, J. - 548 Tseng, F.G. - 69 Tsuboi, O. - 532 Tsugai, M. - 451 Tuantranont, A. - 491 Tung, S. - 340 Turner, K. - 411

Ueda, S. - 532 Uemura, S. - 180

Verbist, A. - 661 Vestergaard, R.K. - 320 Vettiger, P. - 320, 582 Vladimer, M.L. - 511

Wada, Y. - 352 Waibel, G. - 6, 77 Waitz, I.A. - 228, 280 Walsh, K. - 614 Wang, E.N. - 89 Wang, J. - 657 Wang, M.Y. - 156 Wang, T.-H. - 15 Wang, X. - 210 Wang, Y. - 427, 645 Ward, D. - 407 Ward, P. - 214 Washabaugh, P.D. - 264 Washizu, M. - 11 Weinstein, M. - 214 Wells, J.C. - 312 White, J. - 210 Wiegerink, R.J. - 328 Wilson, C.G. - 248 Wise, K.D. - 252, 403 Wong, C.W. - 276 Wong, M. - 28, 60, 85, 288, 475 Wong, P.K. - 15 Wong, Y.Y. - 28 Wu, M.C. - 544

Xie, H. - 495 Xu, Y. - 93, 284, 340

Yalçinkaya, A.D. - 320 Yamada, Y. - 507 Yamagishi, F. - 532 Yamaji, T. - 180 Yamamoto, K. - 113, 180 Yamamoto, S. - 388 Yanada, M. - 396 Yang, H. - 308 Yang, L.-J. - 93, 471 Yang, X. - 24 Yao, T.-J. - 93, 435, 471, 614 Yee, J.K. - 308 Yeshurun, Y. - 141 Yi, S.H. - 260 Yoon, E. - 133, 272, 528, 540, 653, 673 Yoon, J.-B. - 133, 272, 528, 540, 653, 673 Yoshifuji, K. - 602 Yoshikawa, E. - 451 You, J. - 133 Young, D.J. - 641 Yu, C. - 19

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Yu, H. - 125 Yun, K.-S. - 133, 540

Zahn, J.D. - 137 Zappe, H. - 564 Zengerle, R. - 6, 77, 706 Zhang, C. - 160 Zhang, J. - 491, 536 Zhang, L. - 89, 548 Zhang, X. - 164, 228, 276, 280, 407, 411 Zhou, D. - 56 Zhou, L. - 556 Zhou, N. - 204 Zhu, E. - 204 Zhu, X. - 152, 631 Ziaie, B. - 105, 419 Zohar, Y. - 28, 60, 85, 288, 475 Zou, J. - 332 Zou, Q. - 121

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KEYWORD INDEX 3-Axis Accelerometer - 710 3-D - 180 3-D Assembly - 332 3-D Image - 487 3-D Lithography - 673 3-D MEMS - 69 3-D Micro Channel System - 156 3-D Microstructure - 152, 372 3-D Stacking - 388 3-D Structure - 396, 407 Abrasion Tools - 44 Accelerometer(s) - 324,618 Accommodation - 196 Acoustic Device - 296 Acoustic Streaming - 125 Acoustic Waves - 121 Acoustics - 292 Active Alignment - 491 Actuation - 356 Actuator(s) - 200, 292, 344, 582, 590, 610, 614 Adhesive Bonding - 419 Air-Bursting Detonator - 240 ALD - 455 Aluminium - 336 Anemometer - 332, 336 Angular Vertical Comb - 544 Anisotropic Etching - 141 Annealing Temperature - 411 Anodic - 423 Anti-Stiction Coating - 661 Arrays - 568 Artificial Hand - 702 Assembly - 196 Atomic Force Microscope (AFM) - 356, 431, 685 Automated Micro Assembly - 184 Batch Micro Assembly - 184 BCB - 677 Bearing - 276 BEM - 210 Bend - 60 Bi-directional - 113 Bi-directional Pumping - 129 Bimaterial - 578 Biomedical - 141 BioMEMS - 1, 300 Bio-Molecule Separation/Sorting - 40 Biosensor - 64 Bipolar Transistors - 316 Blanched Finger Electrode - 714 Boiling Curve - 28 Bond Strength - 411 Bonding - 415 Branch - 60 Breakdown - 364 Bubble Free EOF - 19

Buckle Beam - 698 Buried Optical Waveguide - 503 CAD - 204 Cantilever - 304, 320, 356, 360, 427, 459, 560 Capacitive - 288 Capacitive Sensor - 85 Capillary Meniscus - 93 Catalytic Combustion - 228 Cellular Phone - 260 Centrifugal Force Micro Assembly - 184 Ceramic - 590 Chaos - 36 Chaotic - 97 Charging - 614 Chromatography - 11 Clamped-Clamped Beams - 308 Clogging - 77 CMOS - 292, 459, 631 CMOS MEMS - 137, 256 CMOS Micromaching - 324, 495 Comb Drive - 560 Comb-Drive Resonator Design - 727 Comb-Driven - 532 Combustion - 272 Communications - 657 Compliance - 661 Compressive Diaphragm - 260 Conductive - 590 Conductive Polymer - 487 Confocal Microscope - 483 Conformal Coating - 455 Contact Angle - 661 Copper - 631 Corner-Cube Retroreflector - 556 Corrugated Diaphragm - 284 Coupled-Field Analysis - 284 Coupling Efficiency - 491 Creep - 439 Curled Films - 610 Curved Surface - 145 Damping - 214, 669 Data Storage - 220, 685 Decoupled - 627 Deep Reactive Ion Etching (DRIE) - 137, 149, 160, 467, 495, 532 Deep X-Ray - 520 Deformable Optics - 511 Delamination - 693 Dermabrasion - 44 Detection Efficiency - 15 Diamond-Like Carbon - 431 Dielectric Heating - 419 Dielectrophoresis - 11, 36, 48 Diffusion - 97 Digital - 536 Digital Actuator - 594

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Digital Micromirror - 528 DIPIE - 200 Direct Selective Metal Plating - 396 Direct Viewing - 578 Directional Ejection - 121 Dispenser - 706 Displacement Sensor - 348 Display - 524 Disposable Biochip - 240 DNA - 11 DNA Kinetics - 60 DNA Mobility - 60 Dosing - 706 DPZT - 548 Droplet - 487 Drug Delivery - 141 Dynamic Response - 308

ECLIA - 602 EEPROM - 598 Elastic Hinge - 188 Electric Contact - 364 Electrical and Mechanical Noise - 714 Electrical Crosstalk - 689 Electrical Stiffness - 731 Electrochemical Etching - 376 Electrode - 56 Electroforming - 400 Electrokinetic Flow - 475 Electroless Plating - 368, 384 Electrolyte Solution - 376 Electromagnetic - 540, 552, 582 Electro-Osmotic Pump - 19 Electroplated Nickel - 443 Electroplating - 56, 364, 380 Electrostatic(s) - 200, 499, 528, 610, 614 Electrostatic Actuation - 598 Electrostatic Actuator - 507 Electrostatic Levitation - 710 Electrothermal Actuator - 693 Electrowetting - 97 Electrowetting-on-Dielectric (EWOD) - 32 Embedded Micro Channels - 69 Enhanced Boiling - 89 Epipoly - 665 External Magnet - 540

Fabrication - 172, 180, 590 Fatigue - 439, 447 Fatigue Test(ing) - 443, 693 Feedback Control - 348 Ferromagnetic - 256 Ferromagnetic Resonance - 635 Field-Balanced Structure - 627 Filters - 665 Finite Element Analysis - 618 Fizeau Interferometer - 348 Floating Gate - 288 Flow Control - 129

Flow Cytometer - 503 Flow Resistance Reduction - 479 Flow Sensor - 332 Fluid(s) - 109, 210 Form Transfer - 524 Fracture - 164 Free-Space Optical Communication - 556 Frequency Simulation - 727 Fresnel Annular Sector Actuator - 125 Fresnel Half-Wave Band Sources - 121 Fuel Processing - 232

Gap - 665 Gas Bubbles - 77 Gas Chromatography - 73 Gas Sensors - 244 Gelatin - 471 Glass Transition Temperature - 520 Graphite - 400 Gratings - 568 Gyroscope - 631, 718, 722

Hermetic - 415, 423 Hermeticity - 677 High-Aspect Ratio - 137, 168, 172 High-Aspect Ratio Trench - 160 High-G Shock - 308 High-Resolution Accelerometer - 714 High-Speed - 276, 511 High-Speed Atomic Force Microscopy - 689 High-Temperature - 392, 641 Hot-Wire - 336 Hybrid - 336 Hybrid Devices - 1 Hydrogel - 105 Hydrogen Separation - 268 Hydrophobic Surface - 479 Hydrophobic/Hydrophilic - 192

ICP-RIE - 352 Igniter - 280 Inchworm Motor - 586 Inclined Cantilever - 176 Inductive Coupling - 606 Inductor - 649 Inertial - 718 Inertial Sensors - 623 Infrared Detector - 578 Infrared Spectroscopy - 411 Integrated - 288 Integration - 6 Interconnection - 388 Interdigitated Cantilever - 528 Interference Filter - 564 Intrinsic Stress - 435

Lab-on-Chip - 32, 483 Lagrangian Chaos - 40 Laminated - 380

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Large Oscillation Amplitude - 627 Laser Heating - 372 Laser Induced Fluorescence - 15 Laser Micromachining - 152, 156 Laser Scanning Microscope - 552 Laser Trap - 48 Latch Up - 586 Latent Heat - 28 Lateral Gyroscope - 627 Leadless - 392 LIGA - 400, 520 LIGA Ni - 439 Liquid Handling - 117 Liquid Metal Switch - 52 Lithography - 172, 180 Localized Heating - 403 Locked-In Structure - 556 Long-Term - 423 Lorentz Force - 256 Low Loss - 681 Low-Power - 641

Magnetic Actuation - 304 Magnetic Actuator - 176 Magnetic Anisotropy - 188 Magnetic Beads - 40 Magnetic Etching - 380 Magnetic Sensor - 256 Magnetometer - 308 Magneto-Optical Recording - 507 Maintenance Tool - 220 Material Loss - 214 Mechanical Modulator - 594 Mechanical Properties - 431, 435, 443 Mechanical Stress - 316 Membrane - 81, 292 MEM TAR - 149 MEMS - 145, 491, 598, 631 MEMS Based Wafer-Scale - 268 MEMS Packaging - 677 MEMS Resonator - 214 MEMS Sensing - 641 MEMS Wing - 101 Metal Surface Micromachining - 673 Micro Actuator - 586, 602 Micro Array - 64 Micro Artificial Muscle - 702 Micro Assembly - 184 Micro Engine - 272 Micro Flow Pattern - 475 Micro Force Moment Sensor - 312 Micro Gas Turbine Engine - 228 Micro Heat Pipe - 85 Micro Pneumatic System - 702 Micro Propulsion - 264 Micro Scanner - 548 Micro Tool - 48 Micro-Air-Vehicle (MAV) - 101 Microbattery - 236

Microchannel(s) - 77, 81, 89 Microchannel Heat Sink - 28 Micro-Combustion - 228 Microconnector - 403 Microdischarge - 248 Microdosing - 6 Microfluid - 129 Microfluidics - 6, 24, 36, 73, 105, 117, 133, 232, 240, 467, 706 Micro-Forming - 372 Micro-g Accelerometer - 623 Microheating - 73 Micro-Inductor - 380 Micro-Jet - 264 Micro-Lens - 483, 487, 516, 520, 524 Micromachined Inductor - 606 Micromachined Inductors and Transmission Lines - 673 Micromachining - 19 Micromechanical Resonator - 731 Micromirror - 491, 495, 499, 528, 532, 536, 540, 544 Micromixer - 133 Micro-Mixing - 40, 97 Microneedle - 467 Microphone - 284, 288, 296 Microplasma - 248 Microprobe - 685 Micropump - 113, 117 Microrelay - 645 Micro-Replication - 64, 516 Microrobot - 606 Micro-Rotors - 276 Microscale - 109 Microspeaker - 260, 296 Microvalve - 105, 117 Microwave Power - 635 Mixed-Mode Ablation - 152 Mixing - 36 Modeling - 204 Molecular Focusing - 15 Monolithic - 459 MOS-Transistor - 304 Motor - 665 Multi-Channel Micro Valve - 702 Muscle MEMS - 1

Nano - 352 Nano Actuator - 594 Nano Channel Fabrication - 156 Nano Crystalline Nickel - 443 Nanojunction - 360 Nanomechanical Structure - 479 Nanopore - 81 NEMS - 360 Neural Prosthetics - 56 Nickel Ceramic Composite - 384 Nonlinear Modulation - 594 Nonvolatile Charges - 598 Nucleate Boiling - 89 Nucleic Acid - 133

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On-Chip Power Source - 240 On-Chip Transformer - 649 Open-Loop - 536 Optical - 574 Optical Coherence Tomography (OCT) - 495 Optical Emission - 248 Optical Flying Head - 507 Optical MEMS - 556, 568 Optical Scanner - 552 Optical Shutters - 610 Optical Switch - 540, 560 Optically Readable - 578 Out-of-Plane Motion - 693 Out-of-Plane Structure - 188 Oxide - 164 Oxygen - 574 Packages - 423 Packaging - 220, 392, 415, 419 Palladium-Silver Alloy Membranes - 268 Parallel Motion - 602 Parylene - 73, 435, 614 Parylene-Valved Skin - 101 Passive Alignment - 348 PCB - 368 PDMS - 582 PECVD - 164 Phase Change - 85 Photoresist - 192 Picoliter - 706 Piezoelectric - 196, 296 Piezoelectric Actuation - 511 Piezoelectric ZnO - 260 Piezojunction Effect - 316 Piezoresistance - 316 Piezoresistive - 312, 618 Piezoresistor - 320, 360 Piezoresistor Sensor - 689 Pirani Sensor - 328 Plasma Surface Modification - 192 Plastic Surgery - 44 Plating Gold - 681 Platinum - 56 PLC - 560 Pneumatic - 129 Pneumatic Actuators - 101 Polydiamond - 657 Polyimide - 81 Polyimide Cable - 403 Polymer Coating - 475 Polymer MEMS - 69 Polymer Micromachining - 137 Polysilazane - 172 Polysilicon - 280, 447 Polysilicon Characterization - 727 Polysilicon Film - 451 Porous Material - 105 Porous Plug - 19 Post-Fabrication Processing - 727

Post-Fabrication-Process - 396 Power Generation - 236 Power MEMS - 220, 228, 232, 280, 407 Power Source - 272 Pressure - 252 Pressure Sensitivity - 340 Pressure Sensor - 328 Probe Card - 364, 368 Processing - 455 Protection Layer - 471 Proteomics - 64 Pull-In - 200 Pump - 109 Pumping - 264 PVDF - 300 PZT - 168 PZT Substrate - 125 Quality Factor - 214, 649, 657 Radiation Pressure - 356 Radio Frequency - 653 Rate Sensor - 722 Reactor - 232 Reciprocating Engine - 272 Reliability - 447 Repeatability - 536 Residual Stress - 164, 451 Residual Stress Gradients - 324 Resonant Sensing - 722 Resonator - 304, 657 RF and Microwave MEMS - 673 RF MEMS - 645, 649, 669, 681 RIE Lag - 145 Sample Preparation - 133 Scanner - 582, 698 Scanning - 483 Scanning Angle - 548 Scanning Probe - 635 Scanning Probe Microscope - 635 Seed Material - 396 Self-Acting - 276 Self-Actuating PZT Cantilever - 689 Self-Alignment - 48 Self-Assembled - 499 Self-Assembly - 192 Self-Balanced Force - 714 Self-Focusing - 121 Sensor - 574 Separation - 11 Sequential Batch Assembly - 188 Shape Memory Alloy - 376 Shear-Stress Sensor - 340 SiC - 392 Sigma-Delta - 623 Silicon Carbide - 618 Silicon Microneedles - 141

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Silicon Through-Holes - 388 Silicone - 24 Silicon-On-Glass - 718 Simulation - 204, 210 Single Molecule Detection - 15 Single-Chip - 284 Skin Resurfacing - 44 Slenderness Ratio - 661 SOG (Spin-On-Glass) - 503, 516 SOI - 669 SOI MEMS - 544 Sol Gel – 516 Sol Gel Method - 168, 548 Solder - 403, 499 Specimen Size Effect - 427 Spectroscopy - 248 Spherical Semiconductor - 710 Stand Alone Application - 6 Stereovision - 524 Stiction - 471 Stokes Flow - 210 Strength - 447 Stress Gradient - 451 SU-8 - 69, 168, 176, 320, 503 Sugar - 204 Surface Charge - 475 Surface Energy - 93 Surface Micromachining - 332, 653, 722 Surface Modification - 52 Surface Tension - 52, 93 Switch - 645 System In Package - 388

Tactile Sensor - 344 Telemetry - 252 Telemetry - 641 Temperature Coefficient - 731 Temperature Compensation - 731 Temperature Control - 324 Temperature Sensor - 244, 280 Tensile - 439 Tensile Test - 431 Thermal Actuator - 645, 698 Thermal Coefficient of Expansion - 435 Thermal Isolation - 160, 564

Thermal Management - 149 Thermo-Acoustic Refrigerator - 149 Thermo-Capillary - 109 Thermo-Elastic - 586 Thermo-Kinetic - 196 Thermo-Optic Effect - 564 Thermo-Pneumatic Action - 24 Thick Silicon Dioxide - 160 Thin Film Metallic Glass - 372, 507 Through Via Hole – 152, 368 Torsion Bar - 532 Transdermal - 467 Transducer - 300 Transformer - 653 Tunable Capacitor - 669 Tunable Optical Filter - 564 Tunneling Current - 352 Tunneling Tip - 352 Turbulent Flow - 113 Turbulent Flow Sensor - 312 Two-Phase Cooling - 89 Two-Phase Flow - 28

Ultrasonic - 415 Ultrasonic Imaging - 300 Ultra-Thin Silicon Film - 427 Underwater - 340

Valve and Pump - 24 Varifocal Mirror - 511 Vertical Motion - 602 Void-Fraction - 85

Wafer Bonding - 407, 411, 419 Wafer Level Package - 681 Waterproof Coating - 340 Waveguide - 574 Wireless - 252, 606

Xenon Difluoride - 710 X-Ray - 180 X-Ray Lithography - 400

Young's Modulus - 427

0-7803-7185-2/02/$10.00 ©2002 IEEE xli

Micro Electro Mechanical Systemsdw/if/ideas/mems/mems_2002_papers/fm.pdf · Welcome to Las Vegas,...

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