Micro Electro Mechanical Systems MEMS”...

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Micro Electro Mechanical Systems“MEMS” Subcommittee Workshop

30-Apr-2015

Earl Fischer Autoliv

Dr. Mykola Blyzniuk Melexis

Mike Aldrich Analog Devices

© Autoliv, Inc. All Rights Reserved. / INTERNAL / ALVcode-Initials-MMMYYYY / filename.pptx - 2

Workshop content

� Teams, Scope, and Timing Earl. Fischer

�Pressure Sensor Status Dr. Mykola Blyzniuk

� Inertial/Oscillators Status Mike Aldrich


Teams

�MEMS Subcommittee Earl Fischer

�Pressure Sensor Subteam Dr. Mykola Blyzniuk

� Inertial/Oscillators Subteam Mike Aldrich

�MEMS Microphone Subteam ???

� Microphone subteam has small membership and no leader. No specification will be developed unless active participation is expanded .

� Members who volunteered to be on team below.

Mark D Sears Bose U

Bassel AtalaST Microelectronics

SAS


MEMS Subcommittee Scope and Timing

�Determine the need to modify AEC Q100’s:

�Qualification tests (Table 2)

�Mission profile(s)

� Failure Mechanisms

�Process Change Qualification … Selection of Tests (Table 3)

�Definition of a Product Qualification Family (Appendix 1)

�Others as needed.

�Device Specific Tests Section 4.2 of Q100.

� Time for completion: specs to be ready for review by AEC Technical committee by Nov 2015.

We Engineer

The Sustainable Future.Written by Team Lead Dr. Mykola BLYZNIUK, Melexis Quality Manager and Reliability Assurance Team Leader

W5: MEMs Qualification Update -Status of Pressure Sensors AEC-Q100

Specification Development

Summary of “Pressure SensorsAEC-Q100 Development”Team Meetings 2014/2015

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Small things make a big difference.

Written by Team lead Dr. Mykola BLYZNIUK , Quality Manager and Reliability Assurance Team Leader

Pressure Sensors Team Roster

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Meetings Statistics(In Total 9 meetings had been organized in 2014/2015)

Yes

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No Yes

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Yes

Yes

7 meetings in 2014

and 2 meetings in 2015

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Main Goal of Pressure Sensors Team

Goal is the same as goal of full MEMS Subcommittee.

Only we should be focused on Pressure Sensors.

Source: Earl Fischer “MEMS Subcommittee Meeting Summary” from 13th of May 2014:

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Example of Meeting Discussion: Focus on Table 2

• Failure Mechanism of Pressure Sensors::• Is proposed approach to work on the base

of Knowledge Matrix OK for all? • In order to have constructive and effective discussion during our meetings it is needed to collect in

advance inputs from users and suppliers related to possible failure mechanisms of pressure sensors,

proposed reliability tests and test conditions for catching of fails:• Collecting of Inputs is proposed by filling the Knowledge Matrix

• Results of discussion:• Inputs from all are very appreciated;

• If there is lack of experience of working with Knowledge Matrix, then inputs in

any free format are welcome as well:• “in most cases the failure mechanisms are intuitive.” (Earl Fischer)

• Already existing world experience should be taken into account:

• We should collect and use as much as possible inputs based on experience of different

users and suppliers;

• At the same time all team members can contribute based on own experience;

• Afterwards all collected info will be critically analysed and reviewed by all in order to

reach aligned final solution.

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Inputs Gathering and Analysis:Failure Mechanism based Approach

• Failure Mechanism of Pressure Sensors

and Proposed Tests:

Sources of

Inputs

Inputs on the

base of intuitive

failure

mechanisms

Filling of

Knowledge

Matrix

Existing world

experience

It is very important to get inputs

from team members which will be

based on own experience

(especially from users about

failure mechanisms from field)

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Meetings Discussion

• Failure Mechanism of Pressure Sensors

and Proposed Tests:

• Knowledge Matrix: Inputs analysis and recommendations

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Meetings Outcome:PROPOSALS: Pressure Sensors AEC-Q100 Specification

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Meetings Continuation - Next Steps: Work on Table 3 “Process Change Qualification Guidelines for the Selection of Tests”

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Meetings Continuation - Next Steps: Work on Table 3 “Process Change Qualification Guidelines for the Selection of Tests”

INPUTS:

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Meetings Continuation - Next Steps:

Final Step:

• Integration of “Pressure Sensors AEC-Q100 Specification”

into General MEMS Specification

© Copyright M

elexis Microelectronic Integrated Systems. All Rights Reserved

Thanks for the Attention!

INERTIAL/OSCILLATORS MEMS SUB-TEAM

MIKE ALDRICH

ANALOG DEVICES, INC.

AEC-Qxxx MEMS Qualification Requirements

4/30/2015

Inertial/Oscillators MEMS Sub-Team Roster

25

Name Company

Mike Aldrich, Sub-team Leader Analog Devices Inc.

Jeff Aquino Maxim Integrated

Bassel Atala ST Microelectronics SA

Ramon S. Aziz Delphi Electronics and Safety

Dave Brown Micrel Inc.

Earl Fischer, Team Leader Autoliv

Herve Couetoux Renault

Nick Lycoudes Freescale

Joseph C Ney General Motors Company

Marie-Pierre Rousse Renault

Saul Sanchez Visteon

Steven P Sibrel Harman

Thomas B. VanDamme TRW Automotive

Inertial/Oscillators MEMS Sub-Team

Specification Development Plan

►Define Scope

► Identify Failure Mechanisms

►Determine Stresses

►Define Mission Profile(s)/Grade(s)

►Define Acceptance Criteria/Reject Disposition

►Define Major Change Categories

►Define Families

26

Define Scope

►There are many types of MEMS processes and technologies

►Technologies considered for inclusion in a new document

� Silicon bulk or surface micromachining

� Hermetic, plastic overmolded, and cavity plastic packages

� Overmolded with or without gel coating

� Capping technology – glass frit, metal/metal, Si Fusion

� MEMS-only die or integrated MEMS

� Combo devices vs. single function

27

►Various types of MEMS packages should be defined in section 1

� This would go beyond the current package types referenced in AEC-Q100

►Packages used for MEMS include the following (Inertial/Oscillator MEMS automotive applications highlighted in blue):

� Hermetic Cavity Package, Hermetic MEMS

� Hermetic Cavity Package, Non-hermetic MEMS

� Non-Hermetic Cavity Package, Hermetic MEMS

� Non-Hermetic Cavity Package, Non-hermetic MEMS

� Open Cavity Package, Non-hermetic MEMS

� Open Cavity Package, Hermetic MEMS

� Overmolded Leadframe Package, Hermetic MEMS

� Overmolded Laminate Package, Hermetic MEMS

� Wafer Scale Package, Hermetic MEMS

� Wafer Scale Package, Non-hermetic MEMS

MEMS Package Types

29

Sample of MEMS Packages

BGA Hermetic Ceramic Package, Non-Hermetic MEMS

Non-Hermetic Cavity Laminate Package, Non-hermetic MEMS,

Multi-Chip

Compound

Cu Lead Frame

Die Attach

Sensor Die

Au Bond Wire

Solder Terminations

MEMS Sensor

Epoxy Mold Silicon Cap

Seal Glass

LFCSP Overmolded Leadframe Package, Hermetic MEMS

•Overmolded LGA Package,•Hermetic MEMS, Multi-Chip

Epoxy Mold

Compound Silicon

Cap

Seal

Glass

Au Bond Wire

MEMS Sensor

BT Laminate

Die

Attach

Sensor Die

Au Land Finish

ASIC Die

Gel CoatAu Bond Wire

BT Laminate

Die Attach

Au Land Finish

ASIC Die

LidMEMS Sensor

Die Attach

Material

LidMEMS Die

Solder Balls

Aluminum

Wire BondSolder Seal

Multilayer

Ceramic

Package

Ball Attach Solder

MEMS Failure Mechanisms

►MEMS devices are susceptible to a new set of failure mechanisms, in addition to traditional semiconductor mechanisms

►MEMS failure mechanisms can time dependent or event related

►Accelerated environment stresses draw out time or cycle dependent mechanisms, while event related mechanisms can be drawn out with worst case simulations

►The inertial MEMS sub-team met and complied a list of known failure mechanisms, and stresses drawn out by those mechanisms

30

MEMS Failure Mechanisms – Event Related

31

Failure Mechanism Stress

Contaminant (not particle)

Biased Accelerated Moisture Stress

Powered mechanical shock

Preconditioning

Unbiased moisture

Cracked/Broken structure


Unpowered mechanical shock/vibration/constant acceleration

power cycling (self test cycling)

Glass frit encroachment Unpowered mechanical shock/vibration/constant acceleration

Particle / ImpedimentPowered mechanical shock

Unpowered mechanical shock/vibration/constant acceleration

Seal breach/ hermeticity loss

(Moisture ingress)

Biased or Unbiased Accelerated Moisture Stress

Lead tests (hermetic)

Preconditioning

Fine/Gross Leak Test

Stiction


ESD - CDM


Parametric failure/Package Stress

High Temperature Storage

Preconditioning

Temperature and Humidity Storage

MEMS Failure Mechanisms – Time Dependent

32

Failure Mechanism Stress

Cracked/Broken structure

Vibration

Temperature, humidity, vibration

Humidity-temp/vib series

Temp,Humidity cycling (non-hermetic)

Temperature cycling

Glass frit encroachment High Temperature Storage

Seal breach/ hermeticity loss

(Moisture ingress)


Temperature cycling

Preconditioning

High Temperature Storage

Low Temperature Storage

Parametric failure/Charge Trapping High Temperature Operating Life

►Temperature Grades

� Same as AEC-Q100

►Proposed Mechanical Grades

� Grade M0: None

� Grade M1: Shock x, Vibration y



� Grade M4: Special, as defined by user and agreed by manufacturer

►Mechanical grades would depend upon the mechanical mission profile (e.g. door slam shock, engine vibration, etc.)

� Perhaps per ISO-16750-3, “Road vehicles — Environmental conditions and

testing for electrical and electronic equipment — Part 3: Mechanical loads”

►Need Tier 1 input to define standard mechanical mission profiles

Inertial/Oscillator MEMS Mission Profiles

MEMS Device Specific Tests

► A set of tests need to be defined as the minimum set to be run for the specific device to be qualified, similar to ESD/LU for IC’s per AEC-Q100, 4.2

► Suggested MEMS Device Specific Tests:� Preconditioning (PC)� Hygroscopic Swelling Test (SWL)� Powered Mechanical Shock (PMS)� Variable Frequency Vibration (VFV)� Constant Acceleration – MEMS (CAM)� Random Drop (RD) or Guided Drop (GD)� Unpowered Mechanical Shock (MECH) and Random Vibration (VIB) per Mechanical

Grade, as applicable� Electrical Distribution - The supplier must demonstrate, over the operating

temperature grade, voltage, and frequency that the device is capable of meeting the parametric limits of the device specification. This data must be taken from at least three lots, or one matrixed (or skewed) process lot, and must represent enough samples to be statistically valid, see Q100-009. It is strongly recommended that the final test limits be established using AEC-Q001 Guidelines For Part Average Testing.

� Other Tests - A user may require other tests in lieu of generic data based on his experience with a particular supplier or technology.

34

Table 2 Tests

TEST GROUP X1 – ACCELERATED ENVIRONMENT STRESS TESTS

Accelerometers, Gyros, and Oscillator Sensors

STRESS ABV # NOTESSAMPLE

SIZE / LOT

NUMBER

OF LOTSACCEPT TEST ADDITIONAL REQUIREMENTS

Low

Temperature

Storage - Seal

LTSS C5 TBD 45 3 0 Fails N/A

-40⁰C for 1000 hours

TEST before and after LTSS HTSL at room and hot temperature.

Random

VibrationVIB A5 TBD 77 3 0 Fails TBD TBD - Per Mechanical Grade. TEST at room temperature.

Temperature,

Humidity and,

Vibration

THV A6 TBD 77 3 0 Fails TBD TBD, for non-hermetic MEMS

Power Cycling PWC B5 TBD 10 3 0 Fails TBD

1 Hz Minimum, unless otherwise specified. Resonating structures only,

maximum operating temperature. Duration TBD. TEST before and after

at room temperature

35

Table 2 (Accel Gyros and Crystal Sensors Dedicated): Qualification Test Methods (additional new tests to already specified relevant tests in Table 2 “Qualification Test Methods” of AEC-Q100-Rev-H)*PMS, VFV, and CA may be done as a sequence.

*** IV - Internal Visual Inspection acc. to MIL 883;M.2013 needs to be considered

Table 2 Tests

TEST GROUP X2 – MECHANICAL EVENT SIMULATION STRESS TESTS


STRESS ABV #NOTE

S

SAMPLE

SIZE /

LOT

NUMBE

R OF

LOTS

ACCEPT

CRITERI

A

TEST

METHODADDITIONAL REQUIREMENTS

Powered

Mechanical

Shock*

PMS B1 TBD 10 3 0 Fails

JEDEC

JESD22-

B110

Performed at the device absolute maximum rating, with the maximum

MEMS element biasing. This test may be performed with the device

soldered to a coupon PCB. Unless otherwise specified, the pulse

width for shocks ≥3000g's shall be 0.1ms or greater. Each device

shall be tested in the positive and negative orientation in the X, Y,

and Z axes. TEST before and after at room temperature.

Variable

Frequency

Vibration*

VFV B2 TBD 10 3 0 Fails

JEDEC

JESD22-

B103

20 Hz to 2 KHz to 20 Hz (logarithmic variation) in >4 minutes,

4X in each orientation, 50 g peak acceleration. TEST before

and after at room temperature.

Constant

Acceleration -

MEMS*

CAM B3 TBD 10 3 0 Fails

MIL-STD-

883

Method

2001

Y1 plane only, Stress to the absolute maximum g shock

rating, minimum. TEST before and after at room

temperature.

Random Drop or

Guided Drop

RD or

GDB4 TBD 10 3 0 Fails

Drop part on each of 6 axes once, or 10 times in a random

orientation from a height of 1.2m onto a concrete surface.

TEST before and after at room temperature.

Power Cycling PWC B5 TBD 10 3 0 Fails

1 Hz Minimum, unless otherwise specified. Resonating

structures only, maximum operating temperature. Duration

TBD. TEST before and after at room temperature

Unpowered

Mechanical

Shock

MEC

HB6 TBD 10 3 0 Fails TBD - Per Mechanical Grade. TEST at room temperature.

36

*PMS, VFV, and CAM may be done as a sequence.

Table 2 Tests

TEST GROUP X3 - Special Consideration Tests:

Disposition of Devices Failing Standard Temperature Cycling or Moisture tests


STRESS ABV # NOTES

SAMPLE

SIZE /

LOT

NUMBER


Hygroscopic

Swelling

Test

SWL D2 TBD 30 3 0 Fails

Stress for at worst case temperature and humidity conditions for

1000 hours.. TEST before and after UHST or THS at room and hot

temperature.

Note, for the sake of MEMS/Package interactions, this test intends

to impart mechanical stress upon the MEMS die to simulate device

behaviour in application, for example, to assess parametric drift

performance. Any other mechanisms observed during moisture

stresses shall be dispositioned by the user and manufacturer as

appropriate for the given mission profile.

Moisture

Ingress TestMIT C3 TBD 45 3 0 Fails

UHST (130°C/85%RH for 24 hours, or 110oC/85%RH for 72 hours)

or THS (85⁰C/85% for 500 hours). TEST before and after UHST or

THS at room and hot temperature.

Unbiased moisture stresses may be used to identify loss of MEMS

hermeticity by causing stiction or changing the device performance.

Marginal parametric failures are invalid if SWL passes, but must be

reported.

Temperature

CyclingTCI D3 TBD 30 3 0 Fails

JESD22-

A104 and

Appendix 3

PC before TCI. For the sake of MEMS/Package Interactions,

temperature is the same, and duration is 1/2 of the TC requirement

for the respective temperature grade. The temperature may be

lowered in the case where the high temperature is beyond the linear

regime of any of the package materials.

TEST before and after TC at hot temperature.

37

Table 2 Tests Modification of existing Q100 Stresses

TEST GROUP A – ACCELERATED ENVIRONMENT STRESS TESTS

STRESS ABV # NOTES

SAMPLE

SIZE /

LOT

NUMBER


Preconditioning PC A1P, B, S, N,

G77 3 0 Fails

JEDEC

J-STD-020

JESD22-A113

Performed on surface mount devices only. PC performed before THB/HAST,

AC/UHST, TC, and PTC stresses. It is recommended that J-STD-020 be

performed to determine what preconditioning level to perform in the actual PC

stress per JA113. The minimum acceptable level for qualification is level 3 per

JA113. Where applicable, preconditioning level and Peak Reflow Temperature

must be reported when preconditioning and/or MSL is performed. Delamination

from the die surface in JA113/J-STD-020 is acceptable if the device passes the

subsequent Qualification tests. Any replacement of devices must be reported.

All preconditioning results shall be summarized in the report. TEST before and

after PC at room and hot temperature.

Autoclave or Unbiased

HAST or Temperature-

Humidity (without Bias)

Unbiased Accelerated

Moisture Test, Unbiased

HAST or Temperature

Humidity Storage

AC or

UHST or

THS

A3 P, B, D, G 77 3 0 Fails

JEDEC

JESD22-A102,

A118, or A101

For surface mount devices, PC before AC (121oC/15psig for 96 hours) or

unbiased HAST (130°C/85%RH for 96 hours, or 110oC/85%RH for 264 hours).

For packages sensitive to high temperatures and pressure (e.g., BGA), PC

followed by TH (85oC/85%RH) for 1000 hours may be substituted. TEST before

and after AC, UHST, or TH at room temperature and hot temperature.

Some package swelling can occur during UHST stresses that provide stresses to

the MEMS device that will not be seen in the application. In those situations the

device must pass MIT and SWL.

38

Table 2 Tests Modification of existing Q100 Stresses

TEST GROUP A – ACCELERATED ENVIRONMENT STRESS TESTS

STRESS ABV # NOTES

SAMPLE

SIZE /

LOT

NUMBER


Temperature

CyclingTC A4

H, P, B,

D, G77 3 0 Fails

JEDEC

JESD22-

A104 and

Appendix 3

PC before TC for surface mount devices.

Grade 0: -55ºC to +150ºC for 2000 cycles or equivalent. Grade 1:

-55oC to +150oC for 1000 cycles or equivalent. Note: -65oC to

150oC for 500 cycles is also an allowed test condition due to

legacy use with no known lifetime issues.

Grade 2: -55ºC to +125ºC for 1000 cycles or equivalent.

Grade 3: -55ºC to +125ºC for 500 cycles or equivalent.

1 cycle per hour for Metal MEMS elements.

TEST before and after TC at hot temperature. After completion of

TC, decap five devices from one lot and perform WBP (test #C2)

on corner bonds (2 bonds per corner) and one mid-bond per side

on each device. Preferred decap procedure to minimize damage

and chance of false data is shown in Appendix 3.

High Temperature

Storage LifeHTSL A6

H, P, B,

D, G, K45 77 1 3 0 Fails

JEDEC

JESD22-

A103

Plastic Packaged Parts

Grade 0: +175ºC Ta for 1000 hours or +150ºC Ta for 2000 hours.

Grade 1: +150ºC Ta for 1000 hours or +175ºC Ta for 500 hours.

Grades 2 and 3: +125ºC Ta for 1000 hours or +150ºC Ta for 500

hours.

Ceramic Packaged Parts

+250ºC Ta for 10 hours or +200ºC Ta for 72 hours.

TEST before and after HTSL at room and hot temperature.

* NOTE: Data from Test B3 (EDR) can be substituted for Test A6

(HTSL) if package and grade level requirements are met.

39


Thanks for your attention

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