IC Fabrication Overview Procedure of Silicon Wafer Production
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1 IC Fabrication Overview Procedure of Silicon Wafer Production Raw material ― Polysilicon nuggets purified from sand Crystal pulling Si crystal ingot Slicing into Si wafers using a diamond saw Final wafer product after polishing, cleaning and inspection A silicon wafer fabricated with microelectronic circuits
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IC Fabrication Overview Procedure of Silicon Wafer Production. Raw material ― Polysilicon nuggets purified from sand. Si crystal ingot. Crystal pulling. Slicing into Si wafers using a diamond saw. A silicon wafer fabricated with microelectronic circuits. - PowerPoint PPT Presentation
Transcript of IC Fabrication Overview Procedure of Silicon Wafer Production
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IC Fabrication Overview
Procedure of Silicon Wafer Production
Raw material ― Polysilicon nuggets purified from sand
Crystal pulling
Si crystal ingot
Slicing into Si wafers using a diamond sawFinal wafer product after polishing,
cleaning and inspection
A silicon wafer fabricated with microelectronic circuits
BASIC PROCESSING STEPSDesign Then
Repeated Application Of:
Oxidation and/or NitridationPhotolithography
Wet Etching (Chemical)Dry Etching (Plasma)
Ion Implantation and/or DiffusionEvaporationSputtering
Plasma Assisted DepositionEpitaxy
Many Processing Steps are at temperatures to 1200°C
OTHER DEVICES AND TECHNOLOGIESThin-Film Transistors (TFT)Displays-Liquid Crystal Displays (LCD), Plasma, LED Backlit, etc.Photonic-Light Emitting Diodes (LED), Organic Light Emitting Diodes (OLED),
LASERS, Optical Chips, etc.)Photovoltaics-Conventional Crystalline and Flexible Thin-FilmDevices and Systems on Flexible Substrates Micro-Electro-Mechanical Systems (MEMS) integration of mechanical
elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology. Electronics are fabricated using integrated circuit (IC) process sequences (e.g., CMOS, Bipolar, or BICMOS processes)Micromechanical components are fabricated using compatible
"micromachining" processes that selectively etch away parts of the silicon wafer or add new structural layers to form the mechanical and electromechanical devices.
