Modular Cleanrooms, Inc.

Silicon wafer fabrication• Taken from www.egg.or.jp/MSIL/english/index-

e.html

Silicon wafer fabrication – slicing and polishing

• Taken from www.egg.or.jp/MSIL/english/index-e.html

Wee

k 1

Wee

k 2

N-type Si wafer <100>

Pre-diffusion cleanPad oxidation

Spin photoresist

PR

SiO 2

O 2

ECE 1406 PMOS Fabrication Sequence

Expose PR with active area maskand develop

Wee

k 3

Wee

k 4

Etch Active Area

Gate oxidation

Deposit LPCVD polysilicon

Poly

PR/etch gate m askStrip PR

O 2

SiH 4

SFO

6

2

Wee

k 2

Wee

k 5

Wee

k 6

Ion im plant BF 2

+

Pre-diffusion cleanDrive-in/oxidation

PR/etch contact m askStrip PR

CleanSputter deposit A l/1% Si

Al/Si

P doped areas

OH O

2

2

Ar

Wee

k 6

PR /etch metal maskStrip PRAnneal

Source

DrainGate (contact not shown)

LPCVD Systems

IBM 7-Level Cu Metallization

What is a Microswitch?

Surface Micromachined5-500 Micron Size5-300 V Actuation

so urc e

so urc e

so urc e

g a te

g a te

g a te

d ra in

d ra in

d ra in

so urc e

so urc e

g a te

g a te

d ra in

d ra in

MEMS Gyroscope Chip

1m D

rive

0.01Å Sen

se

J. Seeger, X. Jiang, and B. Boser

Single chip six-degree-of-freedom inertial measurement unit (uIMU) designed by IMI

principals and fabricated by Sandia National Laboratories

TI Digital Micromirror Device

Micromachining Ink Jet Nozzles

Microtechnology group, TU Berlin

Gene chips, proteomics arrays.

NEMS: TOWARD PHONON COUNTING: Quantum Limit of Heat Flow.

RoukesGroupCal TechTito

Biological Nanomotor