Bosch Sensortec BME280 Integrated Environmental Sensor 2015 teardown reverse costing report...

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

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Electronic Costing & Technology Experts

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February 2015 – Version 1 – Written by Elena Barbarini

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Bosch BME280 barometric pressure sensor

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Glossary1. Overview / Introduction 4

– Executive Summary– Reverse Costing Methodology

2. Company Profile 7– Bosch Sensortec– BME280 Characteristics

3. Physical Analysis 13– Synthesis of the Physical Analysis– Physical Analysis Methodology– Package 16

– Package Views, Dimensions & Pin Out– Bond Pad Opening & Bond Pad– Package Opening– Package Cross-Section

– ASIC 28– View, Dimensions & Marking– Delayering– Main Blocks Identification– Process Identification– Cross-Section – Process Characteristics

– MEMS Pressure 40– View, Dimensions & Marking– Sensing Area Details– Cross-Section– Process Characteristics

– MEMS Humidity 55– View, Dimensions & Marking– Sensing Area Details– Cross-Section– Process Characteristics

4. BME280 Vs BMP280 Comparison 62

5. BME280 Vs Sensirion SHTC1 Comparison 66

6. Manufacturing Process Flow 69– Global Overview– ASIC Process Flow– ASIC Wafer Fabrication Unit– MEMS Pressure Process Flow– MEMS Pressure Wafer Fabrication Unit– MEMS Humidity Process Flow– MEMS Humidity Wafer Fabrication Unit– Packaging Process Flow & Assembly Unit

7. Cost Analysis 85– Synthesis of the cost analysis– Main steps of economic analysis– Yields Hypotheses– ASIC 90

– ASIC Front-End Cost– ASIC Die Cost

– MEMS Pressure 95– MEMS Front-End Cost– MEMS Front-End Cost per process steps– MEMS Probe Test & Dicing Cost– MEMS Wafer & Die Cost

– MEMS Humidity 104– MEMS Front-End Cost– MEMS Front-End Cost per process steps– MEMS Probe Test & Dicing Cost– MEMS Wafer & Die Cost

– Packaging Cost 119– Back-End : Final Test & Calibration Cost– BME280 Component Cost

8. Estimated Price Analysis 116– Manufacturer Financial Ratios– Estimated Selling Price

Contact 122


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• This full reverse costing study has been conducted to provide insight on technology data,

manufacturing cost and selling price of the BME280 integrated environmental sensor supplied by

Bosch for mobile application.

• Assembled in a 8-pins LGA 2.5 x 2.5 x 0.93mm package, the BME280 is a digital humidity, pressure

and temperature sensor equipped with two MEMS dies and an amplification ASIC. It is designed by

CMOS process and it has operating ranges of -40…+85°C, 0…100 % relative humidity and 300…1100

hPa

• The MEMS pressure sensor is manufactured with Bosch APSM process with the flexible pressure

membrane and temperature diodes on Si substrate. The relative humidity sensors presents an

innovative resistive measurement technology which allows a very fast and precise response in very

compact size.

• Since BME280 is an evolution of BMP280 sensors, the report presents a comparison between theASIC and the MEMS pressure sensors of the two devices.

• The report presents also a comparison with Sensirion Humidity sensor SHTC1.


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The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price


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• Package: metal lid LGA 8-pads

• Dimensions: 2.5 x 2.5 x 0.93 mm

• Pitch: 0.65mm

Package top view Package bottom view

Package Side View

2.5 mm

0.95mm

2.5mm

• Marking: 020

UP

325 µm


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• The die marking includes:

CMP460M

2012

<Bosch logo>

MEMS Die Marking


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ASICFront-End Cost

ASICProbe Test Cost

ASICDicing Cost

Packaging Cost

Final Test Cost

Environmental sensor

• We perform the economic analysis of the IC with the IC Price+ tool.

• We perform the economic analysis of the MEMS and packaging with the MEMS CoSim+ tool.

MEMSFront-End Cost

MEMSProbe Test Cost

MEMSDicing Cost

Subcontractor

Subcontractor


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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated).

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

• Consulting and Specific Analysis

– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]

– Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.Email: [email protected]

– RoW: Jean-Christophe Eloy, President & CEO, Yole DéveloppementEmail: [email protected]

• Report business

– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]

– Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service Email: [email protected]

– Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.Email: [email protected]

– Korea: Hailey Yang, Business Development Manager, Korean OfficeEmail: [email protected]

• Financial services

– Jean-Christophe Eloy, CEO & PresidentEmail: [email protected]

• General

– Email: [email protected]

Bosch Sensortec BME280 Integrated Environmental Sensor 2015 teardown reverse costing report...

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