Stefan Finkbeiner, Bosch Sensortec - SEMICON...

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The Big Application

ConvergenceStefan Finkbeiner, Bosch Sensortec

Marketing | 2016 | © Bosch Sensortec GmbH 2016. All rights reserved, also regarding any disposal, exploitation, reproduction, editing, distribution, as well as in

the event of applications for industrial property rights.

Bosch Sensortec

Content

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02

03

Electronics Industry Trends

Today‘s Drivers & Key Success Factors

Cross Domain Convergence

2 Marketing | 2016 | © Bosch Sensortec GmbH 2016. All rights reserved, also regarding any disposal, exploitation, reproduction, editing, distribution, as well as in


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• MEMS are miniature systems that combine tiny

mechanical structures with electronic circuits.

Typical individual structures have a size of a few µm.

• The MEMS sensor element is usually packaged

together with an ASIC and made into one unit, e.g.

into a LGA package.

Micro-Electro-Mechanical Systems

What are MEMS?



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Bosch – 20 Years of Sensor market Innovation

Consumer Electronics

Bosch Sensortec,

Akustica

• Accelerometers, Gyroscopes

• Geomagnetic sensors

• Pressure sensors

• Humidity sensors

• Combo sensors

• MEMS microphones

Automotive

Automotive Electronics

• Accelerometers

• Angular rate sensors

• Pressure sensors

• Mass flow sensors

• Position sensors

Internet of Things

Bosch Connected Devices

and Solutions

• Smart sensors & actuators

• ASSN’s

• Customized sensor & actuator

solutions

• Domain Algorithms

Start-UpStart-Up

2005

2009

2013 1995



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01Electronics Industry Trends –

From sensor

solution perspective



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Future Challenges – Market Pull

Megatrends

New mobility concepts

Demography

Urbanization

CO2-reduction and energy efficiency

Connected world

Individualized products



6.593 billion devices in 2015

0.062 billion vehicles

0.019 billion in telemedicine

0.070 billion in security

0.120 billion smart meters

0.260 billion TVs

0.625 billion tablets

3.000 billion mobile phones

1.498 billion laptops

0.895 billion desktops

0.044 billion servers

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Connectivity & Service – Market Push

Technology evolution

1 billion

2 billion

3 billion

4 billion

Devices connected

People connected

World population

People connected to the internet

1995 2005 2015

5.7bn6.5bn

15%

7.3bn

1995 2005 2015

0,7% 75%

7 Marketing | 2016 | © Bosch Sensortec GmbH 2016. All rights reserved, also regarding any disposal, exploitation, reproduction, editing, distribution, as well as in


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MEMS sensor impact

Proliferation

1st wave

Automotive

2nd wave

Consumer

Electronics

3rd wave

Internet of Things

(IoT)

1990 2000 2010 2020



Sensor solutions beyond MEMS

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Key Assumption: There will be no stand-alone applications

Industry Mobility Energy Smart Home Smart City



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02Today‘s Drivers &

Key Success Factors –

The integration trajectory



Sensor solutions beyond MEMS

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New World – Cross Domain Challenge

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Smart Home:heating systems

Smart Home:security systems

Connected Mobility

Ap

plic

ati

on

do

ma

in

Low Power(Integrated power

management)

Wireless Interface(Network Capability)

Integrated Function(Algos & Software)

FOTA capable(Firmware Over The

Air update)

Efficient Module(integrates all...but

only needed

functions)

Body area network

Se

ns

or

No

de



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Vision - The near future

Domain level integration (SIP)

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Integrates the full domain know-how



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Acoustic

Sensing

Smart

Sensing

Environmental

Sensing

Acceleration (BMA)

eCompass (BMC)

Environmental Unit (BME)

Gyroscope (BMG)

Hubs (BHI/BHA)IMU (BMI)

Geomagnetic (BMM) Microphone (AKU)

ASSN (Absolute Orientation) (BNO)

Barometric Pressure (BMP)

9-axis (BMX)

Humidity (BME)

Software

Inertial

SensingL

evel

of

inte

gra

tio

n

Key Success Factor 1

Broad technology portfolio for integration capability

Microcontroller



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Various integration levels for maximum application coverage

3-axis 6-axis Sensor Hubs / Nodes9+1-axis

FusionLib:

eCompass3.2

BSX3.5

BHV (Vital sensing solution)

BNX (inc. SW for Sensor Hub)

BHY (Fuser Core & SW)

▶ ▶FusionLib:

BSX 3.5* ▶FusionLib:

BSX3.5

* Bosch Sensortec Sensor Data Fusion

**Pressure Temperature Humidity Gas

Environmental

BMP280 - PT

BME280 – PTH

BME680 – PTHG**



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System integration capability (HW & SW)

Sensor related Know-How

• Hardware & SW CO-Design

• Sensor integrated functionality

• Sensor data fusion

Application related Know-How

• Domain know-how

• Application implementation

• Ext. sensor data fusion

Requirements go far beyond classical semiconductor manufacturers capability



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03Cross Domain

Convergence –

The impact of integration



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Bosch Sensortec

Driving functional integration



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Ultra Low Power Sensor Nodes

BHI & BHA Inertial Product line

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User motion

User position

User context

• Quaternion

• Linear Acceleration

• Rotation

• Gravity

• Robust Heading

• eCompass fast Calibration

• Step counter

• Activity monitoring & Interrupt

• Significant motion detection

Robust, small, intelligent, energy-efficient & functional integration concepts:

SIP with microcontroller & firmware integration



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BHV Vital Product line

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Verified & Validated Solution

• Out of one hand solution

Easy to Integrate

• Plug and Play solution

Ultra Low Power

• Due to HW & SW Optimization “Fuser-Core”

BHV160BHV250

0.95 mm

Integrates a 6-axis

IMU (accelerometer

and gyroscope)

Integrates a 3-axis

accelerometer

Driving miniaturization with smallest sensors, lowest power consumption &

functional integration concepts: SIP with microcontroller & firmware integration



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BHV Vital Product line

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PPG Frontend(LED Driver & ADC)

LED PD

Vital Sensor Hub

I2C

Activity RecognitionVital analytics

Heat rate

Orientation

&

Gesture

recognitionFuser Core

(power

optimized

microcontroller)

Application Level

With a wide-range

support

for different PPG

chipsets

PPG Chipset

Human Machine

InterfaceVital Analytics

powered by

Motion

Sensors(Accelerometer,

Gyroscope)

BHV160 (6-axis) /

BHV250 (3-axis)

Innovative vital sensor functions

Ultra-low power consumption for

maximum system battery life

Complete sensor subsystem

out of one hand



HW Components: 5.2 x 3.8 x 1.1 mm3

• Accelerometer

• Gyroscope

• Magnetometer

• Microcontroller SAMD20

(Cortex M0+)

Development Environment (Atmel Studio based)

• Precompiled BSX fusion libray

• API source files

• Example Projects

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Customizable Solutions - BMF055

Sensor development environment

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Industry’s first custom programmable 9-axis motion sensor easy to program for

application requirements in one comprehensive software development package



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Environmental Sensor Solutions

BME – Product line

Fast innovation in environmental sensing

Combo sensors: Sensing our environment

Quantify yourself

• Well-being recommendations

• Personalized environment

• Sport & fitness monitoring

Personalized control

• Environmental monitoring

• Personal weather forecast

• Home automation

Environmental measurement

• Barometric pressure

• Humidity

• Temperature

• Gas / indoor air quality

New drivers for new applications

BME680BME280BMP280

Pressure

GasHumidity

Temperature

Sensor footprint < 3 x 3 mm²

Low power << 1 mA

High accuracy and

fast setting time ( ≃ 1 % / 1 s)



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• Smart Phones are still the big volume driver

• Wearables & IoT take over the innovation drive – but in a different way

• Domain level integration is the key to this new markets

Bosch Sensortec drives innovation

Conclusions



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Sensing our world

Q & A Session



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