Addistionengineering - Silicon Wafer Processing(1)

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Silicon Wafer Processing

Addison Engineering has an extensive array of

processing capabilities. On our silicon or yours, we can

provide virtually any processing service you may need,

from a simple oxide layer to completely patterned wafers.

Thermal oxide

Ion implant

Epitaxial deposition

Plasma nitride

Photoresist

Wafer bumping


About Wafers:

In electronics, a wafer (also called a slice or substrate) is a thin

slice of semiconductor material, such as a silicon crystal, used in the

fabrication of integrated circuits and other microdevices.

The wafer serves as the substrate for microelectronic devices

built in and over the wafer and undergoes many microfabrication process

steps such as doping or ion implantation, etching, deposition of various

materials, and photolithographic patterning.




Formation:

Wafers are formed of highly pure (99.9999999% purity) nearly

defect free single crystal material.

One process for forming crystalline wafers is known as Czochralski

growth invented by the Polish chemist Jan Czochralski.

In this process, a cylindrical ingot of high purity monocrystalline

semiconductor, such as silicon or germanium, is formed by pulling a

seed crystal from a 'melt'.



Donor impurity atoms, such as boron or phosphorus in the case of

silicon, can be added to the molten intrinsic material in precise

amounts in order to dope the crystal, thus changing it into n-type or

p-type extrinsic semiconductor.



Thermal oxide:

Oxide

TEOS/PETEOS oxide

Gate oxide

Low temperature oxide

PSG glass

Silicon Nitride

LPCVD

Low Stress

Ultra-low Stress

Polysilicon (undoped)



Metal deposition

Evaporation

Sputter

Epitaxial deposition

Ion implantation

SOI

oxidation

wafer bonding

Photolithography



Clean

RCA clean

Mechanical

Ingot slicing

Lap & etch

Wafer thinning

Wafer downsize (diameter cut-down)

Wafer dicing



Wafer reclaim

Laser marking

Wafer bumping

MEMS - Silicon machining



Thin Film Processing:

LOW k

Black Diamond

Coral

Spin On

and more

OXIDE: CVD and Thermal

Thick Photoresist & Polymide

High Energy Deep Ion Implant

Nitrides (Si- and O-)



Low Stress Silicon Nitride

BPSG, PSG, USG

Amorphous Silicon

Diamond Like Carbon

Polysilicon (Doped and Undoped)

METALS: PVD, CVD, Electroplate

Ai, Cu, Au, Cr, Ta, Ti, TiN

TiW, TaN, WN, Ni, Ru

Co, NiSi, TiO2, Pt



Czochralski Growth:



Grinding and Slicing:



Lapping and Etching:



Polishing and Cleaning:



Sizes Available:

Silicon wafers are available in several sizes (diameters)

1 (25mm) 2 (50mm) 3 (75 mm) 4 (100mm) 5 (125mm) 6 (150mm) 8 (200mm) 12 (300mm) 18 (450mm)



Addison Engineering provides Silicon wafers that are

available with a wide range of characteristics (specifications)

to select from.

Thank You

Addistionengineering - Silicon Wafer Processing(1)

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