Addisonengineering -silicon wafer processing
Addistionengineering - Silicon Wafer Processing(1)
Silicon wafers, ceramic package -
Introduction Chemical mechanical polishing (CMP) is a widely used technique for the planarization of metal and dielectric films to accomplish multilevel.
Dummy and Pad Chips Needed for various activities (interconnection tests, mass tests, assembly,…) Production of masks, processing, thinning and dicing.
Introduction
Summer04 epitaxial depostion heterojunction
