8-3-05Jens Jørgen Gaardhøje. NBI. ALICE-CR5 1 ALICE Forward Detectors Technical Design Report...
-
Upload
leslie-holdredge -
Category
Documents
-
view
217 -
download
0
Transcript of 8-3-05Jens Jørgen Gaardhøje. NBI. ALICE-CR5 1 ALICE Forward Detectors Technical Design Report...
8-3-05 Jens Jørgen Gaardhøje. NBI. ALICE-CR5
1
ALICE Forward DetectorsTechnical Design Report
Editorial team:I.G. Bearden (NBI)
H. Bøggild (NBI)
C.Holm (NBI)
J.J. Gaardhøje (NBI), ch
J.Y. Grossiord (Lyon)
T. Malkiewicz (Jyvaesk.)
B.S. Nielsen (NBI)
G. Paic (Mexico)
W. Trzaska (Jyvaeskyla)
8-3-05 Jens Jørgen Gaardhøje. NBI. ALICE-CR5
3
FMD ’inner’ protype before dicing
2 sectors of 512 strips
Test structures on 6” wafer
Hamamatsu
8-3-05 Jens Jørgen Gaardhøje. NBI. ALICE-CR5
6
First 3 inner sensors delivered at NBI-Feb 2005
TDR Specs: Full depletion voltage 50-100V
Measure: full depletion voltage: 75 -80V.
TDR specs: thickness = 310 μm +- 10 μm
Measure: t= 323 μm +- 1 μm
8-3-05 Jens Jørgen Gaardhøje. NBI. ALICE-CR5
7
First test of FMD inner Si sensorsLeakage currents
0
50
100
150
200
250
300
350
400
0 50 100 150 200 250 300 350
Bias voltage (V)
Cu
rren
t (n
A)
Serial no 1
Serial no 2
Serial no 3
Stability test
0
50
100
150
200
250
0 20 40 60 80 100 120 140 160
Time (hours)
Leak
age
curr
ent (
nA) Serial no 1 ?
TDR Specs: < 3 μA
Measure: < 0.3 μA
< 0.3 nA /strip
Full-depletion voltage: 75 V
Measure: < 2.5 pF/strip (bulk)
168 hr long-term stability test of leakage current at 200V
1/C^2
0,000
0,020
0,040
0,060
0,080
0,100
0,120
0,140
0,160
0,180
0,200
0 50 100 150 200 250 300
Bias voltage (V)
1/C
^2
(1
0^
-6 p
F^
-2)
Serial no 1
Serial no 2
Serial no 3
8-3-05 Jens Jørgen Gaardhøje. NBI. ALICE-CR5
11
FEE card test results
I MIP 22400 e-
3.5 fC
Gain 20 mV/fC =>
20MIP 1.4 V
TDR: C=0pF => N=310e-, C=25pF => N=410e-
Measure: C=0pF : N=200e-
Expect for C=25pF: N~300e- => S/N= 22400/300=75.
8-3-05 Jens Jørgen Gaardhøje. NBI. ALICE-CR5
13
FMD milestones adjusted to new ALICE installation schedule • Production of VA_ALICE chip
done• Delivery of prototype hybrid cards done• Delivery of prototype Si sensors Feb-05
done• Prototype digitizer boards produced April-05• Lab tests Si-FEE-Digitizer-RCU Jun-05• Rad. hardness studies of FEE&digitizer May-05• Place Si production order Jun-05• Delivery Si & FEE Nov-05• Bonding at CERN Dec-05• Mechanics RB26 completed Feb-06• Full system test with DAQ Dec-05• Sector (half ring) rad. test Jan-06• Detector assembly RB26 Mar-06• Detector assembly RB24 Jun-06• Ready for installation RB26 May-06• Ready for installation RB24 Sep-06