Silicon wafer fabrication• Taken from

www.egg.or.jp/MSIL/english/index-e.html

Silicon wafer fabrication – slicing and polishing• Taken from www.egg.or.jp/MSIL/english/index-e.html

Wee

k 1

Wee

k 2

N-type Si wafer <100>

Pre-diffusion cleanPad oxidation

Spin photoresist

PR

SiO2

O2

ECE 1406 PMOS Fabrication Sequence

Expose PR with active area maskand develop

Wee

k 3

Wee

k 4

Etch Active Area

Gate oxidation

Deposit LPCVD polysilicon

Poly

PR/etch gate maskStrip PR

O2

SiH4

SFO

6

2

Wee

k 2

Wee

k 5

Wee

k 6

Ion implant BF2+

Pre-diffusion cleanDrive-in/oxidation

PR/etch contact maskStrip PR

CleanSputter deposit Al/1%Si

Al/Si

P doped areas

OH O

2

2

Ar

Wee

k 6

PR/etch metal maskStrip PRAnneal

Source

DrainGate (contact not shown)

Influenza Virus

50 nm Transistor

6 LevelMetallization

IBM 7-Level Cu Metallization

Micromachining Ink Jet Nozzles

Microtechnology group, TU Berlin

TI Digital Micromirror Device

MEMS Gyroscope Chip

1µm Drive

0.01Å Sense

J. Seeger, X. Jiang, and B. Boser

Single chip six-degree-of-freedom inertial measurement unit (uIMU) designed by IMI

principals and fabricated by Sandia National Laboratories

Gene chips, proteomics arrays.

NEMS: TOWARD PHONON COUNTING: Quantum Limit of Heat Flow.

RoukesGroupCal TechTito

Biological Nanomotor

What is a Microswitch?

Surface Micromachined5-500 Micron Size5-300 V Actuation

source

source

source

gate

gate

gate

drain

drain

drain

source

source

gate

gate

drain

drain

Two-Contact Switch

Beam

Gate

Drain

Contact

MEMSMicroswitch

Contact

Contact

Contact

LPCVD Systems