Low-Power, Low-Phase Noise SiGe HBT Static Frequency Divider Topologies up to 100 GHz

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Low-Power, Low-Phase Noise SiGe HBT Static Frequency Divider Topologies up to 100 GHz. Ekaterina Laskin, Sean T. Nicolson, Sorin P. Voinigescu University of Toronto, Canada Pascal Chevalier, Alain Chantre, Bernard Sautreuil, STMicroelectronics, France. Outline. Motivation - PowerPoint PPT Presentation

Transcript of Low-Power, Low-Phase Noise SiGe HBT Static Frequency Divider Topologies up to 100 GHz

Low-Power, Low-Phase Noise SiGe HBT Static Frequency

Divider Topologies up to 100 GHz

Ekaterina Laskin, Sean T. Nicolson, Sorin P. VoinigescuUniversity of Toronto, Canada

Pascal Chevalier, Alain Chantre, Bernard Sautreuil,STMicroelectronics, France

10 October 2006 Paper Number 12.3 2/23

Outline• Motivation• Static divider topology• Fabrication technologies• Test setup and results• Conclusion

10 October 2006 Paper Number 12.3 3/23

Motivation• Applications at 80 GHz:

– Phase-locked loop– Radio circuits

• Comparison of divider topologies• Technology benchmark

10 October 2006 Paper Number 12.3 4/23

Static Divider Topology

• On-chip transformer and matching• Toggle flip-flop, 50 Ω output buffer• 2 different latch designs implemented

10 October 2006 Paper Number 12.3 5/23

Integrated Transformer

• Stacked design, top 2 metals over substrate • 30µm square, 1µm spacing, 2µm metal width

primary

secondary

30µm

10 October 2006 Paper Number 12.3 6/23

Transformer Model

• Model extracted from geometry using ASITIC• π - network includes substrate model• k = 0.855 is achieved

primary

secondaryk

substrate model

10 October 2006 Paper Number 12.3 7/23

Input Network Simulation

• Divider input matched 40 – 100 GHz• Transformer operational up to 100 GHz

10 October 2006 Paper Number 12.3 8/23

Latch Design 1 – w/o input EF• ECL latch

• Inductive peaking

• No split load

• Self-biased

• Resistive input biasing

10 October 2006 Paper Number 12.3 9/23

Latch Design 2 – with input EF

• Double-EF input buffer

10 October 2006 Paper Number 12.3 10/23

0.1 1 100

50

100

150

200

250

300

JC (mA/m2)

fT

fMAX

Implementation• Both dividers fabricated in 2 SiGe processes:

BiCMOS9

0.1 1 100

50

100

150

200

250

300

JC (mA/m2)

fT

fMAX

BipX

10 October 2006 Paper Number 12.3 11/23

Fabricated Dividers

with input EF w/out input EF

BiCMOS9

BipX

10 October 2006 Paper Number 12.3 12/23

Fabricated Dividers

with input EF w/out input EF

BiCMOS9

BipX

10 October 2006 Paper Number 12.3 13/23

Fabricated Dividers

with input EF w/out input EF

BiCMOS9

BipX

10 October 2006 Paper Number 12.3 14/23

Fabricated Dividers

with input EF w/out input EF

BiCMOS9

BipX

10 October 2006 Paper Number 12.3 15/23

Fabricated Dividers

with input EF w/out input EF

BiCMOS9

BipX

515μm × 473μm

3.3 V

145 mW

502μm × 360μm

3.3 V

122 mW

10 October 2006 Paper Number 12.3 16/23

Test Setup

0 - 50 GHz:

50 - 75 GHz:

75 - 100 GHz:

10 October 2006 Paper Number 12.3 17/23

Measurement Results• Divider self-oscillation frequency:

404550556065707580

220 240 260 280 300Process f MAX (GHz)

Div

ider

SO

F (G

Hz)

Divider with EFDivider w/out EF

BipX

BiCMOS9

BipX1BipX2

10 October 2006 Paper Number 12.3 18/23

Sensitivity Curves

-50

-40

-30

-20

-10

0

10

20

10 20 30 40 50 60 70 80 90 100Input Frequency [GHz]

Inpu

t Pow

er [d

Bm

]

BipX, w/o EFBipX, w/ EFBiCMOS9, w/o EFBiCMOS9, w/ EF

25 °C

10 October 2006 Paper Number 12.3 19/23

Sensitivity Curves

-50

-40

-30

-20

-10

0

10

20

10 20 30 40 50 60 70 80 90 100Input Frequency [GHz]

Inpu

t Pow

er [d

Bm

]

25 °C50 °C100 °C

10 October 2006 Paper Number 12.3 20/23

Divider Phase Noise

Input Output

• 100 GHz• -90.4 dBc/Hz @

100 kHz offset

• 50 GHz• -96.4 dBc/Hz @

100 kHz offset• Phase noise -6 dB with frequency halving

10 October 2006 Paper Number 12.3 21/23

-50

-40

-30

-20

-10

0

10

20

10 20 30 40 50 60 70 80 90 100Input Frequency [GHz]

Inpu

t Pow

er [d

Bm

]

BiCMOS9, HBT onlyBiCMOS9, MOS-HBTBipX, HBT only

Further Improvements

HBT only

MOS-HBT

10 October 2006 Paper Number 12.3 22/23

Comparison to Previous Work

[6]

[5]

[9]

[7]

[8][2]

This Work

This Work

30

40

50

60

70

80

90

100

100 200 300 400 500

Technology fT [GHz]

Div

ider

SO

F [G

Hz]

InPCMOSSiGe

10 October 2006 Paper Number 12.3 23/23

Conclusion• 2 SiGe static dividers designed and

analyzed in 2 technologies• Designed divider operates up to 100 GHz• Features an integrated transformer

operating at 100 GHz• Ideal phase noise behaviour• Low power

10 October 2006 Paper Number 12.3 24/23

Thank You

10 October 2006 Paper Number 12.3 25/23

Back-up Slides

10 October 2006 Paper Number 12.3 26/23

50-Ω Output Buffer

10 October 2006 Paper Number 12.3 27/23

0.1 1 100

50

100

150

200

250

300

IC (mA)

fMAX

fT

0.1 1 100

50

100

150

200

250

300

IC (mA)

fMAX

fT

BipX Process Splits

BipX2 BipX1

10 October 2006 Paper Number 12.3 28/23

Measurement Results• Divider self-oscillation frequency:

404550556065707580

170 190 210 230 250 270Process fT (GHz)

Div

ider

SO

F (G

Hz)

Divider with EFDivider w/out EF

BiCMOS9

BipX

BipX1BipX2

10 October 2006 Paper Number 12.3 29/23

Measurement Results

with input EF w/out input EF

BiCMOS9 avg= 45.9 GHzavg= 52.03 GHz

s.dev.= 1.54 GHz

BipX avg= 65.02 GHzavg= 72.43 GHz

s.dev.= 2.06 GHz

10 October 2006 Paper Number 12.3 30/23

Source Phase Noise @ 100GHz

10 October 2006 Paper Number 12.3 31/23

BiCMOS Divider