RADICALLY DIFFERENT ETCH TECHNOLOGY - Applied Materials
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MORE COMPLEX DEVICES INTRODUCE NEW MATERIALS DISRUPTIVE TECHNOLOGY REQUIRED FOR CONTINUED SCALING DIMENSIONS CHALLENGE TRADITIONAL ETCH FinFET Gate All Around 3D NAND RADICALLY DIFFERENT ETCH TECHNOLOGY The Applied Producer ® Selectra ™ Etch System Unprecedented Selectivity for Sustained Scaling Unparalleled Uniformity Damage-Free Processing Tight Spaces High Aspect Ratios Pre-Selectra Post-Selectra The industry's first extreme selectivity etch system introduces new materials engineering capabilities for future generations of self-aligned patterning schemes and 3D logic and memory devices. Atomic-Level Precision
Transcript of RADICALLY DIFFERENT ETCH TECHNOLOGY - Applied Materials
MORE COMPLEX DEVICES INTRODUCE NEW MATERIALS
DISRUPTIVE TECHNOLOGY REQUIRED FOR CONTINUED SCALING
DIMENSIONS CHALLENGE TRADITIONAL ETCH
FinFET Gate All Around 3D NAND
RADICALLY DIFFERENT ETCH TECHNOLOGY
The Applied Producer® Selectra™ Etch System
Unprecedented Selectivity for Sustained Scaling
Silicon
Unparalleled Uniformity
Damage-Free Processing
Tight Spaces High Aspect Ratios
Pre-Selectra Post-SelectraThe industry's first extreme selectivity etch system introduces new materials engineering capabilities for future generations of self-aligned patterning schemes and 3D logic and memory devices.
Atomic-Level Precision