Mobile Devices Deep Dive Sample Report Xiaomi MI3

The Xiaomi MI3 smartphone features a 5-in. IPS TFT-LCD display with FHD (1920 x 1080) resolution, 16M colors, and a capacitive touchscreen with anti-glare overlay. It runs the Android 4.2.1 Jelly Bean operating system with Xiaomis proprietary MIUI (Me You I) user interface on a 1.8 GHz quad-core NVIDIA Tegra 4 processor with 2 GB RAM. It also features 16 GB of internal memory (no microSD slot for additional storage) and two cameras. The rear-facing 13 MP BSI (Sony Exmor RS) CMOS camera has autofocus, dual-LED flash, HDR, and 1080p HD video capability. Theres also a front-facing 2 MP webcam. Connectivity is provided by dual-band WiFi 802.11a/b/g/n (2.4 GHz & 5 GHz), WiFi Mobile Hotspot, WiFi Direct, WiFi Display, Bluetooth 4.0, microUSB 2.0, NFC, DLNA, FM radio, and GPS/GLONASS. Sensors include a 6-axis MEMS gyroscope & accelerometer, 3-axis electronic compass, ambient light/proximity sensor, and pressure sensor. The Xiaomi MI3 is powered by a 3.8 V, 3050 mAh Li-polymer battery. (Battery life is unknown.)

Product Description

DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information.Copyright 2014, TechIngsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.

2014, TechInsights

Deep Dive Teardown

Xiaomi MI3Quad-Band GSM/EDGETD-SCDMA/TD-HSDPA/TD-HSUPA(1800-1920 / 2010-2025 MHz) (Bands 34 & 39)Sample Report

Deep Dive TeardownXiaomi MI3 Sample Report

IC Die Count**IC Package Count**

Retail PriceProduct Dimensions (mm) Total Manufacturing Cost*

Electronics Cost**

Integrated Circuits $73.68 39.3%Modules, Discretes & Connectors $12.94 6.9%Substrates $6.92 3.7%

Component Insertion $5.00 2.7%

Card Test $1.64 0.9%Battery Subsystem $6.06 3.2%Display/Touchscreen Subsystem $55.41 29.6%Rear Camera Subsystem $12.56 6.7%Front Camera Subsystem $4.10 2.2%Non-Electronic Parts $6.87 3.7%Final Assembly & Test $2.27 1.2%

Total $187.45 100.0%

*Excluding Supporting Materials' Cost**Including Subsystems

Front Camera 2 MP BSI CMOS

$187.45

Battery 3.8 V, 3050 mAh, Li-polymer

Storage Internal: 16 GB; External: N/A

Key Subsystems

Display/Touchscreen 5.0" TFT-LCD; 1920 x 1080 Pixels; 16,777,216 Colors; Cover Glass w/ Integrated Touchscreen

MI3

1.8 GHz Quad-Core NVIDIA Tegra 4(ARM Cortex-A15) w/ 2 GB RAM

6-Axis MEMS Gyroscope & Accelerometer, 3-Axis Electronic Compass, Ambient Light / Proximity Sensor, Pressure Sensor

Capacitive Touchscreen

$327.00

Cost Metrics

Manufacturing Cost Breakdown

$135.54

Integrated Circuit Metrics

Rear Camera 13 MP BSI CMOS (Sony Exmor RS), Autofocus, Dual-LED Flash, HDR, 1080p HD Video

6352

Android 4.2.1 "Jelly Bean" w/ MIUI User Interface

Product Description

Communications Quad-Band GSM/EDGE; TD-SCDMA/TD-HSDPA/TD-HSUPA (1880-1920/2010-2025 MHz) (Bands 34 & 39)

ConnectivityWiFi 802.11a/b/g/n (2.4 GHz & 5 GHz), WiFi Mobile Hotspot, WiFi Direct, WiFi Display, Bluetooth 4.0, microUSB 2.0, NFC, DLNA, FM, GPS/GLONASS

Battery Life Use Time: N/AStandby Time: N/A

146.2Weight (grams)

Processor

Sensors

Interface

Product Name & Model #

Product Type

Operating System

SmartphoneBrand Xiaomi

Product Features

Official Release Date 10/15/2013

144 x 73.6 x 8.1

Block Diagram Major Components Antenna SubsystemsComponent Arrangement Main Board Costs and MetricsProduct Packaging Exterior Features Teardown Overview & DiscussionOther SubstratesFront Page Product Overview


Estimated block diagram based on observation of this specific product implementation, manufacturers data sheets where available, and best engineering judgment. Certain details of the interface circuitry are not reflected in this block diagram. Partitioning and connectivity are speculative.

DIPL

GSM

180

0/19

00M

Hz

Rx

4 - Broadcom#BCM43341

WiFi 802.11a/b/g/n / Bluetooth / FM Radio / NFC


WiFi 802.11a/b/g/n / Bluetooth / FM Radio / NFC


GNSS Receiver


GNSS Receiver

25 - Infineon#BGA725L6GNSS LNA


28 - STMicroelectronics#ST33xxxx

Secure Microcontroller w/ Flash

28 - STMicroelectronics#ST33xxxx

Secure Microcontroller w/ Flash

GSM

850

/900

MH

zRx

TD-S

CD

MA 1

900/

2000

MH

zRx

Main AntennaMain Antenna GPS AntennaGPS AntennaWiFi/Bluetooth AntennaWiFi/Bluetooth Antenna NFC AntennaNFC Antenna

To Tegra 4

5 - Spreadtrum#SC8803G5

GSM / TD-SCDMA Baseband Processor & PMU

5 - Spreadtrum#SC8803G5

GSM / TD-SCDMA Baseband Processor & PMU

11 - Renesas#uPG2185T6R

GaAs SPDT Switch

11 - Renesas#uPG2185T6R

GaAs SPDT Switch

14 - Spreadtrum#SR3500

GSM / TD-SCDMA RF Transceiver

14 - Spreadtrum#SR3500

GSM / TD-SCDMA RF Transceiver

15 - RF Micro Devices#RF9812

Quad-Band GSM / TD-SCDMA Bands 34 & 39 Power Amplifier,Antenna Switch

15 - RF Micro Devices#RF9812

Quad-Band GSM / TD-SCDMA Bands 34 & 39 Power Amplifier,Antenna Switch

GSM

180

0M

Hz

Rx

GSM

850

MH

zRx

TD-S

CD

MA 1

900

MH

zRx

GSM

190

0M

Hz

Rx

GSM

900

MH

zRx

TD-S

CD

MA 2

000

MH

zRx

GSM

850

/900

MH

zTx

GSM

180

0/19

00M

Hz

Tx &

TD

-SCD

MA 1

900/

2000

MH

zTx

6 - Micron#MT46H32M16LFBF-5

Mobile LPDDR SDRAM Memory - 64 MB

6 - Micron#MT46H32M16LFBF-5

Mobile LPDDR SDRAM Memory - 64 MB

Product Overview Major Components Antenna SubsystemsComponent Arrangement Main Board Costs and MetricsProduct Packaging Exterior Features Teardown Overview & DiscussionOther SubstratesFront Page

Page 2Page 1

Block Diagram


17 - Cirrus Logic#CS42L73

Audio CODEC

17 - Cirrus Logic#CS42L73

Audio CODEC

SIM

SIM

VibratorVibrator

8 - Invensense#MPU-6050

6-Axis MEMSGyroscope & Accelerometer

8 - Invensense#MPU-6050

6-Axis MEMSGyroscope & Accelerometer

9 - AKM Semiconductor#AK8963C

3-Axis Electronic Compass

9 - AKM Semiconductor#AK8963C

3-Axis Electronic Compass

13 - SanDisk#SDIN8DE4-16G

Multichip Memory - 16 GB MLC NAND Flash, Memory Controller (eMMC)

13 - SanDisk#SDIN8DE4-16G

Multichip Memory - 16 GB MLC NAND Flash, Memory Controller (eMMC)

18 - Texas Instruments#TPA2015D1

2 W Class-D Audio Amplifier

18 - Texas Instruments#TPA2015D1

2 W Class-D Audio Amplifier

19 - Audience#eS325

Voice Processor

19 - Audience#eS325

Voice Processor

20 - Intersil#ISL98607

TFT-LCD Power Supply

20 - Intersil#ISL98607

TFT-LCD Power Supply

21 - Texas Instruments#DRV2604

Haptic Driver

21 - Texas Instruments#DRV2604

Haptic Driver

24 - Texas Instruments#INA231

Current / Power Monitor

24 - Texas Instruments#INA231

Current / Power Monitor

26 - Bosch Sensortec#BMP180

Digital Barometric Pressure Sensor

26 - Bosch Sensortec#BMP180

Digital Barometric Pressure Sensor

27 - Texas Instruments#LM3533

Backlight LED Driver

27 - Texas Instruments#LM3533

Backlight LED Driver

38 - Intersil#ISL29147 ?

Ambient Light / Proximity Sensor, IR Emitter LED

38 - Intersil#ISL29147 ?

Ambient Light / Proximity Sensor, IR Emitter LED

39 - Sony#IMX135

13 MP BSI CMOS Image Sensor

39 - Sony#IMX135


42 - Renesas SP Drivers#R63311A

TFT-LCD Display Driver

42 - Renesas SP Drivers#R63311A

TFT-LCD Display Driver

44 - Mitsumi#MM3210

Battery Protection

44 - Mitsumi#MM3210

Battery Protection

41 - Unknown#Unknown


Front Camera41 - Unknown

#Unknown2 MP BSI CMOS Image Sensor

Front Camera Rear Camera

Rear Microphone

Front Microphone

Speaker

Earpiece

StrobeFlash

StrobeFlash

Estimated block diagram based on observation of this specific product implementation, manufacturers data sheets where available, and best engineering judgment. Certain details of the interface circuitry are not reflected in this block diagram. Partitioning and connectivity are speculative.

1 - NVIDIA#Tegra 4

Quad-Core Applications Processor + GPU

1 - NVIDIA#Tegra 4

Quad-Core Applications Processor + GPU

2 - SK Hynix#H9CCNNNBPTMLBR-NTM

Multichip Memory - 2 GB LPDDR3 SDRAM

2 - SK Hynix#H9CCNNNBPTMLBR-NTM

Multichip Memory - 2 GB LPDDR3 SDRAM

3 - Texas Instruments#TPS65913

Power Management

3 - Texas Instruments#TPS65913

Power Management

23 - Fairchild Semiconductor#FSA3031

Dual USB 2.0 Switch w/ MHL

23 - Fairchild Semiconductor#FSA3031

Dual USB 2.0 Switch w/ MHL

37 - ON Semiconductor#NCT218

Temperature Sensor

37 - ON Semiconductor#NCT218

Temperature Sensor43 - Atmel#MXT540S

540-Channel Capacitive Touchscreen Controller

43 - Atmel#MXT540S

540-Channel Capacitive Touchscreen Controller

7 - Maxim#MAX77665A

Power Management

7 - Maxim#MAX77665A

Power Management

USBUSB

HeadsetHeadset

From BCM4752

To SC8803G5 To BCM43341

Product Overview Major Components Antenna SubsystemsComponent Arrangement Main Board Costs and MetricsProduct Packaging Exterior Features Teardown Overview & DiscussionOther SubstratesFront Page

Page 1 Page 2

Block Diagram


Total Estimated Cost of Supporting Materials: $2.54

Packaging$0.27

Documentation$0.04

SIM Eject Tool$0.03

AC Adapter$1.85

USB Cable$0.35

Product Overview Block Diagram Major Components Antenna SubsystemsComponent Arrangement Main Board Costs and MetricsExterior Features Teardown Overview & DiscussionOther SubstratesFront Page

LabelSupporting Materials

Product Packaging


Product Overview Block Diagram Major Components Antenna SubsystemsComponent Arrangement Main Board Costs and MetricsExterior Features Teardown Overview & DiscussionOther SubstratesFront Page

Supporting Materials Label

Product Packaging


Front Camera

Ambient Light/Proximity Sensor

Earpiece

Touchscreen

microUSB

VolumeLock/Power Key

Speaker

NotificationLEDs

Front Microphone

Product Overview Block Diagram Major Components Antenna SubsystemsComponent Arrangement Main Board Costs and MetricsProduct Packaging Teardown Overview & DiscussionOther SubstratesFront Page

Bottom BacklightsTop

Exterior Features


3.5 mm Jack

SIM Tray Slot

Rear Microphone

Rear Camera

Flash LED


Top BacklightsBottom

Exterior Features



BottomTop Backlights

Exterior Features


Product Overview Block Diagram Antenna SubsystemsComponent Arrangement Main Board Costs and MetricsProduct Packaging Exterior Features Teardown Overview & DiscussionOther SubstratesFront Page

Side 2Side 1

Major Components


Product Overview Block Diagram Antenna SubsystemsComponent Arrangement Main Board Costs and MetricsProduct Packaging Exterior Features Teardown Overview & DiscussionOther SubstratesFront Page

Side 1 Side 2

Major Components


Product Overview Block Diagram Major Components Antenna Subsystems Main Board Costs and MetricsProduct Packaging Exterior Features Teardown Overview & DiscussionOther SubstratesFront Page Component Arrangement


Product Overview Block Diagram Major Components Antenna SubsystemsComponent Arrangement Main Board Costs and MetricsProduct Packaging Exterior Features Overview & DiscussionOther SubstratesFront Page

Step 2 Step 3 Step 4Step 1

Teardown




Teardown



Step 1 Step 2 Step 3 Step 4

Teardown


MainAntenna Element

Length Width Height55 mm 10.5 mm 4.5 mm

Product Overview Block Diagram Major Components SubsystemsComponent Arrangement Main Board Costs and MetricsProduct Packaging Exterior Features Teardown Overview & DiscussionOther SubstratesFront Page

GPS AntennaWiFi/Bluetooth Antenna NFC Antenna Main Antenna

Antenna


17.5 mm 10.9 mm 2.9 mm

Antenna ElementWiFi/Bluetooth

Length Width Height


Main Antenna GPS Antenna NFC Antenna WiFi/Bluetooth Antenna

Antenna


17.6 mm 13.4 mm 3.9 mmLength Width Height

Antenna ElementGPS


Main Antenna WiFi/Bluetooth Antenna NFC Antenna GPS Antenna

Antenna


73.6 mm 48.8 mm 0.2 mm

NFCAntenna Element

Length Width Height


Main Antenna GPS AntennaWiFi/Bluetooth Antenna NFC Antenna

Antenna


Product Overview Block Diagram Major Components AntennaComponent Arrangement Main Board Costs and MetricsProduct Packaging Exterior Features Teardown Overview & DiscussionOther SubstratesFront Page

Display/Touchscreen Camera Battery

Subsystems

Battery Pack Estimated Cost


44 - Mitsumi#MM3210Battery Protection

Grid = 1 cm

Grid = 1 cm

SamsungBM31

3.8Lithium Polymer

305072.7 x 64.7 x 4.3

573.047.4244.5

Samsung SDICell(s) $3.19Electronic Parts $0.60Non-electronic Parts $0.22Assembly $0.18Test $0.05Gross Margin $1.82

$6.06

Pack Rating (mAHrs)Pack Size (mm)

Estimated Costs

Pack Weight (grams)

Cell Brand

Estimated Pack Price

Vol. Energy Density (mWHrs/cc)

Battery PackPack Brand

Cell Type

Pack Part NumberPack Voltage

Wt. Energy Density (mWHrs/g)


Display/Touchscreen Camera Battery

Subsystems

Battery Pack Estimated Cost


41 - Unknown#Unknown2 MP BSI CMOS Image Sensor

Unknown12P1BF2616 x 6 x 3.36 x 6 x 3.3

0.10.1

CMOS2 MP1/641

Electronic Parts $1.48Non-Electronic Parts $1.04Assembly $0.21Test $0.15Gross Margin $1.23

$4.10

Lens Elements

Part Number

ResolutionOptical Size

Brand

Subsystem Size (mm)

Type

Front Camera

Optical Zoom

Estimated Costs

Estimated Module Price

Camera Weight (grams)

Camera Size (mm)Subsystem Weight (grams)


Battery Display/Touchscreen Camera

Subsystems

Front Rear


39 - Sony#IMX13513 MP BSI CMOS Image Sensor

40 - Analog Devices#UnknownAutofocus VCM Motor Driver

Sony5118665288

8.5 x 8.5 x 5.38.5 x 8.5 x 5.3

0.70.7

CMOS13 MP

1/351

Electronic Parts $5.64Non-Electronic Parts $1.47Assembly $0.27Test $0.15Gross Margin $5.02

$12.56

Subsystem Weight (grams)

Part Number

Rear CameraBrand

Subsystem Size (mm)

Type

Estimated Costs

Camera Size (mm)

Camera Weight (grams)

Optical Zoom

Resolution

Lens ElementsOptical Size



Battery Display/Touchscreen Camera

Subsystems

Front Rear


42 - Renesas SP Drivers#R63311ATFT-LCD Display Driver

Grid = 1 cm


Battery Camera Display/Touchscreen

Subsystems

Display Touchscreen Estimated Cost


43 - Atmel#MXT540S540-Channel Capacitive Touchscreen Controller

Grid = 1 cm

The Touchscreen circuitry is directly integrated into the Cover Glass.



Subsystems

TouchscreenDisplay Estimated Cost


SharpLS050T1SX06

141.5 x 68 x 2.8533.50

View Size (mm) 110.6901 x 62.26318Type TFT w/Chip-in-GlassColors 16777216Rows / Columns 1920 / 1080Backlighting Scheme 12 White LEDsPanel(s) $7.49Electronic Parts $26.32Circuit Assembly $0.33Non-Electronic Parts $2.46Final Assembly $0.18Test $0.35Gross Margin $18.29

$55.41

BrandPart Number

Panel Metrics

Estimated Costs

Module Dimensions

Display/Touchscreen


Weight (grams)



Subsystems

Estimated CostTouchscreenDisplay


Grid = 1 cm

Earpiece

Vibrator

Button Flex

Rear Camera

Front Camera

Notification LEDs

GND

GND

GND

Product Overview Block Diagram Major Components Antenna SubsystemsComponent Arrangement Costs and MetricsProduct Packaging Exterior Features Teardown Overview & DiscussionOther SubstratesFront Page

Side 1 IC Identification Side 2 Cross-SectionSide 2 IC Identification Side 2 X-Ray & Die PhotosSide 1 X-Ray & Die Photos

Main Board

Side 1


1 - NVIDIA#Tegra 4Quad-Core Applications Processor + GPU

2 - SK Hynix#H9CCNNNBPTMLBR-NTMMultichip Memory - 2 GB LPDDR3 SDRAM (4-Die Pkg.)

3 - Texas Instruments#TPS65913Power Management

4 - Broadcom#BCM43341WiFi 802.11a/b/g/n / Bluetooth / FM Radio / NFC

5 - Spreadtrum#SC8803G5GSM / TD-SCDMA BasebandProcessor & PMU (2-Die Pkg.)

6 - Micron#MT46H32M16LFBF-564 MB LP DDR SDRAM

7 - Maxim#MAX77665APower Management

8 - Invensense#MPU-60506-Axis MEMS Gyroscope& Accelerometer

9 - AKM Semiconductor#AK8963C3-Axis Electronic Compass

10 - STMicroelectronics#M24256Serial EEPROM Memory - 32 KB

11 - Renesas#uPG2185T6RGaAs SPDT Switch

12 - Fairchild Semiconductor#FSA8108Audio Jack Detection & Switch

Grid = 1 cm


Side 1 Side 2 Cross-SectionSide 2 IC Identification Side 2 X-Ray & Die PhotosSide 1 X-Ray & Die Photos

Page 2

Main Board

Page 1

Side 1 IC Identification


32 - Fairchild Semiconductor#FSA2269TSDual SPDT Analog Switch

33 - Intersil#ISL54062Dual SPDT w/ Click &Pop Elimination Switch

34 - STMicroelectronics#EMIF02-SPK03F22-Channel EMI Filter w/ ESD Protection

35 - ON Semiconductor#CSPEMI202AG2-Channel EMI Filter w/ ESD Protection

36 - Ricoh#RP114K281D300 mA / 2.8 V LDO Regulator

37 - ON Semiconductor#NCT218Temperature Sensor

Grid = 1 cm

45 - Texas Instruments#TPS22913Load Switch


47 - Ricoh#RP114Kx300 mA LDO Regulator

48 - Fairchild Semiconductor#NC7WZ04Dual Inverter

31 - Fairchild Semiconductor#FPF1504Load Switch

30 - Texas Instruments#TXS01022-Bit Voltage Level Translator


Side 1 Side 2 Cross-SectionSide 2 IC Identification Side 2 X-Ray & Die PhotosSide 1 X-Ray & Die Photos

Page 1 Page 2

Main Board



2.1 - SK Hynix#H53R4D23MMobile LPDDR3 SDRAM Memory - 512 MBDie Size: 8.8 x 8.5 mm

2 - SK Hynix#H9CCNNNBPTMLBR-NTMMultichip Memory - 2 GB LPDDR3 SDRAM (4-Die Pkg.)Pkg Size: 11.7 x 11 mm


Side 1 IC IdentificationSide 1 Side 2 Cross-SectionSide 2 IC Identification Side 2 X-Ray & Die Photos

Image 2

Main Board

Image 1

Side 1 X-Ray & Die Photos


5.1 - Spreadtrum#UnknownDigital Baseband ProcessorDie Size: 3.6 x 3.6 mm

5.2 - Spreadtrum#UnknownAnalog Baseband Processor & PMUDie Size: 3.8 x 2.7 mm

5 - Spreadtrum#SC8803G5GSM / TD-SCDMA Baseband Processor & PMU (2-Die Pkg.)Pkg Size: 8.55 x 8.34 mm


Side 1 IC IdentificationSide 1 Side 2 Cross-SectionSide 2 IC Identification Side 2 X-Ray & Die Photos

Image 1 Image 2

Main Board



Touchscreen

WiFi/BluetoothAntenna

USB Flex

DisplayNFC AntennaBattery

Main Antenna Coax Cable

GPS Antenna

Flash LEDsSensor Flex

Grid = 1 cm

SIM


Side 1 IC IdentificationSide 1 Cross-SectionSide 2 IC Identification Side 2 X-Ray & Die PhotosSide 1 X-Ray & Die Photos

Main Board

Side 2


13 - SanDisk#SDIN8DE4-16GMultichip Memory - 16 GB MLC NAND Flash,Memory Controller (eMMC) (5-Die Pkg.)

14 - Spreadtrum#SR3500GSM / TD-SCDMA RF Transceiver

15 - RF Micro Devices#RF9812Quad-Band GSM / TD-SCDMA Bands 34 & 39 Power Amplifier, Antenna Switch (3-Die Pkg.)

16 - Broadcom#BCM4752GNSS Receiver

17 - Cirrus Logic#CS42L73Audio CODEC

18 - Texas Instruments#TPA2015D12 W Class-D Audio Amplifier

19 - Audience#eS325Voice Processor

20 - Intersil#ISL98607TFT-LCD Power Supply

21 - Texas Instruments#DRV2604Haptic Driver

22 - Texas Instruments#TPS22913Load Switch

23 - Fairchild Semiconductor#FSA3031Dual USB 2.0 Switch w/ MHL

24 - Texas Instruments#INA231Current / Power Monitor


26 - Bosch Sensortec#BMP180Digital Barometric PressureSensor (2-Die Pkg.)

27 - Texas Instruments#LM3533Backlight LED Driver

28 - STMicroelectronics#ST33xxxxSecure Microcontroller w/ Flash

29 - Fairchild Semiconductor#NC7SV322-Input OR Gate

Grid = 1 cm


50 - Texas Instruments#TLV71718P150 mA / 1.8 V LDO Regulator


Side 1 IC IdentificationSide 1 Side 2 Cross-SectionSide 2 X-Ray & Die PhotosSide 1 X-Ray & Die Photos

Main Board



13.1 - SanDisk#EGK0 32GMLC NAND Flash Memory - 4 GBDie Size: 8.2 x 7.8 mm

13.2 - SanDisk#PHOENIXC2EMP6Memory ControllerDie Size: 3.46 x 2.42 mm

13 - SanDisk#SDIN8DE4-16GMultichip Memory - 16 GB MLC NAND Flash, Memory Controller (eMMC) (5-Die Pkg.)Pkg Size: 12.9 x 11.6 mm


Side 1 IC IdentificationSide 1 Side 2 Cross-SectionSide 2 IC IdentificationSide 1 X-Ray & Die Photos

Image 2Image 1


Main Board


15.1 - RF Micro Devices#M3D9812-12Power Amplifier ControllerDie Size: 1.33 x 1.25 mm

15.2 - RF Micro Devices#M2D981239Antenna SwitchDie Size: 1.34 x 1.35 mm

15.3 - RF Micro Devices#M1D981203RF Power AmplifierDie Size: 0.94 x 0.89 mm

15 - RF Micro Devices#RF9812Quad-Band GSM / TD-SCDMA Bands 34 & 39 Power Amplifier, Antenna Switch (3-Die Pkg.)Pkg Size: 6.6 x 5.3 mm


Side 1 IC IdentificationSide 1 Side 2 Cross-SectionSide 2 IC IdentificationSide 1 X-Ray & Die Photos

Image 1 Image 2

Main Board




Side 1 IC IdentificationSide 1 Side 2 Side 2 IC Identification Side 2 X-Ray & Die PhotosSide 1 X-Ray & Die Photos

Main Board

Cross-Section


Front MEMSMicrophone

microUSB

Main Board

Main Antenna

Grid = 1 cm Grid = 1 cm

Backlight LEDs for

Touch Keys

Main Antenna Coax Cable

Speaker

Product Overview Block Diagram Major Components Antenna SubsystemsComponent Arrangement Main Board Costs and MetricsProduct Packaging Exterior Features Teardown Overview & DiscussionFront Page

Sensor Flex Button Flex

Other Substrates

USB Flex


38 - Intersil#ISL29147 ?Ambient Light / ProximitySensor, IR Emitter LED


Main Board

Rear MEMS Microphone

3.5 mm Jack


USB Flex Button Flex

Other Substrates

Sensor Flex



Main Board

Volume Lock/Power Key


USB Flex Sensor Flex

Other Substrates

Button Flex


AssemblyName Manufacturer Core Material Mfg. Technology Layers

Area(cm)

Min.TracePitch(mm)

Min.TraceWidth(mm)

ThruViaLand Dia

(mm)

ThruViaHole Dia

(mm)

BlindViaLand Dia

(mm)

BlindViaHole Dia

(mm)

Thickness(mm)

RoutingDensity

EstimatedCosts

Button Flex Multi-Fineline Electronix Polyimide 2 Layer flex w/vias 2 2.0 0.26 0.10 0.47 0.17 0.1 30.0 0.32$ Main Board Unimicron Technologies FR4 10 Layer buildup FR4 / HF 10 27.1 0.15 0.05 0.26 0.13 0.8 86.4 2.52$ Sensor Flex Multi-Fineline Electronix Polyimide 2 Layer flex w/vias 2 2.2 0.20 0.10 0.45 0.15 0.1 37.1 0.36$ USB Flex Multi-Fineline Electronix Polyimide 4 Layer flex w/vias 4 14.8 0.26 0.08 0.44 0.14 0.2 13.5 3.72$

Substrates

Product Overview Block Diagram Major Components Antenna SubsystemsComponent Arrangement Main BoardProduct Packaging Exterior Features Teardown Overview & DiscussionOther SubstratesFront Page

Integrated Circuits Subsystem ICs Modules Active Discretes Passive Discretes Connectors

Electronic Costs BreakdownElectronic Assembly Metrics Vendor IC Cost Distribution Non-Electronic Cost Estimate Cost SummaryFinal Assy Labor & Test Cost

Substrates

Costs and Metrics


Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.

Pkg Ref. # PkgQty Brand Name Part Number Pkg Description Form Pin CountLength(mm)

Width(mm)

Height(mm) Die Ref # Die Qty Brand Name Part Number Description

Length(mm)

Width(mm) Each Total

1 1 NVIDIA Tegra 4 Quad-Core Applications Processor + GPU BGA 797 14.00 14.00 1.00 1.1 1 NVIDIA Tegra 4 Quad-Core Applications Processor + GPU 9.60 9.34 $ 27.070 $ 27.070 2 1 SK Hynix H9CCNNNBPTMLBR-NTM Multichip Memory - 2 GB LPDDR3 SDRAM BGA Stacked 4 (UF) 253 11.70 11.00 0.80 2.1 4 SK Hynix H53R4D23M Mobile LPDDR3 SDRAM Memory - 512 MB 8.80 8.50 $ 2.560 $ 10.240 3 1 Texas Instruments TPS65913 Power Management Flip Chip, Solder 169 5.90 5.70 0.80 3.1 1 Texas Instruments TWL6035B2 Power Management 5.90 5.70 $ 2.230 $ 2.230 4 1 Broadcom BCM43341 WiFi 802.11a/b/g/n / Bluetooth / FM Radio / NFC Flip Chip, Solder 141 5.60 4.60 0.40 4.1 1 Broadcom BCM43341 WiFi 802.11a/b/g/n / Bluetooth / FM Radio / NFC 5.60 4.60 $ 4.310 $ 4.310

5.1 1 Spreadtrum Unknown Digital Baseband Processor 3.60 3.60 $ 3.260 $ 3.260 5.2 1 Spreadtrum Unknown Analog Baseband Processor & PMU 3.80 2.70 $ 1.840 $ 1.840

6 1 Micron MT46H32M16LFBF-5 Mobile LPDDR SDRAM Memory - 64 MB BGA 60 9.00 8.00 0.75 6.1 1 Micron Unknown Mobile LPDDR SDRAM Memory - 64 MB 5.60 5.12 $ 0.810 $ 0.810 7 1 Maxim MAX77665A Power Management Flip Chip, Solder 100 4.50 4.50 0.60 7.1 1 Maxim PR93B-2 Power Management 4.50 4.50 $ 4.510 $ 4.510 8 1 Invensense MPU-6050 6-Axis MEMS Gyroscope & Accelerometer QFN 24 4.00 4.00 0.90 8.1 1 Invensense MANTIS-B10 6-Axis MEMS Gyroscope & Accelerometer 2.80 2.80 $ 2.150 $ 2.150 9 1 AKM Semiconductor AK8963C 3-Axis Electronic Compass Flip Chip, Solder 14 1.60 1.60 0.70 9.1 1 AKM Semiconductor 4164 3-Axis Electronic Compass 1.60 1.60 $ 0.340 $ 0.340 10 1 STMicroelectronics M24256 Serial EEPROM Memory - 32 KB Flip Chip, Solder 8 1.30 1.30 0.60 10.1 1 STMicroelectronics M24256KB Serial EEPROM Memory - 32 KB 1.30 1.30 $ 0.140 $ 0.140 11 1 Renesas uPG2185T6R GaAs SPDT Switch DFN 6 1.00 1.00 0.80 11.1 1 Renesas G2185 GaAs SPDT Switch 0.50 0.35 $ 0.060 $ 0.060 12 1 Fairchild Semiconductor FSA8108 Audio Jack Detection & Switch Flip Chip, Solder 12 1.60 1.20 0.80 12.1 1 Fairchild Semiconductor FSA8108 Audio Jack Detection & Switch 1.60 1.20 $ 0.150 $ 0.150

13.1 4 SanDisk EGK0 32G MLC NAND Flash Memory - 4 GB 8.20 7.80 $ 2.040 $ 8.160 13.2 1 SanDisk PHOENIXC2EMP6 Memory Controller 3.46 2.42 $ 0.570 $ 0.570

14 1 Spreadtrum SR3500 GSM / TD-SCDMA RF Transceiver BGA 65 5.00 5.00 0.90 14.1 1 Spreadtrum SR3500BA GSM / TD-SCDMA RF Transceiver 3.00 3.00 $ 1.120 $ 1.120 15.1 1 RF Micro Devices M3D9812-12 Power Amplifier Controller 1.33 1.25 $ 0.150 $ 0.150 15.2 1 RF Micro Devices M2D981239 Antenna Switch 1.34 1.35 $ 0.470 $ 0.470 15.3 1 RF Micro Devices M1D981203 RF Power Amplifier 0.94 0.89 $ 0.220 $ 0.220

16 1 Broadcom BCM4752 GNSS Receiver Flip Chip, Solder 30 2.40 2.00 0.60 16.1 1 Broadcom BCM4752 GNSS Receiver 2.40 2.00 $ 0.680 $ 0.680 17 1 Cirrus Logic CS42L73 Audio CODEC Flip Chip, Solder 64 3.50 3.50 0.60 17.1 1 Cirrus Logic 42L73 CLI1551B0 Audio CODEC 3.50 3.50 $ 0.850 $ 0.850 18 1 Texas Instruments TPA2015D1 2 W Class-D Audio Amplifier Flip Chip, Solder 16 2.00 2.00 0.60 18.1 1 Texas Instruments TPA2015D1 2 W Class-D Audio Amplifier 2.00 2.00 $ 0.290 $ 0.290 19 1 Audience eS325 Voice Processor BGA 36 3.00 3.00 0.90 19.1 1 Audience AUD202 Voice Processor 2.00 1.93 $ 0.590 $ 0.590 20 1 Intersil ISL98607 TFT-LCD Power Supply Flip Chip, Solder 20 2.10 1.80 0.70 20.1 1 Intersil 54136-01 TFT-LCD Power Supply 2.10 1.80 $ 0.270 $ 0.270 21 1 Texas Instruments DRV2604 Haptic Driver Flip Chip, Solder 9 1.50 1.50 0.60 21.1 1 Texas Instruments DRV2604 Haptic Driver 1.50 1.50 $ 0.170 $ 0.170 22 1 Texas Instruments TPS22913 Load Switch Flip Chip, Solder 4 0.90 0.90 0.60 22.1 1 Texas Instruments TPSBPS 22913B0 Load Switch 0.90 0.90 $ 0.080 $ 0.080 23 1 Fairchild Semiconductor FSA3031 Dual USB 2.0 Switch w/ MHL QFN 12 1.80 1.80 0.80 23.1 1 Fairchild Semiconductor FSA3031Z Dual USB 2.0 Switch w/ MHL 0.95 0.95 $ 0.110 $ 0.110 24 1 Texas Instruments INA231 Current / Power Monitor Flip Chip, Solder 12 1.60 1.40 0.70 24.1 1 Texas Instruments 5409 Current / Power Monitor 1.60 1.40 $ 0.170 $ 0.170 25 1 Infineon BGA725L6 GNSS LNA DFN 6 1.10 0.70 0.60 25.1 1 Infineon T1549A GNSS LNA 0.90 0.50 $ 0.080 $ 0.080

26.1 1 Bosch Sensortec CMD173 Pressure Sensor 1.20 1.10 $ 0.120 $ 0.120 26.2 1 Bosch Sensortec 7170 Signal Processor 1.40 1.00 $ 0.120 $ 0.120

27 1 Texas Instruments LM3533 Backlight LED Driver Flip Chip, Solder 20 2.00 1.80 0.90 27.1 1 Texas Instruments LM3533 Backlight LED Driver 2.00 1.80 $ 0.260 $ 0.260 28 1 STMicroelectronics ST33xxxx Secure Microcontroller w/ Flash DFN 8 4.00 4.00 0.60 28.1 1 STMicroelectronics K8C0A Secure Microcontroller w/ Flash 3.48 2.64 $ 0.640 $ 0.640 29 1 Fairchild Semiconductor NC7SV32 2-Input OR Gate DFN 6 1.00 1.00 0.60 29.1 1 Fairchild Semiconductor SP00X 2-Input OR Gate 0.55 0.30 $ 0.040 $ 0.040

30 1 Texas Instruments TXS0102 2-Bit Voltage Level Translator DFN 8 1.30 1.00 0.70 30.1 1 Texas Instruments T0102A0 2-Bit Voltage Level Translator 1.00 0.40 $ 0.060 $ 0.060 31 1 Fairchild Semiconductor FPF1504 Load Switch Flip Chip, Solder 4 1.00 1.00 0.60 31.1 1 Fairchild Semiconductor FPF1504A Load Switch 1.00 1.00 $ 0.090 $ 0.090 32 1 Fairchild Semiconductor FSA2269TS Dual SPDT Analog Switch QFN 10 1.80 1.30 0.50 32.1 1 Fairchild Semiconductor FSA2269Z Dual SPDT Analog Switch 1.20 0.80 $ 0.090 $ 0.090 33 1 Intersil ISL54062 Dual SPDT w/ Click & Pop Elimination Switch QFN 10 1.80 1.30 0.50 33.1 1 Intersil MTA53682 Dual SPDT w/ Click & Pop Elimination Switch 1.20 0.80 $ 0.090 $ 0.090 34 2 STMicroelectronics EMIF02-SPK03F2 2-Channel EMI Filter w/ ESD Protection Flip Chip, Solder 5 1.30 0.90 0.60 34.1 1 STMicroelectronics 3 2-Channel EMI Filter w/ ESD Protection 1.30 0.90 $ 0.100 $ 0.200 35 1 ON Semiconductor CSPEMI202AG 2-Channel EMI Filter w/ ESD Protection Flip Chip, Solder 5 1.40 0.90 0.50 35.1 1 ON Semiconductor EMI202 2-Channel EMI Filter w/ ESD Protection 1.40 0.90 $ 0.110 $ 0.110 36 1 Ricoh RP114K281D 300 mA / 2.8 V LDO Regulator DFN 4 1.00 1.00 0.80 36.1 1 Ricoh L235-004 300 mA / 2.8 V LDO Regulator 0.60 0.50 $ 0.040 $ 0.040 37 1 ON Semiconductor NCT218 Temperature Sensor Flip Chip, Solder 8 1.70 1.30 0.60 37.1 1 ON Semiconductor SE Temperature Sensor 1.70 1.30 $ 0.150 $ 0.150

Sensor Flex, Side 1 38 1 Intersil ISL29147 ? Ambient Light / Proximity Sensor, IR Emitter LED DFN 8 4.00 2.40 1.00 38.1 1 Intersil ISL29147 ? Ambient Light / Proximity Sensor 1.50 0.80 $ 0.250 $ 0.250

45 2 Texas Instruments TPS22913 Load Switch Flip Chip, Solder 4 0.90 0.90 0.60 45.1 1 Texas Instruments TPSBPS 22913B0 Load Switch 0.90 0.90 $ 0.080 $ 0.160 46 1 Ricoh RP114K121D 300 mA / 1.2 V LDO Regulator DFN 4 1.00 1.00 0.61 46.1 1 Ricoh L235-004 300 mA / 1.2 V LDO Regulator 0.57 0.48 $ 0.030 $ 0.030 47 1 Ricoh RP114Kx 300 mA LDO Regulator DFN 4 1.00 1.00 0.60 47.1 1 Ricoh L235-004 300 mA LDO Regulator 0.57 0.48 $ 0.030 $ 0.030 48 1 Fairchild Semiconductor NC7WZ04 Dual Inverter DFN 6 1.01 0.99 0.56 48.1 1 Fairchild Semiconductor WZ04X Dual Inverter 0.41 0.37 $ 0.040 $ 0.040

49 1 Ricoh RP114K111D 300 mA / 1.1 V LDO Regulator DFN 4 1.01 1.01 0.67 49.1 1 Ricoh L235-004 300 mA / 1.1 V LDO Regulator 0.57 0.48 $ 0.030 $ 0.030 50 1 Texas Instruments TLV71718P 150 mA / 1.8 V LDO Regulator DFN 4 0.98 0.97 0.42 50.1 1 Texas Instruments TLV717P 150 mA / 1.8 V LDO Regulator 0.64 0.64 $ 0.040 $ 0.040

46 2516 57 $73.68

(UF) = Underfilled

Main Board, Side 2

Main Board, Side 1

Main Board, Side 2

Main Board, Side 1

Main Board, Side 1

3.80 3.60 0.90Digital Barometric Pressure Sensor MCP - 2 Chips 726 1 Bosch Sensortec BMP180

22 6.60 5.30 1.05

12.90 11.60 1.00

15 1 RF Micro Devices RF9812 Quad-Band GSM / TD-SCDMA Bands 34 & 39 Power Amplifier, Antenna Switch MCP - 3 Chips

8.34 0.80

13 1 SanDisk SDIN8DE4-16G Multichip Memory - 16 GB MLC NAND Flash, Memory Controller (eMMC) BGA Stacked 5 153

MCP - 2 Chips 345 8.551 Spreadtrum SC8803G5 GSM / TD-SCDMA Baseband Processor & PMU

Totals

Location

Estimated CostsDie InfoPackage Info

5


Substrates Subsystem ICs Modules Active Discretes Passive Discretes Connectors


Costs and Metrics

Integrated Circuits


Note: The ICs listed below are for reference only.Their costs are integrated into the cost of the individual subsystems.

Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.

Pkg Ref. # PkgQty Brand Name Part Number Pkg Description Form Pin CountLength(mm)

Width(mm)

Height(mm) Die Ref # Die Qty Brand Name Part Number Description

Length(mm)


39 1 Sony IMX135 13 MP BSI CMOS Image Sensor COB 77 6.91 5.29 0.20 39.1 1 Sony IMX135 13 MP BSI CMOS Image Sensor 6.00 4.35 $ 4.330 $ 4.330 40 1 Analog Devices Unknown Autofocus VCM Motor Driver Flip Chip, Solder 6 1.20 0.85 0.40 40.1 1 Analog Devices Unknown Autofocus VCM Motor Driver 1.20 0.85 $ 0.100 $ 0.100

Front Camera: Front Camera Flex 41 1 Unknown Unknown 2 MP BSI CMOS Image Sensor COB 36 4.67 3.82 0.30 41.1 1 Unknown Unknown 2 MP BSI CMOS Image Sensor 3.93 3.15 $ 1.100 $ 1.100

Display/Touchscreen: Display Flex 42 1 Renesas SP Drivers R63311A TFT-LCD Display Driver Flip Chip, Adhesive 2008 29.80 0.85 0.30 42.1 1 Renesas SP Drivers R63311A TFT-LCD Display Driver 29.80 0.85 $ 1.620 $ 1.620

Display/Touchscreen: Touchscreen Flex 43 1 Atmel MXT540S 540-Channel Capacitive Touchscreen Controller BGA 72 6.00 6.00 0.80 43.1 1 Atmel AT359C8 540-Channel Capacitive Touchscreen Controller 5.10 5.00 $ 1.940 $ 1.940

Battery Pack: Battery Flex 44 1 Mitsumi MM3210 Battery Protection DFN 6 1.60 1.50 0.80 44.1 1 Mitsumi Unknown Battery Protection 0.99 0.70 $ 0.070 $ 0.070 6 2205 6 $9.16

Rear Camera: Rear Camera Flex

Die Info

Location

Estimated Costs

Totals

Package Info


Integrated CircuitsSubstrates Modules Active Discretes Passive Discretes Connectors


Costs and Metrics

Subsystem ICs


Pin Count

Length(mm)


1 TXC 8Q Series Crystal: Ceramic 4 1.60 1.20 $ 0.200 $ 0.200 1 Kyocera ST2012SB Crystal: Ceramic 2 2.00 1.20 $ 0.200 $ 0.200 1 Kyocera CX2520DB Crystal: Ceramic 4 2.50 2.00 $ 0.200 $ 0.200 1 Miyazaki Epson FC-135 Crystal: Ceramic 2 3.20 1.50 $ 0.200 $ 0.200 1 AAC Acoustic Ltd AAC130910F2 Speaker: Earpiece 2 13.20 6.00 $ 0.330 $ 0.330 1 KDS DSA321SCA Oscillator: TCXO 4 3.17 2.47 $ 0.620 $ 0.620 1 Unknown Unknown Vibrator: Vibrator 2 8.00 8.00 $ 0.380 $ 0.380 1 Unknown Unknown Shielding: Small 1 7.10 5.00 $ 0.020 $ 0.020 1 Unknown Unknown Filter: Diplexer 6 1.80 1.20 $ 0.060 $ 0.060

1 Murata SAWEN1G84CV0F00 Filter: Dual SAW - GSM 1800/1900 Rx 10 1.80 1.35 $ 0.110 $ 0.110 2 TDK-EPC B8401 Filter: SAW - GPS/GLONASS 4 1.40 1.10 $ 0.070 $ 0.140 1 Murata SAWEN881MCX0F00 Filter: Dual SAW - GSM 850/900 Rx 10 1.80 1.35 $ 0.110 $ 0.110 1 Murata SAWFD1G90CA0F0A Filter: Dual SAW - TD-SCDMA 1900/2000 Rx 10 1.50 1.10 $ 0.110 $ 0.110 4 Unknown Unknown Shielding: Small 1 20.00 20.00 $ 0.020 $ 0.080 1 Unknown Unknown Antenna: NFC w/ Ferrite Sheet 2 77.80 55.10 $ 0.450 $ 0.450 1 Kyocera KT2016 Oscillator: TCXO for GPS 4 2.00 1.70 $ 0.620 $ 0.620

1 Knowles SPK0415HM4H-B Microphone: MEMS 8 4.00 3.00 $ 0.270 $ 0.270 1 Unknown Unknown Speaker: Speaker 2 19.00 13.50 $ 0.360 $ 0.360

Sensor Flex, Side 2 1 Knowles SPK0415HM4H-B Microphone: MEMS 8 4.00 3.00 $ 0.270 $ 0.270

Button Flex, Side 1 1 Unknown Unknown Key Pad: Assembly 6 40.80 5.90 $ 0.070 $ 0.070 TOTALS 24 99 $4.80

Main Board, Side 1

Main Board, Side 2

USB Flex, Side 1

Qty Brand Name Part NumberPackage Estimated Costs

DescriptionLocation


Integrated CircuitsSubstrates Subsystem ICs Active Discretes Passive Discretes Connectors


Costs and Metrics

Modules


Form Top Marking Pin Count Length(mm)Width(mm) Each Total

1 Small Active MOSFET A95H 7 2.00 2.00 $0.090 $0.09021 Small Active Diode, SMT jS 2 2.00 1.20 $0.015 $0.3132 Small Active Transistor, Small E23 3 1.20 0.80 $0.030 $0.0601 Small Active Transistor, Small TF 3 3 1.60 0.80 $0.030 $0.03016 Small Active Diode, SMT A4 2 0.66 0.30 $0.015 $0.2382 Small Active Diode, SMT D 2 0.66 0.30 $0.015 $0.0301 Small Active Diode, SMT 6 5 2 0.66 0.30 $0.015 $0.0152 Small Active Diode, SMT None 2 0.66 0.30 $0.015 $0.0301 Small Active LED, Multi-Color None 4 1.65 1.50 $0.090 $0.0901 Small Active Dual Transistor D6 6 1.56 1.17 $0.030 $0.030

1 Small Active Diode, SMT 9A 2 0.66 0.30 $0.015 $0.01533 Small Active Diode, SMT A4 2 0.66 0.30 $0.015 $0.4922 Small Active Diode, SMT A3 2 0.66 0.30 $0.015 $0.0301 Small Active Diode, SMT B2 2 1.10 0.75 $0.015 $0.0151 Small Active Diode, SMT T 2 1.00 0.70 $0.015 $0.0152 Small Active LED, Flash none 2 2.00 1.70 $0.250 $0.5006 Small Active Diode, SMT jS 2 2.00 1.20 $0.015 $0.089

4 Small Active Diode, SMT A1 2 0.66 0.30 $0.015 $0.0601 Small Active Diode, SMT 43 2 0.66 0.30 $0.015 $0.0151 Small Active Diode, SMT 9A 2 0.66 0.30 $0.015 $0.0151 Small Active Diode, SMT m6 2 0.66 0.30 $0.015 $0.015

USB Flex, Side 2 2 Small Active LED, Single None 2 2.00 1.10 $0.050 $0.100TOTALS 103 220 $2.29

Main Board, Side 1

Main Board, Side 2

USB Flex, Side 1

Location Functional DescriptionQty

Package Estimated Costs


Integrated CircuitsSubstrates Subsystem ICs Modules Passive Discretes Connectors


Costs and Metrics

Active Discretes


Form Pin Count Each Total

3 Small Passive Cap, Res, Ferrite Array 10 $0.007 $0.0222 Small Passive Cap, Res, Ferrite Array 6 $0.007 $0.0157 Coil SMT, Small 2 $0.050 $0.3509 Small Passive Coil, Inductor 2 $0.008 $0.072

362 Small Passive Cap, Res, Ferrite 2 $0.004 $1.448

2 Small Passive Cap, Res, Ferrite Array 10 $0.007 $0.0152 Small Passive Cap, Res, Ferrite Array 6 $0.007 $0.0152 Coil SMT, Small 2 $0.050 $0.10021 Small Passive Coil, Inductor 2 $0.008 $0.168235 Small Passive Cap, Res, Ferrite 2 $0.004 $0.940

4 Small Passive Coil, Inductor 2 $0.008 $0.03215 Small Passive Cap, Res, Ferrite 2 $0.004 $0.060

Sensor Flex, Side 1 6 Small Passive Cap, Res, Ferrite 2 $0.004 $0.024TOTALS 670 1396 $3.26

Location

Estimated Costs

Qty Functional DescriptionPackage

Main Board, Side 1

Main Board, Side 2

USB Flex, Side 1


Integrated CircuitsSubstrates Subsystem ICs Modules Active Discretes Connectors


Costs and Metrics

Passive Discretes


Pin Count

Length(mm)


Button Flex, Side 1 1 Bd to Bd: Main Board 14 3.30 1.20 $0.090 $0.090

1 Bd to Bd: Rear Camera 34 8.90 2.20 $0.190 $0.1901 Bd to Bd: Front Camera 20 6.00 2.20 $0.120 $0.1203 Connector: Spring - Formed, GND 1 3.20 1.20 $0.030 $0.0901 Bd to Bd: Button Flex 10 4.20 1.60 $0.070 $0.070

1 Connector: External Test Antenna, Main 2 2.70 2.70 $0.070 $0.0701 Socket: SIM 6 28.00 19.00 $0.230 $0.2302 Connector: Spring - Formed, GPS Antenna 1 3.10 1.10 $0.030 $0.0601 Bd to Bd: Touchscreen 10 4.10 1.70 $0.070 $0.0701 Bd to Bd: Sensor Flex 20 6.40 2.20 $0.120 $0.1202 Connector: Spring - Formed, WiFi/Bluetooth Antenna 1 3.00 1.10 $0.030 $0.0601 Connector: External Test Antenna, WiFi/Bluetooth 2 2.70 2.70 $0.070 $0.0701 Bd to Bd: USB Flex 24 7.30 2.20 $0.140 $0.1402 Connector: Spring - Formed, NFC Antenna 1 3.00 1.10 $0.030 $0.0601 Connector: External Test Antenna, GPS 3 2.70 2.70 $0.070 $0.0701 Connector: Antenna Coax, Main 2 1.70 1.70 $0.040 $0.0401 Cable: Coax, Main Antenna 2 85.00 0.80 $0.140 $0.1401 Bd to Bd: Battery 4 3.90 2.40 $0.040 $0.0401 Bd to Bd: Display 34 9.00 2.20 $0.190 $0.190

Sensor Flex, Side 1 1 Bd to Bd: Main Board 24 5.30 1.60 $0.140 $0.140

Sensor Flex, Side 2 1 Jack: Headphone 6 12.20 7.20 $0.150 $0.150

1 Connector: Micro USB 5 8.60 6.10 $0.100 $0.1003 Connector: Spring - Formed, Main Antenna 1 3.30 1.25 $0.030 $0.0901 Connector: Antenna Coax, Main 2 1.80 1.80 $0.040 $0.040

USB Flex, Side 2 1 Bd to Bd: Main Board 28 6.30 1.50 $0.160 $0.160TOTALS 32 264 $2.60

Main Board, Side 1

Main Board, Side 2

USB Flex, Side 1

Location

Estimated Costs

Qty FormPackage


Integrated CircuitsSubstrates Subsystem ICs Modules Active Discretes Passive Discretes


Costs and Metrics

Connectors


NOTE: Occasional inconsistencies in totals may be present due to rounding error.

General Area Assembly Name

Subs

trat

e A

rea

(sq.

cm)

Met

al L

ayer

s

Circ

uit A

rea

(sq.

cm)

Rou

ting

Den

sity

(cm

of r

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bstr

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Num

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Num

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Com

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ty(C

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)

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Den

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(Con

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/sq.

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Avg

. Pin

Cou

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Ass

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Main Electronics Button Flex 2.0 2 4.0 30.0 2 20 1.0 10.0 10.0 0.10Main Electronics Main Board 27.1 10 271.0 86.4 827 4313 30.5 159.2 5.2 14.20Main Electronics Sensor Flex 2.2 2 4.4 37.1 10 58 4.6 26.4 5.8 0.20Main Electronics USB Flex 14.8 4 59.2 13.5 36 104 2.4 7.0 2.9 1.60Main Electronics Totals 46.1 18 338.6 875 4495 19.0 97.5 5.1 16.10Subsystem Electronics Battery Pack: Battery Flex 1.8 2 3.6 21.8 12 34 6.6 18.7 2.8 0.30Subsystem Electronics Display/Touchscreen: Display Flex 12.8 2 25.6 299.1 35 2112 2.7 164.7 60.3 0.50Subsystem Electronics Display/Touchscreen: Touchscreen Flex 3.2 2 6.3 109.2 7 171 2.2 54.3 24.4 0.10Subsystem Electronics Rear Camera: Rear Camera Flex 1.8 4 7.2 92.3 11 137 6.1 76.1 12.5 0.10Subsystem Electronics Front Camera: Front Camera Flex 1.0 4 4.0 74.0 9 74 9.0 74.0 8.2 0.10Subsystem Electronics Totals 20.6 14 46.8 74 2528 3.6 122.8 34.2 1.10

System Totals 66.7 32 385.38 949 7023 14.2 105.3 7.4 17.20

Electronic Assembly Metrics by Assembly


Integrated CircuitsSubstrates Subsystem ICs Modules Active Discretes Passive Discretes Connectors

Electronic Costs Breakdown Vendor IC Cost Distribution Non-Electronic Cost Estimate Cost SummaryFinal Assy Labor & Test Cost

Page 2 Page 3 Page 4

Electronic Assembly Metrics

Costs and Metrics

Page 1




Tota

l

Inte

grat

ed C

ircui

ts

Mod

ular

& O

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C

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nent

s

Smal

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Com

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Pass

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Com

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Main Electronics Button Flex 0.68$ -$ 0.07$ -$ -$ 0.09$ 0.32$ 0.04$ 0.16$ Main Electronics Main Board 92.44$ 73.43$ 3.83$ 2.08$ 3.14$ 1.83$ 2.52$ 4.64$ 0.97$ Main Electronics Sensor Flex 1.46$ 0.25$ 0.27$ -$ 0.02$ 0.29$ 0.36$ 0.08$ 0.18$ Main Electronics USB Flex 5.60$ -$ 0.63$ 0.20$ 0.09$ 0.39$ 3.72$ 0.24$ 0.33$ Main Electronics Totals 100.18$ 73.68$ 4.80$ 2.29$ 3.26$ 2.60$ 6.92$ 5.00$ 1.64$ Subsystem Electronics Battery Pack 0.76$ 0.07$ -$ 0.09$ 0.06$ 0.09$ 0.29$ 0.11$ 0.05$ Subsystem Electronics Display/Touchscreen 27.00$ 3.56$ 19.16$ 0.62$ 0.10$ 0.30$ 2.59$ 0.33$ 0.35$ Subsystem Electronics Front Camera 1.70$ 1.10$ -$ -$ 0.03$ 0.14$ 0.21$ 0.08$ 0.15$ Subsystem Electronics Rear Camera 5.89$ 4.43$ 0.60$ -$ 0.03$ 0.21$ 0.37$ 0.10$ 0.15$ Subsystem Electronics Totals 35.36$ 9.16$ 19.76$ 0.71$ 0.22$ 0.74$ 3.46$ 0.61$ 0.70$

System Totals 135.54$ 82.84$ 24.56$ 2.99$ 3.48$ 3.34$ 10.38$ 5.62$ 2.34$

Electronics Costs by Assembly




Page 1 Page 3 Page 4

Costs and Metrics

Page 2





IC P

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IC C

onne

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Mod

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/Odd

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Com

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nts

Mod

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Com

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Main Electronics Button Flex 0 0 1 6 0 0 0 0 1 14 0 22Main Electronics Main Board 45 2508 20 75 94 202 645 1346 23 182 0 5140Main Electronics Sensor Flex 1 8 1 8 0 0 6 12 2 30 0 68Main Electronics USB Flex 0 0 2 10 9 18 19 38 6 38 0 140Main Electronics Totals 46 2516 24 99 103 220 670 1396 32 264 0 5370Subsystem Electronics Battery Pack 1 6 0 0 1 8 7 14 3 6 4 50Subsystem Electronics Display/Touchscreen 2 2080 1 77 13 26 24 48 2 52 48 2373Subsystem Electronics Front Camera 1 36 0 0 0 0 7 14 1 24 24 107Subsystem Electronics Rear Camera 2 83 1 2 0 0 7 14 1 38 38 186Subsystem Electronics Totals 6 2205 2 79 14 34 45 90 7 120 114 2716

System Totals 52 4721 26 178 117 254 715 1486 39 384 114 8086

Counts by Assembly




Page 2Page 1 Page 4

Costs and Metrics


Page 3




IC D

ie C

ount

IC P

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Num

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Con

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Die

Are

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ytes

)

Main Electronics Main Board 56 45 2508 875.6 0.32 878.2 1.00 285.6 2162688 16777248Main Electronics Sensor Flex 1 1 8 1.2 0.01 9.6 0.13 83.3 0 0Main Electronics Totals 57 46 2516 876.8 887.8 0.99 283.4 2162688 16777248Subsystems Battery Pack 1 1 6 0.7 2.4 0.29 2.5 0 0Subsystems Display/Touchscreen 2 2 2080 50.8 61.3 0.83 33.9 0 0Subsystems Front Camera 1 1 36 12.4 17.8 0.69 2.0 0 0Subsystems Rear Camera 2 2 83 27.1 37.6 0.72 2.2 0 0Subsystem Electronics Totals 6 6 2205 91.0 119.1 0.76 1850.8 0 0

System Totals 63 52 4721 967.8 1007.0 0.96 468.8 2162688 16777248

IC Metrics




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Costs and Metrics



Estimated Cost of Electronics

(Includes Subsystem Electronics)

$135.54

Estimated Cost of Electronics

(Includes Subsystem Electronics)

$135.54

Card Test2%

Insertion4%

Small Active Components2%

Modular & Odd Components18%

Substrates8%

Passive Components3%

Connector Components2%

Integrated Circuits61%



Electronic Assembly Metrics Vendor IC Cost Distribution Non-Electronic Cost Estimate Cost SummaryFinal Assy Labor & Test Cost

Costs and Metrics

Electronic Costs Breakdown


Pkg. Brand CostNVIDIA $27.07SK Hynix $10.24SanDisk $8.73Spreadtrum $6.22Broadcom $4.99Maxim $4.51

Sony $4.33Texas Instruments $3.46Invensense $2.15Atmel $1.94Renesas SP Drivers $1.62Unknown $1.10STMicroelectronics $0.98Cirrus Logic $0.85RF Micro Devices $0.84Micron $0.81Intersil $0.61Audience $0.59Fairchild Semiconductor $0.52AKM Semiconductor $0.34ON Semiconductor $0.26Bosch Sensortec $0.24Ricoh $0.13Analog Devices $0.10Infineon $0.08Mitsumi $0.07Renesas $0.06

Other


* Includes Subsystem Vendors & Associated Costs

Broadcom6% Maxim

5%

Spreadtrum8%

Other25%NVIDIA

33%

SanDisk11%

SK Hynix12%



Electronic Costs BreakdownElectronic Assembly Metrics Non-Electronic Cost Estimate Cost SummaryFinal Assy Labor & Test Cost

Costs and Metrics

Vendor IC Cost Distribution


Subsystem Part ID No. Qty Description Fabrication Process Material Dimensions (mm)Weight (grams)

Est'd Cost Each

Est'dExtended Cost

1 1 Main Chassis Cast + Co-Molded + Tapped + Painted + Pulls Magnesium + Plastic 144 x 70 x 7.1 17.00 3.380 3.3802 1 Rear Cover Molded + Pulls + Printed Plastic 144 x 73 x 6.9 11.70 1.000 1.0003 1 Speaker Housing & Main Antenna Support Molded + Pulls + Painted Plastic 70.5 x 17.5 x 5.8 2.80 0.450 0.4504 1 WiFi/Bluetooth & GPS Antenna Support Molded + Pulls + Painted PC 70.7 x 50.8 x 5.7 4.10 0.920 0.9205 1 SIM Card Tray Stamped + Co-Molded Metal + Plastic 27.5 x 26.8 x 3.2 0.60 0.100 0.1008 2 Key Molded + Painted Plastic x 0.10 0.020 0.04010 1 Keys Carrier Molded Rubber 48 x 4 x 0.3 0.10 0.020 0.020

6 1 Microphone Boot Molded Rubber 8 x 4 x 2 0.01 0.010 0.0107 1 Proximity Sensor Boot Molded Rubber 5.4 x 3.4 x 0.2 0.01 0.010 0.01011 3 Moisture Sensor Die-Cut Paper + Adhesive 3.4 x 3.4 x 0.2 0.30 0.010 0.03012 1 Display Sticky Tape Die-Cut Plastic + Adhesive 139 x 68 x 0.2 1.00 0.030 0.03013 1 Foam under Display Die-Cut Plastic + Adhesive 110 x 65 x 0.4 1.00 0.060 0.06014 1 Insulation Foil under Display Die-Cut Plastic + Adhesive 100 x 52 x 0.2 1.00 0.040 0.04015 1 Earpiece Screen Stamped Metal 12 x 4 x 0.4 0.10 0.030 0.03016 1 Earpiece Foam Seal Die-Cut Plastic + Adhesive 12 x 4 x 0.2 0.10 0.010 0.01017 1 Front Microphone Fabric Screen Die-Cut Plastic + Adhesive 2.7 x 2.7 x 0.2 0.10 0.010 0.01018 2 Rubber Bumper Die-Cut Rubber + Adhesive 5 x 4 x 0.5 0.20 0.010 0.02019 1 Processor Insulation Foil Die-Cut Plastic + Adhesive 13.8 x 13.8 x 0.2 0.10 0.010 0.01020 2 USB Flex Conductive Fabric Die-Cut Metal + Adhesive x 0.00 0.030 0.06022 1 USB Sticky Tape Die-Cut Plastic + Adhesive 9 x 4.6 x 0.2 0.10 0.010 0.01023 1 Vibrator Foam Die-Cut Plastic + Adhesive 3.8 x 3.8 x 0.3 0.10 0.010 0.01024 1 NFC Antenna Sticky Tape Die-Cut Plastic + Adhesive 69 x 56 x 0.2 0.10 0.030 0.03025 15 Screws Machined Metal 3 x 2 x 1 1.50 0.010 0.15026 1 Headset Jack Sticky Tape Die-Cut Plastic + Adhesive 12.2 x 7.4 x 0.2 0.10 0.010 0.01027 5 Foam Bumpers on Antenna Carrier Die-Cut Plastic + Adhesive 9 x 5 x 0.3 0.50 0.010 0.05028 1 Rear Cover Insulation Foil Die-Cut Plastic + Adhesive 65 x 55 x 0.2 0.50 0.030 0.03029 1 Main Board Insulation Foil Die-Cut Plastic + Adhesive 55 x 34 x 0.2 0.10 0.030 0.03030 1 Thermal Pad Die-Cut Rubber + Adhesive 13.8 x 13.8 x 0.3 1.00 0.030 0.03031 3 Connector Foam Bumper Die-Cut Plastic + Adhesive 6.4 x 4 x 0.3 0.30 0.010 0.03032 1 Conductive Fabric Die-Cut Metal + Adhesive 9.5 x 4.5 x 0.2 0.10 0.010 0.01033 1 Notification LEDs Window Molded Plastic 3.9 x 3.9 x 0.3 0.10 0.010 0.01034 1 Earpiece Seal Die-Cut Rubber + Adhesive 11.8 x 5.6 x 0.2 0.10 0.010 0.01035 2 Conductive Fabric - Earpiece Die-Cut Metal + Adhesive 5.6 x 1.5 x 0.2 0.20 0.010 0.02036 1 Insulation Tape Die-Cut Plastic + Adhesive 6.2 x 3.4 x 0.2 0.10 0.010 0.01037 1 Insulation Foil Die-Cut Plastic + Adhesive 14.2 x 11.8 x 0.2 0.10 0.010 0.01038 1 Rear Microphone Fabric Screen Die-Cut Plastic + Adhesive 3.9 x 2.5 x 0.2 0.10 0.010 0.01039 1 Vibrator Sticky Tape Die-Cut Plastic + Adhesive 3.8 x 3.8 x 0.2 0.10 0.010 0.01040 1 Rear Camera Window Molded + Polished Plastic 9 x 8.5 x 0.4 0.30 0.030 0.03041 1 Main Board Label Die-Cut + Printed Plastic + Adhesive 13.8 x 10.8 x 0.2 0.10 0.040 0.04042 1 Flash Window Molded Plastic 8.2 x 3.7 x 1 0.10 0.020 0.02043 2 Conductive Fabric Die-Cut Metal + Adhesive x 0.00 0.010 0.02045 1 Insulation Foil Die-Cut Plastic + Adhesive 6.7 x 3.9 x 0.2 0.10 0.010 0.01046 1 NFC Antenna Connector Sticky Tape Die-Cut Plastic + Adhesive 12 x 6 x 0.2 0.10 0.010 0.01047 1 Insulation Foil on Main Board Die-Cut Plastic + Adhesive 6.8 x 3.4 x 0.2 0.10 0.010 0.01048 1 Rear Microphone Fabric Screen Die-Cut Plastic + Adhesive 5 x 5 x 0.2 0.10 0.010 0.01049 1 Speaker-Front Microphone Fabric Screen Die-Cut Plastic + Adhesive 33 x 4 x 0.2 0.10 0.010 0.01050 1 Speaker Foam Seal Die-Cut Plastic + Adhesive 14 x 4 x 0.2 0.10 0.010 0.010

74 $6.87Estimated CostTotal

Enclosures

Miscellaneous



Electronic Costs BreakdownElectronic Assembly Metrics Vendor IC Cost Distribution Cost SummaryFinal Assy Labor & Test Cost

Costs and Metrics

Non-Electronic Cost Estimate


1.02$ 1.25$

Final Assembly & Test

Est'd final test cost

China983531341

Made in

Est'd final assembly cost

Number of partsEst'd number of stepsEst'd time (seconds)



Electronic Costs BreakdownElectronic Assembly Metrics Vendor IC Cost Distribution Non-Electronic Cost Estimate Cost Summary

Costs and Metrics

Final Assy Labor & Test Cost


Front Camera2%

Non-Electronic Parts 4%

Main Electronic Assemblies53%

Final Assembly & Test1%

Battery Pack3%

Display/Touchscreen30%

Rear Camera7%

Main Electronic Assemblies 100.18$ Battery Pack 6.06$ Display/Touchscreen 55.41$ Rear Camera 12.56$ Front Camera 4.10$ Non-Electronic Parts 6.87$ Final Assembly & Test 2.27$

Total 187.45$

Estimated Cost Totals

Assumes fully scaled production.

Note: An additional $2.54 estimated for accessories and supporting materials

Cost Total Notes:Estimated final assembly cost includes labor only.Total cost does not include Non-recurring, R&D, G&A, IP licensing fees/royalties, software, sales & marketing, distribution.



Electronic Costs BreakdownElectronic Assembly Metrics Vendor IC Cost Distribution Non-Electronic Cost Estimate Final Assy Labor & Test Cost

Costs and Metrics

Cost Summary


COST ESTIMATION PROCESSOverview and Discussion

Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of the output of the model across product families and over time. TechInsights philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years, we have developed an estimation process that, while necessarily lacking an insiders knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in high-volume production environments. We do not claim that the model will produce the right answer for your firms environment. However, TechInsights does give customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the results based on substitution of their own component cost estimates where they have better information based on inside knowledge.

Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-of-materials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these sources.

Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive at their estimated cost. Other system items such as optics, antennas, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost.

The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules, electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate.

We believe our cost estimates generally fall within 15 percent of the right answer, which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type. Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce.

Please feel free to contact us at [email protected] with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input.

Product Overview Block Diagram Major Components Antenna SubsystemsComponent Arrangement Main Board Costs and MetricsProduct Packaging Exterior Features Teardown Other SubstratesFront Page

MetricsCost Estimation Process

Overview & Discussion


MetricsOverview and Discussion

In our product teardowns, we gather a series of metrics for product profiling and comparison. Some metrics focus on system characteristics such as total silicon area, total system semiconductor storage capacity, and total connection count. Other metrics reflect more subtle aspects of electronics assembly such as connection density, average component I/O count, and silicon tiling density. Taken as a whole, the metrics allow deeper comparison and benchmarking across multiple disciplines and multiple products. Key metrics we gather on products are described below along with their definitions and what they tend to say about the system under study. Most metrics can be used both in comparing similar products for benchmarking purposes or for quantifying differences in levels of complexity between dissimilar product types. Data fall into two categories; either raw measured data or ratios of these measured data sets.

Total Silicon Area : This metric describes the total area of silicon as measured from X-ray or direct measurement of ICs. The area is an expression of the enclosed bare die area and excludes packaging area. The aggregate silicon area is a good benchmark to show how integrated a design might be when making comparisons to similar systems. Total silicon area also reflects the major cost driver for most systems we examine. Silicon Tiling Density : Ratio of Total Silicon Area to total printed circuit board projected area (i.e. the simple board area and not the cumulative surface area of both sides of the board). This metric directly reflects the level of efficiency and aggressiveness in integrated circuit packing and placement. Single digit Silicon Tiling Density is typical but silicon coverage of 10% - 20% has been seen in some of the most advanced products we have examined. Higher Tiling Densities often correspond with the use of chip scale packaging (CSPs) or other small form-factor IC packaging technologies. High density circuit boards are also often a supporting technology.Number of Parts : Total component count including ICs, passives, modules, connectors, etc., each separated out in our reporting.Number of Connections : The total number of connections corresponds to the total number of interconnects introduced by the aggregate component set and reflects any electrical connection observed (solder joints, adhesive interconnect, or connector terminal interfaces).Opportunity Count : Opportunity Count is the total number of parts plus the total number of connections; the name reflects that each of these constituent elements represents an opportunity for failure. A high opportunity count means more complex and riskier electronics assembly. Average Pin Count (APC) : Ratio of total number of component terminals to total number of parts, at the system level. This metric reflects the average terminal complexity of the components and often provide a signature of integration level and/or digital-ness of the overall product. Low APCs reflect a high number of discretes or other low-pincount devices often characteristic of analog circuitry. Conversely, high APCs are characteristic of highly integrated, high-pincount assemblies, often those composed largely of digital integrated circuits.Connection Density : This metric is a ratio of the total Number of Connections to total printed circuit board assembly area, in units of connections per sq. inch. The metric provides data related to the Silicon Tiling Density above, but with an emphasis on complexity of I/O interconnect. For example, with a fixed Connection Density, high tiling density of low-pincount memory chips is more readily achieved than comparable silicon tiling of high pincount logic.Part Density : This metric is a ratio of the total Number of Parts to total printed circuit board assembly area, in units of components per sq. inch. The metric provides data related to the Silicon Tiling Density and Connection Density as described above, but with an emphasis on density and complexity of component packing efficiency. For example, low Part Density of high-pincount devices can pose an equal challenge in Connection Density to high Part Density of low-pincount devices. High Part Density does reflect challenges in surface mount assembly in terms of (typically) precision of placement, number of placements, and engineering of part clearances.Routing Density (heuristic estimate) = 3*(Average Pin Count)*Part Density. The Routing Density metric is an empirically derived relationship that characterizes the wiring density of the interconnect used to support the interconnection of components in a planar electronic assembly (i.e. the circuit board). Architectural issues such as bussing or other factors affecting the regularity of wiring impact the actual Routing Density needed to support a given application, but the metric provides a ready measure of wiring complexity.

Product Overview Block Diagram Major Components Antenna SubsystemsComponent Arrangement Main Board Costs and MetricsProduct Packaging Exterior Features Teardown Other SubstratesFront Page

Cost Estimation Process Metrics

Overview & Discussion

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Mobile Devices Deep Dive Sample Report Xiaomi MI3

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