GPON ONU...

GPON ONU Transceiver

of 10Coretek Opto Corp. 1F,10 Industry E. Rd. IV., Science-Based Industrial Park, Hsinchu, Taiwan, R.O.C. 6/30/2010http://www.coretek.com.tw Tel:886-3-5787871 Fax:886-3-5645105 Version：C

SFF 2x10, Single SC/APC Pigtail, 1310nm DFB LD,Power Budget 28.5dB,RoHSCompliantDigital Diagnostics Functions

Applications Gigabit-capable Passive Optical Network ONU

side. Gigabit Ethernet Point-to-Point Bi-directional

Transmission. Burst mode application. FTTx broadband access system.

Features TX:1310nm DFB LD Burst Mode RX:1490nm APD CW Mode Upstream:1244Mbps, Downstream:2488Mbps Single +3.3V Power Supply RoHS Compliant and Lead-free PECL Differential Electrical Interface Compliant with Multi-Source Agreement

(MSA) Small Form Factor (SFF) 2x10Footprint

Compliant with SFF-8472 Digital DiagnosticMonitoring Interface

Single SC/APC Connector Compliance with ITU-T G.984.2 GPON ONU

Class B+ Eye Safety

Designed to meet Laser Class 1 comply withEN60825-1

DescriptionThe CT-1225TGT-IH5V-D from Coretek Opto Corp. is the high performance and cost-effective module

for serial optical telecommunication applications specified for single mode of TX 1244Mb/s / RX 2488Mb/s. Itoperates with +3.3V power supply. The module is intended for single mode fiber, operates at a nominalwavelength of Tx: 1310nm / Rx: 1490nm and complies with Multi-Source Agreement (MSA) Small FormFactor (SFF) 2x10 footprint. Each module consists of a bi-directional optical subassembly that combines atransmitter with a receiver and an electrical subassembly. All of them are housed in a metal package and thecombination produces a reliable component.Each module is integrated digital diagnostics functions via an I2Cserial interface.

The module is a single fiber connector transceiver designed for use in Gigabit-capable Passive OpticalNetwork (GPON) ONU applications. The transmitter is operating at burst mode and the receiver is operating atcontinuous mode. The characteristics are performed in accordance with Telcordia SpecificationGR-468-CORE.

EMCMost equipment utilizing high-speed transceivers will be required to meet the following requirements:

1) FCC in the United States2) CENELEC EN55022 (CISPR 22) in Europe

To assist the customer in managing the overall equipment EMC performance, the transceivers have beendesigned to satisfy FCC class B limits and provide good immunity to radio-frequency electromagnetic fields.

Eye SafetyThis laser based single mode transceiver is a CLASS 1 LASER PRODUCT, Hazard level 1. It complies

with IEC 60825-1 Ed.2: 2007-03 and FDA performance standards for laser products (21 CFR 1040.10 and1040.11) except for deviations pursuant to Laser Notice 50, dated June 24, 2007.

PbRoHS

http://www.coretek.com.tw



Product Information

Model NumberOperatingVoltage &

SD IN/OUTBurst Control TX RX Output

Power Sensitivity

CT-1225TGT-IH5V-D 3.3V LVTTLDC/AC

LVTTL(Enable:Logic”1”)

1244Mbps1310 nm DFB

2488Mbps1490 nm APD 0.5 ~ 5 dBm ≦-28 dBm

ABSOLUTE MAX RATINGSPARAMETER SYMBOL MIN MAX UNIT NOTE

Storage Temperature TS -40 85 ℃

Supply Voltage VCC 0 3.6 VLead Soldering Temperature/Time TSOLD 260 ℃ 10 sec on lead

OPERATING CONDITIONSPARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTE

Ambient Operating Temperature TA 0 70 ℃

Supply Voltage VCC 3.1 3.5 V

ELECTRICAL CHARACTERISTICSPARAMETER SYMBOL MIN MAX UNIT NOTE

TransmitterTransmitter Supply Current ICCT 200 mATransmitter Data Input Differential Voltage VID 0.2 1.6 VLVTTL Transmit Burst Input Voltage - Low VIL 0 0.8 VLVTTL Transmit Burst Input Voltage - High VIH 2.4 3.3 VReceiverReceiver Supply Current ICCR 120 mAReceiver Data Output Differential Voltage VOD 0.4 1.6 VLVTTL Signal Detect Output Voltage – Low VOL 0 0.8 VLVTTL Signal Detect Output Voltage – High VOH 2.4 3.3 VLVTTL Tx_SD Output Voltage – Low VOL 0 0.8 VLVTTL Tx_SD Output Voltage – High VOH 2.4 3.3 V

TRANSMITTER ELECTRO-OPTICAL CHARACTERISTICSPARAMETER SYMBOL MIN TYP. MAX UNIT NOTE

Data Rate 1244.16 Mb/sOptical Output Power Po 0.5 5 dBmExtinction Ratio ER 10 dBCenter Wavelength λc 1260 1310 1360 nmSpectral Width (-20dB) Δλ 1 nmSide Mode Suppression Ratio SMSR 30 dBOptical Rise,Fall time (20%-80%) tr, , tf 260 ps 1TX burst on time Ton 12.86 ns 2TX burst off time Toff 12.86 ns 2Output Eye Compliant with G.984.2




RECEIVER ELECTRO-OPTICAL CHARACTERISTICSPARAMETER SYMBOL MIN TYP. MAX UNIT NOTE

Data Rate 2488.32 Mb/sMaximum Input Optical Power Pmax -8 dBm 3Receiver Sensitivity Pmin -28 dBm 3Operating Wavelength λ 1480 1500 nmReturn Loss RL -30 dBSignal Detect - Asserted PA -27 dBm 4Signal Detect - Deasserted PD -40 dBm 5Signal Detect - Hysteresis PA - PD 0.5 6 dB

Notes:1. These are 20-80% values.2. Measured with 16 bits.3. Measured with 223-1 PRBS at BER<10-10

4. Measured on transition – low to high5. Measured on transition – high to low

BLOCK DIAGRAM OF TRANSCEIVER PIN OUT DIAGRAM OFTRANSCEIVER

TXR

X 6 7 8 9 101112131415

VEER

VC

CR

SDR

D-

RD

+

TD-

TD+

TX_B

RST

VEET

VC

CT

16171819201 2 3 4 5

NC

VEER

VEER

NC

NC

Tx_SDTx_Fail

SDA

SCL

VEET

WDM OPTICALSUBASSEMBLY

ELECTRICA L SU BA SSEM BLY

D RIV ER IC

QUANTIZERIC

DATA OUTDIFFEREVTIAL

SIGNAL DETECT OUT

DATA INDIFFERENTIAL

PREA M PIC

PINPHOTODIODE

LD TX_BRST




Alarm and Warning Thresholds(56 bytes)

Cal Constants(40 bytes)

Real Time Diagnostic Interface(24 bytes)

Vender Specific

Enhanced Digital Diagnostic InterfaceThe memory map in the following describes an extension to the memory map defined in SFF-8472MSA.

The enhanced interface uses the two wire serial bus address 1010001X (A2h) to provide diagnostic information aboutthe module’s present operating conditions. The transceiver generates this diagnostic data by digitization of internalanalog signals. Calibration and alarm/warning threshold data is written during device manufacture.

2 wire address 1010000 X (A0h) 2 wire address 1010001 X (A2h)

0 0

Serial ID Defined by SFP MSA 55(96 bytes) 56

95 9596 96

127

Vender Specific(32 bytes)

119120

127


G-PON ONU Transceiver

Page 1 of 10Coretek Opto Corp. 1F,10 Industry E. Rd. IV., Science-Based Industrial Park, Hsinchu, Taiwan, R.O.C. 06/30/2010http://www.coretek.com.tw Tel:886-3-5787871 Fax:886-3-5645105 Version：C

EEPROM Serial ID Memory Contents (2-Wire Address A0h)

Address Name of Field Hex DescriptionBase ID Fields

00 Identifier 02 SFF physical device (soldered device)01 Ext. Identifier 04 Serial ID module supported02 Connector 0B Optical pigtail

03-10 Transceiver Codes 00 Undefined for GPON11 Encoding 03 Compatible with NRZ encoding code12 BR, Nominal 0C Nominal 1244Mbps (indicate transmitter data rate)13 Reserved 0014 Length (9um)-km 14 20km @9/125um fiber15 Length (9um)-100m C8 20000m @9/125um fiber

16-18 Length for MMF 00 Undefined for GPON19 Reserved 00

20-35 Vendor Name 43 4F 52 4554 45 4B “CORETEK” (ASCII character)

36 Channel Spacing 00 Undefined37-39 Vendor OUI 00 Undefined

40-55 Vendor P/N

43 54 2D 3132 32 35 5447 54 2D 4948 35 56 4435 56 44

“CT-1225TGT-IF5VD” (ASCII character)

56-59 Vendor P/N Rev. 30 30 30 41 “1” (ASCII character)60-61 Laser Wavelength 05 1E 1310nm in Hex byte

62 DWDM Wavelength Fraction 00 Undefined63 CC_BASE XX Check sum of bytes 0-62

Extended ID Fields64-65 Options 00 04 Signal Detect is implemented

66 BR, Max. 00 Undefined67 BR, Min. 00 Undefined

68-83 Vendor SN SN Vendor serial number in ASCII character84-91 Date Code DC Vendor date code in ASCII character

92 Diagnostic Monitoring Type 28 Implemented with internal calibration andreceivedpower measurement type by Avg. power93 Enhanced options 80 Alarm/Warning flags monitor are implemented

94 SFF-8472 compliant 02 SFF-8472 compliant with revision 9.595 CC_EXT XX Check sum of bytes 64-94

Vendor Specific ID Fields96-127 Vendor Specific 00 Vendor specific EEPROM


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Digital Diagnostic Monitoring Interface (2-Wire Address A2h)

Alarm and Warning Thresholds (2 Wire Address A2h)Address # Bytes Name of Field HEX Real Value Unit

00-01 2 Temp High Alarm 55 00 85℃ Degree C02-03 2 Temp Low Alarm FB 00 -5℃ Degree C04-05 2 Temp High Warning 50 00 80℃ Degree C06-07 2 Temp Low Warning 00 00 0℃ Degree C08-09 2 Voltage High Alarm 94 70 3.8 V10-11 2 Voltage Low Alarm 6D 60 2.8 V12-13 2 Voltage High Warning 87 8C 3.47 V14-15 2 Voltage Low Warning 7A 44 3.13 V16-17 2 Bias High Alarm 9C 40 80 mA18-19 2 Bias Low Alarm 05 DC 3 mA20-21 2 Bias High Warning 88 B8 70 mA22-23 2 Bias Low Warning 07 D0 4 mA24-25 2 TX Power High Alarm 9B 83 6 dBm26-27 2 TX Power Low Alarm 27 10 0 dBm28-29 2 TX Power High Warning 7B 87 5 dBm30-31 2 TX Power Low Warning 31 2D 1 dBm32-33 2 RX Power High Alarm 0C 5A -5 dBm34-35 2 RX Power Low Alarm 00 08 -31 dBm36-37 2 RX Power High Warning 06 31 -8 dBm38-39 2 RX Power Low Warning 00 10 -28 dBm40-55 16 Reserved

Calibration Constants (2 Wire Address A2h)Address # Bytes Name of Field HEX Description

56-59 4 Rx_PWR (4) 00 00 00 00 Set to zero for “internally calibrated” devices.60-63 4 Rx_PWR (3) 00 00 00 00 Set to zero for “internally calibrated” devices.64-67 4 Rx_PWR (2) 00 00 00 00 Set to zero for “internally calibrated” devices.68-71 4 Rx_PWR (1) 3F 80 00 00 Set to 1 for “internally calibrated” devices.72-75 4 Rx_PWR (0) 00 00 00 00 Set to zero for “internally calibrated” devices.76-77 2 Tx_I (Slope) 01 00 Set to 1 for “internally calibrated” devices.78-79 2 Tx_I (Offset) 00 00 Set to zero for “internally calibrated” devices.80-81 2 Tx_PWR (Slope) 01 00 Set to 1 for “internally calibrated” devices.82-83 2 Tx_PWR (Offset) 00 00 Set to zero for “internally calibrated” devices.84-85 2 T (Slope) 01 00 Set to 1 for “internally calibrated” devices.86-87 2 T (Offset) 00 00 Set to zero for “internally calibrated” devices.88-89 2 V (Slope) 01 00 Set to 1 for “internally calibrated” devices.90-91 2 V (Offset) 00 00 Set to zero for “internally calibrated” devices.92-94 3 Reserved 00 00 00 Reserved

95 1 Checksum XX Checksum of bytes 0 – 94.




A/D Value (2 Wire Address A2h)

Address # Bytes Name of Field Description96-97 2 Temperature (MSB, LSB) Internally measured module temperature98-99 2 Supply Voltage (MSB, LSB) Internally measured supply voltage in module

100-101 2 Tx Bias Current (MSB, LSB) Internally measured Tx Bias current102-103 2 Tx Optical Power (MSB, LSB) Internally measured Tx Power104-105 2 Rx Received Power (MSB, LSB) Measured Rx input power106-109 4 Reserved

Status Bits and Alarm/Warning Flag Bits (2 Wire Address A2h)Address Bit Name Description

110 7 TX Disable State Digital state of Tx disable (1) and enabled (0)110 6 Soft TX Disable No implemented.110 5-3 Reserved110 2 TX Fault State 1=Tx failure state, 0=Tx normal state

110 1 Signal Detect StateDigital state of SD output pin. 1=optical signaldetected,0=no optical signal detected110 0 Data_Ready_Bar Not implemented.

111 1-0 Soft Tx Mode Not implemented112 7 Temp High Alarm Set when internal temperature exceeds high alarm level.112 6 Temp Low Alarm Set when internal temperature is below low alarm level.112 5 Vcc High Alarm Set when internal supply voltage exceeds high alarm level.112 4 Vcc Low Alarm Set when internal supply voltage is below low alarm level.112 3 TX Bias High Alarm Set when TX Bias current exceeds high alarm level.112 2 TX Bias Low Alarm Set when TX Bias current is below low alarm level.112 1 TX Power High Alarm Set when TX Power exceeds high alarm level.112 0 TX Power Low Alarm Set when TX Power is below low alarm level.113 7 RX Power High Alarm Set when Received Power exceeds high alarm level.113 6 RX Power Low Alarm Set when Received Power is below low alarm level.113 5-0 Reserved Alarm

114-115 All Reserved116 7 Temp High Warning Set when internal temperature exceeds high warning level.116 6 Temp Low Warning Set when internal temperature is below low warning level.116 5 Vcc High Warning Set when internal supply voltage >high warning level.116 4 Vcc Low Warning Set when internal supply voltage < low warning level.116 3 TX Bias High Warning Set when TX Bias current exceeds high warning level.116 2 TX Bias Low Warning Set when TX Bias current is below low warning level.116 1 TX Power High Warning Set when TX Power exceeds high warning level.116 0 TX Power Low Warning Set when TX Power is below low warning level.117 7 RX Power High Warning Set when Received Power exceeds high warning level.117 6 RX Power Low Warning Set when Received Power is below low warning level.117 5-0 Reserved Warning

118-119 All Reserved




Vendor Specific and User Accessible EEPROM (2 Wire Address A2h)Address # Bytes Name Description120-122 3 Reserved

123 1 Password Byte 3 High order byte of 32 bit password124 1 Password Byte 2 Second highest order byte of 32 bit password125 1 Password Byte 1 Second lowest order byte of 32 bit password126 1 Password Byte 0 Low order byte of 32 bit password127 1 User EEPROM Select “1” selects user writable EEPROM at locations 128-247

PIN OUT TABLEPin Symbol Functional Description

Mounting Posts The mounting posts are provided for transceiver mechanical attachment to the circuit board. Theyshould not be connected to the circuit ground but can be connected to the chassis ground.

1 NC Not Connect2 VEER Receiver Signal Ground3 VEER Receiver Signal Ground4 NC Not Connect5 NC Not Connect6 VEER Receiver Signal Ground7 VCCR Receiver Power Supply8 SD Signal Detect is a TTL output. A high level indicates a received optical signal9 RD- Receiver Data Inverted Differential Output

10 RD+ Receiver Data Non-inverted Differential Output11 VCCT Transmitter Power Supply12 VEET Transmitter Signal Ground13 TX_BRST Transmitter Burst Control14 TD+ Transmitter Data Non-inverted Differential Input15 TD- Transmitter Data Inverted Differential Input16 VEET Transmitter Signal Ground17 SCL Serial I2C Clock18 SDA Serial I2C Data19 Tx_Fail Tx Fail20 Tx_SD Transmitted State Indicator ,Tx_SD Assert When Transmitter ON




TRANSMITTER OPERATING FUNCTION TABLEVcc TX_BRST Data Input Optical Power

Vcc<3.0V X X OFFHigh Yes ONHigh No OtherVcc>3.0VLow X OFF

X=Don’t careHigh=Logic High Level , Low = Logic Low LevelYes= Data Input, No = No Data InputOFF = Optical Power is less than –45dBmOther = Optical Power is less than +8dB

RECOMMENDED CIRCUIT SCHEMATIC

6 7 8 9 10

1112131415

L1/L2 = 1μHC1 = 4.7μFC2/C3 =0.1μFR1/R2 = 82ΩR3/R4 = 130Ω

L1

L2

C1

C2

C3

System

LDDriver

R2

LimitingAmp

SD (LVTTL)

3.3V

50oZ

50oZ

50oZ

50oZ

TX-

TX+

RX-

RX+

100

R4 R3

R2 R1

3.3V

1 2 3 4 5

1617181920




MECHANICAL DIMENSIONSUnits in mm

X= 210All dimensions are ±0.1mm unless otherwise specified.

RECOMMENDED SFF HOST BOARD LAYOUTUnits in mm

Claim:CORETEK Opto Corp. reserves the right to make changes in the specification described hereinafter without prior notice.


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