GPON ONU 2x2 Triplexer Transceiverao-inc.com/images/uploads/products/80-21-0454 ATG7... · GPON ONU...

ATG7-CGT3-5GGA

APPLIED OPTOELECTRONICS, INC.

GPON ONU 2x2 Triplexer Transceiver

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80-21-0454 REV 007

www.ao-inc.com © Applied Optoelectronics, Inc. 2013

Applications

Features

Ordering Information

GPON ONU Class B+

Burst mode operation transmitter with 1310nm DFB laser for 1244Mbit/s upstream

Continuous mode operation digital receiver with 1490nm high sensitivity APD-TIA for 2488Mbit/s downstream

46~870MHz CATV receiver with 1550nm analog PD

20Km transmission with SMF

3.3V power supply for 1310nm/1490nm digital transceiver

12V power supply for 1550nm CATV receiver

RF AGC function

Video Disable/Enable control function

Digital Diagnostic Monitor (Digital): Temperature, Voltage, TX Bias Current, 1490nm RX Optical Power

Digital Diagnostic Monitor (Analog): RF output power, 1555nm Rx Optical Power

3 pin RF Output connector type

-40°C to +85°C Industry operating temperature range

Digital Diagnostic SFF-8472, Rev. 9.5 MSA compliant

Compliant with ITU-T G.984.2

Compliant with ITU-T G.984.5 enhancement band for next generation network access

Complies with RoHS

TX DC CML data input / RX AC data output.

CML differential transmitter burst-mode

CML enable control

Form Factor Date Rate Media Type Wavelength

(nm) TX Power

(dBm) RX Sensitivity

(dBm) Voltage

(V) Coupling

Signal Detect

DDM (Y/N)

Temperature (°C)

Part Number

2x2 Triplexer 1.25/2.5G SMF Class B+ 1310 0.5 ~ 5 < -28 3.3 DC/AC LVTTL Y -40 ~ +85 ATG7-CGT3-5GGA

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Absolute Maximum Ratings

Parameter Symbol Conditions Min Max Unit

Storage Temperature TS -40 85 °C

Storage Relative Humidity RH Non condensing 5 95 %

Power Supply Voltage (Digital 3.3V) Vcc3.3 0 5 V

Power Supply Voltage (Analog 12V) Vcc12 0 15 V

Lead Soldering Temperature TSOLD 10 seconds on leads only -- 260 °C

Recommended Operating Conditions

Parameter Symbol Conditions Min Typ Max Unit

Operating Case Temperature TC -40 -- 85 °C

Power Supply Voltage (Digital 3.3V) Vcc3.3 3.3V±5% 3.13 3.3 3.47 V

Power Supply Voltage (Analog 12V) Vcc12 12V±5% 11.4 12 12.6 V

Power Supply Current (Digital 3.3V) Icc3.3 -- -- 400 mA

Power Supply Current (Analog 12V) Icc12 -- -- 220 mA

Data Rate of Transmitter DR-Tx -- 1244 -- Mbps

Data Rate of Receiver DR-Rx -- 2488 -- Mbps

Transmitter Specifications

(Tc= -40 to +85°C,Vcc=3.13 to 3.47V,Data Rate=1244Mbps) Parameter Symbol Conditions Min Typ Max Unit

Optical Output Power(Avg.) Po +0.5 -- +5 dBm

Optical Extinction Ratio ER 10 -- -- dB

Center Wavelength λc DFB 1290 1310 1330 nm

Transmitter OFF Output Power Poff -- -- -45 dBm

-20dB Spectrum With(RMS) σ -- -- 1 nm

Side Mode Suppression Ratio SMSR 30 -- -- dB

Differential Line Input Impedance Rin 90 100 110 Ohm

Differential Data Input Swing VDT DC-Coupled CML 400 -- 1200 mVp-p

Input common mode voltage VCM 1.4 -- Vcc-0.2 V

Output Eye Mask EYE Note 1 Compliant with ITU-T G.984.2

Tx Enable/Disable Time Ton/off Note 2 -- -- 16 bits

Note 1. Transmitter eye mask definition shown in Fig. 1. Note 2. Tx Enable/Disable Time definition shown in Fig. 2

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h

1244.16 Mbit/s x1/x4 0.22/0.78 x2/x3 0.40/0.60 y1/y4 0.17/0.83 y2/y3 0.20/0.80

Figure-1 Eye Mask Diagram and Setup

Figure-2 Ton/Toff Time Definition

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Receiver Specification

(Tc= -40 to +85°C,Vcc=3.13 to 3.47V,Data Rate=2488Mbps)


Input Optical Wavelength λ APD 1480 1490 1500 Nm

Receiver Sensitivity PINMIN Note 1 -- -- -28 dBm

Input Saturation Power (Overload) PINMAX -8 -- -- dBm

Signal Detect- Assert PA -- -- -28 dBm

Signal Detect- De-Assert PD -45 -- -- dBm

Signal Detect-Hysteresis PA- PD 0.5 -- -- dB

Differential Data Output Swing VDO AC-Coupled CML 400 -- 1200 mVp-p

Signal Detect Output Voltage-High VSDH LVTTL

2.4 -- Vcc V

Signal Detect Output Voltage-Low VSDL 0 -- 0.4 V

Note 1. Measured with PRBS 223 –1 at 10-10 BER

Specification of RF Video Receiver


Operating Wavelength -- 1550 1555 1560 nm

Receiving Optical Power (Avg.) -- -7 -- +1 dBm

RF AGC Dynamic Range -- 24 -- -- dB

Responsivity -- 0.9 -- -- mA/mW

RF Output Level -- Note 1 20 -- -- dBmV/ch

Total RF Output power -- -- 36 -- dBmV

RF Output Impedance -- -- 75 -- Ω

CNR -- Note 2 46 -- -- dB

C/CSO -- Note 3 -- -- -55 dB

C/CTB -- -- -- -55 dB

RF Return Loss -- 46-870MHz -- -- -12 dB

RF Output Tilt -- 46-870MHz 2 4 6 dB

RF Output Flatness -- 46-870MHz -- -- 3.0 dB

Note 1: Tested at 450MHz, OMI=4.4% per channel, RF_Setting=0 Note 2: Tested at -7dBm, 78 channels in 46M~870M, OMI=3.5% per channel Note 3: Test at +1dBm, 78channels in 46M~870M, OMI=3.5% per channel

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Functional Block Diagram

Optical Characteristics

Parameter Conditions Min Typ Max Unit

Optical Isolation From external 1310 nm to 1490 nm Rx 28 -- -- dB


Optical Cross-talk From internal 1310 nm to 1490 nm Rx -- -- -47 dB

Optical Cross-talk From internal 1310 nm to 1555 nm Rx -- -- -47 dB



Optical Return Loss (Reflectance) 1480 nm to 1500 nm -- -- -30 dB

Optical Return Loss (Reflectance) 1260 nm to 1360 nm -- -- -30 dB

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Pigtail Fibre Characteristics

Parameter Min Typ Max Unit Note

Mode Field Diameter 9 µm

Cladding Diameter 125 µm

Jacket Diameter 0.9 mm

Bending Radius of Pigtail Fiber 30 mm

Tension Force on Pigtail Fiber 1 Kg

Pigtail Fiber Length 590 ±12 mm

Optical Return Loss (APC type)- 1310nm 55 dB

Digital Diagnostic Monitor Accuracy

Parameter Accuracy Unit Calibration Note

Transceiver Temperature ±3°C °C Internal Operating Temp.(Tc)

Digital Power Supply Voltage ±3% V Internal Vcc=3.3V±5%

TX Bias Current ±10% mA Internal Specified by nominal bias value

1490nm RX Optical Power ±3dB dBm Internal -28 to -8 dBm

RF output power ±3dB dBmv Internal 20~50dBmV (Total Power)

1550nm Rx Optical Power ±3dB dBm Internal -7 to +1dBm

Note. Temperature and Voltage is measured internal to the transceiver.

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Pin Description

Pin No. I/O Pin Name DESCRIPTION

1 GND_A Common Ground

2 VeeR Digital Receiver Ground

3 VccR Digital Receiver Power Supply +3.3V

4 O SD Digital Receiver Signal detect (LVTTL): Normal Optical Input indicated by logic

“High”,and No Optical Input indicated by logic “Low”

5 O RD+ Non-Inverted Digital Receiver Data Output (CML)

6 O RD- Inverted Digital Receiver Data Output (CML)

7 I BEN+ Non-Inverted Burst Enable Input (CML)

8 I BEN- Inverted Burst Enable Input (CML)

9 VeeT Digital Transmitter Ground

10 I TD+ Non-Inverted Transmitter Data Input (CML)

11 VeeT Digital Transmitter Ground

12 I TD- Inverted Transmitter Data Input (CML)

13 VccT Digital Transmitter Power Supply +3.3V

14 I/O SDA I2C Data Input/ Output

15 I SCL I2C Clock Input

16 O INT/NC Interrupt: Module Fail Detect (LVTTL), Low for interrupt / No

Connect

17 Vdd +12V RF Video Power Supply +12V

18 3.3V uP 3.3VDC MCU Power

19 I RESET u-Processor reset, Active Low (LVTTL)

20 GND_A Analog Ground

21 GND_A Analog Ground (Note 1)

22 O RF Output Video Output 75 Ohm (Note 1)

23 GND_A Analog Ground (Note 1)

Note 1. Pin 21-23 for 3 pin RF Output type

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Electrical Interface Recommended Circuit

This recommended circuit is only for reference and would be modified further if necessary according to customer’s requirement.

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Mechanical Design Diagram

UNIT: mm [inch]

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EEPROMSerial ID Memory Contents (A0h) Address Name of field Hex Description

BASE ID FIELDS

00-11 Customer Part Number (ASCII) 20,20,20,20,20,20,20,20,20,20,20,20

12 BR, Upstream (unit:10Mbps) 7C 1240Mbps

13 BR, Downstream (unit:10Mbps) F8 2480Mbps

14-15 Reserved 00,00,

16 Minimum RF output level (Note1) 01 20dBmV

17 Low Video Input Power (unit: 0.1dBm) BA -7dBm

18 High Video Input Power (unit: 0.1dBm) 0A +1dBm

19 Nominal RF Tilt (unit: 0.1dB) 28 +4dB (from 55-870MHz)

20-35 Vendor name (ASCII) 41,4F,49,20,20,20,20,20,20,20,20,20,20,20,20,20 AOI

36 Reserved 0

37 RF Bandwidth (Note2) 01 46MHz to 870MHz

38-49 Reserved 00,00,00,00,00,00,00,00,00,00,00,00,

50 Video PD Responsivity (Unit: 0.01mA/mW) 5A 0.9 mA/mW

51-55 Reserved 00,00,00,00,00,

56-59 Vendor Rev (ASCII) 41,20,20,20, A

60 Digital TX Wavelength (Units: 10nm) 83 1310nm

61 Digital RX Wavelength (Units: 10nm) 95 1490nm

62-67 Reserved 00,00,

68-83 Vendor SN (ASCII) xx,xx,xx,xx,xx,xx,xx,xx,xx,xx,xx,xx,xx,xx,xx,xx

84-91 Manufacturing Date code (ASCII) xx,xx,xx,xx,xx,xx,20,20, (YY/MM/DD/BB)

92 Diagnostic Monitoring Type (Note3) 28

93-95 Reserved 00,00,00,

96-125 Vendor PN (ASCII) 41,54,47,37,2D,43,47,54,33,2D,35,47,47,41,20, 20,20,20,20,20,20,20,20,20,20,20,20,20,20,20

ATG7-CGT3-5GGA

126-127 Vendor Specific 00,00,

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Note.1

Byte Value RF(dBmV) Freq(MHz) OMI(%) Loading Condition Carrier Type

1 20 450 4.4 78 Analog Modulated

Note.2

Byte Value Min. RF (MHz) Max. RF (MHz)

1 46 870

Note.3

Data Address

(Dec) Bits Description Setting

92 7 Reserved for legacy diagnostic implementations. Must be '0' for compliance with this document

0

92 6 Digital diagnostic monitoring implemented per SFF-8472 0

92 5 Internally Calibrated 1

92 4 Externally Calibrated 0

92 3 Received power measurement type, 0-OMA, 1 =Average Power

1

92 2 1 =Address change required. 0= not required. SEE SFF-8472 for "addressing modes change".

0

92 1 Reserved 0

92 0 Reserved 0

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EEPROMSerial ID Memory Contents (A2h) Address Name of field Hex Description

BASE ID FIELDS

00-01 Temp High Alarm Tc(Max.)+10 (1LSB=1/256)

02-03 Temp Low Alarm Tc(Min.)-5 (1LSB=1/256)

04-05 Temp High Warning Tc(Max.)+5 (1LSB=1/256)

06-07 Temp Low Warning Tc(Min.) (1LSB=1/256)

08-09 Voltage High Alarm Vcc+10% (1LSB=100uV)

10-11 Voltage Low Alarm Vcc-10% (1LSB=100uV)

12-13 Voltage High Warning Vcc+6% (1LSB=100uV)

14-15 Voltage Low Warning Vcc-6% (1LSB=100uV)

16-17 1550nm RX Power High Alarm

18-19 1550nm RX Power Low Alarm

20-21 1550nm RX Power High Warning

22-23 1550nm RX Power Low Warning

24-25 RF Power High Alarm

26-27 RF Power Low Alarm

28-29 RF Power High Warning

30-31 RF Power Low Warning

32-33 1490nm RX Power High Alarm

34-35 1490nm RX Power Low Alarm

36-37 1490nm RX Power High Warning

38-39 1490nm RX Power Low Warning

40 Bias High Alarm (1LSB=1mA)

41 Bias Low Alarm (1LSB=1mA)

42-43

44-45

46-47

48-49

50 RF_Offset

Control of the RF output level to offset for different OMI values in feed forward or different channel plans in feed back (LSB=0.5dB)

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51-55 Reserved 00,00,00,00,00 Reserved

56-59 Rx_PWR (4)

20,20,20,20 Set to zero for “internally calibrated” devices.

60-63 Rx_PWR (3)


64-67 Rx_PWR (2)


68-71 Rx_PWR (1)

3F,80,20,20 Set to 1 for “internally calibrated” devices.

72-75 Rx_PWR (0)


76-88 Reserved 20,20,20,20,20,20,20,20,20,20,20,20,20 Reserved

89-90 Reserved 00,00 Reserved


93-94 Version 00,01 Firmware version number

95 Reserved 00 Reserved

96-97 Temperature (MSB, LSB) Internally measured module temperature (1LSB=1/256)

98-99 Supply Voltage (MSB, LSB)

Internally measured supply voltage in pin 18 of the module(microprocessor Supply) Convert Signed 16-bit value to decimal Vcc = X*0.1mV

100-101 1550nm RX Power (MSB, LSB)

Monitor of current from the PD across 300ohm resistor; To calculate the value: VPDMON(dBm)= 10*log((VPD_AD/Rkohm/1023*1.1)/(Resp/100)); -VPD_AD = (A2[100]*256+A2[101]); -Rkohm = 0.3; -Resp = A0[50];

102-103 RF Power (MSB, LSB) Measured Rx output power RF POWER(dBmV) = (A2[102]*256+A2[103])*0.1-60

104-105 1490nm RX Power (MSB, LSB)

Internally measured supply voltage in pin 18 of the module(microprocessor Supply) Convert Signed 16-bit value to decimal 10*log(((A2[104]*256+A2[105])*0.1)/1000)

106-107

108 TX Bias Current Internally measured Tx Bias current, multiply by 1.0 to get the DC bias current. (Unit=1mA)

109 Reserved 00 Reserved

110 Control Bit Note.1

111

112 Alarm Flag Bit Note.3

113 Flag Bit Note.4

114 IMASK0 Interrupt Mask for Byte 70 (0= enable)

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116 Flag Warning Flag Bit Note.5

117 Flag Bit Note.6



120 Control Bit Note.7


123 Password Byte 3 High order byte of 32 bit password

124 Password Byte 2 Second highest order byte of 32 bit password

125 Password Byte 1 Second lowest order byte of 32 bit password

126 Password Byte 0 Low order byte of 32 bit password

127 User EEPROM Select “1” selects user writable EEPROM at locations 128-255

128-255 Reserved 00 Reserved for future use

Note.1 Control Bit

Data Address

(Dec) Bits Bytes Name of Field Description

110

7

1

RF_SQUELCH_EN Control bit. If set, allows RF squelching if input power too low

6 Reserved Reserved

5 HOLD_AGC Control bit. If set, hole AGC fixed. Auto-clears on boot

4 TX Disable Control "1"=Tx output Disable, "0"= Tx output enable

3 RF Output Enable "1"=RF Output Enable, "0"=RF Output Disable

2 TX_FAULT "0"=Digital state of the TX Fault Output Pin

1 Interrupt "1"=Interrupt

0 Signal Detect State "1"=Digital state of the SD Output Pin.

Note.3 Alarm Flag Bit

Data Address

(Dec) Bits # Bytes Name of Field Description

112

7

1

RF Power Low Alarm Set when RF Power is below low alarm level.

6 RF Power High Alarm Set when RF Power exceeds high alarm level.

5 1550nm RX Power Low Alarm Set when 1550nm Received Power is below low alarm level.

4 1550nm RX Power High Alarm Set when 1550nm Received Power exceeds high alarm level.

3 Vcc Low Alarm Set when internal supply voltage is below low alarm level.

2 Vcc High Alarm Set when internal supply voltage exceeds high alarm level.

1 Temp Low Alarm Set when internal temperature is below low alarm level.

0 Temp High Alarm Set when internal temperature exceeds high alarm level.

Note.4 Flag Bit

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Data Address


113

7

1

TX Disable State_ON TX_DIS went HIGH

6 TX Disable State_OFF TX_DIS went LOW

5 TX_FAULTL_ON TxFail signal went HIGH

4 TX_FAULT_OFF TxFail signal went LOW

3 Signal Detect_ON SD signal went HIGH

2 Signal Detect_OFF SD signal went LOW

1 1490nm RX Power Low Alarm Set when 1490nm Received Power is below low alarm level.

0 1490nm RX Power High Alarm Set when 1490nm Received Power exceeds high alarm level.

Note.5 Flag Warning Flag Bit

Data Address


116

7

1

RF Power Low Warning Set when RF Power is below low warning level.

6 RF Power High Warning Set when RF Power exceeds high warning level.

5 1550nm RX Power Low Warning Set when 1550nm Received Power is below low warning level.

4 1550nm RX Power High Warning Set when 1550nm Received Power exceeds high warning level.

3 Vcc Low Warning Set when internal supply voltage is below low warning level.

2 Vcc High Warning Set when internal supply voltage exceeds high warning level.

1 Temp Low Warning Set when internal temperature is below low warning level.

0 Temp High Warning Set when internal temperature exceeds high warning level.

Note.6 Flag Bit

Data Address


117

7

1

RESET STATE Reset Interrupt Status. 1 if reset was performed (occurs at each power up). This is the only interrupt that cannot be masked.

6

5

4

3 TX Bias Low Alarm Set when TX Bias current is below low alarm level.

2 TX Bias High Alarm Set when TX Bias current exceeds high alarm level.

1 1490nm RX Power Low Warning Set when 1490nm Received Power is below low warning level.

0 1490nm RX Power High Warning Set when 1490nm Received Power exceeds high warning level.

Note.7 Control Bit

Data Address


120

7

1 Reserved Reserved 6

5

4

3

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2

1 Reset (Write 1 to reset) Reset (Write 1 to reset)

0 Save Active data to Flash (write 1) Save Active data to Flash (write 1)

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Label drawing

Unit: mm

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Regulatory Compliance

Item Standard

Electromagnetic

Interference (EMI)

FCC Part 15 Class B

EN55022 Class B (CISPR 22B)

VCCI Class B

Electrostatic Discharge to the Electrical Pins (ESD)

MIL-STD-883E Method 3015.7

Electrostatic Discharge to the

Receptacle (ESD) IEC 61000-4-2

RoHS 2011/65/EU

Laser Eye Safety FDA 21CFR 1040.10 and 1040.11

Component Recognition UL and TUV

Laser Safety Information

All versions of this laser are Class 1 laser products per IEC1/EN2 60825-1:2007. Users should observe safety precautions such as those recommended by ANSI3 Z136.1-2000, ANSI Z36.2-1997 and IEC 60825-1:2007.

This product conforms to FDA (CDRH) 21 CFR 1040.10 and 1040.11 except for deviations of laser safety class designation

pursuant to 'Laser Notice No.50' , dated June 24, 2007

Product labeling:

If labeling is not affixed to the module due to size constraints; then rather, labeling is placed on the outside of the

shipping box.

This product is not shipped with a power supply.

Caution: use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

Certifications

UL 60950-1 (E243407)

TUV EN60950-1/A12:2011, EN 60825-1, EN 60825-2

Documentation is available upon request.

(1) IEC is a registered trademark of the International Electrotechnical Commission

(2) Within Europe the IEC standard has been adopted as a European Normative standard known as EN 60825, and each European country will have its own

version of this standard, for example, the British Standards version known as BS EN 60825. There can be small differences between the different countries versions of EN 60825, and these are in part caused by the process of translating the standard into the native language of that country.

(3) ANSI is a registered trademark of the American National Standards Institute

Note : All information contained in this document is subject to change without notice.

Class 1 Laser Product Compliance with 21 CFR 1040.10 and 1040.11

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