Fairchild IR Presentation October 2011
Transcript of Fairchild IR Presentation October 2011
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www.fairchildsemi.com1
Fairchild SemiconductorInternational, Inc.
October 2011
Investor Presentation
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www.fairchildsemi.com2
Notes on Forward Looking Statementsand Non-GAAP Measures
Comments in this presentation other than statements of historical fact may constitute forwardlooking statements and are based on Fairchild s management s estimates and projections and aresubject to various risks and uncertainties
These risks and uncertainties are described in the Company s periodic reports and other filings withthe Securities and Exchange Commission (see the Risk Factors section) and are available athttp://sec.gov and investor.fairchildsemi.com
Actual results may differ materially from those projected in the forward looking statements
Some data in this presentation may include non-GAAP measures that we believe provide usefulinformation about the operating performance of our businesses that should be considered byinvestors in conjunction with GAAP measures that we also provide. You can find a reconciliationof non-GAAP to comparable GAAP measures at the Investor Relations section of our web site athttp://investor.fairchildsemi.com
Recent additions to our website at http:// investor.fairchildsemi.com
Updated Financials (through current quarter with segment revenue/gross margin breakouts)
Quarterly Fact Sheet with current quarter highlights
This investor presentation
http://sec.gov/http://investor.fairchildsemi.com/http://investor.fairchildsemi.com/http://investor.fairchildsemi.com/http://investor.fairchildsemi.com/http://sec.gov/ -
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Fairchild Overview
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Wireless Convergence and EnergyEfficiency mega-trends
Power silicon content growsfaster than end market sales premium paid for efficiency
Segment structure increases ourapps knowledge and ability tosell solutions
Large customers dominate these
markets and align well withFairchild s strengths in SCM,global presence and wide productbreadth
Markets That Drive Our Business
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Shift to Industry Leading CustomersTop Tier Customers Drive Sales & Margin Growth
Significant shift to fast-growing,industry leading customers
Minimize exposure to low-margin, non-strategic tier 3customers
0% 20% 40% 60% 80% 100%
Q4 04
Q3 10
64%
79%
36%
21%
Ratio of Total Sales by Tier
Tier 1 & 2 Tier 3
-40.0%
-30.0%
-20.0%
-10.0%
0.0%
10.0%
20.0%
Tier 1 & 2 Tier 3
5 Year Revenue CAGR by Tier
Total High Mgn Low Mgn
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0 50 100 150 200 250 300 350 400 450
Q3 05
Q3 10
Sales Growth by Margin
Low Mgn High Mgn
Headwinds to Revenue Growth SubsideLower Margin Business Has Been Pruned
Reduced low margin (
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Double-Digit Sales Growth EnablersSemiconductor Sales $ Growth - Handsets
Power management is a critical enabler to increased functionality = high value Smartphones contain 3X semi content as feature phones - $35B Semi TAM in 2013 Move to standard USB and automatic accessory detection shifts more BOM to semis
0% 10% 20% 30% 40%
Voltage Regulators
Interface
Amplifiers
Smartphones
Handsets
36%
34%
27%
24%
5%
2007 - 2013 CAGR Handset - 5% CAGRSmartphone -24% CAGR
FCS SAM 27%+CAGR
Source: iSuppli - Aug 2010
Switch & Mobile Power Salesin 2010 expected to be up 21%from 2009 and 10% from 2008
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0% 5% 10% 15% 20% 25%
Power MOSFETs
Notebooks
Computers
24%
23%
11%
2007 - 2013 CAGR
Double-Digit Sales Growth EnablersSemiconductor Sales $ Growth - Computers
Power management key to battery life - $3B power transistor TAM in 2013 Power MOSFET performance and integration drive share gains Technology leadership in silicon and packages enable strong sales & margin growth
Computers 11%CAGR
Notebooks 23% CAGR
FCS SAM 24%CAGR
Source: iSuppli - Aug 2010
LV MOSFET 2010 results
expected to be up 40% YoYand GM up 400 bps from 2008
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0% 5% 10% 15% 20% 25% 30% 35% 40%
Inverter-based Dishwasher (units)
Inverter-based Refrigerators (units)
Inverter-based Washing Machine (units)
Inverter-based Room A/C (units)
Major Home Appliances (units)
39%
16%
14%
14%
3%
2008 - 2013 CAGR
Double-Digit Sales Growth EnablersUnit Sales Growth Major Home Appliances (MHA)
Conversion to inverter- based motors opens huge new market to our SPMsjust 15%of MHA expected to be inverter-based in 2011 - $2B Semi TAM in 2013
SPMs provide complete power management solution that reduces risk and decreasestime to marketenables our customers to meet/exceed new efficiency standards
MHA - 3% CAGR
Inverter-basedappliances -
14 39%CAGR
Source: IMS -Jul 2010
SPM sales for 2010 expected
to increase >60% from 2008
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16% 17% 18% 19% 20% 21%
Power Analog
Power Discrete
LCD/PDP TVs
18%
18%
21%
2007 - 2013 CAGR
Double-Digit Sales Growth EnablersSemiconductor Sales $ Growth LCD/PDP TVs
Power mgmt is a critical enabler for LED backlighting , a key feature in LCD TVsdue to higher refresh rates, better color & 3D capability - $5B power semi TAM in 2013
Power conv analog and small form factor MOSFETs enable efficient & thin designsSource: iSuppli - Aug 2010
Panel TVs - 21%CAGR
Power Semis -18%
CAGR
Power conversion sales for2010 expected to be up 11%
from 2008
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Double-Digit Sales Growth EnablersSemiconductor Sales $ Growth Automotive
Power modules used to improve fuel efficiency and increase reliability - $2B powersemi TAM in 2013
Fairchild is the leader in supplying power modules for the electronic Power Steering(EPS) market that provides as much as a 10% improvement in fuel efficiency
0% 2% 4% 6% 8% 10% 12% 14% 16%
Power Modules
Power Discrete
Automotive
16%
6%
5%
2007 - 2013 CAGR Automotive 5%CAGR
Power Discrete 6% CAGR
Power ModuleSAM 16%+CAGR
Source: iSuppli - Aug 2010, IMS Jul 2010
Auto sales for 2010 expectedto be up 36% from 2008
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Our SAM Supports Double-Digit Sales Growth
Power management and wireless convergence continue to grow rapidly Our SAM outgrows the end markets significantly due to the higher value our
customers place on performance, size and efficiency
Source: iSuppli - Aug 2010, IMS Jul 2010
0% 5% 10% 15% 20% 25% 30% 35% 40%
Power Modules for Industrial Motors
Inverter-based Washing Machines
Inverter-based Room A/C
Inverter-based Refrigerators
Automotive Power Modules
Panel TV Power SemisNotebook Power MOSFETs
Power Modules for Renewable Energy
Smartphone Amplifiers
Smartphone Interface
Smartphone Voltage Regulators
Inverter-based Dishwashers
13%
14%
14%
16%
16%
18%
24%
26%
27%
34%
36%
39%
2007 - 2013 CAGR
More than 60% of Our Q2 2010 Sales
support these SAMs Huge Growth
Potential
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Mobile, Computing, Consumer &
Communications (MCCC) GroupOverview
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MCCC Business Overview
MCCC
42%PCIA47%
SPG11%
Sales - 2010
Wirelessconvergenceand need for
greaterefficiency in
lower voltageapplications
EnergyRegulations
MobileComputing
Telecom &Server High
EfficiencyPower Supplies
Consumerelectronics
Handsets andwireless
What Drives Our Business?
Focus on leadership power efficiency in DC:DC applications Solutions with increasingly small form factors Portfolio of products to service OEM s & ODM s needs
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Mobile Trends
Smartphone user experience and energy efficiency driving IC growth
OEM competition driving differentiation and IC opportunity
Increasing OEM requirement for broad based IP suppliers
Quality of supply critical differentiator
Three of four of the world s largest SC consumers are now handset OEMs
Strong Market Growth with 28% SAM CAGR
*Q2 iSuppli Mobile Std Linear+logic+MOSFET 2010-2013 CAGR
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Mobile Revenue and IP Growth
The 6 year CAGR is 21% for the signal path and power management focus areas
The IP portfolio has grown from simple functions 6 years ago to more complex powermanagement and signal path functions today
Power
Logic
Signal
MOSFET
2004 2010
I P B l o c k s
MOSFET
Analog Swch
Tiny Logic
Analog Swch
Analog ASSP
USB 2.0
Audio Amp
LDO
Buck DC-DC
Boost DC:DC
RF DC:DC
Chargers
MUS
MOSFET
Tiny Logic
$0
$50
$100
$150
$200
$250
$300
$350
2004 2010
Signal
Power
Logic
MOSFET
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Our Customers
Content in most of the Smart Phones at each OEM
Content in many handset reference designs
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Focus Areas in Smart Phones
Power for CPU DrivenSubsystems, IO Power
Transceivers, OVP,Charging, Detection
Class A/B. D, G AmplifiersCODECs, Mic. ADC,Subsystems
DC/DC for 2/3G PARF Transceiver DC/DC
WLED Drivers with DC/DCLighting Management Units
Tiny Logic Gates, BuffersMicropak2 packaging
Audio, Video, USBCamera, MemoryMIPI
IntelliMAX LoadswitchesUSB Charging, Fuel Gauging
Low RDSon, smallPackaging
Switching, VideoFiltering/Drivers, uSerDes
PLLs, Reset Timers, I2CControl Translators, Sensors
ASSP
Sensors
LED Driver
BasebandProcessor
USBXcvr
Charger
ApplicationProcessor
DisplayMemoryCamera
Switching
RF Transceiver
RF Pwr Mgt
WiFiBlue Tooth
GPS
AudioCoDec
A m p
l i f i e r s
DigitalMic
USBMux
Power Management ICs
VideoFilter/driver
Tiny Logic MOSFET
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Analog Switches
Audio Jack:Detect and configure for3 or 4 pole headset
Route audio to eitherspeakers or headphones
Switch composite videoor MIC to accessory plug
MIPI / Camera:Route & isolateMIPI interface todual cameras ordisplays whilemaintainingsignal integrity
Dual SIM:Sharing onebaseband port withtwo SIM cards
Dual Microphone:Switch & isolate betweentwo microphones for noisecancellation
Source: iSuppli 2010
Mobile Handset Feature Forecast 2010 - 2012
Fairchild Semiconductor is a globalleader in innovative Analog Switchsolutions designed to route, switch,isolate, protect and detect an arrayof signals in mobile devices.
PowerManagement
AudioJack
Detection
MIPISwitch
AudioSwitch
DBTV
TVSwitch
SIM
SIM
RF
DualSIM
SwitchDualMIC
Switch
Processor
0
200
400
600
800
1000
1200
1400
1600
MusicPlayback
(Audio Jack)
Camera(>3Meg)
(MIPI/Camera)
Dual SIM DualMicrophone
M o
b i l e H
a n d s e
t S A M
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USB Solutions for Handsets
Smart Phones Feature Phones Low Cost Phones
USB Accessory DetectionBattery Charger DetectionSwitching/RoutingHandles 3 or more types of media (Audio, Video, Data, etc)
Battery Charger DetectionSwitching/RoutingHandles 2-3 types of media
Switching/RoutingHandles 1-2 type(s) of media
239M Handsets in 2010* 706M Handsets in 2010* 328M Handsets in 2010*
Three out of four mobile handsets utilize a USB Port*
F a i r c h
i l d
S o l u t i o n s
* Source : iSuppli 2010
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33% 3yr CAGR* Fast growing, semi custom space Reset Timers Series; hardware reset for
software lock up Temperature Sensors; provide thermalprotection
I/O Level Shifters for I2C, SD Memoryand SIM cards
Clock buffering and distribution Baseband / Application Processor I/O
expansion
ASSP SolutionsASSPs Enable Smart Phone Applications
Ambient Light
Proximity
Temperature
Compass
Motion / Acceleration
Inclination
Current & Voltage
Timing
Mobile ASSP Solutions
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Mobile Audio
Investment started in 2009 with purchase of Leadis Audio IP and Team
Focused on proving competitive IP and selection as audio supplier at majorhandset suppliers
2010 Customer Driven Products Include:
CODEC /
ADC
DigitalMicrophone IC
(PGA + ADC) w/ low sleep current
and EnhancedSNR
Class D and G AudioSubsystem w/ Pop and
Click reduction
Class D Speaker Amp w/ Battery Boost for Power
Mgt
Class G HeadphoneAmp w/ Integrated
Buck for Power Mgt
Dig Mic = Digital Microphone ICSub = Audio SubsystemSPA = Speaker AmplifierHPA = Headphone Amplifier
Source: Fairchild
SPA
HPA
S u b s y s t e m
Dig Mic IC
Mobile Audio Focus SAM ($M)
$ M
0
100
200
300
400500
2010 2011 2012 2013 2014
Dig Mic
Sub
SPA
HPA
http://images.google.com/imgres?imgurl=http://www.made-in-china.com/image/2f0j00mBEQHzMJrhqNM/Earphone-E-5601-.jpg&imgrefurl=http://www.made-in-china.com/showroom/emaxtech/product-detailwonQzYMOEHcj/China-Earphone-E-5601-.html&usg=__nLodA7jIo5Ysg_PaiPznA5kCp-s=&h=398&w=400&sz=28&hl=en&start=36&tbnid=MNLdtFKTO-OFFM:&tbnh=123&tbnw=124&prev=/images?q=earphone&gbv=2&ndsp=20&hl=en&sa=N&start=20http://images.google.com/imgres?imgurl=https://academictech.doit.wisc.edu/ORFI/otr/creating/speakers.png&imgrefurl=http://forums.savage2.com/showthread.php?p=270641&usg=__AozdrWvnbD1uTsm5nqIE7QlvMDs=&h=137&w=137&sz=3&hl=en&start=28&tbnid=32FuiwC-vQUNUM:&tbnh=93&tbnw=93&prev=/images?q=microphone+symbol&gbv=2&ndsp=20&hl=en&sa=N&start=20 -
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Core Power Management
Step-down DC/DC for SDFlash Memory Cards
Low noise regulators for Proximityand accelerometers
Step-Up DC/DCconverter of USB-OTG
Multi-Channel + Mixed Signal forImage sensor modules
Handset features and usage patterns continue to increase demands on energy efficiency Continues to drive adoption of switching DC/DC across a wider range of voltages Fast growing High Performance Analog Segment through 2014 (21% CAGR*)
Li-IonBattery
3.2V 4.2V
DC/DC 3.0V SDRAM
DC/DC Applicationprocessor
DC/DC 2.9V GPS receiverDC/DC 1.1V BaseBand DSPDC/DC 2.6V ImageSensorDC/DC 1.6V RF TransceiverDC/DC 2.8V FLASH memoryDC/DC 12V LCD DisplayDC/DC 30V LED BacklightDC/DC 2.0V PLLDC/DC RF PADC/DC WiFisub
systemDC/DC Audio AmplifierDC/DC AccelerometerDC/DC Hall SensorDC/DC KeyboardDC/DC I/ODC/DC 3.0V Touchscreen
*Q2 2010 iSuppli 2010-2014
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3G/4G Smart Phone
BasebandChipset
3G PA
470nH
1
10
64
Li-Ion Battery
11
RFTransceiver
VOUT_SNS
SW
GND
PVIN
EN
VCONDAC
RF_IN
P_DET
3GPIO
FAN5902/4/5
+ 200 Minutes More Talk Time+ 140 Minutes More Access Time
34% adoption today to 85% in 2013Over 40% CAGR
Runs 50%
Cooler
Multi-Band RF Power Management
Switching Regulator for RF Saves Power, Extends Battery Life
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LV MOSFET Trends
Process Technology Continues to Drive Cost and Performance
Packaging Technology Shift Enabled by Process Drives Power Density
Performance Segments Require Power Density Improvements
Efficiency Gains are Highly Valued
Good Market Growth at 8% SAM CAGR
Source: WSTS Fukuoka May 28 th 2010 projection 2010 - 2013
P T h l D i
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0.01
0.1
1
1994 1996 1998 2000 2002 2004 2006 2008 2010 2012
Process Technology DrivesCost and Performance
UltraFETTrench-
-10M cellPlanar
-Trench
-Oxide Charge Balance
Key:
-PT1
PT3-
-PT8
PT4- -RP5
PT6-PT7 Sync-
PT10-
30V Die Size for 3mohm Die, (cm2)
20% Average DieSize Reduction perTechnology Node
Enables :
-Die Cost Reduction(Margin
Improvement)
-Smaller PackageFootprint
(Market Share)
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Power Density
2 X D-Pak 130 mm 2
Power Stage 30 mm
2 X 3X3 PQFN 21 mm
2X 5x6 PQFN 60 mm
Old Approach New Approach
20A DC/DC
2 X SO-8 60 mm 2
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Power Density Improves Over 8X
SO-8
Q JA = 74.2C/W
P d = 56 mW/mm 2
30 mm 2
Power 33
Q JA = 59.5C/W
P d = 190 mW/mm 2
11 mm 2
Power 56
Q JA = 48.6C/W
P d = 86 mW/mm 2
30 mm 2
Power 22
Q JA = 65.8C/W
P d = 475 mW/mm 2
4 mm2
Transitions Power56 to Power33 SO8 to Power33 Power33 to Power22 and Power Stage Duals
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MOSFET Power in Notebook Computers
Focus AreasNotebook VcorePowerStage 5x6 Duals 30VPower33 NCH 30V sub 3mOhmPower56 30VPT8S
Notebook DC:DC/BatteryPowerStage Dual 30V 3x3,3x4.5, 5x6Power33 NCH 30V 3-30mOhmPower56 NCH 30V 3-15mOhmPower33 PCH 30V ST3Power33 NCH 30V Dual Cool TM
N VDC Notebook/TabletPowerStage Duals 25VPower33 NCH 25V Dual Cool TM
Power33 PCH 25V ST3Power22 NCH 25V PT7CSP 20V NCH Zener PT7Power33 NCH 100V (LED BLU)
LV MOSFET Content $3.05 in 2013
Cost Effective Performance as Small as Possible
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MOSFET Power in LED LCD TVs
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Focus Areas
LED BLU : Main Switching FETN-CH PT5 100VN-CH PT5 150VN-CH PT7 40VPower33, Power56, SOT223and DPAK
LED BLU : Sync MOSFETN-CH PT5 100VN-CH PT5 150VN-CH PT5 200VPower33, SOT223 and DPAK
T-Con Board & Video Board :PowerStageDuals 30VPower33 NCH 30V PT7
Analog
Micom
RF Tuner
PCIInterface
Analog/ Digital I/O
AMP
Source driver
Display
Rectifier
PFC
LLC
Stand by
WLED backlight& Optical structure
Video BoardSMPS
Timing controller
Boost
Boost
Buckboost
Buck
VCOM Buffer
Gamma corrector
Level shifter
GPM
T-Con Board
LED driver board
Isolated DCDC
G a t e
d r i v e r
Buck
PM IC
LED Backlight
Buck
LDO
LDOLDO
LV MOSFET Content $0.68 Today Growing to $1.33 in 2013
Efficient and Reliable Performance as Cool as Possible
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MOSFET Power in Power Over Ethernet
Focus Areas
Power Sourcing Equipment CircuitIsolation switch with wide SOASOT223Power 33
Powered Device CircuitIsolation switchSSOT3SSOT6
Powered Device DC-DCPrimary Switch 150VPower56, power33, SSOT3, SSOT6,SO8, DPAKSynchronous rectifier30V SO8, SSOT6, power33, power 56
Powered Device BridgeSSOT3SO8 DualMLP QuadPower33
LV MOSFET Content $0.50 per port
High Levels of Reliability as Small as Possible
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MOSFET Power in Servers
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Focus Areas
Server Vcore/DDRPowerStage56 25VPower33 25V PT8+Power56 25V PT7/8+Power56/33 Dual CoolDrMOS Multi-Chip-Module
Server POLsPowerStage56/34/33Power33 PT7/8Power56 PT7/8TinyBuck Integrated solution
CPU 1 CPU 2
DIMM 1
DIMM 4
DIMM 3
DIMM 2
2.5 HDD
Romley VR Block Diagram12-19-07
1.0V AUX1.0V @ 1.2A
12V3
Zoar
1.8V AUX1.8V @ 0.8A Zoar-Eathernet
IBMC1.2V AUX1.2V @ 0.8A
5VSBVR12 Dual SVID
Vccp @ 126AVsa @ 3A
12V1a
DDR3 VDDQ1.5V@ 70A
CPU PLL1.8V @ 1.2A
12V1b
CPU VTT1.05V @ 25A
1.5V STBY1.5V @ 0.4A
KEY
VRLoadVR12 SVID combo
VR controler
Jaketown (CPU)VCCP
VSAVTT
VPLL
VDDR01
DDR3 (4 DIMMs)VDDQ
VTT
VDDR23
DDR3 (4 DIMMs)VDDQ
VTTDDR3 Vtt0.75V@ 1.1A
OPTIONAL 12VSOURCE
OPTIONAL 12VSOURCE
VR12 Dual SVIDVccp @ 126AVsa @ 3A
12V2a12V2b
Jaketown (CPU)
VCCPVSA
VTT
VPLL
VDDR01
DDR3 (4 DIMMs)VDDQ
VTT
VDDR23
DDR3 (4 DIMMs)VDDQ
VTT
OPTIONAL 12VSOURCE
OPTIONAL 12VSOURCE
Pattsburg (PCH)
1.5V
1.1V STBY
1.1V
1.5V STBY
1.1V STBY
1.1V @ 1.1A
1.1V PBG1.1V@ 21A
5VSB
3.3V STBY3.3V@ 0.4A
12V3
PCI
CPU PLL1.8V @ 1.2A
DDR3 Vtt0.75V@ 1.1A
DDR3 Vtt0.75V@ 1.1A
DDR3 Vtt0.75V@ 1.1A
DDR3 VDDQ1.5V@ 70A
DDR3 VDDQ1.5V@ 70A
DDR3 VDDQ1.5V@ 70A
Note: All currents are TDC (Thermal Design Current)
LV MOSFET content grows from< $0.50 to > $5.00 in 2013
Most Efficient Performance as Small as Possible
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Dual Cool vs. DirectFET
Small Can
7.2m
3x32.4m
3x37.2m
ComponentArea:49mm 2 ComponentArea:21.5mm 2
MediumCan
2.4m
70
72
74
76
78
80
82
84
86
88
90
92
94
0 5 10 15 20 25 30
P o w e r E f
f i c i e n c y %
Load (A)
1Phase CCM- Heatsink, No Air
MOSFETS: FDMC3020DC 3x3 HS, FDMC2512SDC 3x3 LS
MOSFETS: IRF6710S HS, IRF6795 LS
MOSFETS: FDMC3020DC 3x3 HS, FDMC2502SDC 5x6 LS
Dual Cool Runs Cooler
Dual Cool is Smaller
Dual Cool is More Efficient
Dual Cool 3x3 and 5x6 ramp in 2011Lead applications are performance computing
Dual Cool TMDirect FET
DirectFET is a registered trademark of International Rectifier
Fairchild
Fairchild
IR
PowerStage Clip vs TI Stacked
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PowerStage Clip vs. TI Stackedvs. Renesas
Fairchild:75 C @ 25A
TI Stacked:99 C @ 25A
Renesas:108 C @ 25A
LateralStacked Silicon
processexhibits higherringing than
Shielded-GateTrench
Technology
FairchildFDMS3600S
and
FDMS3602S
Under typical application conditions, Asymmetric duals in 5x6
Power Stage is more efficient
Power Stage runs cooler
Power Stage low ringing, no snubber
0
1
2
3
4
5
6
7
8
9
10
68
70
72
74
76
78
80
82
84
86
88
90
92
0 5 10 15 20 25
E f f i c i e n c y
( % )
Output Load (A)
Efficiency and Power Loss12V IN, 1V OUT, 300kHz
P owFairchild
RenesasTI
Components Tested:Fairchild FDMS3600SRenesas RJK0214TI CDS86350
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Market Segment Mix Improves Margin
Gross margin increases over 3 year horizon Mix of performance computing, consumer and communications increases
LV MOSFET GM Projection
2009ACT
2010EST
2011 2012 2013
Cons/Coms/Ind
PerformanceComputing
Notebook
Total
LV MOSFET Segment Mix
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
2009ACT
2010EST
2011 2012 2013
Cons/Comms/Ind
Performance Computing
Notebook
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Efficiency, Power Density, and Size are Valued inPerformance Applications of the Communications,Consumer and Computing Segments
Process and Package Technology are Key to Leadingin These Value Dimensions
Revenue Growth and Margin Expansion thatOutperforms the Low Voltage MOSFET Market
Low Voltage MOSFET Summary
MCCC Mobile Products
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MCCC Mobile ProductsExtend Battery Life, Enable Greater Functionality
MOSFET IntelliMAX Building Block Regulators ASSP Regulators
Analog Switches USB SerDes Mixed Signal ASSP
Base Band andApplication Processor
PMIC
Memory
Display
Sub DisplayLMU
Camera
Audio DataVideo
Display &Camera
uSerDes
Signal PathSubsystems
GPSPower
SubsystemsLMU
DC:DC
RF
SD cardHDMI
CameraDC:DC
Microphone
Power
P M I C
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Increasing Power Consumption
3G 3.5G Pre 4G 4G2.75G2G
GPRSUMTS
WCDMATD-SCDMA
HSDPAHSPA
GSMWiMax / WiFi
WiBroLTEEDGE
70M172M14Mbps
384K180k56k9.6k
DATA RATE (bps)
VOICESMS
InternetBrowsing
Email
Video callVideo Download
Interactive Gaming
Video ConferenceVideo Broadcast
VOIP
HDTVMultiview Video
Digital TV
10hr 5hr 2:30hr 1:00hr ?hrTalk / Connection time
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USB Switch
WLANModule
Mobile Handset Targeted Subsystems
Audio
Connectors
Distributed ArchitectureDrivers :
Dissimilar ProcessTechnology
Dissimilar IC lifecycles Optimized power
consumption/efficiency Improved Time to Market
(modularity) Differentiation (feature
sets and user experience)
FAIRCHILD FOCUS: Distributed Signal PathSubsystems and Power
OVPT
X
MU
S
BluetoothModule
SDIO
SwitchDACCodecADCAMPAMP AMP
ApplicationProcessor PMIC
BroadbandProcessor
RF Power
Chipset
LCDBacklight
Driver
DisplayGPS
Mobile TV
FeaturesMP3
Other
P
P
P1
PN
P
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Battery Life in Smartphones
Only 5 6.4 hrs of 3G talk timefor leading smartphones
Battery life gates userexperience
All 4 phones use a similar
battery with a capacity of 1400mAh More functionssame battery
form factor
10MP image sensors
Multi core apps processors
3D MEMS gyroscopes
5.0 GBit/s datarates
AMOLED WQVGA displays
8 RF Bands.
Bridging the energy gap:
Higher energy density batteries (new Chemistries) Optimized usage of features (HW & SW) More efficient conversion of battery power Lower power consuming components
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RFPA PowerManagament
Batt Mngment
ApplicationApplicationProcessorProcessor
MemoryMemoryI/OI/O
WiMaxWiMax
LightingManagement
WW--CDMACDMA
RFPARFPA
GSMGSMRFPARFPA
Core PowerManagement
Fairchild s Mobile DC/DC Products
Battery Management
Core Power
RF Power Management
Lighting
DC/DC converters for digital coresPMICs
RF DC/DC
microPMIC RF subsystem
LCD back lighting
AMOLED
LED Flash
Switching Chargers
Efficient DC/DC Conversion = Longer Battery Life
http://rds.yahoo.com/_ylt=A0WTb_322bFJwmcAEnqJzbkF;_ylu=X3oDMTBqaHBscmZmBHBvcwMxMwRzZWMDc3IEdnRpZAM-/SIG=1g59ioe1c/EXP=1236478838/**http:/images.search.yahoo.com/images/view?back=http://images.search.yahoo.com/search/images?p=usb+logo&fr=yfp-t-501&ei=utf-8&x=wrt&w=366&h=366&imgurl=www.right-click.ie/shop/images/new_usb_logo.jpg&rurl=http://www.right-click.ie/shop/images&size=12.2kB&name=new_usb_logo.jpg&p=usb+logo&type=JPG&oid=77e12d50977794a2&no=13&tt=73,671&sigr=11598v8vi&sigi=11fbb826a&sigb=12j9lbror -
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Mobile Subsystem Capabilities
USB
Accessory DetectionSwitchesTransceivers (Std, full, high)Over Voltage Protection (OVP)Charging
AudioClass D AmpClass G AmpClass A/B AmpDigital Mic. ICSwitches
VideoFilter/DriversSwitchesMIPI SwitchuSerDesCamera Switches
ASSPPLL GPIO ExpandersTiny Logic SIMM Card SwitchReset Timer Memory SwitchTranslators
Display
u S e r D e s
Base Band/ApplicationProcessor
CameraSwitch
PMIC Charging/OVP
USB TRX A c c
. D e t . M U X
uSerDes
USB
Audio
Video
ASSP ASSP
Switch C O D E C
Class G
Class D
Class A/B
O V
P
http://images.google.com/imgres?imgurl=http://de.bluewin.ch/internetzugang/images/symbol_usb.jpg&imgrefurl=http://msn83235502.fotopages.com/?&page=1&h=65&w=133&sz=3&hl=en&start=3&tbnid=hJIhRVX_e_KK2M:&tbnh=45&tbnw=92&prev=/images?q=usb+symbol&gbv=2&ndsp=20&hl=en&sa=Xhttp://images.google.com/imgres?imgurl=http://de.bluewin.ch/internetzugang/images/symbol_usb.jpg&imgrefurl=http://msn83235502.fotopages.com/?&page=1&h=65&w=133&sz=3&hl=en&start=3&tbnid=hJIhRVX_e_KK2M:&tbnh=45&tbnw=92&prev=/images?q=usb+symbol&gbv=2&ndsp=20&hl=en&sa=X -
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Mobile USB
Solutions for the full USB signal path USB Switches Multimedia Switches Accessory Detection Transceivers
Enable USB port sharing for data, audio,
video, and charging Reduce external components Power savings with low power modes Ultra-small packaging
Maximizing USB port functionality in mobile electronics
USB AccessoryDetectionDetect an accessory typefor automatic applicationrouting.
USBTransceiversMaximizes designflexibility andassures USBcompliance.
LV MOSFET
http://images.google.com/imgres?imgurl=http://etc.usf.edu/te_WIN/hardware/i/usb2logo.gif&imgrefurl=http://etc.usf.edu/te_WIN/hardware/usb.html&usg=__4qmSM2GUjkNI6fIgap7XSrH04j8=&h=236&w=425&sz=4&hl=en&start=2&tbnid=kxCcXoWhDc-GIM:&tbnh=70&tbnw=126&prev=/images?q=high+speed+usb+logo&gbv=2&hl=en&sa=G -
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LV MOSFETLeading Technology = Best in Class Margins
1998 2000 2002 2003 2005 2006 2007 2008 2009 2010 2011
Leading silicon and packagetechnology enables optimum size,performance and profitability
Move to next-gen packages lowercosts and improves performance
Technology leverage is greaterthan scale leverage
$-
$10
$20
$30
$40
$50
$60
$70
0 1 2 3 4 5 6 7Volume Scenario
P a c
k a g e
C o s
t
Next GenCurrent PkgCurrent PkgNext GenNext Gen
Long Term Die Cost Trends
Relative Package Cost Curve
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F F L di P k T h l
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Form Factor Leading Package Technology
Reference: SO-8Power 33
Power 56
Q JA = 74.2C/W
P d = 56 mW/mm 2
Q JA = 59.5C/W
Pd
= 190 mW/mm 2
Q JA = 48.6C/W
P d = 86 mW/mm 2
30 mm 230 mm 211 mm 2
Form Factors for Singles:
Power 22
Q JA = 65.8C/W
P d = 475 mW/mm2
4 mm2
A package portfolio to drive mobile computing transitions! Power56 to Power33 SO8 to Power33 Power33 to Power22 and PowerStage Duals
fi hi
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Infineon Partnership
P T h D l C l
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25A Control and Synchronous Solutions
S7.2m
Dual Cool TM 3x37.2m
Dual Cool TM 3x32.4m
30A Control and Synchronous Solutions
M
M
Power Trench Dual Cool
ComponentArea:49mm 2
ComponentArea:21.5mm 2
M2.4m
Dual Cool TM 3x3
7.2m
Dual Cool TM 5x61.2m
ComponentArea:62mm 2
ComponentArea:41mm 2
Shif i h F F
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Shifting the Form Factor
MLP 3x3 Dual9 mm 2
2 x SO-860 mm 2
Fairchild Integrated PowerStage Solutions
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Fairchild Integrated PowerStage SolutionsHigh Side and Low MOSFETs in a Single Package
25A Buck Converter Solution
6mm
5mm
6mm
5mm
5A Buck ConverterSolution
S08
3mm
3mm
Standard Solution: 60mm 2
PowerStage Solution: 30mm 2Better Performance, 3X Smaller Footprint
HS HS
LS
LS LS
HS
LS
HSLS
Standard Solution: 90mm 2
PowerStage Solution: 9mm 2Better Performance, 7X Smaller Footprint
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Power Conversion,Industrial & Auto (PCIA)
Group Overview
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Regulation and Policy Drives our
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g yMarkets
Eco-friendly policies are moving the market WW
Energy Labeling, Energy Efficiency Adoption of inverters in motor control applications Change from traditional lighting to LED, CFL Regional Examples:
EU: EPBD (Energy Performance of Building Directive) : All new buildingsshould consume zero energy from 2019
EU: New Energy Labeling system For Eco-Design:
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Inverter Driven Motors
Brushless DC (BLDC) motors
Improved performance andefficiency
Lowers total cost of ownership
Reduced size = raw materialsavings
Fairchild is well positioned to helpour customers capitalize on themove from Mechanical control toElectronic solutions (inverters)
Our Smart Power Modules
facilitate this transition easingthe design requirements
Our IC s can simplify thecontrol of these motors
AC BLDC
Size/Weight 100% 70% of AC @1HP55% of AC @2HP
Raw materialcost
AC >= BLDC driven by size/weight
Efficiency 40~45% 70~75%
Speed control Difficult Easy & Linear
Accuracy ofSpeed
3~5% 0.5%
Torque control Poor Controllable
Induction Motor vs BLDC Motor
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Induction Motor vs. BLDC Motor
The speed and efficiency of AC induction motor is restricted by its power source (the line voltage and frequency). The power source of BLDC motor is controlled by semiconductor devices, which can achieve
high efficiency at various speed and output load.
BLDC motor A Brushless DC motor has
permanent magnets on therotor which eliminates theproblems of inducingcurrent to the movingarmature.
An IC controller keeps thestator current in phase withthe permanent magnets ofthe rotor This requires less
current to turn the motorwith the same out force
Resulting in greaterefficiency and smallersize.
AC Induction motor The induction motor is also
known as a rotating transformer .
Power is supplied to the rotorby electromagnetic induction.
This method of transferringpower to the rotor lowersthe efficiency.
The motor turns because of themagnetic force exertedbetween a stationaryelectromagnet (stator) and therotating electromagnet (rotor).
The phase differencerequires greater current andcurrent losses to achievepower.
The stator is also powered byAC, the low frequency (50/60
Hz) requires a bigger magnetic-core and more windings tocouple the current from statorto rotor.
VAC: 110V/220V ;50/60 Hz
Inverterization Drives SAM
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-
100
200
300
400
500
2010 2011 2012 2013 2014 2015
M Units
SAM using Inverter Appliance TAM
Expansion in Appliances
Washing machines, refrigerators, airconditioners all require inverter drivenmotors to meet energy savingsregulations
Content: $2 - $20/system Our SPM solutions:
Reduce total system cost Reduce development time Optimize performance Provide higher reliability Reduce board space
In 2009, SPM revenue remained flat to2008
Expect SPM revenue to more thandouble from 2010 to 2012
Source; IMS, iSuppli, Fuji Chimera, Darnell, WSTS etc
TAM growth of end markets is modest,but Inverter % grows rapidly
TAM CAGR of 6% 2010-2015
SAM CAGR of 21% 2010-2015
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Application: Pump Drive
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SPM3
SPM5
-
10.00
20.00
30.00
40.00
50.00
2010 2011 2012 2013 2014 2015
M Units
SAM using Inverter Pump TAM
SPM2
SPM4
Application: Pump Drive
Small overall pump growth but
regulations in EU will push adoptionof BLDC inverter Working with many of the world s
leading customers Broad portfolio of SPM products to
address many needs SPM5 Circulation pump SPM4 2 General pump 1200V SPM2 3 General pump
Content $ Circulation pump : $2.5 ~ $5.0
2 General pump : $18 ~ $36 3 General pump : $27 ~ $50
TAM CAGR of 2% 2010-2015
SAM CAGR of 44% 2010-2015
Application: Fan Motors
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-
50
100
150
200
250
300
350
2010 2011 2012 2013 2014 2015
M Units
SAM using Inverter Fan TAM
Application: Fan Motors
In fans, like appliances, BLDC motor
usage is rapidly outpacing traditionalAC motors We provide both the IC control and
power train Our SPM solutions outperform IGBT
based one-chip solutions MOSFET has superior efficiency in
major fan motor area MOSFET has superior ruggedness (10
times longer short circuit time)
Our IC solutions provide customers
with a simple way to implement control BOM$ (40W ~ 70W fan motor) Module(SPM5) $1.6 ~ $3.0 Motor control IC $0.7 ~ $ 1.4
TAM CAGR of 6% 2010-2015
SAM CAGR of 18% 2010-2015
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Working Principle of IH Cooker
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Working Principle of IH Cooker
Electromagnetic Induction + Skin Effect + Heat generation in cooking vessel
Inverter Module
CookingVessel(Pot)
CeramicPlate
Work
Coil
MagneticFlux
CookingVessel(Pot) Heat loss to
air byconvection
Gas stoveHeat loss tocookingstove byconduction
Conventional Heating MethodsCooking vessel is heated though thermal conduction or radiation from heat source including combustion of gas, hotplate with heating coil and thermal radition from
Halogan. So there is some amount of thermal energy loss due to conduction or convection during thermal energy transfer from heating source.
Induction Heating MethodsOnly electromegnetic energy is transferred to cooking vessel from Induction cooker, so there is no thermal energy transfer resulting in no thermal energy loss during the process. All the transferred electromegnetic energy is used to heat the cooking vessel itself.
Heat is generatedwithin the cookingvessel by EddyCurrent
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Application: Induction Heating &
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-
50
100
150
200
250
300
2010 2011 2012 2013 2014 2015
M Units
SAM using Inverter TAM
Microwave Oven
Energy Savings and increased functionalitydriving adoption of inverters in cookingapplications
Particularly strong in Asia and EU FCS provide a broad family of IGBT s and
Drivers for these applications Content:
IH cooktop:
8 x 600V IGBT or 4 x 1200V IGBT $3.70 ~ $7.60/system
IH tabletop: 1200V IGBT, $0.60 ~ $0.95/system
MWO : 2 x 600V IGBT or 1-2 1000V IGBT,
$0.85~ $1.6/system Rice Cooker :
1000V IGBT or 1200V IGBT, $0.85 ~ $1.90/system
Key Customers Include: BSH Balay, Fagor,Midea, Fushibao, Panasonic, Hitachi, Cuckoo
TAM CAGR of 7% 2010-2015
SAM CAGR of 11% 2010-2015
World Class Standby Power
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-
1,000
2,000
3,000
4,000
5,000
6,000
7,000
8,000
9,000
10,000
30 150 500
E n e r g y S a v
i n g s /
D a y
( M W h )
Standby Power of Comparison Charger (mW)
y
Why is this important? Current specs for cell phone chargers
require
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Application: High Efficiency Computing
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and Consumer - World Class Standby Power
NB
Std by of PC
Printer
Std by of LCD TV/ LED TV LCD/LED Monitor
Green ModePWM only designfor NPB adapter w/
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pp
Strong Market Acceptance of our
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0
100
200
300
400
2010 2011 2012 2013 2014 2015
M Units
NB > 75W SAM NB TAM
0
50
100
150
2010 2011 2012 2013 2014 2015
M Units
PC Gold SAM PC TAM
Power Supplies
Computing market continues todrive towards higher efficiency atfull load while minimizing power atlow loads
FCS controllers provide a uniquefeature set:
Leading Patented Power SavingTechnology
Higher efficiency Reduced component count Easy to design
Content: $1.50-$2.00 per PC $0.65-$1.20 per NB adapter
TAM CAGR of 1% 2010-2015
SAM CAGR of 43% 2010-2015
TAM CAGR of 10% 2010-2015
SAM CAGR of 15% 2010-2015
Application: +75W NB Adapter Multiple Solutions Available
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Multiple Solutions Available
PFC + QRcombo
High SideDriver Content: $0.9~$1.2
Next gen of NB adaptor solutions to meet92%+ efficiency
High integration provides cost effectivedesign
Wider power range 75W~250W
Allows for very slim design
Syn. RectifierController
FAN6921
VDD
RES
AGNDGND
LPC
VOUTISR
R1
R2 R4
R3
1
GATE
8
3 5
7
64
Q2
FAN6204
PFC + QR combo Syn. Rectifier Controller
Content: $0.65~$0.8
Current mainstream solution for NBadaptors
Meets 90%+ efficiency, high integration ,75W~150W
Application: PC Gold
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pp
FAN6982FAN9612
FAN7621
FAN6208
12V
SG1577A3.3V
5V
SG652X
CCM PFCInterleave CRM PF C LLC
Supervisor
LLC SR
Dual Buck
FSBH0X705VSB
Standby
Content: $1.5~ $2.0
Multiple sockets necessary to meet High efficiency necessary for 80+ gold
Low standby power to meet 2013 EuP lot 6 regulation:
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Robust Auto Solutions for energy efficient applications
Engine ManagementIgnition, Glow PlugInjector control and supply
HID Lighting
Braking (ABS, ESC)
Electric pumps (water, fuel, oil)DC/DC in HEV / EV
Electric Power Steering
El. Parking Brake
Transmission andGearbox
Engine Cooling
Power Steering Types
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(HPS) Purely hydraulic power steeringPump mechanically attached to the engine.
Pump power output proportional to RPMPump must satisfy assistance at min RPM, thusat high RPM energy is wasted.
Pulleys and belt from enginecrankshaft power the pump
Pump for HPS has to be beside theengine, thus requiring long hoses.
Reservoir
EHPSPump mounted locallyPump powered by an electrical motor
only upon demand
EPSNo Pump, no hydraulic fluid.An electrical motor provides assistance upon demand
Electric motor
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Application: Automotive PowerM d l f EPS
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0
510
15
20
25
30
35
4045
2010 2011 2012 2013 2014 2015
Module SAM EPS TAM
M Units
Modules for EPS
$12 to $25 per system / vehicle
2009: Fairchild sold modules for300k vehicles
2010: Modules for 900k vehicles willbe sold by end of the year
3 platforms and 5 car models
Outlook 2012: 2-3M Fairchild APMmodules 9 platforms with 20 car models will be in
production by end 2012
Other hydraulic systems are all
potential opportunities
TAM CAGR of 11% 2010-2015
SAM CAGR of 18% 2010-2015
Application: Automotive IGBTsf I iti S t
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for Ignition Systems Fairchild supports the full
portfolio of IGBTs for Ignitionsystems
Fairchild Ignition IGBT products: Improve thermal management
in a reduced footprint Facilitate high system reliability
Best in class energy handlingcapability
Simplify design Improve fuel efficiency
Fairchild is the number onesupplier across all ignitionarchitectures, from Coil on Plugto advanced multispark Switchon Plug systems
EngineControl
IgnitionSwitch
IgnitionCoil
SparkPlug
Application: Automotive IGBTs forIg iti S t
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Ignition Systems
Strong growth:
2009: 61Mu/year (Y-on-Y growth) Forecast 2010: 94Mu/year 2012: targeting > 110Mu/year
Content: $2 to $10 for a 4 cylinder
gasoline vehicle
Further growth will be fueled by: New technologies allowing for reduced die
size hence smaller packages
New Smart Ignition and Ignitor Moduleproducts
EcoSPARKdeliversbenchmarkenergycapability perunit area
0
20,000
40,000
60,000
80,000
100,000
Ignition IGBT Sales History
Calendar Year
Y e a r l y
U n
i t e s
( I n M u
)
PCIA Summary
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y
PCIA are in a Target Rich environment While many of our end markets have single digit TAM
growth Energy efficiency is driving double digit SAM growth.
Our technology should allow us to take significant market positions We have a unique combination of IC, Discrete and Packaging
capabilities to create value added products
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Finance Overview
Highlights of the Quarter Q3 2011
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Sales were $403m, down 7% QoQ and 3% YoY strong mobile analog sales offset by weak demand in consumer,computing, appliance and solar sectors
PCIA sales were down 10% QoQ but up 5% YoY due weaker demand from consumer, computing, appliance and solarcustomers as they continue to reduce inventory MCCC sales were f lat QoQ due as strong mobile analog sales wereoffset by weaker demand in the consumer and computing sectors
Adjusted gross margin was 36%, down 120 bps QoQ and 50 bps YoY lower factory loadings plus roughly a 1percentage point impact from 8 fab start costs caused margins to decrease
Distribution POS was down 9% QoQ causing channel inventory to increase from the prior quarterfactory loadings havebeen reduced to drive an expected reduction in channel inventory in Q4
Internal inventory increased 2% in dollars
Generated $19m in free cash flow (cash from operations capex) and ended Q3 with $165m in net cash
Pricing was down less than 1% QoQ
Utilization decreased to roughly 80%virtually all lead times are at normal levels
Q4 Forward Guidance
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Sales expected to be $350 370mcurrent scheduled backlog nearlycovers the low end of this range
Gross margin expected to be 32 34% due to reduced factory loadings asinventories are reduced
R&D and SG&A forecast to remain roughly flat QoQ at $92m
Adjusted tax rate forecast to be between 15% +/-3%
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Adjusted EPS
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j
Factors Driving Future Gross MarginExpansion
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Accelerate the development of new products that offer higher valueadd to our customers
Leverage current manufacturing footprint through existing factoryconsolidation plan and continued 8 wafer conversions
Continued proliferation of lean manufacturing efforts throughout theorganization
Pricing management through effective inventory and product lifecycle management
Effective management of capital expenditures Leverage bulk purchasing opportunities Continually raise the acceptance threshold for new projects
Expansion
Product Mix: 250 300 bps
Cost: 100 150 bpsMFG Optimization: 100 150 bps
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Free Cash Flow
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4 Qtr Rolling FCF % Revenue
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g
Debt Composition & Trend
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0
200,000
400,000
600,000
800,000
1,000,000
1,200,000
1997 1999 2001 2007 2008 2009 2010 2011
Drawn Revolver Term Loan Convert High Yield
Net Debt & Interest Trend
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0.0%
1.0%
2.0%
3.0%
4.0%
5.0%
6.0%
7.0%
8.0%
9.0%
-$700.0
-$600.0
-$500.0
-$400.0
-$300.0
-$200.0
-$100.0
$0.0
$100.0
$200.0
$300.0
1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 Q1 '11 Q2 '11 Q3 '11
Net Cash Interest % of Revenue
Why Fairchild is Winning
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Focus on Large, Industry-Leading Customers in Fast-
Growing Markets
World-class SCM and WW
Reach Make Fairchild a GoodFit in the Top 3 5 SupplierEcoSystem
Great Technology& IP Creates
Higher Barriersand Strong
Growth in TargetMargin Band
Disciplined SCM,Capex & Asset
Mgmt GeneratesHigher ROI &
Cashflow
BaseBandandApplicationProcessor
PMIC
Memory
Display
Sub DisplayLMU
Camera
Audio DataVideo
Display &Camera
uSerDes
Signal PathSubsystems
GPSPower
SubsystemsLMU
DC:DC
RF
SDcardHDMI
CameraDC:DC
Microphone
Power
P M I C
SPMs
Dual Cool TM
MLP Duals
http://images.google.com/imgres?imgurl=http://etc.usf.edu/te_WIN/hardware/i/usb2logo.gif&imgrefurl=http://etc.usf.edu/te_WIN/hardware/usb.html&usg=__4qmSM2GUjkNI6fIgap7XSrH04j8=&h=236&w=425&sz=4&hl=en&start=2&tbnid=kxCcXoWhDc-GIM:&tbnh=70&tbnw=126&prev=/images?q=high+speed+usb+logo&gbv=2&hl=en&sa=G -
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