Fairchild Quality Manual

FAIRCHILD SEMICONDUCTOR CORPORATIONQuality ManualFSC-QM0001REVISION 16

CONFIDENTIAL DOCUMENTTHIS DOCUMENT IS UNCONTROLLED UNLESS VIEWED ONLINE OR IN A DOCUMENT CONTROL BOOK

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TITLE: Quality Manual

REV DATE ECN NUMBER

ORIGINATORSite

CHANGES

16 27 July 2016 80b1b746 Gary Dewitt Added section 7.10 Sales Description and process flow. Added Attachment 1 –Fairchild Affiliation Site Location Matrix.

15 31 May 2016 80ad8bd5 Malcolm Anderson

MERH

Updated the Mission statement to reflect Barry’s desired mission.

14 15 Feb 2016 80a72286 Gary DewittMERH

Changed top management Org Chart to match workday (4.0). Updated IT process flow (7.4) and description. Updated Configuration Control and Order Management process flow (7.5) and description. Removed references to Penang Malaysia facility.

13 02-Sep-2015 8098238a Gary DewittMERH

Andie Kupec MERH

Update “Configuration Control and Order Management” flow chart (pg.15). Removed all references to Salt Lake Manufacturing Location. Removed “Vijay Ullal” as a required approver. Update approval names. CDCA moved approvals section to page 2 of spec and updated Table of Contents.

12 17-Mar-2014 8074475b Joel Loosli UTSL

Removed details of support locations as they change and aren’t located in the same places as originally stated. Clarified verbiage on systems that have been modified since last update. Added Configuration Control and Order management. Updated Specification List.

11 05/14/2012 80318178 Joel Loosli UTSL

Changed Detailed Drawing Review location to RHR. Removed Colorado location. Fixed Links. Clarified support audit management review.

10 02/03/2010 150024 Mike Dietrich MERH

Remove reference to a specific ISO/TS-16949 version, update the foundry process map and add purchasing reference document.

ENGINEERING CHANGE NOTICES (ECNs) ARE ON FILE IN DOCUMENT CONTROL



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APPROVALS

A. This Approvers Matrix documents the functions required for approval of revisions to this specification.

B. The individual names listed document the specific approvers of the current revision of this specification, and must be verified, and updated if needed, in succeeding revisions.

C. Changes to the functions listed must be reviewed and approved by the Quality Assurance representative. That approval is captured in the succeeding revision of this specification.

D. This specification can only be released after approval is received from all of the listed approvers.

SITE FUNCTION NAME

MERH Global Quality Audit Program Manager Gary Dewitt

MERH Global Quality Systems Director Malcolm Anderson

FSME Quality Manager Maine site Jason Berthiaume

FSMP Quality Manager MTP site Dan Copertino

FSBK Quality Manager Bucheon site Kyungdug Ko

FSSZ Quality Manager Suzhou site Albert Zeng

FSCP Quality Manager Cebu site Dexter Duremdes

SUBCON Quality Manager Subcon SF Chen



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Table of Contents

APPROVALS............................................................................................................................. 2

1. PURPOSE AND SCOPE.................................................................................................... 4

2. COMPANY DESCRIPTION................................................................................................ 6

3. THE WAY WE WORK........................................................................................................ 7

4. CORPORATE ORGANIZATION........................................................................................ 8

5. QUALITY POLICY ............................................................................................................. 8

6. WAFER FABRICATION, ASSEMBLY/TEST SITES AND SUPPORT SITES .................... 8

7. KEY SUPPORT PROCESS DESCRIPTIONS...................................................................12

8. QUALITY MANAGEMENT SYSTEM SPECIFICATIONS..................................................23

9. OTHER GLOBAL SPECIFICATIONS...............................................................................24

10. QUALITY CERTIFICATIONS............................................................................................24



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1. PURPOSE AND SCOPE

This Quality Manual describes Fairchild Semiconductor’s approach to quality at our wafer fabrication sites, assembly/test sites and support sites that enable us to design and manufacture high quality semiconductor products.

It also identifies the policies and procedures used by Fairchild Semiconductor to ensure that our products and services meet both the expectations of our customers and our business objectives in a consistent, economical and reliable manner.

The policies and procedures identified in this manual are intended to establish and communicate the requirements that all groups at Fairchild Semiconductor meet. These requirements are based on the requirements of our customers as well as applicable international and national standards. These requirements are updated as the needs of our customers and the respective standards are changed and for continuous improvement of our quality system.

This document identifies corporate policies and references corporate level specifications. Each site has an associated addendum to this specification that references site level specifications, exceptions, additions, or clarifications applicable to their own sites.

The key processes described in this manual meet the intent of ISO9001,ISO/TS16949 and VDA6.3.



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1.1 Site Quality Management Scopes for TS16949 Automotive Certification

SiteRequirements Scope

Fairchild Korea Semiconductor Ltd. ISO/TS16949 The manufacture of semiconductors

#82-3, Dodang-dong

Wonmi-ku, Puchon-si, Kyunggi-do

420-711, Korea

Fairchild Semiconductor (Phils.),Inc. ISO/TS16949 Package design, and the manufacture of semiconductor components

Mactan Economic Zone, Lapulapu City 6015Cebu, Philippines

Fairchild Semiconductor – MTP ISO/TS16949 The manufacture of semiconductors

Crestwood Industrial Park

125 Crestwood Road

Mountain Top, PA 18707

Fairchild Semiconductor - South Portland ISO/TS16949 The manufacture of semiconductors

333 Western Ave.

South Portland, ME 04106

Fairchild Semiconductor (Suzhou) Co.,Ltd.

ISO/TS16949 Package design, and the manufacture of semiconductor components

1 Sutong Road, Suzhou Industrial Park

Suzhou, Jiangsu, P.R.China



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1.2 Remote Support Locations

2. COMPANY DESCRIPTION

Fairchild Semiconductor (NASDAQ: FCS) is the leading global provider of semiconductor technologies that address some of today’s most important technology challenges – leveraging advances in packaging, proprietary technologies and experience in semiconductor design and manufacturing – delivering power and mobile semiconductor solutions for a broad range of applications. Our high performance semiconductors are used in power supplies, portable devices, lighting, motors, computing, consumer electronics and automobiles.

Fairchild has manufacturing facilities in:

South Portland, MaineBucheon, South KoreaMountaintop, PennsylvaniaCebu, the PhilippinesSuzhou, China

Remote Support Process

Auto/Non-Auto Process Owner

Locations Support by RSL

Drawing Review Y/YDir., Quality Systems/Quality Systems Engineer All MFG Sites

Customer Feedback Y/YDir., WW Customer Quality/Quality Systems Engineer All MFG Sites

Information Technology Y/Y

Sr. VP, Information Technology/IT Security & Compliance Manager All MFG Sites

Foundry Management N/Y Dir., Foundry Management/Foundry Q&R Mgr. All MFG SitesSubcontractor Management N/Y

Dir., Subcontractor Management/Subcontractor Q&R Mgr. All MFG Sites

Contract Review Y/Y Dir., Contract Administration All MFG Sites



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3. THE WAY WE WORK

Fairchild’s executive management and employees have identified our Guiding Principles that we hold important and build our work around:



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4. CORPORATE ORGANIZATION

4.1 See detailed organization structure in Workday.

5. QUALITY POLICY

The quality policy, created and approved by executive management, provides the framework by which Fairchild Semiconductor Company’s Strategic Business Plan is carried out and is communicated and understood throughout the organization. It is customer focused and instills the spirit of continual improvement.

"Build customer trust in Fairchild Semiconductor’s brand to win in a competitive environment".

6. WAFER FABRICATION, ASSEMBLY/TEST SITES AND SUPPORTSITES

The wafer fabrication and assembly/test sites where value-added manufacturing processes occur are the core to Fairchild’s ability to build defect-free, on-time, quality product. The following sections give a high level overview of these manufacturing and support sites.

CEO

Analog Pwr

Group

Discrete Pwr

Solutions

Finance

and IT

Global Quality & Reliability

Global Sales, Mkt, & Bus Ops Planning

HR LegalManuf

OpsMotion Tracking Solutions

Strategic Planning

Executive Admin



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6.1 Wafer Fab & Assembly Sites

The process maps below show the relationship between Fairchild’s Wafer Fabs, Assembly Sites, Support Sites, and our customers.



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6.2 Fairchild Quality System

The map below describes how Fairchild’s Quality System supports the organization:



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7. KEY SUPPORT PROCESS DESCRIPTIONS

7.1 Specification Review

All documents of external customer origin, customer detail and drawing reviews, received by Fairchild Semiconductor are submitted to the Customer Spec Quality Group for drawing reviews. Records of drawing reviews are maintained in the Customer Specification database. Key participants of the affected parties review the documents and any requirements that deviate from Fairchild Semiconductor requirements are identified and communicated to the customer.

Requirements that are unacceptable to Fairchild Semiconductor are identified in a waiver request report which is sent to the customer. Requests for waivers are attached to the drawing review. Customer acceptance of waivers is acknowledged by customer purchased orders. Where necessary, requirements that cannot be addressed by standard Fairchild processes are incorporated into special flows called stampoffs. Once stampoffs are created wafer fabrication and assembly/test sites develop special methods/instructions to fulfill customer requirements.

The relationship between how this process interacts with the customer and how it supports wafer fabrication and assembly/test sites is explained below in the process map:



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7.2 Complaints Process (PQA)

When customers return failed parts for analysis, Fairchild Semiconductor uses a disciplined problem solving method to ensure permanent corrective and preventive actions are implemented.

The relationship between how this process interacts with the customer and how it supports assembly/test sites is explained below in the process map:



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7.3 Customer Feedback

Various stakeholders within the Fairchild Semiconductor organization are responsible to ensure customer scorecards are understood, analyzed and actions executed to improve customer scorecard performance.

The customer feedback support process delineates customer scorecard information, initiates stakeholder participation and consolidates stakeholder improvement plans.

The relationship between how this process interacts with the customer and how it supports wafer fabrication and assembly/test sites is explained below in the process maps:

CUSTOMER

Customer Feedback Detailed Process Map

FSSQ FSC SITES (Stakeholders)

Improvement Action Definition

Improvement Action

Implementation

Action ItemEffectiveness

Tracking

Acquisition of Scorecards

Analysis of Scorecards

Scorecard Response Generation

Data ReportingTrack / Follow -up

Progress of Improvement Actions

CORPORATE

Customer Feedback General Process Map

Customer

Feedback Process

Fairchild Support & Manufacturing Sites

(Scorecard Stakeholders)

Scorecards

Tier OneCustomers

ScorecardResponses

Improvement Plan

Execution of Improvement Plan

Improved Customer Satisfaction

FAIRCHILD SEMICONDUCTOR CORPORATION

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7.4 Information Services

Information Services Business continuity plans are the foremost critical factor in ensuring the resiliency of factory systems in the face of catastrophe. Failure in business continuity results, in factory systems, could cause the wafer fabrication and assembly/test sites to miss deliveries. By means of the Global Help Desk, systems monitoring and maintenance, disaster recovery and change control, the Information Technoavailability.



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Information Services Business continuity plans are the foremost critical factor in ensuring the resiliency of factory systems in the face of catastrophe. Failure

usiness continuity results, in factory systems, could cause the wafer fabrication and assembly/test sites to miss deliveries. By means of the Global Help Desk, systems monitoring and maintenance, disaster recovery and change control, the Information Technology process help to maintain systems

IT Tracking System

A DOCUMENT CONTROL BOOK

Information Services Business continuity plans are the foremost critical factor in ensuring the resiliency of factory systems in the face of catastrophe. Failure

usiness continuity results, in factory systems, could cause the wafer fabrication and assembly/test sites to miss deliveries. By means of the Global Help Desk, systems monitoring and maintenance, disaster recovery and

logy process help to maintain systems



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7.5 Configuration Control and Order Management

Customer orders are entered into our PeopleSoft application. These orders trigger A/T starts to fulfill customer orders. Additionally, the forecast in Demand Manager is used to trigger FAB starts to prepare supply for future customer orders. The forecast is maintained by Business Planners. Inventory targets (STI) are maintained in Inventory Optimizer by Business Planners. The Operations group executes the starts based on this flow and logic:



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7.6 Foundry Management

Foundry management refers to the wafer fabrication suppliers that are notFairchild Semiconductor owned. Foundry management extends to wafer fabrication sites providing unique processing to FSC wafer fabs.

Foundry management includes the monitoring, development and evaluation of wafer fabrication supplier performance. Supplier audits and reviews are conducted regularly.

The relationship between how this process interacts and supports the assembly/test sites is explained below in the process map:

Product

Business Case/Project Charter

Manufacturing / Production

Foundry

Customer

Corporat

AOP / Benchmar

k/

Foundry Qualification

Performance Monitoring

Foundry Selection

Foundry Management

Customer Complaints

Process

Customer Feedback Process

Improvement Planning &

Driving

Integrated Business Plan

(IBP)

FSC Assembly Site

PPrroocceessss MMaapp –– FFoouunnddrryy MMaannaaggeemmeenntt

Subcontractor



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7.7 Subcontractor Management

As a method to meet customer requirements as demand and product mix fluctuates, Fairchild Semiconductor controls the outsourcing of assembly and test sites. This process includes the monitoring, development and evaluation of subcontracted assembly and test sites. Audits and reviews are conducted regularly.

The relationship between how this process interacts and supports the assembly/test sites is explained below in the process map:

1

Assessment/ Qualification

Regional Subcon Performance

Review

• Periodic Review• Scorecard Rating• DTO Program

Manufacturing / Production

Subcon Selection

FSSQ Regional Subcon Management

FSC Warehouses

FSC Sites Subcon Management

Subcon Sites

Customers

Strategic Planning

• Consolidation• Grow / Exit• New Engagement• Benchmarking

Subcon Performance

Monitoring

• Operations review, (e.g. Yield, Quality, Capacity Review, Pack -out & Delivery)

Subcontractor Management

Site Subcon Operations

• 8D Process• Planning &

Operations• Sustaining

Engineering• Value Engineering

& Continuous Improvement

• Audits

FSC Global Manufacturing GroupSBP/AOP Key Initiatives, Policies, Procedures,

Product LineBusiness Case

Customer Feedback & Complaint Process



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7.8 Contract Administration/Review

The contract review process ensures the requirements between Fairchild Semiconductor’s customers and Fairchild Semiconductor are understood and agreed upon prior to receiving a Purchase Order. This process also ensures service level requirements are understood and agreed upon.

The relationship between how this process interacts with Customers and the Fairchild organization is explained below in the process map:



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7.9 Product Line (Product Design)

The product design process utilizes customer input (requirements and needs) to determine products to develop. The product line is responsible for product and package definition and design. This can result in the development of new technologies or new technologies can result in defining new products or packaging. The product lines interface with manufacturing (fabrication and assembly) to develop manufacturing processes and to qualify products manufactured on those processes through characterization and reliability testing.

The relationship between how this process interacts with the customer and how it supports wafer fabrication and assembly/test sites is explained below in the process map:

CustomerRequirements

CustomerFeedback

Product Line

Site Quality System

Product Line

Manu -Facturing /Assembly

• ManufacturableProcess

• Products on the ManufacturableProcess

DeviceConcepts

Product/Quality

Management

• Business Case

• Technology Tables

• Priorities

• Product Design

• Characterization

• Reliability

New ProductDevelopment

Technology Development

Unit ProcessDevelopment

Integration

Project Management

• Process Technology

• Product Definitions

New PackageDevelopment

• Package Definitions • Packages on the

ManufacturableProcess



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7.10 Sales (Customer Interface)

The sales team is the liaison between the customer and the various groups within the organization. The sales group is responsible for growing the revenue of our organization. This is achieved by working closely with new or existing customers to determine in which designs they are working, and where Fairchild has the technology to offer a competitive solution. There are two possible paths to increase revenue. We can sell our customers products that have already been developed, or we can develop new products to meet their requirements. The sales team interfaces with various product lines to achieve this goal.

Sales facilitates contract negotiations, NDAs (Non-Disclosure Agreements), quotes/samples/models/ presentations/ datasheets to customers. The relationship between sales and the various groups within Fairchild is explained below in the process map:

Customer Sales Team

Sample Request

Contract Negotiation File

NDA Request

New Product Request

Request for Quote

Request for Technical Docs (Datasheets/Models/

Presentations)

Enter in SFDC (Sales Force Dot Com)

Send to Pricing Team

Send to Legal Team

Discuss Business Case with Product Line

Enter in Model N

If Material exists

Request Material from Product

Line

Sales Responds to Customer

If NDA is accepted

Legal Stores NDA

Yes

No

Yes

No

mtg w/customer or pricing file sent to sales

If pricing is agreed

No Yes



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7.11 Other ISO/TS16949 procedures:

7.11.1 Internal Audit Process

Internal quality management system audits are conducted at the manufacturing sites and support operations. The results of these audits are reviewed and reacted to by the management at the respective manufacturing sites and support sites.

7.11.2 Document Control

All documented procedures are controlled. A formal process is in place to issue and update all process documents so that only the latest, approved versions are available to employee for their use. The document control process includes:

A method for reviewing, approving and re-approving the content & adequacy of the procedure.

A method for identifying the changes being made and the current revision of status identified.

A method for providing the necessary background information to approvers.

A method that ensures the latest version of documents are available at point of use and remain legible and identifiable.

A method for controlling obsolete information to prevent its use. A method that ensures documents of external origin are

identified and their distribution controlled.

7.11.3 Record Control

Records are maintained that provide evidence of conformity to requirements and the effective operation of the quality management system. Each process ensures records are legible, identifiable, retrievable, stored and protected appropriately, retained for appropriate time and disposed of when appropriate.

7.11.4 Control of Nonconforming Product

This procedure is defined locally at each manufacturing and assembly/test site. The RETURN MATERIAL AUTHORIZATION & MANAGEMENT procedure (FSC-LOG-0001) addresses how product is identified and transported between customer and facilities.

7.11.5 Training

Each operation of the manufacturing process are performed in a consistent and repeatable manner. Operators running these operations are trained, tested, and certified to ensure their competency. Training records are maintained on each operator to demonstrate this competency.



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7.11.6 Corrective & Preventive Action

Corrective and preventive actions are identified and implemented whenever nonconformities or potential nonconformities are identified. These actions are designed to eliminate the root cause of nonconformities and prevent recurrence.

7.11.7 Lab Scope

All lab scopes, both internal and external, are described in each of the wafer fabrication and assembly/test site’s quality systems documentation.

8. QUALITY MANAGEMENT SYSTEM SPECIFICATIONS

Below is a list of the Global Quality System specifications used at each site. Each site will have other Quality System specifications outlining specific processes at their own site.

Specification Title

FSC-ADM-0005 FAIRCHILD PRODUCT/PROCESS CHANGE NOTIFICATION PROCESS (PCN)

FSC-ADM-0006 PRODUCT OBSOLESCENCE PROCEDURE

FSC-ADM-0015 FSC CORPORATE GENERAL DRAWING REVIEW PROCEDURE

FSC-PUR-0001 FAIRCHILD SUPPLIER PERFORMANCE MEASUREMENT

FSC-QAR-0002 PROCESS REQUIREMENTS FOR CUSTOMER RETURNS

FSC-QAR-0011 FAIRCHILD CUSTOMER FEEDBACK PROCESS

FSC-LOG-0001 RETURN MATERIAL AUTHORIZATION & MANAGEMENT

FSC-QAR-0001 SUPPLIER ASSESMENT POLICY AND PROCEDURE

FSC-QAR-0004 STD OPERATING PROCEDURE FOR IDENTIFICATION OF SPECIAL PRODUCTS

FSC-QAR-0007 RELIABILITY MONITOR PROGRAM

FSC-QAR-0008 LOT TRACEABILITY SYSTEM SPECIFICATION

FSC-QAR-0009 FOUNDRY QUALIFICATION AND QUALITY MONITOR PROCEDURES

FSC-QAR-0010 SUBCONTRACTOR QUALITY MANAGEMENT POLICY

FSC-QAR-0014 SUBCONTRACTOR ASSESSMENT POLICY AND PROCEDURE

FSC-QAR-0020 APPROVED ASSEMBLY & TEST SUBCONTRACTORS LIST

FSC-QAR-0017 OQC/IQA FAB TO ASSEMBLY ONE PAGE ACCEPTANCE CRITERIA

FSC-QAR-0022 DOUBLE THREE OUT PROGRAM

FSC-QAR-0025OUTGOING QUALITY ASSURANCE - MINIMUM VISUAL AND MECHANICAL CRITERIA AND SAMPLING PLAN

FSC-DEV-0001 PRODUCT DEVELOPMENT PROCESS SPECIFICATION

FSC-DEV-0002 FAIRCHILD IC PROCESS DEVELOPMENT SYSTEM

FSC-QAR-0006 FAIRCHILD SEMICONDUCTOR GENERAL RELIABILITY REQUIREMENTS

FSC-QAR-0013 FAIRCHILD SEMICONDUCTOR PACKAGE ENGINEERING METHODOLOGY

FSC-QAR-0027FAIRCHILD SEMICONDUCTOR FMEA GENERATION AND IMPLEMENTATION REQUIREMENTS

FSC-MKT-0003 PRODUCT CODE DEFINITIONS AND REQUIREMENTS

FSC-DOC-0001 CORPORATE DOCUMENT CONTROL PROCEDURE

FSC-DOC-0002 CORPORATE DOCUMENT CONTROL ADMINISTRATION PROCEDURE

FSC-MKT-0001 FAIRCHILD MARKETING OUTLINE DRAWING SPECIFICATION



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9. OTHER GLOBAL SPECIFICATIONS

https://sites.google.com/a/fairchildsemi.com/wwquality/home/quality-systems-1/corporate-document-control

10. QUALITY CERTIFICATIONS

http://www.fairchildsemi.com/support/quality-reliability/certificates

ATTACHMENT 1: Fairchild Affiliation Site Location Matrix



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