Fairchild FIS1100 6-Axis MEMS IMU 2015 teardown reverse costing report published by Yole...

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

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Electronic Costing & Technology Experts

www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]

September 2015 – Version 1 – Written by Elena Barbarini

http://www.systemplus.fr/index.php?lang=ge&page=home.php

http://www.systemplus.fr/index.php?lang=ge&page=home.php

mailto:[email protected]

mailto:[email protected]

Fairchild FIS1100 6-Axis MEMS IMU

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Glossary1. Overview / Introduction 4

– Executive Summary

– Reverse Costing Methodology

2. Company Profile 7– Fairchild

– FIS1100 Characteristics

3. Physical Analysis 13– Synthesis of the Physical Analysis

– Physical Analysis Methodology

– Package 16

– Package Views & Dimensions

– Package Pin Out

– Package Opening

– Wire Bonding Process

– Package Cross-Section

– ASIC Die 31

– View, Dimensions & Marking

– Delayering

– Main Blocks Identification

– Cross-Section

– Process Characteristics

– MEMS Die 47

– View, Dimensions & Marking

– Bond Pad Opening & Bond Pads Details

– Cap Removed & Cap Details

– Sensing Areas Details (Gyro & Accelerometer)

– Cross-Section (Sensor, TSV, Cap & Sealing)

– Process Characteristics

– Fairchild Patents

4. Comparison with IMU from ST, Bosch and InvenSense 89

5. Manufacturing Process Flow 93– Global Overview

– ASIC Front-End Process

– ASIC Wafer Fabrication Unit

– MEMS Process Flow

– MEMS Wafer Fabrication Unit

– Packaging Process Flow

– Package Assembly Unit

6. Cost Analysis 115– Main steps of economic analysis

– Yields Hypotheses

– ASIC Front-End Cost

– ASIC Back-End 0 : Probe Test & Dicing

– ASIC Wafer & Die Cost

– MEMS Front-End Cost

– MEMS Back-End 0 : Probe Test & Dicing

– MEMS Front-End Cost per process steps

– MEMS Wafer & Die Cost

– Back-End : Packaging Cost

– Back-End : Packaging Cost per Process Steps

– Back-End : Final Test Cost

– FIS1100 Component Cost

7. Estimated Price Analysis 141– Manufacturer Financial Ratios

– Estimated Selling Price

8. Cost Comparison with ST, Bosch and InvenSense 145

S+C_RS230_Fairchild _FIS1100_6-Axis_IMU_Sample.pptx






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• This full reverse costing study has been conducted to provide insight on technology data,

manufacturing cost and selling price of the Fairchild FIS1100 6-Axis IMU.

• By increasing of 18% the footprint respect to the latest STMicroelectronics and Bosch 6-axis IMU,

Fairchild propose a 3.3x3.3x1mm device. The device presents one ASIC and one MEMS die stacked

on 2 layers PCB and connected by wire bonding.

• Moreover the device has a completely new design: the electrical connections in the MEMS structure

are perfomed by TSV which allows a better utilisation of the space and a larger gyroscope and

accelerometer area. The MEMS die is manufactured by bulk micromachining on three wafers

bonded together by eutectic and direct bonding.

• Thus, nevertheless the presence of TSV, Fairchild designs a bigger component, whithout improving

the technology node neither the performances.

• The FIS1100 is targeted for wearable sensors for sports, fitness, and health; pedestrian navigation;

autonomous robots; and virtual and augmented reality.

• The report includes a detailed technology and cost comparison with ST’s previous generation

LSM6DS0 and with leading edge 6-Axis IMUs from Bosch Sensortec (BMI160) and InvenSense (MPU-

6500).


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The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price


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• Package: LGA 16-pin

• Dimensions: 3.3 x 3.3 x 1.0mm

• Pin Pitch: 0.5mm

Orientation of Axes (from datasheet)

Package top view Package bottom view

Package Side View

3.3mm

1.0mm

3.3mm

• Marking includes Fairchild logo and:

KF501

FIS1100

•

Assembly plant code: Korea

Year & week code: 2015 week 11-12

Pin 1 Identifier


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• The die marking includes the logo of Fairchild and:

FIS001B

2014

ASIC Die Marking


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• The die marking includes the logo of Fairchild and:

NP1

X0Y1

MEMS Die Marking


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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated).

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

Fairchild FIS1100 6-Axis MEMS IMU 2015 teardown reverse costing report published by Yole...

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