EV Group

EVG - Corporate Profile

SEMI MEMS Tech Seminar

September 26th, 2013

Roland Staudinger

EV Group Confidential and Proprietary

EV Group (EVG) is a global supplier of

Wafer Bonders

Temporary Bonders / Debonders

Aligners

Coaters / Developers

Cleaners

Inspection Systems

EV Group (EVG) is a global supplier to

MEMS (MicroElectroMechanical Systems)

Compound Semiconductor and Silicon based Power Devices

Advanced Packaging, 3D Interconnect

SOI (Silicon-On-Insulator)

Nanotechnology

EV Group holds the dominant share of the market for

wafer bonding equipment and is a leader in lithography

for advanced packaging and nanotechnology.

EV Group at a glance

Privately owned founded in 1980 ~700 employees

Headquartered in Austria Subsidiaries in US, Japan, Taiwan, Korea

Market and Technology Leader for Wafer Bonding (over 800 chambers)

World Leader in Mask Alignment and Resist Coating Systems

300mm ready on all equipment platforms, 450mm capability given

Internal sophisticated process development and pilot line facilities

Global Customer and Sales Support infrastructure

EV Group – In a nutshell

presented at Photonics Festival Taiwan 2012 - EVG confidential and proprietary

EV Group Confidential and Proprietary

Most complete equipment portfolio for semiconductor and

MEMS processes on a wafer level up to 300mm!

EV Group and MEMS

Process Portfolio for MEMS

Source: EVG

EV Group Confidential and Proprietary

EV Group and MEMS

Wafer bonding

Wafer bonder Bond aligner LT plasma activation

R&D and HVM Manual and fully integrated Up to 300mm

Bond alignment

(BS, F2F) & LTDA

Wafer

bonding

EVG600, SmartView®, EVG810

EVG500 Series

GEMINI®

EV Group Confidential and Proprietary

EV Group and MEMS

Wafer bonding

Wafer Bonding Applications

SOI wafers

Cavity SOI

Wafer level capping

Wafer level packaging

MEMS and CMOS

Integration

Courtesy of Okmetic

Courtesy of Okmetic

Courtesy of Chipworks and Yole’

Courtesy of RPI

EV Group Confidential and Proprietary

EV Group and MEMS

Lithography

Spin and spray coater Double side mask aligner Developer

R&D and HVM Manual and fully integrated Up to 300mm

Spin and Spray Coating /

Developing

Double-side Mask

Alignment

EVG100 Series

EVG6000 Series and IQ

HERCULES®

NanoSpray®

EV Group Confidential and Proprietary

EVG‘s Coating Technology

NanoFillTM Technology

High aspect ratios (up to 10:1)

Suitable for all common polymeric

materials

NanoSprayTM Technology

OmniSpray® coating of high

topographic structures

Patterns on wafers

Mechanical components

Coating of fragiles substrates

6

0°

EV Group Confidential and Proprietary

EV Group and MEMS

Thin wafer processing

Temporary Bonding/Debonding

on/from Rigid Carrier Non-Carrier

Thin Wafer Processing

EV Group Confidential and Proprietary

EV Group and MEMS

Thin wafer processing

Temporary bonder Debonder Dry film lamination

R&D and HVM Manual and fully integrated Up to 300mm

EVG850TB(L), EVG850DB

Supporting different

intermediate layers

HT thermal release

UV release

Solvent release

Vacuum release

EV Group Confidential and Proprietary

EV Group and MEMS

Process development

comprehensive process knowledge throughout complete portfolio

Tool and process demonstrations

Process development

Sample processing

small volume production support

IP management/ process technology licenses

Application Laboratories located in:

Austria (pieces to 300 mm)

USA (pieces to 300 mm)

Japan (pieces to 200/ 300 mm)

Our philosophy Our mission

Sta

tus: 2

3.0

8.2

01

3