A “BTeV” Hybrid Pixel Telescope for MTest

David Christian

May 4, 2007

Outline

• Review of hybrid pixel detectors, status of “BTeV” R&D.

• Conceptual design of pixel telescope.

• MTest assets.

• First crack at task list; items for further discussion.

What is a Hybrid Pixel Detector?

A Pixel

50 µm

200 µm

250 µm 400

µm

A Hybrid - a 2-D array of Pixels

“8-chip” Hybrid

Sensor

The Sensor

+-+-+

-+

-+

-+

-+

-+

-+

-+

-+-+ -+Holes

Electrons

P P P P P P P P P P P P P P P P

N-type bulk

N+ N+ N+ N+

P-spray isolation

SiO2 passivation

Contact metallization

V

+

Flash Latch to BinaryEncoder

Thermometer

Thresholds (Vth1-Vth7)

Sensor

Command Interpreter

00 - 01 - 10 - 11 -

idleresetoutputlisten

HFastORRFastOR Throttle4 pairs of

Command Lines

Kill

ADC

RowAddress

Read ClockRead Reset

Token InToken Reset

Token Out

Threshold (Vth0)Vref

Resets

BusController-

+

Vdda

Test

Inject

Vfb2

Vfb

Iff

Ibp1 Ibb Ibp2

Preamp 2nd stage+disc

ADC Kill/inject

ADCencoder

Digital interface

The readout IC

FPIX2 developed for BTeV

DebuggingOutputs

128x22Pixel array

End-of-ColumnLogic

Data OutputInterface

CommandInterface

Registersand DAC’s

LVDS Driversand I/O pads

Pixel array+ End-of-ColumnLogic + = “Core”

Internal bondpads for Chip ID

Chiphit available for use in trigger

Hybrid Pixel R&D After BTeV

• As of two years ago:– FNAL-designed readout chip had two minor fatal

flaws.– No system demonstration had yet been done.

• An “extended closeout” R&D program was approved– 1 more chip submission.– R&D refocused on ILC.– Two system tests approved:

• Telescope for the forward direction of PHENIX (at RHIC)• Test beam telescope

Sensor & FPIX2.1 wafers

Sensor wafers produced for PHENIX by CiS (LANL has agreed to donate

the x4 sensors for use in MTest)

FPIX2.1 fabricated on wafer with “TripT” for D0; fatal flaws fixed; 11 wafers

purchased by LANL for PHENIX, 11 by FNAL to support R&D - 2 required for

MTest telescope.

Sensors & ROCs probed – yield is high

260945-12 sensor 06 11_06 UNM

0

500

1000

1500

2000

2500

3000

0 50 100 150 200 250 300 350 400

V (volts)

I (n

A)

Series1

Typical FPIX2.1 wafer map

Typical sensor IV curve

Hybridization – solder bump bonding done by VTT (Finland)

X-ray made at FCC

VTT bump-deposition process flow

15 Pre-production PHENIX (x8) hybrids delivered 12 April 2007

First 10 x4 hybrids being assembled at VTT this week.

Half-plane = three 1x4 modulesread out by 1 FPGA

(collaboration with Columbia U.)

Station = two half-planesoffset by active area of sensor

2 stations upstream of DUT & 2-4 downstream

(precision x & precision y)

New test beam telescope

4x HDI

PCB

Interposer

SensorReadout chips

Glue HDI

TPG

Concept for pixel plane

MT6-A1

MT6-A1 Assets

• Climate controlled hut.• Aluminum table on rails allows entire setup to be

removed from beam.• Dark box with feed throughs for signals, power, &

cooling fluid.• Remotely controlled motors determine (x,y) position

of both ends of box.• Local chiller provides closed loop cooling system• CAEN power system can provide LV & sensor bias

(“HV”).• Plenty of quiet power is available.

Climate Controlled Hut

Table on rails

Feed Through Boards

Moveable Pixel Box

Remotely Controlled

x-y Positioners

Chiller

Old picture of pixel box interior

MT6-A1 task list

• Status of CAEN & motor control system?

• Modify box mechanicals– Support 6x4 stations– Stations positioned to minimize MS error at

DUT– Flexible DUT station (CMS upgrade didn’t

really work out)

Pixel telescope task list

• x4 HDI• x4 plane/station design (mechanical and

electrical)• DAQ• Integration of telescope data with:

– DUT in pixel box– data from other MTest detectors (if

necessary)