Webinar Wire Bonding 2016

Würth Elektronik Circuit Board Technology

www.we-online.de/wirebondingSeite 104.05.2016

Your Speaker

Dipl.-Ing. (FH), MBA Philipp Conrad

At Würth Elektronik CBT since 2008

Product Manager Wire Bonding

Cooperation with B&F Bonding since 2010

www.we-online.de/wirebondingSeite 204.05.2016

Agenda

Wirebonding

Quality Control

Applications

www.we-online.de/wirebondingSeite 304.05.2016

WirebondingProcess

Bare Die Pickup

Bare Die Placement

Wirebonding (25µm Diameter)

www.we-online.de/wirebondingPage 404.05.2016

WirebondingDesign Rules

Cu

Ni

Pd

0,04 – 0,08 µm

0,1– 0,2 µm

4 – 7 µm

Au

ENEPIG

Cu

Ni

Au 0,05 – 0,1 µm

4 – 7 µm

ENIG

www.we-online.de/wirebondingPage 504.05.2016

Gold Wire Bonding

Source: B&F Bonding

www.we-online.de/wirebondingSeite 604.05.2016

Substrate

Protection of Die and Wire Bonds

Substrate

Globtop

Lensholder

www.we-online.de/wirebondingSeite 704.05.2016

WirebondingAdvantages of „wirebonded“ components?

Miniaturization

Performance/Function

Reliability

• Thermal Management• Short signal paths (HF)

• Wirebond Tester• Over 25 years Experience• WE know HOW

• Package replacement• Space savings • High Precision Positioning

www.we-online.de/wirebondingPage 804.05.2016

Agenda

Wirebonding

Quality Control

Applications

www.we-online.de/wirebondingSeite 904.05.2016

Quality ControlWirebond Tester

Advantages XYZTec Wirebond-Tester (since 02/2016)

Automated Process

Standardized Test Process

Continuous Surface Quality Control

Online Test

www.we-online.de/wirebondingPage 1004.05.2016

Agenda

Wirebonding

Quality Control

Applications

www.we-online.de/wirebondingSeite 1104.05.2016

ApplicationsInternal Study: “WE LED”

Replacement for E1O Socket

PCB: Double Sided FR4, 2,4mm Core, Edge Plating

Bare die is glued to the edge of the PCB, wire bonded and encapsulated

04.05.2016 www.we-online.de/wirebondingSeite 12

SMD LED or Bare die LED?

Source: OSRAM

Decision made on thermal considerations:

Use of bare dies(Thermal resistance casing eliminated)

SMD LEDs

Advantages:

� Good availability� Large range of various types and

manufacturers available � Tried and tested standard assembly process

But:

Thermal resistanceJunction layer� Solder pad 6,5 - 11 K/W (Datasheet OSRAM Golden DRAGON Plus)

ApplicationsLED High Power Module

04.05.2016 www.we-online.de/wirebondingSeite 13

� PCB production� Thermal management� Sourcing bare die LED diodes in small

quantities� Placement and wire bonding of the diodes� Encapsulation and protection of the diodes� System solution

04.05.2016 www.we-online.de/wirebondingSeite 14

ApplicationsLED High Power Module

How will the assembly and connection technologybe realised

� Double sided PCB or multilayer with individual bare die assembled and wire bonded

� Individual heatsinks glued

� Miniaturisation through reduction of the overall height

� Optimized thermal management

� Adjustment of the projection angle

Heatsink

Bare Die

ApplicationsLED High Power Module

04.05.2016 www.we-online.de/wirebondingSeite 15

Referencen

Testboard

www.we-online.de/wirebondingSeite 1604.05.2016

www.we-online.com/thermal_management04/05/2016

� 4-Layer Flex with bare die directly wire

bonded on a copper

Heatsink 0.8 mm with ENIG-surface

� 2 Chips in Cavity

� AlSi-wire bonding

Source: UNI Heidelberg/CERN

Seite 17

Applications

Summary

High accuracy placement compared to SMD solder process

High accuracy placement of the bare die in following sectors:

• Optoelectronics (3D Camera Systems)

• Sensor Applications

• Medical Applications

Flexible design

Advantages of Wire Bonding

• Miniaturisation

• Very good electrical connection

• Good mechanical and thermal stabilty

www.we-online.de/wirebondingSeite 1804.05.2016

Now it’s your turn!

www.we-online.de/wirebondingSeite 1904.05.2016

Philipp Conrad Dipl.-Ing.(FH), MBA

Productmanager Wirebonding

Würth Elektronik GmbH & Co. KGCircuit Board Technology

Standort Schopfheim

An der Wiese 179650 Schopfheim

Germany