MULTI CHIP MODULE

Contents:IntroductionOverviewTypes of MCM’sApplicationsAdvantagesDisadvantagesConclusion

Introduction:A Multi-Chip Module

is a specialized electronic package where multiple IC’s, semiconductor dies or other modules are packaged in such a way as to facilitate their use as a single IC.

The MCM itself will often be referred to as a "chip" in designs, thus illustrating its integrated nature.

Block Diagram:

Micro controller:Specifications:

a) PIC16F877b)ISM Band Data Transceiverc) Low Power Consumptiond)Sensor Data Collection

Transceiver:Specifications:

a) Multiple I/O interfaceb) Configurable to application requirements, host/master/slavec) Transparent drop-in intelligent RF solutiond) operating frequencies

Transceiver Board

Types of MCM’s:MCM consists of 3 different types.

They are:

MCM-L MCM-CMCM-D

MCM-L: Organic

substrates-based MCM-LBased on laminated PCB technologies that have evolved to accomplish the denser integration requirements of today's demands.

MCM-C:o Ceramic substrate-

based MCM-C

o Substrates based on co-fired ceramic or glass-ceramic technologies.

MCM-D:Silicon substrate-

based MCM-D

MCM-D are formed by Deposited dielectrics and conductors on a base substrate typically made with silicon.

Applications:

Alarm and Security Systems

Automatic Meter Reading (AMR)

Home Automation

Remote Control, Surveillance, Automotive, Telemetry, Industrial Control,

Wireless Communications, Remote Data Logging

Advantages:Size and Weight

Data Speed and Signal Integrity

Reliability/Harsh Environments…

Low Power Consumption

Technology Integration

Cost

Disadvantages:

Electrical drawbacks Thermal drawbacks

Conclusion: Complete redesign in Si

a) Not cost effective at low scale production

b) Not always feasibleAvoiding the Si design

a) Get rid of the packageb) Use smallest possible componentsc) Use a high density multilayer PCB

Solution: MCM Technology

Thank You!

Queries….?