Multi Chip Module1

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MULTI CHIP MODULE

Transcript of Multi Chip Module1

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MULTI CHIP MODULE

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Contents:IntroductionOverviewTypes of MCM’sApplicationsAdvantagesDisadvantagesConclusion

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Introduction:A Multi-Chip Module

is a specialized electronic package where multiple IC’s, semiconductor dies or other modules are packaged in such a way as to facilitate their use as a single IC.

The MCM itself will often be referred to as a "chip" in designs, thus illustrating its integrated nature.

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Block Diagram:

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Micro controller:Specifications:

a) PIC16F877b)ISM Band Data Transceiverc) Low Power Consumptiond)Sensor Data Collection

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Transceiver:Specifications:

a) Multiple I/O interfaceb) Configurable to application requirements, host/master/slavec) Transparent drop-in intelligent RF solutiond) operating frequencies

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Transceiver Board

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Types of MCM’s:MCM consists of 3 different types.

They are:

MCM-L MCM-CMCM-D

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MCM-L: Organic

substrates-based MCM-LBased on laminated PCB technologies that have evolved to accomplish the denser integration requirements of today's demands.

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MCM-C:o Ceramic substrate-

based MCM-C

o Substrates based on co-fired ceramic or glass-ceramic technologies.

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MCM-D:Silicon substrate-

based MCM-D

MCM-D are formed by Deposited dielectrics and conductors on a base substrate typically made with silicon.

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Applications:

Alarm and Security Systems

Automatic Meter Reading (AMR)

Home Automation

Remote Control, Surveillance, Automotive, Telemetry, Industrial Control,

Wireless Communications, Remote Data Logging

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Advantages:Size and Weight

Data Speed and Signal Integrity

Reliability/Harsh Environments…

Low Power Consumption

Technology Integration

Cost

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Disadvantages:

Electrical drawbacks Thermal drawbacks

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Conclusion: Complete redesign in Si

a) Not cost effective at low scale production

b) Not always feasibleAvoiding the Si design

a) Get rid of the packageb) Use smallest possible componentsc) Use a high density multilayer PCB

Solution: MCM Technology

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Thank You!

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Queries….?