4 - 5 JULY, 2017TAY ENG SOON CONVENTION CENTREITE COLLEGE CENTRAL SINGAPOREwww.microelectronics.sg
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Organised by
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(SINGAPORE)www.microelectronics.sg
2017 Sponsors & Exhibitors
Morning RefreshmentsSponsor
Event Bag Sponsor
Documentation Sponsor
Events Badge Sponsor
Exhibitors
Bronze Sponsors
Afternoon RefreshmentsSponsor
Advertisers
Media Partners
Platinum Sponsors
Supporting Partner
BreakfastSponsor
Silver Sponsor
Networking LuncheonSponsor
LanyardSponsor
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www.microelectronics.sg(SINGAPORE)
Photovoltaics/Solar Micro-electromechanical systems (MEMS) LEDs/Solid State Lighting Printed/Flexible Electronics Device Fabrication/Waferrocessing Equipment and Materials Deposition (CVD, PVD, ALD) Etch Ion implant Lithography Masks/reticles and mask-making equipment Chemical mechanical planarization (CMP) equipment and materials Silicon and non-silicon based wafers and substrates Process chemicals and gases Chemical handling systems Vacuum systems, components, and parts Robotic systems and components Valves, actuators, gear systems, and other components
Factory automation systems, software, and components Assembly and packaging equipment and materials Wire bonding Bump/flip chip/wafer-level packaging Automated semiconductor test equipment (ATE) Test handlers Probe cards and test materials
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Conference AngendaConference Day 1: 4th July 2017 (Tuesday)
AM8:00 - 8:45
Registration & Exhibition Viewing
9:00 Organiser’s Opening Remarks
9:05 Keynote Address:The Expanding Role of FO-WLP: Market and Technology Trends
Speaker: E. Jan Vardaman, President and Founder, TechSearch International, Inc.
9:35 The Future of Advanced Packaging Market & Technology
Speaker: Lee Chee Ping, Regional Technologist and Technical Marketing Manager, LAM Research
10:05 Process Challenges and Case Study In SiP and Fan-Out Wafer Level Packaging
Speaker: Jason Chou, Asia Technical Manager, Indium
10:35 Networking Morning Refreshments & Exhibition Viewing
11:05 Technology Masterclass: Fan-Out Wafer Level Packaging (WLP) From an Expert Practitioner
Speaker: Isaac Ow, Director, Head of Key Product Unit, Metal Deposition Product Business Unit, Applied Materials Inc
11:35 Fan Out – From Simple to Complex
Speaker: John Hunt, Senior Director, Engineering, Technical Promotion, ASE (US) Inc
PM12:05
Networking Luncheon & Exhibition Viewing
1:15 Foundries & OSATs Roundtable: How Are Current Players Reacting to Fan-Out Manufacturing?
Panelists: Dr SW Yoon, Director, Products & Technology Marketing, Stats Chippac
2:00 Expandable Structure – Introduction
Speaker: Peter Lemmens, General Manager, imec Taiwan
2:30 Innovations in Flip Clip Technologies
Speaker: Dr Lee Teck Kheng, Director, Technology Development, Technology Development Centre, Director, Technical Transfer Office, ITE Headquarters
3:00 Networking Afternoon Refreshments & Exhibition Viewing
3:30 How can Semiconductors Power the Next Wave of Growth in IoT
Speaker: Chong Chan Pin, Senior Vice President, AP – Hybrid, Electronics Assembly, Wedge Bonders, Capillaries and Blades Business Lines, Kulicke & Soffa
4:00 Improving Wafer Dicing Throughput in Advanced MEMS Applications
Speaker: Chew Soon Chiah, Senior Business Development Manager, AMEC
4:30 PVD for Advanced Packaging
Speaker: Sanjay Vishwanath, Asia Service Manager, SPTS Technologies Ltd
5:00 The Dynamic Interaction Between WLCSP and SMD Packaging on IoT
Speaker: STM (Speaker to be confirmed)
5:30 End of Event Day 1
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Conference AngendaConference Day 2: 5th July 2017 (Wednesday)
AM8:00 - 8:45
Registration & Exhibition Viewing
9:00 The Role of Smart Equipment in Future Electronics Manufacturing
9:30 Process Re-engineering: Overview of Process Equipment and How the Supply Chain Can Help Reduce Equip-ment Costs
10:00 Adapting Established FOUP Architecture to New Manufacturing Trends
Speaker: Lee Lan Wurn, Senior Technology Manager, AdvancedMaterials Handling Division, Entegris
10:30 Networking Morning Refreshments & Exhibition Viewing
11:00 Advanced Predictive Maintenance in IoT Era
Speaker: Lionel Hum, Program Lead, OMRON Electronics
11:30 Discussion Roundtable: The Technology Transfer Landscape in the Semiconductor Industry - Technology differentiation & current research - Trends in Semicon IP and strategic alliances in the semicon industry - Licensing issues
PM12:45
Networking Luncheon & Exhibition Viewing
2:00 RFIC Testing from R&D to Production: Characterizing Multiband ET/DPD Modern Front End Modules
Speaker: Wei Ren Neo, Semiconductor Business Development Manager, National Instruments
2:30 Digital Transformation in Manufacturing – The German Perspective
Speaker: Ricco Walter, Managing Director, Systema Automation Solutions Malaysia Sdn. Bhd
3:00 Networking Afternoon Refreshments & Exhibition Viewing
3:30 Big Data Transforming Manufacturing from Automation to Intelligent
Speaker: Hung Cheong Sin (H C Sin), IT Deputy Director. UMC
4:00 Energy Solutions & the Impact on Internet of Things
Speaker: VS Hariharan, Co-Founder & CEO, Third Wave Power Pte Ltd
4:30 Security Analysis of Connected Objects using Machine Learning techniques
Speaker: Matthieu LEC’HVIEN, R&D Leader, Secure-IC, Singapore
5:00 End of Event
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