WaferTech LLC (see TSMC

INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-1

Rest of World Company Profiles Acer Laboratories

ACER LABORATORIES

Acer Laboratories, Inc.11F, 45 Tung Hsing Road,Taipei 110, Taiwan, ROC

Phone: (886) (2) 2762-8800Fax: (886) (2) 2762-6138

IC Manufacturer

Financial History ($M)

1 9 9 6 1 9 9 7

Sales 100 110 (est.)

Employees — 200

Company Overview and Strategy Acer Laboratories was founded in 1987 as an independent research and development center for the Acer Group.In 1993, the company separated from Acer Inc. and became a member company of the Acer Group.

The company’s primary activity is the design and manufacturing of integrated circuits for the personal computerand embedded systems markets. Present products include core logic chipsets, multimedia chips and peripheralchips.

The headquarters are in Taipei. The manufacturing and test activities are in the Hsinchu Science Park.

5-2

INTEGRATED CIRCUIT ENGINEERING CORPORATION

Alphatec Rest of World Company Profiles

ALPHATEC

Alphatec Electronics Public Co., Ltd.17/2 Moo 18, Suwintawong Road

Saladang, Amphur Bang-Num-PriowCha-Cherng-Sao, 24000 Thailand

Telephone: (66-38) 593-223Fax: (66-38) 593-229

IC Manufacturer

Regional Headquarters/Representative Locations

North America: Alphatec Electronics Corporation • San Jose, CaliforniaTelephone: (408) 998-4620 • Fax: (408) 998-4711

Alphatec has undergone extensive changes in the past year. In prior years they had IC Manufacturing capabilitybut now they are only an Assembly house. Profile kept in for historical value.

Company Overview and Strategy

Alphatec Electronics Corporation is currently made up of three independently financed and operated Assemblyand Test operations which are linked through agreement for management: Alphatec Electronics Public Co. Ltd.(ATEC), NS Electronics Bangkok (NSEB) and Alphatec Electronics Corporation of Shanghai (ATES).Headquarters are located in Bangkok, Thailand; Sales and Management offices are also located in San Jose,California.

Combined, these plants produce a full range of PDIP, SOIC, PLCC, MQFP, TQFP, TSOP, SSOP, TSSOP, Q &VSOP packages plus many hermetic packages. Total output exceeds 100 million units per month. Hermeticvolume is approximately 1 million units per week. Approximately 80 percent of assembled product goes throughfinal test at the assembly site.

All facilities are ISO certified; ATEC and NSEB are also SAC certified. They have World Class performancesindices.

Combined, the plants total approximately 575K square feet and employ about 5,000 people.


Rest of World Company Profiles Alphatec

Management

Bob Mollerstuen Acting Chief Executive OfficerWillem de Vries President, ManufacturingK.Y. Wong Vice President, Worldwide SalesH.K. Foo General Manager, Alphatec Electronics Corporation of ShanghaiThavisakdi Thangsuphanich Chief Executive Officer, NS Electronics BangkokUdom Udompanyavit President, NS Electronics BangkokJohn Griffin President, Alphatec Electronics Corporation (U.S.)Thom Dietmeier Director, North American Sales and Marketing

5-4


Amkor / Anam Rest of World Company Profiles

AMKOR / ANAM SEMICONDUCTOR

Amkor / Anam SemiconductorA division of Amkor Electronics, Inc.

222 Dodang-dong, Wonmi-guBuchon, Kyunggi-do, 420-130

South KoreaTelephone: (82) 32 680 4700

Fax: (82) 32 683 8104Web Site: www.amkor.com

IC FoundryFounded: 1968

Regional Offices/Representative Locations

U.S.: U.S. SalesSanta Clara, CA 95054Telephone: 408-496-0303 • Fax: 408-496-0148

Customer EngineeringBoise, ID 83712Telephone: 208-345-9300 • Fax: 208-345-8199

Europe: Euroservices SARL (AAES)01210 Ferney-Voltaire, FranceTelephone: 33-2-50-40-9797 • Fax: 33-4-50-40-9888


1 9 9 6 1 9 9 7 *

Corporate Sales 1,171 — Net Income 34.2 —

Employees 8,180 —

*Company did not disclose.

Ownership: Privately held (35 percent - owned by the Kim family, the founders of the Anam Group).

http://www.amkor.com


Rest of World Company Profiles Amkor / Anam


Amkor is well known as one of the largest subcontractors for semiconductor packaging, assembly and test. Withthe opening of their new wafer fabrication facility, Amkor is now offering fully integrated IC manufacturing, includingmasks, wafer processing packaging, assembly and test. The company intends to provide overall solutions throughwhat they call Silicon-Package Architecture (SPA). SPA is an “architectural level concept” used to design apackage in concert with device and system design requirements, so as to optimize product and processcapabilities. Reported FY 1996 corporate sales were $1,171 (M) and net income $34.2 (M), and the 1997 saleswere unavailable due to possible initial public offering of the company.

The fab will provide dedicated and independent contract manufacturing services for CMPS logic semiconductors.It will use 0.25 and 0.35µm, five metal layer processes. Amkor’s strategy is to provide better total systemengineering solutions that combine silicon, package and test through vertical integration. Vertically integratedsemiconductor manufacturing service can provide significant advantages in operations, logistics, quality, reliability,and offer a better engineering system solution.

Management

James J. Kim Chairman and Chief Executive OfficerJohn N. Boruch PresidentFrank J. Marcucci Chief Financial OfficerMichael D. O’Brien Vice PresidentEric R. Larson Vice President

Products and Processes

Anam has replicated a CMOS process from Texas Instruments’ DMOS-5 fabrication facility in Dallas, Texas; it’s TI’sproven robust and most advanced 25C10 process family, used for advanced digital circuits. Briefly described, the25C10 process uses an epitaxial silicon starting wafer, 0.25µm polysilicon critical dimensions (0.20µm effectivegate length), shallow trench isolation, retrograde twin-well fabrication with MeV ion implantation, five metalinterconnect levels with 0.898µm minimum metal pitch, chemical mechanical polishing planarization, andtungsten-plug vias and contacts. The process provides leading edge gate delay performance and circuit densitiesthat are on the mainstream of industry trends. Options are available for 3.3 and 2.5 volt power supplies. Amkor’sprocess roadmap includes upgrades to even tighter design rules for 0.18µm and below.

Semiconductor Fabrication Facilities

In December of 1997, Amkor / Anam celebrated the opening of their deep submicron wafer foundry in Buchon,South Korea. The fab has both 0.25µm and 0.35µm capability. The five-metal-layer processes that will be used,were obtained from a long-term cooperative agreement between Texas Instruments, Dallas, TX, and Anam.

5-6


Amkor / Anam Rest of World Company Profiles

Amkor / Anam222 Dodang-dong, Wonmi-guBuchon, Kyunggi-do, 420-130South KoreaCleanroom size: 67,000 sq. ft.Capacity (wafers/week): 25,000Wafer sizes: 125mm, 150mmProcess: CMOSProducts: MCUs, EEPROMs, EPROMs, ASSPsFeature sizes: 0.25µm-0.35µm

Amkor / Anam maintains assembly and test facilities in the Philippines, and Korea.

Key Agreements

• The five-metal-layer processes that Amkor/Anam will be using were obtained from a long-term cooperativeagreement between Texas Instruments, Dallas, Texas and Anam. As part of the agreement, TI has contractedto purchase a significant portion of the fab’s wafer capacity.

• Anam has a joint venture with Photronics Korea from which it can obtain critical photomask technology tosupport its wafer fabrication operations.


Rest of World Company Profiles Angstrem

ANGSTREM

Angstrem103460 Zelenograd

RussiaTelephone: (7) (095) 531-1470/2515

Fax: (7) (095) 531-2756/0306

IC Manufacturer


Russia: Angtrade Joint Stock Company • Moscow, RussiaTelephone: (7) (095) 531-5530 • Fax: (7) (095) 531-2756

Employees: 2,000

Ownership: Privately held as of 1993.


Angstrem was created in June 1963, as the leading microelectronics enterprise of the Soviet Union andintegrated a research institute and an experimental plant. It was primarily targeted to develop and master ICtechnologies and devices for their subsequent transfer to mass production to more than 30 factories in the formerUSSR.

Angstrem has 56 patents; six licenses sold to foreign firms.

Before 1990, Angstrem served primarily the domestic and East Europe markets.

In the early 90’s Angstrem started development and mass production of IC chips for consumer electronics in theframework of a conversion project.

Management

Valery L. Dzhkhunyan, Ph.D. General DirectorAnatoly J. Sukhoparov, Ph.D. First Deputy General DirectorVladimir S. Travnitsky Deputy General Director, External Relations

5-8


Angstrem Rest of World Company Profiles


Current Development Trends

• Consumer Electronics (calculators, electronic games, watches, etc.);• Special-Purpose Electronic Products;• Industrial Electronics;• Telecommunication Systems;• SmartCards;• Display Units; and• Power Consumption Monitoring.

Angstrem has several experimental and pilot facilities, a Foundry, several Design centers, including external ones,a Technological center, and a Foreign trade firm.


Angstrem Angstrem103460 Zelenograd 103460 ZelenogradRussia RussiaFab 0 Fab 1Cleanroom size: 21,500 square feet (Class 10) Cleanroom size: 25,000 square feet (Class 10)Capacity (wafers/week): 7,500 Capacity (wafers/week): 1,250 (future: 3,000)Wafer size: 100mm Wafer size: 150mmProcesses: CMOS, BiCMOS (1 and 2 metals) Processes: CMOS, BiCMOS (1 and 2 metals)Products: Consumer electronics ICs, logic ICs Products: Consumer electronics ICs, logic ICsFeature sizes: 1.5-2.0µm Feature sizes: 1.0-1.2µm

Angstrem103460 ZelenogradRussiaFab 2New facility, anti vibration platform, cleanrooms of Class 10Capacity (wafers/week); 5,000Wafer size: 6 inch (150mm) and 8 inch (200mm)Processes: CMOS, BiCMOS (2-4 metals)Feature sizes: 0.35-0.5µm(Scheduled for launch in 1999).

Angstrem’s Foundry makes customized CMOS devices with design rules 2.0 and 1.2 microns. Typical lead time is45 to 60 days.


Rest of World Company Profiles Asicom Technologies

ASICOM TECHNOLOGIES, LTD.

Asicom Technologies, Ltd.MATAM, Building 6/2

P.O.B. MATAM Haifa 31905Israel

Telephone: (972) (4) 831-3322Fax: (972) (4) 831-3551

Web Site: www.asicom-tech.comEmail: [email protected]

Fabless IC Supplier


ASICOM Technologies Ltd. operates as a design and service operation and provides the following services.

• System definition• IC design and technology selection• Foundry Selection and interface• Testing


The company works with the following technologies.

Voltages: 100V, 20V, 5V, 3V, 1.2V

Processes: CMOS, BiCMOS, EEPROM

Geometries: 1.5, 1.2, 0.8, and 0.5 micron.

http://www.asicom-tech.com

5-10


ASMC Rest of World Company Profiles

ADVANCED SEMICONDUCTOR MANUFACTURING (ASMC)

Advanced Semiconductor Manufacturing Corp. of Shanghai385 Hong Cao Road

Shanghai 200233, ChinaTelephone: (86) (21) 64851900

Fax: (86) (21) 64851056Web Site: www.asmcs.com

IC Manufacturer


Advanced Semiconductor Manufacturing Corp. of Shanghai (ASMC) was established in 1995 when Nortel (thenNorthern Telecom) of Canada made an agreement with Philips Electronics of the Netherlands and the Chinesegovernment to jointly own and operate Philips’ semiconductor fabrication facility in Shanghai. Formerly known asPhilips Semiconductor Corp. of Shanghai, the operation was initially intended to manufacture ICs primarily forPhilips’ own television sets.

As ASMC, the operation now functions as an independent foundry, owned 38 percent by Philips, 34 percent byNortel, and 28 percent by Chinese banks. It is a QS-9000 certified wafer foundry providing subcontractmanufacturing to international companies. Currently, ASMC’s customers include several IC manufacturers in theU.S. and Europe. It is looking to add additional customers, including both IC suppliers for subcontractmanufacturing or foundry services. Meanwhile, services for local design houses are also being developed.

Management

John Montesi PresidentJon Macro Chief Technical Officer


As a wafer foundry, ASMC targets the niche technology market. Its current process capabilities include 3.0µmbipolar with voltages up to 60 volts, 3.0µm SACMOS (self-aligned contact CMOS) with an EEPROM option, 1.0µmCMOS double-level metal and double-level polysilicon, and 8.0µm powerMOS. Some of these processes arelicensed from the company’s technical partners for use in producing wafers for design houses.

Wafer testing is an optional service. ASMC can also arrange for local assembly and final testing of devices.

http://www.asmcs.com


Rest of World Company Profiles ASMC


ASMC ASMCCao He Jing Hi-Tech Park Cao He Jing Hi-Tech ParkShanghai, China Shanghai, ChinaFab 1 Fab 2Cleanroom size: 16,150 square feet, Class 10 Cleanroom size: 16,150 square feet, Class 1Capacity (wafers/week): 5,250 Capacity (wafers/week): 3,750 (1,750 currently)Wafer size: 125mm Wafer size: 150mmProcesses: CMOS, bipolar, powerMOS Process: CMOS (bipolar in 1998)Products: Linear ICs, discretes Products: FoundryFeature sizes: 3.0µm-8.0µm Feature sizes: 0.8µm-1.0µm

Key Agreements

• Both Philips Semiconductors and Nortel have technology transfer cooperation agreements with ASMC.

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Bharat Electronics Rest of World Company Profiles

BHARAT ELECTRONICS LTD. (BEL)

Bharat Electronics Ltd.Integrated Circuits Division

Bangalore ComplexJalahalli, Bangalore 560 013

IndiaTelephone: (91) (80) 8382626Fax: (91) (80) 3832927/2322Web Site: www.bel-india.co.

IC ManufacturerFounded: 1954 / 1970

Employees (Integrated Circuits Division): 210


North America: Bharat Electronics Ltd. • Garden City, New YorkTelephone: (516) 248-4020 • Fax: (516) 741-5894


Bharat Electronics Ltd. (BEL) manufactures a broad spectrum of products ranging from semiconductors to largeradar systems. Target markets include defense communication, radars, optical and opto-electronics,telecommunications, sound and vision broadcasting, and electronic components. In addition to manufacturing,BEL offers a variety of services including telecom consultancy, contract manufacturing, calibration of test andmeasuring instruments.

BEL was established in 1954 to meet the defense needs of the Government of India. Since then, BEL has grownto a multi-product technology driven company. BEL's Integrated Circuits Division was started in 1970, in technicalcollaboration with M/S RCA of the U.S. to manufacture linear bipolar and digital CMOS ICs. Today, the divisionmanufactures a wide range of linear bipolar circuits and digital CMOS circuits for the telecommunications,consumer electronics, computer, and professional markets.

To support its commitment to new product development, BEL established its Central Research Labs (CRL) wheredevelopment is focused on futuristic technologies in the areas of signal processing, computing, communicationssystems, materials and devices, microelectronics, and manufacturing.

http://www.bel-india.co.


Rest of World Company Profiles Bharat Electronics

Management

Y. GopalaRao General Manager, SemiconductorsV. Muthuswamy Additional General Manager, ICsH.V. Ananda, Ph.D. Deputy General Manager, Design Centre and Mask FabD.A. Mohan Deputy General Manager, Marketing


Linear Integrated Circuits: Digital Integrated Circuits:Operational amplifiers Standard TTL circuitsVoltage comparators and regulators Low-power Schottky TTLsTelecom circuits CMOS CD4000 seriesSpecial function circuits CMOS 74HC seriesRadio/Audio circuitsTelevision circuitsAutomotive electronic circuits

Besides the manufacture and sale of ICs, Bharat Electronics also undertakes contract jobs for external customersin the areas of design, mask manufacture, test, and assembly.


Bharat Electronics Ltd.Bangalore ComplexJalahalli, Bangalore 560 013IndiaWafer size: 100mmProcesses: Bipolar, CMOSProducts: Linear and digital ICsFeature size: 5.0µm

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Chartered Semiconductor Rest of World Company Profiles

CHARTERED SEMICONDUCTOR MANUFACTURING (CSM)

Chartered Semiconductor Manufacturing Ltd. (CSM)60 Woodlands Industrial Park, Street 2

Singapore 738406Telephone: (65) 362-2838

Fax: (65) 362-2938Web Site: www.csminc.com

IC ManufacturerFounded: 1987

Regional/Representative Locations

North American: Chartered Semiconductor Manufacturing, Inc. • Milpitas, CaliforniaTelephone: (408) 941-1108 • Fax: (408) 941-1297

Europe: Chartered Semiconductor Manufacturing • Germering, GermanyTelephone: (49) (89) 84108-599 • Fax: (49) (89) 84108-601


1 9 9 2 1 9 9 3 1 9 9 4 1 9 9 5 1 9 9 6 1 9 9 7

Sales 50 100 160 285 360 472Capital Expenditures — — 100 550 700 921

Employees 450 600 600 1,800 2,000 2,800


Chartered Semiconductor Manufacturing Ltd. (CSM) is a dedicated foundry, providing advanced technology wafermanufacturing services for the global semiconductor industry. It was the first high technology semiconductorcompany in Singapore to create, produce, and market leading edge ICs. Today, Chartered manufactures ICs forsuch diverse applications as graphics, communications, computing, and networking, as well as backbonetechnologies like memories.

Chartered’s services include chip design assistance, mask making, wafer fabrication, wafer sort, assembly, andtest. Customers can choose from a comprehensive portfolio of design services and products, including standardcell and gate array libraries, I/Os, memory compilers, datapaths, and intellectual property cells. The company alsooffers customers a turnkey solution that includes some or all of Chartered’s services.

http://www.csminc.com


Rest of World Company Profiles Chartered Semiconductor

Chartered was established in 1987 as a captive foundry. In 1991, the company became a pure, independentfoundry. Chartered is part of Singapore Technologies Semiconductors (STS), a group of companies that providea full range of services for the semiconductor industry. STS is a strategic business unit of SingaporeTechnologies, a holding company that comprises more than 100 companies whose total revenues exceed $3.2B.

Management

Tan Bock Seng President and Chief Executive OfficerChia Song Hwee Chief Financial OfficerChoong Chan Yong Senior Vice President, Asia/Europe Sales and MarketingTom Gurnee President, Chartered Semiconductor Manufacturing, Inc., North AmericaRick Hodgman General Manager, Chartered Silicon Partners Pte. Ltd.John Martin, Ph.D. Vice President, Research and DevelopmentSubash Gupta, Ph.D. Fellow and Vice President, Advanced Technology


Chartered offers a full complement of leading-edge CMOS processes ranging from 0.8µm to 0.35µm line widths,with a 0.25µm process in development. Technologies offered include digital, analog, mixed-signal, EEPROM(0.8µm and 0.6µm in development), ROM (0.6µm, 0.45µm, 0.40µm, and 0.35µm in development), SRAM (0.5µm,0.45µm, 0.40µm, 0.35µm, and 0.30µm in development), and flash memory ROM (0.7µm, 0.5µm, and 0.35µm indevelopment). The company’s technology in embedded logic/memory is as follows: DRAM (both 0.35µm and0.25µm in development), SRAM (0.35µm in development), EEPROM (0.8µm, and 0.6µm in development) andFlash (both 0.5µm and 0.35µm in development). Also in Chartered’s process technology portfolio is BiCMOS in0.8µm and in development is 0.6µm. Options include multiple voltages/poly/metal. For designs requiring highperformance and low contact resistance, customers can also select a salicide option, which Chartered has used involume production since the 0.8µm process generation. There are also 0.6 or smaller micron processes generallyavailable in polycide and salicide.


In April 1997, Chartered announced the development of a new joint venture foundry company with partner,Hewlett-Packard, and the Economic Development Board of Singapore. The new venture, called Chartered SiliconPartners, will be located adjacent to Chartered’s existing facilities in the Woodlands Industrial Park in Singapore. InJuly 1997, groundbreaking began on the construction of a 200mm wafer manufacturing with productionbeginning in mid-1999. HP will receive a specified amount of wafers (0.35µm and 0.25µm ASICs) from theventure in exchange for its investment, while the remaining capacity will be offered as part of Chartered’s usualfoundry services.

Similarly, in 1997, a joint venture company with Lucent Technologies Microelectronics Pte. Ltd. was formed. Thenew fab will also be located next to Chartered’s existing facilities in the Woodlands Industrial Park. The foundryfacility is expected to begin operations in 1999 to produce ASICs and other products, yet to be announced.

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Chartered Semiconductor Manufacturing Ltd. Chartered Semiconductor Manufacturing Ltd.No. 2 Science Park Drive 60 Woodlands Industrial Park DSingapore Science Park Street 2Singapore 0511 Singapore 738406Fab I Fab IICleanroom: 35,000 square feet (Class 10) Cleanroom size: 70,000 square feet (Class 1 SMIF)Capacity (wafers/week): 6,100 Capacity (wafers/week): 10,500Wafer size: 150mm Wafer size: 200mmProcess: CMOS Process: CMOSProducts: Foundry services Products: Foundry servicesFeature sizes: 0.8µm-0.6µm Feature sizes: 0.6µm-0.35µm (0.20µm capability)

Chartered Semiconductor Manufacturing Ltd. Silicon Manufacturing Partners, Pte., Ltd.Woodlands Industrial Park D (A joint 60 venture with Lucent TechnologiesStreet 2 Microelectronics Pte. Ltd.).Singapore 738406 60 Woodlands Industrial Park DFab III Street 2Cleanroom size: 46,000 square feet (Class 1 SMIF) Singapore 738406Capacity (wafers/week): 4,700 Cleanroom size: 46,000 square feet (Class 1 SMIF)Wafer size: 200mm Capacity (wafers/week): 6,100Process: CMOS Wafer size: 200mmProducts: Foundry services Processes: CMOS digital, analog, SRAM, BiCMOSFeature sizes: 0.35µm-0.25µm (0.18µm capability) Products: Foundry services

Feature sizes: 0.35µm-0.18µmChartered Silicon Partners, Pte. Ltd. (Operational beginning Q4 1999).(A joint venture with Hewlett-Packard Companyand Singapore Economic Development Board).60 Woodlands Industrial Park DStreet 2Singapore 738406Cleanroom: Class I, SMIFCapacity (wafers/week): 8,100Processes: ASIC; others TBAGroundbreaking: July 1997(Operational beginning 1999).

Key Agreements

• In February 1998, Chartered Semiconductor Manufacturing and Fairchild Semiconductor formed a foundryrelationship for EEPROM supply. Under the terms of the agreement, Chartered will manufacture EEPROMproducts based on Fairchild’s advanced EEPROM process. Fairchild has transferred its EEPROM technologyto Chartered, and Chartered returned test runs of silicon with high yields. The Chartered-produced EEPROMwafers will augment existing production from Fairchild’s Salt Lake City, UT fabrication facility.


Rest of World Company Profiles Chartered Semiconductor

• In September 1997, Chartered Semiconductor Manufacturing and Avant! Corporation formed a joint marketingagreement to calibrate the Avant! suite of full chip validation tools for Chartered silicon technologies. Thisagreement makes Chartered the first silicon foundry to formally partner with Avant!’s Silicon BlueprintProgram . Avant! Tools provide a validation suite for deep-submicron (DSM) designs that Chartered andAvant! customers will use for full chip verification before IC commitment to silicon.

• In January 1998, Lucent Microelectronics Group and Chartered announced the formation of a $1B-plus jointventure in Singapore to manufacture integrated circuits. The new venture, called Silicon ManufacturingPartners Pte., Ltd., will eventually employ 800 people and will manufacture a variety of integrated circuits usingprocess technology by Lucent’s Bell Laboratories, as well as technologies developed by Chartered. Thecompany will produce 8 inch wafers using 0.25 micron processing technology, and at full capacity will produce26,000, 8 inch wafers per month. The venture expects to migrate to 0.18 micron technology by the year 2000.

• In July 1997 Chartered Semiconductor Manufacturing and Mentor Graphics Corporation’s Inventra BusinessUnit announced a joint marketing and technology agreement. This collaboration will enable integrated circuitdesign teams to utilize silicon-proven libraries with selected intellectual property in designs and have chipsfabricated using Chartered’s leading edge manufacturing processes. Inventra™ will develop and supplystandard cell, memory and datapath libraries for Chartered’s 0.35 micron fabrication process. The twocompanies will jointly develop test chips based on a subset of Inventra’s CoreAlliance pre-designed circuits,for design verification in silicon. This agreement will help Chartered’s objective to shorten the time betweenproduct design and market entry for customers.

• In June 1997, Chartered and Toshiba Corporation forged a five year technology and manufacturing partnershipon embedded DRAMs. Under the agreement, Chartered will manufacture embedded DRAM products forToshiba and other customers through gaining Toshiba’s license on its embedded DRAM technology (0.35µmto 0.25µm). This relationship will expand Chartered’s offerings to their diverse customer base.

• In April 1997, Chartered announced a joint venture company, Chartered Silicon Partners, with Hewlett-PackardCompany and Singapore Economic Development Broad Investments. This joint venture company willcomplement Chartered’s foundry business and provide semiconductor wafer manufacturing services toHewlett-Packard and other foundry customers. Chartered Silicon Partners will produce ASICs utilizing bothHewlett-Packard’s and Chartered Semiconductor Manufacturing’s deep-submicron process technologies.

• Simtek entered into a manufacturing and development agreement with Chartered SemiconductorManufacturing (CSM) in 1992 for 64K through 1M nvSRAMs. CSM will provide Simtek with wafers at leastthrough 3Q89.

• In 1996, Chartered established a technical and marketing agreement with Excellent Design Inc. Under theagreement, Chartered will supply Excellent with design rules, Spice models, and process data that Excellentwill use to create the methodology and tools to produce libraries optimized for Chartered’s deep-submicronprocesses. The agreement will last three years and will cover all the technologies Chartered intends to developduring that period. Previously, Chartered also signed a similar agreement with Aspec Technology.

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• Since 1995, Chartered established technical and marketing agreements with a number of electronic designautomation/assistance (EDA/A) companies and intellectual property (IP) providers. Under these agreements,Chartered supplies design rules, Spice models, process data and test chips that verify libraries, tools and IPcores are compatible with Chartered fabrication processes. Alliances include Artisan Components; AspecTechnology; Avant! Corporation, Cadence, Cascade, Leda, Compass-Galax!, Leda Systems; Mentor Graphics;SiArc-Synopsys; Simplex Solutions; TriTech Microelectronics, Inc.; Virage; and Quadic.

• Since early 1994, Chartered has made several strategic agreements with semiconductor companies — with orwithout their own fabrication facilities — that have involved investments in Chartered in exchange forguaranteed wafer output. Those companies include Actel, Alliance Semiconductor, Analog Devices,Brooktree (a division of Rockwell), LSI Logic, Rockwell Semiconductor Systems (Newport Beach, CA), andStandard Microsystems. In addition, Chartered has process technology alliances with VLSI Technology andToshiba.


Rest of the World Company Profiles Continental Device India Limited

CONTINENTAL DEVICE INDIA LIMITED (CDIL)

Continental Device India LimitedC-120, Naraina Industrial Area

New Delhi – 110 028India

Telephone: (91-11) 579-6150Fax: (91-11) 579-9569

Web Site: www.cdil.com



India: Continental Device India Ltd. • Bangalore, IndiaTelephone: (080) 2255968

Continental Device India Ltd. • Mumbai, IndiaTelephone: (022) 8717262


Continental Device India Limited (CDIL) initiated in 1964 the manufacturing of silicon semiconductor devices inIndia. With 1997 total sales of $14.5 million, CDIL manufactures discrete semiconductor components.

Management

Dr. Gurpreet Singh Chairman and Managing DirectorMr. Inderdeep Singh Executive DirectorMr. Pankaj Gulati Vice PresidentMr. Pradeep Maitra Vice President, EngineeringMr. G.V. Subramaniam Vice President, QADr. Navin Kapur General Manager, Technical

Product and Processes

CDIL supplies a wide range of discrete semiconductors. The company fabricates silicon wafers for both transistorsand diodes (zener and switching). Transistors range from small signal bipolar, Darlington power, to high powergeneral purpose (up to 150W) transistors. The products also include single and dual Schottky Barrier Rectifiers,and surface mounted semiconductors.

Continental Device India Limited also offers subcontract assembly services.

http://www.cdil.com

5-20


Continental Device India Limited Rest of the World Company Profiles


Continental Device India Ltd.C-120 Naraina Industrial AreaNew Delhi – 110 028, IndiaTelephone: (91-11) 5796150

Continental Device India Ltd.132, Industrial AreaChandigarh – 160 002Telephone: 32021, 32022 Fax: 01744757

Continental Device India Ltd.14/5, Marthura Road, FaridabadTelephone: 8275708, 8275709

Continental Device India Ltd.Rangreth, Srinagar (J&K)Telephone: 31082


Rest of World Company Profiles Faraday Technology

FARADAY TECHNOLOGY

Faraday Technology Corporation7F, 9, Prosperity First Road

Science-Based Industrial ParkHsinchu, Taiwan, R.O.C.

Telephone: (886) (3) 578-7888Fax: (886) (3) 578-7889

Fabless IC Supplier

Employees: 100


North America: Faraday Technology Corp. • Santa Clara, CaliforniaTelephone: (408) 235-8888 • Fax: (408) 235-8889


Faraday Technology Corporation is Taiwan’s leading full-service ASIC design company, offering highperformance, high density and low power deep sub-micron gate array and standard cell products. Clienteleincludes several international companies involved in the areas of computers, communications and consumerproducts. Established in June 1993, the company has 100 employees at present. Revenue by November, 1997was U.S. $18M.

Supported by its unique, integral design flow, Faraday has claimed more than 500 successful cases of highperformance, top quality design projects since 1993. Products include 0.6µm Gate Array, 0.5µm/0.35µmStandard Cell, and 0.25µm Standard Cell, which the company expects to put on the market in January, 1998. Inaddition, Faraday offers complete Memory Building Blocks, Datapath Building Blocks, Megacells, and AnalogCells.

Management

M.K. Tsai ChairmanH.P. Lin President


Faraday's ASIC products include high-performance, high-density 0.6µm three-layer-metal CMOS gate arrays,0.5µm three-layer-metal CMOS standard cells, and 0.35µm three- and four-layer-metal CMOS standard cells.

5-22


Faraday Technology Rest of World Company Profiles

Gate Arrays

0.6µm series— Single poly and double- or triple-metal CMOS process— 3,000 to 104,100 usable gates— 68 to 296 I/Os— Provide variety RAM/ROM memory compilers— 3V, 5V, and mixed-voltage applications supported— Propagation delay: 90ps

0.45µm series (2Q98)— Single poly two- or three-layer-metal CMOS— 10,000 to 150,000 usable gates— Up to 352 I/Os— Provide variety RAM/ROM compilers— 3V, 5V, and mixed-voltage applications supported— Propagation delay: 65ps

Standard Cells

0.5µm series— Single poly and two- or three-layer-metal CMOS process— Up to 470 core cell 300 I/O— Provide variety RAM/ROM memory compilers— 3V, 5V and mixed-voltage application supported— Propagation delay: 73ps— Power consumption: 2.22µw/Gate/MHz

0.35 series— Single poly and three- and four-layer-metal CMOS process— Up to 500 core cells and I/O cells

Analog Cell

PLL, AGP, 8-bit AD, 10-bit AD, USB Buffer, IEEE1394 Buffer, PECL.

Magacell

8031, 8032, 8051, 8052, 8032 turbo, USB, XA51, UART, PCI, FR3000 (32-bit RISC CPU), EPP/ECP, IEEE1394.


Faraday's ASICs are manufactured by UMC, USI, UICC, and USC in Taiwan using Faraday's CMOS processtechnologies. In order to offer Faraday’s customers with the flexibility of multiple fab solutions, Faraday is presentlycooperating with several new fab companies to acquire versatile services.


Rest of World Company Profiles Galileo Technology

GALILE O TECHNOLOGY LTD.

Galileo Technology Ltd. Moshav Manof D.N. Misgav

20184 Israel Telephone: (972) (4) 999-9555

Fax: (972) (9) 999-9574 Web Site: ww w.galileot.com

Fabless IC Manufacturer

Founded: 1993 Financial History ($M) 1 9 9 6 1 9 9 7

Sales 6 37 Net Income (1) 10 R&D Expenditures 3 6 Employees — 100 Ownership: Publicly held. NASDAQ: GALTF. Company Overview and Strategy Galileo Technology Ltd. is a fabless semiconductor company that designs and markets advanced digitalsemiconductor devices that perform critical functions for network and communications systems. The Company isfocused on mid-to-high-end embedded control applications, as represented by systems that typically sell for morethan $500 and predominantly use high-performance RISC microprocessors. The largest segments of this marketare data communications and imaging areas. Galileo was founded in Karmiel, Israel in January 1993, with the charter of providing advanced semiconductordevices to the embedded control market. In March 1994, Galileo opened its marketing and businessdevelopment group, Galileo Technology Inc., in San Jose, California. Galileo also has business offices in SanJose, Boston, London, and Israel. The Israeli operation is responsible for the architecture and design of all chip and board-level products offered byGalileo as well as product engineering, test engineering, and quality control. The responsibility of the U.S.organization include sales, marketing, technical support, operational logistics and customer service for allcustomers worldwide. The U.S. and Israeli operations work closely with customers to define new products andprovide technical support.

http://www.galileot.com

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Galileo Rest of World Company Profiles

Galileo obtained seed capital from various private placements with individuals in 1993. In August of 1994, Galileoconcluded its first venture capital round of $1.5M with the Nitzanim Venture Fund, which was founded by Kyocera,Oxford Partners, AVX, and leading officers within these organizations. In November 1995, Galileo concluded itssecond venture capital round of $3M, with Weiss, Peck & Greer acting as the lead investor and with participationfrom the Nitzanim Venture Fund, and the Tikvah Fund started by Mr. Sanford Bernstein. Galileo went public on NASDAQ in July 1997, raising over $50M USD. Management Avigdor Willenz Chief Executive Officer and Founder Manuel Alba President Eyal Waldman Vice President, Engineering Eliaz Lavi Vice President, Operations, Quality and Reliability David Shemla Vice President, Communications Mitchell Kahn Vice President, Marketing John C. Mein Vice President, Sales Products and Processes Galileo products are divided into three areas: high-performance core logic, data communications controllers andWAN interface devices, all of which are key building blocks of embedded systems. These product areas aredetailed below: High Performance Core Logic Products

PCI and Core Logic Products include Advanced PCI System Controllers for MIPS, PCI Interface and SystemControllers for IDT, and PCI Integrators (i.e., high-integration PCI bridge/memory controllers). Galileo’s highlyintegrated system controller chips complement the leading embedded RISC microprocessors to form CPUsubsystems. This product line is targeted at performance-sensitive applications, including bridges, routers,switches, cellular base stations, laser printers, digital video distribution equipment, etc. Some of the mostdemanding applications are found in the area of data communications, for which Galileo’s products are well-suited. Data Communications Controllers

Galileo data communications controllers include Galileo’s family of GALNET and FALAZ\XY Ethernet switches.These devices provide unparalleled levels of value and performance to OEM Ethernet Switches ranging in scopefrom workgroups to enterprise backbones. Galileo is the inventor of the single-chip Ethernet switch, and is theacknowledged leader in the field. WAN Interface Devices

Galileo’s remote access controllers provide the high-performance necessary to build WAN access devices such asUSDN/xDSL routers and frame relay access devices. Galileo also provides evaluation platforms for nearly all of their products. These systems can help the customerjump-start software development or help them to evaluate silicon during the design phase.


Rest of World Company Profiles Galileo

Semiconductor Fabrication Facilities Galileo contracts the manufacturing of its semiconductor products to leading providers of standard cell ASICtechnology. Current fabrication facilities include TSMC in Taiwan, Samsung in Korea and Matra MHS in France.

5-26


Holtek Microelectronics Rest of World Company Profiles

HOLTEK MICROELECTRONICS

Holtek Microelectronics Inc.No. 5 Creation Road II

Science-Based Industrial ParkHsinchu, Taiwan

Telephone: (886) (3) 5784888Fax: (886) (3) 5770879

Web Site: www.holtek.com

IC Manufacturer


North America: Holmate Technology Corporation • San Jose, CaliforniaTelephone: (408) 573-8050 • Fax: (408) 573-8055


1 9 9 2 1 9 9 3 1 9 9 4 1 9 9 5 1 9 9 6 1 9 9 7

Sales 45 58 70 90 105 135Capital Expenditures — 8 10 25 30 50

Employees 560 620 760 960 1,160 1,500


Holtek Microelectronics Inc. was established in 1983 as an ASIC design house, but in 1989 added a 125mm waferfab. Today, Holtek is a manufacturer of not only ASICs, but also consumer electronics ICs, PC peripheral andcommunication ICs. The company was the first in Taiwan to design and manufacture 4- and 8-bit microcontrollers.

During 1996, Holtek initiated a major company reorganization, focusing its efforts on three main business units:Sales and Product Development, Fab I operations, and Fab II operations. Holtek also renewed its commitment tomaintain a diversified product line by focusing future product development on PC peripherals, microcontrollers,one-time programmable (OTP) 8-bit MCUs, non-volatile memory products, and high-level telecom products suchas network ICs and digital signal processors.

In addition to a variety of planned new product developments, Holtek’s commitment to the future can also bedemonstrated by its major investment in a new 0.25µm 200mm wafer manufacturing facility.

http://www.holtek.com


Rest of World Company Profiles Holtek Microelectronics

Management

Keith Wu Chairman and President


The following provides a sampling of various Holtek products.

ASIC Microcontroller

• Gate Arrays • 4-bit MCUs• Standard Cells • 8-bit MCUs• Full Custom ICs

Memory PC Peripheral

• Mask ROMs • I/O Series• SRAMs • Keyboard Series• EEPROMs • Mouse Series• EPROMs • Misc. Series• OTP ROMs

Consumer Telecom

• Speech Synthesizer Series • All-in-one Dialers• Voice Processor Series • Dialer IDD Lock Dialers• Melody Series • French Dialers• Tone Series • ABR Dialers• Remote Series • Talking Dialers• LCD Driver Series • Pager ICs• Power Manager Series • Digital Answering Machine ICs• Home Appliance Series


Holtek Microelectronics Inc. Holtek Microelectronics Inc.No. 5 Creation Road II No. 5 Creation Road IIScience-Based Industrial Park Science-Based Industrial ParkHsinchu, Taiwan Hsinchu, TaiwanFab I Fab IICleanroom size: 1,400 square feet (Class 10) Cleanroom size: 9,000 square feet (Class 1)Capacity (wafers/week): 7,500 Capacity (wafers/week): 1,500 (8,750 by 2001)Wafer size: 125mm Wafer size: 200mmProcess: CMOS Process: CMOSProducts: MCUs, ASICs, ASSPs, memories Products: MCUs, ASICs, ASSPs, foundry, memoryFeature sizes: 0.6µm-1.2µm Feature sizes: 0.18µm-0.5µm

(Operational by January 1998).

5-28


Huajing Electronics Rest of World Company Profiles

HUAJING ELECTRONICS

China Huajing Electronics Group Corporation14 Liangxi Road

Wuxi, Jiangsu, ChinaTelephone: (86) (510) 6707123

Fax: (86) (510) 6701391

IC Manufacturer


Founded in 1960, China Huajing Electronics has grown into the largest solely state-owned microelectronicsmanufacturer in China. It is one of the five largest and most advanced semiconductor plants in China. Huajingmanufactures a wide range of MOS, bipolar, and BiCMOS integrated circuits and discrete semiconductor productsfor applications such as communications, computer systems, instrumentation and metering, automobileelectronics, power supply, machinery, and consumer electronics.

Approximately 60 percent of Huajing’s MOS IC output is exported, while only about 5 percent of its traditionalbipolar and discrete devices are exported.

Management

Guang Ping Su PresidentJiang Fu Lai Vice PresidentGuo Yong Fu Vice President


Huajing’s semiconductor products include analog ICs, ASICs, microprocessors and controllers, memory ICs,BiCMOS ICs, full-custom ICs, thick-film hybrids, and discretes.

For MOS production, Huajing uses 100mm and 125mm wafers with 3.0µm to 2.0µm technology, and for bipolar, ituses 100mm wafers with 5.0µm to 3.0µm technology and 125mm wafers with 3.0µm to 2.0µm technology. Thecompany also is pushing its CMOS lines for foundry production. Huajing is said to be manufacturingmicrocontrollers for Seiko Epson and logic ICs for Fujitsu.


Huajing is expected to complete construction of a new 150mm wafer fab during 1997. The facility will produceMOS ICs with 0.8µm to 1.0µm feature size technology obtained from Lucent Technologies. When complete, thefab will have the capacity to produce about 2,500 wafers per week.

At press time, unable to confirm if the wafer fab construction was completed.


Rest of World Company Profiles Huajing Electronics

China Huajing Electronics Group14 Liangxi RoadWuxi, Jiangsu, ChinaCapacity (wafers/week): 8,750Wafer sizes: 100mm, 125mm (upgrading to 150mm)Processes: MOS, bipolar, BiCMOS, CMOSProducts: Linear ICs, ASICs, MPUs, MCUs, memory ICs, BiCMOS ICs, discretes, hybridsFeature sizes: 1.25µm-5.0µm (upgrading to submicron)

Key Agreements

• In September 1996, Huajing purchased Promis Systems’ Manufacturing Execution System (MES) software(PROMIS®). The investment is estimated at half a million dollars. The new system will provide Huajing withflexibility and performance for quick turnaround in the electronics industry.

• In early 1995, Huajing licensed some of Toshiba’s older 1M DRAM technology, making it the first of China’sstate-run companies to field DRAMs.

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Hualon Microelectronics Rest of World Company Profiles

HUALON MICROELECTRONICS (HMC)

Hualon Microelectronics CorporationScience-Based Industrial Park

Number 1, R&D 4th RoadHsinchu, Taiwan

Telephone: (886) (3) 5774945Fax: (886) (3) 5774305

Web Site: hmc.com.tw/index_e.htm

IC Manufacturer


North America: Hualon Microelectronics Corporation • San Francisco, CaliforniaTelephone: (415) 288-0390 • Fax: (415) 288-0399


1 9 9 2 1 9 9 3 1 9 9 4 1 9 9 5 1 9 9 6 1 9 9 7

Semiconductor Sales 101 112 128 150 175 189 IC Sales 91 97 108 125 150 162 Discrete Sales 10 15 20 25 25 27Capital Expenditures — 5 80 60 50 54

Employees 850 850 1,100 1,150 1,170 1,263


Hualon Microelectronics Corporation (HMC) is part of the Hualon Group, a conglomerate with over $2.5 billion inannual sales. The Hualon Group first invested in the semiconductor industry in 1984, by establishing Chino-ExcelTechnology (CET), an IC assembly house. Then in 1987, HMC's fab was constructed.

HMC is a broad-based manufacturer of integrated circuits and discrete devices. The company is divided intoseven major business units: memory, foundry, microcomponent, ASIC, CCD, consumer, andtelecommunications.

Management

D.M. Oung President and Chief Executive OfficerC.F. Hsu Research and Development ManagerH.S. Huang Plant ManagerGene Tsai Vice Plant ManagerChiu-Chung Jung Director, Sales and Marketing

http://www.hmc.com.tw/index_e.htm


Rest of World Company Profiles Hualon Microelectronics


Memory ICs ASICs

ROMs up to 16M in density, EPROMs up to 256K, Gate arrays and standard cellsEEPROMs up to 1M, SRAMs up to 1M

Microcomponent ICs CCDs

4-bit and 8-bit MCUs, 4-bit, 8-bit, and 16-bit Image sensors, bar code chipsets,DSPs, GUI and SVGA circuits, mass storage fax scanner ICscontrollers, network ICs, and PC chipsets

Consumer ICs Telecom ICs

Speech synthesizer and recognition, Dialers and controllers, receivers,watch, and calculator circuits cordless phone controllers

Foundry Service

0.5µm to 3.0µm silicon gate

HMC's current facilities operate with CMOS, BiCMOS, and NMOS processes down to 0.5µm.


Hualon Microelectronics CorporationScience-Based Industrial ParkNumber 1, R&D 4th RoadHsinchu, TaiwanFab I and IICleanroom size: 21,000 square feetCapacity (wafers/week): 34,000Wafer size: 125mmProcesses: CMOS, NMOS, BiCMOSProducts: Memory ICs, telecom ICs, consumer ICs,

ASICs, discretes, foundry servicesFeature sizes: 0.5µm, 0.6µm CMOS, BiCMOS; 0.8µm CMOS;

1.0µm CMOS, BiCMOS; 1.2µm NMOS

In 1994, Hualon announced plans to build a new $400 million 200mm wafer fab that would be operational by theend of 1996. In early 1996, however, plans for the new facility were put on hold indefinitely.

Key Agreements

• HMC holds a 10 percent stake in Seeq Technology and is providing foundry services for the supplier. The twocompanies also agreed to jointly develop and market network ICs.

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Hyundai Rest of World Company Profiles

HYUNDAI

Hyundai Electronics Industries Co., Ltd. (HEI)Semiconductor Division

12th Floor, Hyundai Building140-2, Kye-dong, Chongro-gu

Seoul, Korea 110-793Telephone: (82) (2) 746-4288

Fax: (82) (2) 746-4277Web Site: www.hei.co.kr/www.hea.com



North America: Hyundai Electronics America (HEA), Semiconductor Division • San Jose, CaliforniaTelephone: (408) 232-8000 • Fax: (408) 232-8125 • Web Site: www.hea.com


1 9 9 2 1 9 9 3 1 9 9 4 1 9 9 5 1 9 9 6 1 9 9 7

CorporateSales (HEI) 1,150 1,575 2,600 5,036 3,751 5,031

SemiconductorSales 455 1,020 1,750 3,953 2,450 3,348Capital Expenditures 225 400 600 2,100 2,500 3,000

Ownership: Publicly held, Korea: 7825.


Hyundai Electronics Industries Co., Ltd. (HEI) was founded in 1983 as a part of the Hyundai Business Group, a$70 billion Korean conglomerate involved in over 40 business areas ranging from steel fabrication,petrochemicals, engineering and construction to electronics, automobiles, and finance.

HEI is made up of the following business divisions: Semiconductors, Semiconductor Assembly and Testing,Information Systems, Telecommunications, and Industrial Electronics. The Semiconductor Division is furtherdivided into the Memory IC and System IC subdivisions. Its semiconductor assembly business was launched in1985. HEI had developed its own 4M DRAM by 1989, 16M part by 1991, and its own 64M part by 1992.

http://www.hei.co.kr/www.hea.com


Rest of World Company Profiles Hyundai

Today, Hyundai is among the world's leading memory IC producers, with a memory portfolio that includes DRAMsup to 64M in density, SRAMs up to 4M in density, mask ROMs up to 16M in density, VRAMs, and flash devices.The company is moving to become less dependent on the memory IC business by aggressively expanding itscapabilities in logic ICs. A major part of this effort was the acquisition in early 1995 of the NCR MicroelectronicProducts Division of AT&T for $340 million. Renamed Symbios Logic Inc., the business operates as anindependent, autonomous subsidiary of Hyundai Electronics America (HEA) offering products such as businterface chips, ASICs, and Ethernet controller ICs.

In mid-1996, Hyundai Electronics America spun-off its Digital Media Division into a separate entity, called OdeumMicrosystems Inc. The new company focuses on the development of silicon and software solutions for homeentertainment systems.

Management

Hyundai Electronics IndustriesYoung Hwan Kim President and Chief Executive OfficerK. H. Oh Executive Vice President, Semiconductor DivisionD.S. Kim Executive Vice President, Assembly and TestI.B. Jeon Senior Vice President, Semiconductor Sales and MarketingS.I. Kim Vice President, Semiconductor ManufacturingS. C. Kim Senior Vice President, Semiconductor Research and DevelopmentH. J. Shim Vice President, System IC, Research and Development Laboratory

Hyundai Electronics AmericaC.S. Park President and Chief Executive OfficerSteve Grossman Senior Vice President, Marketing, Flash Memory DivisionMark Ellsberry Vice President, Memory MarketingAlex Chenok Vice President, Assembly and TestJames Hartman Chief Executive Officer, Hyundai Semiconductor AmericaAnil Sawe Chief Executive Officer, Odeum Microsystems Inc.Charles F. Christ President and Chief Executive Officer, Symbios Logic Inc.


Hyundai manufactures and markets primarily DRAMs and SRAMs, but also offers other memory ICs (SIMM orDIMM), microperipheral ICs, logic ICs, ASSPs, and ASIC devices. In October of 1997, Hyundai announced that ithad succeeded in developing the world’s first 1-gigabit Synchronous DRAM using 0.17 micron SOI technology.Currently, the whole range of Hyundai’s ICs are fabricated solely using CMOS process technology.

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MOS MEMORY ANALOG✔ DRAM Amplifier✔ SRAM Interface✔ Flash Memory Consumer/Automotive✔ EPROM Voltage Regulator/Reference✔ ROM Data Conversion✔ EEPROM Comparator

Other (Including Non-Volatile RAM) Other (Includes Telecom)

MOS LOGIC DIGITAL BIPOLAR

General Purpose Logic Bipolar Memory✔ Gate Array General Purpose Logic✔ Standard Cell Gate Array/Standard Cell✔ Field Programmable Logic Field Programmable Logic✔ Other Special Purpose Logic Other Special Purpose Logic

MPU/MCU/MPR

MOS MICROCOMPONENT

MPU OTHER✔ MCU ✔ Full Custom IC✔ MPR Discrete

DSP Optoelectronic

Memory ICs

• 256K, 1M, 4M, 16M, and 64M DRAMs (low voltage and wide versions are available).• 16M, 64M and 128M synchronous DRAMs (SDRAMs).• 8M and 16M SGRAM• 64K, 256K, 1M, and 4M SRAMs (high-speed 256K and 1M versions are available for Cache applications).• 1M, 4M, and 16M mask ROMs.• 256K and 1M EPROMs.• Serial EEPROMs.• 4M and 16M flash memories for PCs and peripherals, telecom switches, cellular phones, internetworking,

instrumentation and automotive devices.

ASICs

• Gate arrays based on a sea-of-gates architecture and 1.2µm and 0.8µm CMOS double-level-metaltechnologies or 0.8µm triple-level-metal technology. Usable gate counts vary from 800 to 200,000 gates.

• Standard cells based on 0.8µm CMOS double-level-metal technology.• A limited line of PLDs based on technology from ICT Inc. are available.• BiCMOS ASICs and mixed-signal capabilities are being developed.

ASSPs

• SmartCard and Terminal ICs based on 0.35µm and 0.25µm technologies.• 16-bit DSP Cores.• MPEG-II, QPSK, Line Drivers.



Other ICs

• TFT LCD ICs• Image Sensors for digital imaging and multimedia.• PC chipsets.• PCMCIA peripheral function ICs.• RAMDACs.• ICs for digital audio and cordless phone applications.


In March 1997, Hyundai broke ground on its second overseas wafer fab, to be located in Scotland. The facility willmanufacture DRAMs on 200mm wafers using a 0.3µm process technology. Initial production of 64M DRAMs isexpected to begin in December 1998, moving later to 256M DRAMs. Full capacity of the fab will be 30,000 wafersper month. Construction on the facility will take place in two phases, together costing an estimated $3.0 billion.The plant is expected to employ 1,000 workers.

Production at Hyundai’s first overseas fab — a $1.3 billion 200mm, sub-micron CMOS production facility located inEugene, Oregon — was expected in 2H97, but has been held up due to environmental permit issues.

Hyundai Electronics Industries Co. Hyundai Electronics Industries Co.San 136-1, Ami-Ri, Bubal-Eub San 136-1, Ami-Ri, Bubal-EubIchon-kun, Kyungki-Do Ichon-kun, Kyungki-DoKorea 467-860 Korea 467-860Telephone: (82) (2) 741-0661 Telephone: (82) (2) 741-0661Fab 1 Fab 4Capacity (wafers/week): 6,250 Capacity (wafers/week): 2,500Wafer size: 125mm Wafer size: 200mmProcess: CMOS Process: CMOSProducts: SRAMs, EPROMs, EEPROMs, Products: DRAMs

ASICs, Logic ICs. Feature size: 0.5µmFeature sizes: 0.8µm, 1.0µm

Hyundai Electronics Industries Co. Hyundai Electronics Industries Co.San 136-1, Ami-Ri, Bubal-Eub San 136-1, Ami-Ri, Bubal-EubIchon-kun, Kyungki-Do Ichon-kun, Kyungki-DoKorea 467-860 Korea 467-860Telephone: (82) (2) 741-0661 Telephone: (82) (2) 741-0661Fab 2 Fab 5Capacity (wafers/week): 6,250 Capacity (wafers/week): 6,250Wafer size: 150mm Wafer size: 200mmProcess: CMOS Process: CMOSProducts: DRAMs, SRAMs Products: DRAMsFeature sizes: 0.45µm, 0.6µm, 0.65µm Feature sizes: 0.35µm

5-36



Hyundai Electronics Industries Co. Hyundai Electronics Industries Co.San 136-1, Ami-Ri, Bubal-Eub San 136-1, Ami-Ri, Bubal-EubIchon-kun, Kyungki-Do Ichon-kun, Kyungki-DoKorea 467-860 Korea 467-860Telephone: (82) (2) 741-0661 Telephone: (82) (2) 741-0661Fab 3 Fab 6Capacity (wafers/week): 6,000 Capacity (wafers/week): 6,250Wafer size: 150mm Wafer size: 200mmProcess: CMOS Process: CMOSProducts: DRAMs Products: DRAMsFeature sizes: 0.5µm Feature sizes: 0.22µm-0.28µm

Hyundai Electronics Industries Co. Hyundai Semiconductor AmericaSan 136-1, Ami-Ri, Bubal-Eub Eugene, OregonIchon-kun, Kyungki-Do Fab E-4Korea 467-860 Capacity (wafers/week): 7,500Telephone: (82) (2) 741-0661 Wafer size: 200mmR&D I Process: CMOSCapacity (wafers/week): 3,200 Products: DRAMsWafer sizes: 150mm, 200mm Feature size: 0.20µmProcess: CMOS (Operations to begin 1H98).Products: R&DFeature sizes: 0.25µm-0.6µm Hyundai Electronics Industries Co.

San 136-1, Ami-Ri, Bubal-EubHyundai Semiconductor Europe Limited Ichon-Kun, Kyungki-DoDunfermline, Scotland Korea 467-860Capacity (wafers/week): 7,500 R&D IIWafer size: 200mm Capacity (wafers/week): 6,000Process: CMOS Wafer Size: 200mmProducts: DRAMs Process: CMOS, DRAMSFeature size: 0.3µm Products: R&D(Operations to begin in late 1998). Feature Size: 0.2µm

Hyundai Electronics Industries Co.San 136-1, Ami-Ri, Bubal-EubIchon-Kun, Kyungki-DoKorea 467-860Fab 7Capacity (wafers/week): 6,250Wafer size: 200mmProcess: CMOSProducts: DRAMSFeature sizes: 0.22µm-0.28µm



Key Agreements

• In February 1998, Adaptec Inc. announced it will buy Symbios Logic Inc. from Hyundai Electronics America for$775M. The sale of Symbios, one of Hyundai’s only remaining profitable businesses, gives the Koreancompany much needed capital.

• Hyundai licensed Rambus’ technology for the development of 16M and 64M Rambus DRAMs (RDRAMs).

• Hyundai signed a licensing agreement with LSI Logic that gave it permission to develop products based on LSILogic's 1.2µm and 2.0µm double-level-metal gate arrays.

• As a major equity holder in ICT Inc., Hyundai offers a limited line of PLDs based on ICT's designs.

• Hyundai and Fujitsu formed a DRAM manufacturing and development alliance in 1993, under which 4M and16M Hyundai-designed DRAMs are produced worldwide by both companies. They also are codeveloping 64MDRAM products.

Noteworthy News

• In March of 1998, the U.S. Department of Commerce assessed 12.64 percent dumping penalties againstHyundai Electronics Industries Co., Ltd. for violations occurring for the 12 month period, ended April 30, 1997.The Commerce Department is expected to complete its investigation and issue a final dumping decision in Julywhich could adjust the penalty duties up or down, or could eliminate them altogether.

5-38


Industrial Technology Research Institute Rest of World Company Profiles

INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Industrial Technology Research Institute195 Chung Hsing Road, Sec. 4

Chu Tung, Taiwan 310, ROCTelephone: (886) (3) 582-0100

Fax: (886) (3) 582-0045Web Site: www.itri.org.tw/english

Research Laboratory


U.S.: Industrial Technology Research Institute • Milpitas, CaliforniaTelephone: (408) 946-3015 • Fax: (408) 946-3019


Industrial Technology, in addition to R&D activities, provides technical consulting and training programs to theindustry. The technical services include testing, processing and consulting.

http://www.itri.org.tw/english


Rest of World Company Profiles LG Semicon

LG SEMICON

LG Semicon Co., Ltd.LG Yeong-Dong Building

891, DaeChi-Dong, KangNam-GuSeoul 135-280, Korea

Telephone: (82) (2) 508-1067Fax: (82) (2) 508-1068

Web Site: www.lgsemicon.co.kr

IC ManufacturerFounded: 1989, S. Korea


North America: LG Semicon America, Inc. • San Jose, CaliforniaTelephone: (408) 432-5000 • Fax: (408) 432-6067


1 9 9 2 1 9 9 3 1 9 9 4 1 9 9 5 1 9 9 6 1 9 9 7

CorporateSales (Goldstar Co.) 4,700 5,400 6,300 10,000 12,500 11,000

SemiconductorSales 690 1,000 1,800 3,600 2,500 2,700Capital Expenditures 320 200 300 2,100 2,300 1,500

Employees 3,600 3,750 3, 900 6,600 8,400 9,445

Ownership: Publicly held.


LG Semicon (formerly Goldstar Electron) was formed in 1989, through the consolidation of the memory chipbusiness of LG Electronics (formerly Goldstar) and the ASIC/Micro businesses of Goldstar Semiconductor. It isnow 62 percent owned by LG Electronics, the flagship company of the $60 billion Korean conglomerate LGGroup. LG Electronics is Korea’s largest maker of electrical appliances and consumer electronics.

LG Semicon is one of the world's leading DRAM suppliers. The company is a world-class producer of ICs forinformation systems, consumer electronics and new media systems. Ongoing R&D activities include highlyintegrated multifunctional and ultra-high speed semiconductors, (i.e., giga-DRAMs, high-value-added ASICs andmicro products).

http://www.lgsemicon.co.kr

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LG Semicon Rest of World Company Profiles

Future product development at LG Semicon will be directed more toward non-memory IC products in an effort todecrease its reliance on the memory market. Approximately 94 percent of total semiconductor sales in 1996 werefrom memory devices, primarily DRAMs. Over the next several years, the company plans to increase its sales ofnon-memory products to 30 percent of total chip sales. As part of this strategy, LG Semicon has adapted its 64MDRAM technology to a 0.35µm standard-cell ASIC process. LG Semicon is now developing the 256M DRAM, anew generation memory chip, and many other advanced customer chips such as ASIC and MICRO.

LG Companies are comprised of multiple organizations that support six different markets — Chemicals andEnergy, Electric and Electronics, Machinery and Metals, Trade and Service, Finance, Public Service/Sports. LGSemicon is one of 12 different companies supporting the Electric and Electronics business sector in Korea.

Management

Bon-Jun Koo Chief Executive OfficerB. D. Sun Vice President, MemoryS. H. Kang Vice President, System ICsD.M. Koo Vice President, SalesJ.H. Bae Director, Marketing, LG Semicon America


LG Semicon offers memory ICs (1M to 64M DRAMs, 64K to 1M SRAMs, 1M to 32M flash memories, and 1M to 32MROMs), application-specific ICs (including gate arrays, standard cells, and full custom devices), bipolar and CMOSgeneral-purpose logic ICs, and other specialized semiconductor devices such as ICs for personal computers(including sound generators and LCD panel controllers) and 8-bit, 16-bit, and 32-bit microcontrollers. In 1996, LGSemicon began production of Mpact™ single-chip media processors, licensed from Chromatic Research Inc.Volume production of the Mpact1 began in 2Q97 at LG Semicon’s Cheongju facility. The company also offers a2Mx9 Rambus DRAM for the multimedia buffer and plans to offer the associated Mpact glue logic integrated intoan ASIC.

MOS MEMORY ANALOG✔ DRAM Amplifier

SRAM Interface✔ Flash Memory Consumer/Automotive

EPROM Voltage Regulator/Reference✔ ROM Data Conversion

EEPROM Comparator

Other (Including Non-Volatile RAM) Other (Includes Telecom)


Rest of World Company Profiles LG Semicon

MOS LOGIC DIGITAL BIPOLAR✔ General Purpose Logic Bipolar Memory✔ Gate Array General Purpose Logic✔ Standard Cell Gate Array/Standard Cell

Field Programmable Logic Field Programmable Logic

Other Special Purpose Logic Other Special Purpose Logic

MPU/MCU/MPR

MOS MICROCOMPONENT✔ MPU OTHER✔ MCU ✔ Full Custom IC✔ MPR Discrete✔ DSP Optoelectronic


In January 1997, LG Semicon began construction on its first fab facility outside of Korea. The facility, to be locatedin Newport, South Wales, will be used for 64M and 256M DRAM production and assembly, starting in 1999.

LG Semicon Co., Ltd. LG Semicon Co., Ltd.Cheongju Facility Gumi FacilityCleanroom size: 345,155 square feet Cleanroom size: 106,749 square feetCapacity (wafers/week): 30,000 Capacity (wafers/week): 10,000Wafer sizes: 150mm, 200mm Wafer sizes: 100mmProcesses: CMOS, MOS Processes: NMOS, CMOS, bipolarProducts: DRAMs, ROMs, ASICs, Products: Logic ICs, ASICs, MPUs, MCUs,

flash memories, MCUs. HDTV ICs, LCD ICsFeature sizes: 0.25µm, 0.35µm, 0.5µm, 1.0µm Feature sizes: 0.35µm – 1.0µm

LG Semicon Co., Ltd.Newport, South WalesCapacity (wafers/week): 7,500Wafer size: 200mmProcess: CMOSProducts: DRAMsFeature sizes: 0.25µm(Expected to begin production in 1999).

In the Fall of 1997, LG Semicon announced that it had independently developed a third-generation digital signalprocessor. This makes LG the first Korean firm to develop this core non-memory technology. LG plans to produce200,000 DSP units per month starting in the first half of next year. The size of the world DSP market is expectedto be worth $8.5B in 1997, with projected growth of 40 percent per year. Given this projection, the market is set tobe worth $290B by the year 2001.

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LG Semicon Rest of World Company Profiles

Key Agreements

• In early 1999, LG Semicon will produce 64M Flash Memory with SIMP cell which is originally patented by LGSemicon.

• In February 1998, LG Semicon and Tannisys Technology signed an agreement to provide quick turn design,manufacturing, testing and distribution of board-level products. Tannisys will provide design services,manufacturing and supply management services.

• In 1996, LG Semicon licensed the Java processor from Sun Microsystems.

• In March 1996, LG Semicon announced an agreement with Crosspoint Solutions involving both licensing andmanufacturing of Crosspoint’s FPGAs.

• In early 1996, LG Semicon entered into a two-year foundry agreement with Chips and Technologies, Inc.Under the agreement, Chips is guaranteed monthly wafer output for the production of its own graphicscontrollers.

• LG Semicon signed an agreement with Siemens to develop 8-bit microcontrollers for use in consumerelectronic products, automobiles, and communications equipment.


Rest of World Company Profiles Libit Signal Processing Ltd.

L IBIT SIGNAL PROCESSING LTD.

Libit Signal Processing Ltd.2 Chenkar StreetP.O. Box: 12670

Herzliya, Israel, 46766Telephone: (972) 9 956-4937

Fax: (972) 9 956-5183Web Site: www.libit.com

Email: [email protected]

Fabless IC ManufacturerFounded: 1994


U.S. – East Coast: Libit Signal Processing Co.Telephone: (201) 816-9232 • Fax: (201) 816-0557

U.S. – West Coast: Libit Signal Processing Co.Telephone: (415) 949-2864 • Fax: (415) 917-0636

Taiwan: Libit Signal Processing Co.Telephone: (886) 22 785-0172 • Fax: (886) 22 653-7952

Employees: 39

Ownership: Privately held.


Libit Signal Processing Ltd. delivers cutting-edge modem technologies and products for high-speed digitalcommunications applications. Libit is a pioneering supplier of IC modem devices compliant with the emergingMCNS-DOCSIS industry standard for cable modem and set-top box applications. Libit also provides advancedtechnologies of V.34+/V.PCM telephone-line modem solutions.

Targeted to the OEM market, Libit’s products have tested for interoperability with modem hardware provided byleading suppliers such as Toshiba, Bay Networks, 3Com and Cisco. The Company has established strategicpartnerships with prominent industry players possessing complementary skills and market access, includingAnalog Devices and Fujitsu Electronic Devices.

http://www.libit.com

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Libit Signal Processing Ltd. Rest of World Company Profiles

Management

Ehud Weinstein, Ph.D. PresidentMordechai Segal, Ph.D. Vice President, TechnologiesOfir Shalvi, Ph.D. Vice President, Research and DevelopmentAlan V. Oppenheim, Ph.D. Chairman of Executive Committee


Libit has an extensive line of Cable Modem and Telephone-line Modem Products. Libit’s cable modem product-line consists of IC modem devices enabling high-speed applications such as digital video broadcast and fastInternet access at data rates of tens of Mbps over the cable TV infrastructure. Products are based on a proprietarycore technology and very powerful algorithms, achieving highly efficient silicon implementation and significantcost-performance benefits. This product line is fully compliant with the MCNS, DVB, DAVIC and IEEE9\802.14standards, and is directed to the cable modem and set-top box OEM markets.

Libit has developed, in cooperation with Analog Devices, Inc., a complete V.34+ modem technology,implemented as a software package on the Analog Devices family of fixed-point DSP chips. This technology isoptimally designed to operate at the high data rate of 33.6Kbps, exhibiting superior performance over competingV.34+ technologies.


Rest of World Company Profiles Macronix International

MACRONIX INTERNATIONAL (MXIC)

Macronix International Co., Ltd.No. 3, Creation Road III


Telephone: (886) (3) 5788-888Fax: (886) (3) 5788-887

Web Site: www.macronix.com

IC Manufacturer


North America: Macronix America Co. Ltd. • San Jose, CaliforniaTelephone: (408) 453-8088 • Fax: (408) 453-8488

Europe: Macronix International Co., Europe Office • Strombeek, BelgiumTelephone: (32) (2) 267-7050 • Fax: (32) (2) 267-9700

Japan: Macronix International Co., Japan Office • Kawasaki-shi, Kanagawa, JapanTelephone: (81) (44) 246-9100 • Fax: (81) (44) 246-9105


1 9 9 2 1 9 9 3 1 9 9 4 1 9 9 5 1 9 9 6 1 9 9 7

Sales 63 143 221 328 373 368Net Income (23) 18 35 114 95 50R&D Expenditures — — 16 29 34 33Capital Expenditures — 20 42 113 250 184

Employees 800 980 1,440 1,700 2,000 2,230

Ownership: Publicly held, Taiwan Stock Exchange and NASDAQ: MXICY.


Macronix International Company (MXIC) designs, manufactures, and markets memory ICs for the personalcomputer, telecommunications, and data communications market segments. MXIC is currently Taiwan’s largestsupplier of EPROMs, Flash memories and Mask ROMs. Unlike so many of it’s competitors, it has largely avoidedgoing into the foundry business, preferring to produce it’s own designs.

http://www.macronix.com

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Macronix International Rest of World Company Profiles

The company is divided into two groups: the Memory Product Group, which designs and develops non-volatilememory ICs, and the Logic Product Group, which designs and develops logic ICs for PC, communications, andhigh-end consumer applications.

Plans for 1997 include an increased focus on the U.S. market. The company announced its strategy to expand itsU.S.-based subsidiary, Macronix America, to expose its flash, EPROM, and mask ROM products line to a broaderrange of OEMs. In particular, the company will promote the pin-to-pin compatibility of its non-volatile memorychips.

In addition, Macronix America is developing ASSPs with embedded non-volatile memory and has establishedthree engineering units to work on communications, graphics, and mixed-signal applications. The company plansto acquire more intellectual property that will be used as building blocks for the ASSPs. The company is a MIPS’licensee and has developed its own microcontroller and DSP cores.

Mask ROM57%

EPROM12%Flash

12%

1997 Sales by Product Type

Logic19%

Management

Ding-Hua Hu ChairmanMiin Wu PresidentRay Mak Vice President and Chairman, Macronix AmericaChris Kao Vice PresidentY.S. Tan Vice PresidentTom Yiu Vice PresidentAlan Portnoy President, Macronix America


Macronix International's products include flash memories (1M to 16M capacities), EPROMs (256K to 8M), maskROMs (1M to 64M), 32-bit RISC microprocessors, 16-bit DSPs, standard cell ASICs, graphics/video controllers,audio chips, clock generators, and LAN ICs.


Rest of World Company Profiles Macronix International

Memory Products

• Flash memories — 1M, 2M, 4M, 8M, and 16M densities.• Mask ROMs — 1M, 2M, 4M, 8M, 16M, 24M, 32M, and 64M densities.• EPROMs — 256K, 512K, 1M, 2M, 4M, and 8M densities.• Macronix is developing a new EPROM technology resembling flash memory that is called multiple-time-

programmable EPROM.

Logic Products

• Video chips — GUI/video accelerators and JPEG circuits.• Audio chips — 16-bit DSPs, codecs, and digital answering machine engines.• Networking chips — 10Mbps Ethernet and 100Mbps Fast Ethernet LAN ICs.• ASICs — standard cells based on 0.8µm DLM, 0.6µm DLM/TLM, 0.5µm DLM/TLM, and 0.35µm DLM/TLM

CMOS technologies. Its cell/core library consists of RAMs, ROMs, flash memories, DMAs, 8-/16-/32-bitmicrocontrollers, 16-bit DSPs, 32-bit FPUs, timers, PLLs, DACs, ADCs, datapath elements, and others.

Other Products

• Auto focus ICs.• 32-bit RISC embedded processors compatible with the MIPS R3000.• Clock generators.• RAMDACs.• New system-on-a-chip designs targeted at video projection and LCD monitor markets.


Macronix International Co., Ltd. Macronix International Co., Ltd.No. 3, Creation Road III No. 3, Creation Road IIIScience-Based Industrial Park Science-Based Industrial ParkHsinchu, Taiwan Hsinchu, TaiwanFab I Fab IICleanroom size: 62,500 square feet (Class 1) Capacity (wafers/week): 10,000Capacity (wafers/week): 8,250 Wafer size: 200mmWafer size: 150mm Process: CMOSProcess: CMOS Products: EPROMs, ROMs, flash memories, logic ICsProducts: EPROMs, ROMs, flash memories, Feature size: 0.35µm (0.2µm capability)

DSPs, MPUs, MPRs, logic ICs . (Began operations in 2Q97).Feature sizes: 0.4µm-0.8µm

Key Agreements

• In January 1998, MXIC announced a technology alliance with Matsushita Electronics Industrial. Under the termsof the agreement, Matsushita will license its 16Mbit and 64Mbit DRAM technology to MXIC for foundry servicesand future technology transfer. These products will not be sold on the open market but will be built forMatsushita on a foundry basis. In the long term, MXIC will use Matsushita’s technology to develop and sell itsown line of embedded memory products. Also included in the agreement.

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Macronix International Rest of World Company Profiles

• In August 1997, Macronix announced an alliance with Netherlands based Phillips Electronics NV. Under termsof the agreement, MXIC will manufacture and sell microcontrollers developed by Phillips and gain the right tocombine MXIC’s flash-memory technology with Philips 16-bit XA microcontroller cores. This will be used tocreate embedded flash controllers and hybrid ASIC chips that can be programmed with new instructions afterthey are built.

• In July 1997, MXIC announced long term plans to spend an additional $7B for three more fabs beginning in2000. The company requires about $1.3B over the next year to complete its latest production expansion.

• In April 1996, Macronix (MXIC) and IBM announced a mutual agreement on the cross licensing of patents.

• Since 1995, MXIC has been Nintendo’s biggest supplier of 64Mbit Mask-ROM chips, used in Nintendo’snewest generation of video game cartridges.


Rest of World Company Profiles Metalink

METALINK

Metalink Ltd.24 Habarzel Street

Ramat HachayalTel Aviv, 69710

IsraelTelephone: (972) (3) 645-4333

Fax: (972) (3) 648-8022Web Site: www.metalink.co.il

Email: [email protected]

Fabless IC Supplier


North America: Metalink, Inc. • Mountain View, CaliforniaTelephone: (650) 903-2290 • Fax: (650) 903-2237

Employees: 50

Metalink is a privately-held company headquartered in Kidmat Atidim, the high-tech business park of Tel Aviv.


Founded in 1993, Metalink is a fabless chip vendor with a QA program designed and implemented in accordancewith ISO 9000. Metalink uses suppliers it certifies as ISO 9002 compliant in fabrication, assembly and test.Metalink’s management team worked together developing communications equipment for the Israeli Ministry ofDefense for 10 years prior to founding the company. Metalink markets its products through direct sales anddistributors worldwide.

Metalink has distributors in San Jose and Irvine, California; Ontario, Canada; Tullnerbach, Austria; Bievres Cedex,France; Munich; Limerick, Ireland; Milano; Warsaw; Lisbon; Madrid; Istanbul; Bucks, UK; NSW, Australia; HongKong; Yokohama; Seoul; Singapore; Taipei Hsien; and Sao Paulo.

Management

Avi Kliger Technologies DirectorPaul Nurflus HDSL Product ManagerAvi Shabtay VDSL Product Manager

http://www.metalink.co.il

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Metalink Rest of World Company Profiles


Metalink’s products include ETSI- and ANSI-compliant high-performance, low-power high-bit-rate DigitalSubscriber Line (HDSL) and Medium Digital Subscriber Line (MDSL) system-on-a-chip connectivity solutions formultimedia broadband access over copper. Metalink solutions transmit over one to three pairs of copper wiresfrom 272Kbps to 2.3Mbps.

Rather than relying upon Decision-Feedback-Equalizer (DFE) techniques for signal decoding, Metalink hasdeveloped an algorithm called Maximum Likelihood (ML) in its DSPs, thereby achieving higher noise immunityboost and extended distance reach. This led to the ETSI Standards Board adopting Metalink’s HDSL 1-pairchipset performance capabilities as the industry standard for single pair (ETR-152).

Metalink’s products are targeted at business and residential applications. In the Data Communications market,access applications include: Fast Internet, Frame Relay, ATM, Public Network, and Private Network. In theTelecommunications market, applications include: Digital Pair-Gain Systems, Cellular Base Station, Public Networkand Private Network access. Metalink offers five chipset products to include DSP, AFE and Framer components.


Rest of World Company Profiles Mikron

MIKRON

Mikron CorporationZelenograd, Moscow, 103460

RussiaTelephone: (7) (095) 535-1509

Fax: (7) (095) 535-6264

IC Manufacturer


Mikron was one of the principle IC firms in the former USSR. Founded in 1964, the company's focus wastraditionally in the field of bipolar technology. Today, Mikron is a private company focusing on advanced processtechnologies, including CMOS, BiCMOS, and GaAs. Its product offerings includes logic, memory, and linear ICs,as well as ASICs. It is the leading source for GaAs LSI and gate array ICs in Russia. The company's linear devicesare expected to gain emphasis in the future.

Mikron’s standard and custom IC products can be found in a variety of applications such as digital and analogwatches, televisions, VCRs, supercomputers, and control systems. Roughly half of the company’s productionoutput is sold in international markets.

Management

Gennady Ya. Krasnikov General DirectorEvgenii Gornev Deputy General DirectorPavel S. Prikhodko Deputy General DirectorAlexander P. Nechiporenko, Ph.D. Chief of External DepartmentVitaly N. Panasuk Head of Technology and Research and Development


Mikron uses bipolar, CMOS, BiCMOS, and GaAs process technologies for the production of general purpose logicICs; ROMs and PROMs; SRAMs; MPUs; PLDs; CMOS, BiCMOS, and ECL gate arrays (up to 10K-gatecomplexity); linear ICs; and GaAs digital and analog ICs.

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Mikron Rest of World Company Profiles


Mikron joined Hong Kong-based Hua Ko Electronics to create a joint venture facility, located in Russia, that willmanufacture 150mm wafers on 0.8µm-1.2µm processes. In addition to funding, Mikron’s investment into the jointventure includes its EEPROM technology and its cleanroom design experience.

Mikron CorporationZelenograd, Moscow, 103460RussiaCleanroom size: 73,200 square feet (Class 10)Capacity (wafers/week): 15,000Wafer sizes: 100mm, 150mmProcesses: CMOS, BiCMOS, bipolar, GaAsProducts: Logic, memory, and linear ICs; ASICsFeature sizes: ≥0.8µm

Key Agreements

• Mikron has an alliance with Samsung under which Mikron produces ICs for the Korean company.


Rest of World Company Profiles Mosel-Vitelic

MOSEL-VITELIC

Mosel-Vitelic Inc.1 Creation Road I


Telephone: (886) (3) 5783344Fax: (886) (3) 5792838

Web Site: www.moselvitelic.com



North America: Northwest OfficeMosel-Vitelic Corporation • San Jose, CAPhone: (408) 433-6000 • Fax: 433-0952

Northeast OfficeMosel-Vitelic Corporation • Nashua, NHPhone: (603) 889-4393 • Fax: 889-9347

Southwest OfficeMosel-Vitelic Corporation • Long Beach, CAPhone: (562) 498-3314 • Fax: 597-2174

Central & Southeastern OfficeMosel-Vitelic Corporation • Richardson, TXPhone: (972) 690-1402 • Fax: 690-0341

Japan: Mosel-Vitelic Japan • Nagano-Ku, TokyoPhone: (813) 3365-2851 • Fax: 3365-2836

Europe & Israel: Mosel-Vitelic • GermanyPhone: (49) (70)-32-2796-0 • Fax: 2796-22


1 9 9 2 1 9 9 3 1 9 9 4 1 9 9 5 1 9 9 6 1 9 9 7

Sales 213 238 285 540 461 302

Employees — 880 1,411 1,800 1,916 1,884

Ownership: Publicly held, (Taiwan Stock Exchange).

http://www.moselvitelic.com

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Mosel-Vitelic Rest of World Company Profiles


Mosel-Vitelic designs, manufactures, and markets high-performance, application-specific memory ICs and logicdevices. The company's main business focus is on DRAMs and VRAMs for graphics accelerators used inworkstations, and desktop, notebook, and subnotebook PCs. Other core markets for its DRAM products includedata storage equipment, telecommunications peripherals, and printers. More than half of the company's DRAMsare sold in North America.

Mosel-Vitelic was formed in October 1991, through the merging of MOS Electronics Taiwan Inc. (Mosel) and U.S.-based fabless chip firm Vitelic Corporation, both of which were originally established in 1983.

SRAMs1%

1997 Sales by Product Type

AudioProducts

4%Other5%

DRAMs and VRAMs90%

Management

Hung-Chiu Hu Chairman and PresidentWilliam Chen Executive Vice President, Administration and FinanceJohn Fulton Executive Vice President, SalesJohn Seto Executive Vice President, Memory ProductsHsing Tuan Executive Vice President, Product DevelopmentRajit Shah Vice President, MarketingThomas Chang Vice President, ManufacturingM.L. Chen President, ProMOS Technologies, Inc.


Mosel-Vitelic offers specialized DRAMs (256K to 16M), standard SRAMs (16K to 1M), high-speed SRAMs (64K to1M), VRAMs (256K and 1M), FIFOs and other specialty memories, SIMMs, and voice chips. The company plans tointroduce a 120MHz version of a synchronous graphics RAM (SGRAM), as well as several new SRAM versions,including very low power parts (200µA standby current).


Rest of World Company Profiles Mosel-Vitelic


In early 1997, Mosel-Vitelic announced plans to break ground on a 256M DRAM 300mm wafer fabrication facilitysometime after 1998, with full production to begin in 2003. The company has chosen the Science-BasedIndustrial Park near Tainan, Taiwan, as a possible location.

Mosel-Vitelic Inc. ProMOS Technologies, Inc.1 Creation Road I (Joint venture between Mosel-Vitelic and Siemens).Science-Based Industrial Park Science-Based Industrial ParkHsinchu, Taiwan Hsinchu, TaiwanCapacity (wafers/week): 7,500 Cleanroom size: 66,000 square feetWafer size: 150mm Capacity (wafers/week): 5,000Process: CMOS Wafer size: 200mmProducts: Memory ICs Process: CMOSFeature sizes: 0.4µm-0.6µm (0.35µm capable) Products: Memory ICs

Feature size: 0.35µm (0.25µm capable)(Operations started in mid-1997).

Supplementing its own internal production, Mosel-Vitelic has foundry relationships with Oki, Fujitsu, TSMC, andUMC.

Key Agreements

• In October 1997, 64Mbit DRAMs became available by Mosel-Vitelic and Siemens AG. Both companies plan toexpand their 64Mbit portfolio with the release of 64Mbit synchronous DRAMs.

• In September 1996, Mosel-Vitelic announced the formation of ProMOS technologies, a $1.7 billion jointventure company with Siemens. The joint venture facility, located in Hsinchu, will be used to manufactureadvanced high-density DRAMs using technology transferred from Siemens. The facility began production of64M DRAMs in mid-1997 and expects to move to 256M DRAMs in 1998. Mosel holds 62 percent interest inthe venture, while Siemens holds the remaining 38 percent.

• Mosel-Vitelic has a foundry and technology exchange partnership with Oki.

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Novacom Technologies Ltd. Rest of the World Company Profiles

NOVACOM TECHNOLOGIES LTD.

Novacom Technologies Ltd.4 Harharoshet St.

P.O. Box 2660Raanana, Israel, 43657

Telephone: (09) 7464411Fax: (09) 7464422

Web Site: www.novacom.comE-Mail: [email protected]

Fabless IC SupplierFounded: 1988


U.S.: Novacom Technologies, Inc. • Hyannis, MassachusettsTelephone: (508) 862-0606 • Fax: (508) 862-0605

Employees: 20

Ownership: Privately held; private investors and an Israeli public telecom company.

Novacom Technologies Ltd. specializes in the design, development and marketing of multi-functional ICs for thedata communications and networking industries. Annual sales for 1995 and 1996 were $1.6 million and $2.0million, respectively. Novacom’s business is largely supported by off-shore sales — nearly 70 percent ofNovacom’s 1996 revenues were attributed to exported products.

Management

Avishay Noam PresidentSara Friedman Vice President, Marketing and Sales


All of Novacom’s ICs are based on the company’s proprietary repeating technologies. Crystal Controlled AdaptiveReclocking Technology (C2-ART ) performs full regeneration of the data signals in the system, enabling the userto connect a larger number of stations over longer distances, using all types of cabling media, without beingconcerned with noise or accumulated jitter in the network. Another key product, Hi-PHY™, provides complete,multi-port digital PHY solutions for data rates of up to 700Mb/sec.

http://www.novacom.com


Rest of the World Company Profiles Novacom Technologies Ltd.

Novacom’s products are divided into several major environments.

ICs for ATM 25.6 MBPS Networks

Provide a complete solution for the design and implementation of PHY layer and system interface for ATM hubs,switches and NICs. Simplify the link between the PHY and ATM layers.

ICs for Token Ring Local Area Networks

Provide a complete solution for the design and implementation of active retiming concentrators and repeaters aswell as Token Ring switching hubs providing extensive management support.

ICs for the IBM AS/400 5250 Midrange Environment

Provide a complete solution for designing and implementing Multiplexers and DeMultiplexers, Stars and repeatersall active in the IBM 5250 environment.

ICs for the IBM 3270 Mainframe Environment

Provide a complete solution for building multiplexers and repeaters for the IBM 3270 environment.

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RCL Semiconductors Limited Rest of the World Company Profiles

RCL SEMICONDUCTORS LIMITED

RCL Semiconductors Limited3, Dai Fu Street

Tai Po Industrial EstateTai Po, N.T.Hong Kong

Telephone: (852) 2665-9229Fax: (852) 2665-2201

Web Site: www.eleccom.com/relEmail: [email protected]



RCL Semiconductors Limited is one of the pioneers in the Far East to enter the semiconductor business. Thecompany started operations in 1982, and is a full service semiconductor company. RCL specializes in design,production, and testing integrated circuits.

Management

Mr. On K.W. General ManagerMr. Li S.W. Deputy General ManagerMr. Rick Fok Assistant Manager, Marketing Department


RCL provides MOS Logic for special purpose logic and full custom ICs. The company’s products focus mainly onDigital CMOS, and are capable of producing digital CMOS mixed-signal ICs and a small volume of linear circuits.RCL has the ability to develop their own standard products and the experience of doing custom made designs forcustomers, which also include foundry services.

Their service is focused on 1.8µm-2.0µm CMOS devices, including double poly single metal CMOS. Theseprocesses have been thoroughly characterized at every critical step, based on their own SRAM and gate arrayproducts. Under development is a 1.2µm CMOS process. Other processes include 2 to 5µm CMOS, single ordouble poly.

Since the mid-80’s the company’s foundry service has supported customers with local offices to those withoverseas buyers. They provide the finished goods in wafer form, dice form, Chip-On-Board or package ICs.

http://www.eleccom.com/rel


Rest of the World Company Profiles RCL Semiconductors Limited

RCL’s product list includes: voice synthesizers, musical-melody chip, 8-10 digits for calculator ICs, 32KHz analogwatch and clock CMOS, timer and counter devices. Other products support applications such as sound effect, ledflashers, and telephones – pulse dialer and DTMF tone dialer. The custom devices include customer-made pulsecounter, customer-made remote controller, and digital clinical thermometer.


RCL Semiconductors Limited3, Dai Fu StreetTai Po Industrial EstateTai Po, N.T.Hong KongTelephone: (852) 2665-9229Capacity (wafers/month): 8,000Wafer size: 130mmProcess: CMOS, NMOS, linear ICProducts: ASIC, SRAM, Gate ArrayFeature sizes: 5µm, 3µm, 2µm, 1.8µm, 1.5µm, (1.2µm available soon).

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Realtek Rest of the World Company Profiles

REALTEK

RealtekNo. 2, Industry E. Rd. IX,

Science-Based Industrial Park,Hsinchu 300, Taiwan, R.O.C.Telephone: 886-3-578-0211

Fax: 886-3-577-6047Web Site: www.realtek.com.tw

Fabless IC SupplierFounded: 1987

Regional Offices/Representative Regions

Asia: Realtek • Taipei, TaiwanTelephone: 886-2-2298-0098 • Fax: 886-2-2298-0097


1 9 9 7

Sales 61

Employees 220


Realtek designs, tests, and distributes ICs for the consumer electronics, computer peripherals, multimedia, andcommunications network hardware markets. With 30 patents worldwide, the Company is one of Taiwan’s largestand most successful IC design houses, which offers complete technical counseling and systems software, inaddition to design technology.

Management

Dr. Po-Len Yeh Chairman


Realtek’s Bcore Technology® combines a knowledge of advanced technologies with a mastery of keycomponents such as digital signal processors, microcontrollers, and various types of memory (SRAM, DRAM,EEPROM, etc.). The Company is able to develop standard chips, integrating these components into a singleunified system, called Bsystem on a chip®. It is a distinguished circuit design, featuring mixed-mode technology.

http://www.realtek.com.tw


Rest of the World Company Profiles Realtek

Realtek’s three product families are described below.

• Consumer Division: Melody Series, Sound Effect, Speech, MCU Based Speech/Melody Series, ControllerSeries, and Telecommunication Series.

• Communication Division: Full Duplex Ethernet Controller with PnP function (16Kbyte SRAM built in),Realtek PCI Full-Duplex Ethernet Controller with built-in SRAM, Single Chip Fast Ethernet Controller.

• Computer Peripheral Division: Sound ICs and Graphic Video Chip. Products for sound ICs are full duplexWave Table Sound chip, integrated Audio Controller with 3D chip, and Plug & Play Sound Blaster proSound chip. A new product introduced is an Integrated PCI Audio Accelerator. Graphic video chip productsinclude Video Graphic Adapter Controller, entry level ISA VGA chip, 128-bit Performance plus Video, 64-bitAccelerator with full-motion video chip, 64-bit Accelerator for PCI VGA chip, and 32-bit entry-level PCI, VL,ISA, VGA chip.

Key Agreements

• In December 1997, a joint venture was formed amongst Realtek, UMC, Alliance Semiconductor, SanDisk, andXilinx. This joint venture foundry will produce 8 inch wafers at a capacity of 10,000 per month by the end of1998. Full production capacity will be 25,000 wafers per month.

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SAMES Rest of World Company Profiles

SOUTH AFRICAN MICRO-ELECTRONIC SYSTEMS (SAMES)

South African Micro-Electronic Systems Pty., Ltd.2 Rooibok

Koedoespoort Industrial AreaPretoria, South Africa

Telephone: (27) (12) 333-5406Fax: (27) (12) 333-6021

Web Site: www.sames.co.za



1 9 9 5 1 9 9 6 1 9 9 7

Sales 16 11 30.3

Employees — — 210

Ownership: Privately held.


SAMES manufactures mixed analog/digital ASICs in CMOS and BiCMOS technologies. In addition, the companyprovides system solutions such as single-chip telephones and electric meters for telecom and industrialapplications. The company was founded by Siemens and the Industrial Development Corporation of South Africa(IDC) to manufacture ICs for the South African telecommunications industry. The company is currently the onlycommercial manufacturer of ICs in South Africa, and the largest in advanced CMOS technology.

The company was originally controlled by the IDC, which held 70 percent of the company. Other minorityshareholders included Allied Technologies Ltd., Grinaker Electronics Ltd., Plessey South Africa Ltd., ReunertLtd., Siemens, and Telephone Manufacturers of South Africa Ltd. In 1995, Austria Mikro Systeme InternationalAG (AMS) acquired a 51 percent controlling interest in SAMES and IDC held the remaining 49 percent of theshares. In 1996, however, IDC made an additional investment into SAMES, increasing its share to 81 percent,leaving AMS with a 19 percent interest. As part of its relationship with AMS, SAMES receives free technologytransfers from AMS and the two companies share knowledge in the area of process technology, design, andproducts.

In 1990, with the completion of a new 150mm wafer facility, SAMES aimed at globalizing its activities in the field ofASICs and at providing foundry capacity. The new fab facility is designed to fulfill submicron requirements inCMOS technology, with 2.0µm to 1.0µm manufacturing processes currently in operation.

http://www.sames.co.za


Rest of World Company Profiles SAMES

The company’s capabilities involve design, fabrication, packaging, testing, and qualification of customer service.SAMES has successfully fulfilled wafer second-source requirements for other foundries. SAMES can supplysecond-source paths either within the AMS group or at external foundry alliances. SAMES offers MPW (multi-project wafer) service and flexible design entry points. MPW allows users to share development costs andtherefore, make ASICs more attractive to potential users.


Since 1981, SAMES has developed telephone dialers and provides unique telephony solutions to a worldwidecustomer base. The SA54XX Range features are selectable pulse or tone dialing, 24 digit last number redial,selectable inter digit pause, selectable make break ration, a TBR of 100, 270, 300msec, and keypad switchablefrom pulse to tone. The SA253X, SA15XX Range of CMOS devices contain all the functions needed to form highperformance electronic telephones. The Pulse/Tone Switchable Dialing, Tone Ringer and a high quality SpeechCircuit is in one CMOS circuit that allows it to meet a wide range of PTT requirements internationally. Other keyfeatures are last number redial of 31 digits with Moving Cursor Protocol, and 14 Repertory Memories (SA2531),and two Flash Keys, Real or Complex Impedance set on Chip.

SAMES has been involved in the development of telecommunications products that are widely used in CentralSwitches and PBX equipment. The LED Driver SA 8803 solves the universal problem of driving LED viaMicroprocessor bus efficiently. The SA3488 is a non-blocking Digital Switching Matrix capable of routing any of256 input channels to any of 256 output channels at 2Mbit/sec rates via eight serial PCM links. The control is via astandard eight-bit parallel microprocessor interface. It is hardware and software compatible to M3488/MO88 andEuropean PCM30 and U.S. PCM24 compatible.

SAMES has 1.0µm, 1.2µm, and 2.0µm double metal and double polysilicon CMOS manufacturing processes inoperation. The company has recently shipped its first 1.2µm EEPROM process.


SAMESPretoria, South AfricaCleanroom size: 15,070 square feet (Class 10)Capacity (wafers/week): 2,500Wafer size: 150mmProcesses: CMOS, BiCMOSProducts: ASICs, foundry servicesFeature sizes: 1.0µm, 1.2µm, 2.0µm

5-64


Samsung Rest of World Company Profiles

SAMSUNG

Samsung Electronics Co., Ltd.Semiconductor Business

10th Floor, Samsung Main Building250, 2-ka, Taepyung-ro, Chung-gu

Seoul 100-191, KoreaTelephone: (82) (2) 727-7114

Fax: (82) (2) 753-0967Web Site: www.sec.samsung.com


(See Top Ten)

http://www.sec.samsung.com


Rest of the World Company Profiles Semiconductor Complex Ltd.

SEMICONDUCTOR COMPLEX LTD.

Semiconductor Complex Ltd.Phase VIII, S A S Nagar-160 059

(Near Chandigarh) PunjabIndia

Telephone: (91) (172) 670065, 670085, 670110,670409, 670443

Fax: (91) (172) 671575, 670397



Semiconductor Complex Ltd. (SCL), organized in 1983, is a Government of India Enterprise. SCL designs,develops, and manufactures LSI/VLSI circuits with custom design capabilities. This company accrued 1997 totalsales of $11.80 million.

SCL has two business components – VLSI division and Systems division. The VLSI division is composed ofthese five departments: VLSI design, process technology development, wafer fabrication, testing and assembly,and quality assurance. The System division consists of customer product development and application support,customer specific products, and standard products.

In India, SCL sells their own products, but also has marketing ties with Rockwell International and Mitel Corporation.Semiconductor Complex Ltd. has many relations with private sector companies, but enjoys preferentialrelationships with Indian government agencies. SCL has developed ICs for the clock and watch industry, anddeveloped and supplied over 100 ASICs.

Management

Dr. M.J. Zarabi Chairman, President, and Chief Executive OfficerMr. M.M. Sobti Vice President, Sales and Marketing

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Semiconductor Complex Ltd. Rest of the World Company Profiles


In the beginning, Semiconductor Complex Ltd. started developing 5 micron technology from American MicroSystems Inc., USA. CMOS in 3 micron, 2 micron, and 1.2 micron was developed, and so were EEPROM and CCDtechnologies.

MOS MEMORY ANALOG✔ DRAM Amplifier✔ SRAM Interface

Flash Memory ✔ Consumer/Automotive✔ EPROM Voltage Regulator/Reference

ROM Data Conversion

EEPROM Comparator

Other (Including Non-Volatile RAM) ✔ Other (Includes Telecom)

MOS LOGIC DIGITAL BIPOLAR✔ General Purpose Logic Bipolar Memory✔ Gate Array General Purpose Logic✔ Standard Cell Gate Array/Standard Cell

Field Programmable Logic Field Programmable Logic

Other Special Purpose Logic Other Special Purpose Logic

MPU/MCU/MPR

MOS MICROCOMPONENT✔ MPU OTHER✔ MCU ✔ Full Custom IC

MPR Discrete✔ DSP Optoelectronic


The VSLI Wafer Fabrication is upgradable to process 100,000wpa in 0.6 micron CMOS.

Semiconductor Complex Ltd.Phase VIII, S A S Nagar-160 059(Near Chandigarh) Punjab, IndiaCleanroom size: 8,225 square feetWafer size: 150mmProcesses: CMOSProducts: Logic and Memory ICs, Analog ICs, ASICsFeature sizes: 0.8µm, 1.2µm, 2µm, 3µm


Rest of World Company Profiles Tower Semiconductor

TOWER SEMICONDUCTOR

Tower Semiconductor Ltd.P.O. Box 619

Migdal Haemek 23105Israel

Telephone: (972) (6) 506-670Fax: (972) (6) 6547-788

Web Site: www.towersemi.com

IC Manufacturer


North America: Tower Semiconductor USA, Inc. • San Jose, CaliforniaTelephone: (408) 551-6500 • Fax: (408) 551-6509


1 9 9 3 1 9 9 4 1 9 9 5 1 9 9 6 1 9 9 7

Sales 38 58 100 98 126Net Income 4 8 20 10 19Capital Expenditures 5 20 45 76 —R&D Expenditures — — — — 7

Employees 400 455 680 620 638

Ownership: Publicly held. NASDAQ: TSEMF.


Tower Semiconductor is an independent foundry-dedicated IC manufacturer, formed by the partial buyout of aNational Semiconductor fab in 1993. National began commercial production of wafers at the fab in 1988. Tower isa public company traded in NASDAQ (57.2 percent). The remainder of Tower’s shares are divided between TowerHoldings (41 percent) and managers (1.8 percent). Tower Holdings is owned by Data Systems and Software Inc.(60 percent) and the Israel Corporation (40 percent).

As a foundry, Tower manufactures wafers using its advanced production capability and the proprietary IC designsof its customers. Devices produced by the company are used in a wide variety of applications including personalcomputer products and peripherals, communications products, office automation equipment, and consumerproducts.

http://www.towersemi.com

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Tower Semiconductor Rest of World Company Profiles

PCs/Peripherals30%

Consumer 23%

1997 Sales by End-Use Market (est.)

Communications24%

OfficeAutomation

6%

Other14%

CellularProducts

3%

Management

Yoav Nissan-Cohen, Ph.D. Co-Chief Executive OfficerRafael M. Levin, Ph.D. Co-Chief Executive OfficerJeffrey Levy Vice President, Fab FacilityReuven Marko Director, Marketing and Sales


Tower manufactures primarily differentiated ICs rather than commodity products. Such products include digitalsignal processors, microprocessors, microcontrollers, and mixed-signal devices. It currently uses 1.0µm, 0.8µm,0.6µm, and 0.5µm double- and triple-level metal CMOS technologies with 0.35µm increasing in production in1998. It focuses on supply of leading edge EPROM and flash processes for stand-alone as well as embeddedapplication. Tower also provides specialty CMOS processes for optical sensing applications.


Tower Semiconductor Ltd.P.O. Box 619Migdal Haemek 23105, IsraelCleanroom size: 46,575 square feetCapacity (wafers/week): 4,500Wafer size: 150mmProcess: CMOSProducts: Foundry servicesFeature sizes: 0.35µm, 0.5µm, 0.6µm, 0.8µm, 1.0µm

Key Agreements

• Tower has an agreement with Fairchild Semiconductor to supply advanced EPROM processes for thecommodity and ASSP markets. In January 1998, the parties extended their agreement to include a new familyof products. The first project under way is the development of a next-generation Flash technology.


Rest of World Company Profiles Tower Semiconductor

• In January 1997, WSI signed a long-term technology exchange and foundry agreement with TowerSemiconductor. Under the agreement, the two companies will jointly develop manufacturing processtechnologies such as WSI’s AMG EPROM architecture using Tower’s 0.6µm technology. The agreement alsoguarantees WSI access to Tower’s wafer capacity.

• In October 1997, Tower and Saifun Semiconductors Ltd. signed a definitive agreement to license and jointlydevelop a new Flash technology. Tower has an exclusive license for semiconductor contract manufacturingusing the Flash technology.

• Tower has supply agreements with National, Motorola, WSI and Chip Express.

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TriTech Microelectronics Rest of World Company Profiles

TRITECH MICROELECTRONICS

TriTech Microelectronics Ltd.5 Yishun Street, 23

# 0 5 - 0 1Singapore 768442

Telephone: (65) 752-2788Fax: (65) 752-6557

Web Site: www.tritechmicro.com

Fabless IC Supplier


North America: TriTech Microelectronics Inc. • Milpitas, CaliforniaTelephone: (408) 941-1300 • Fax: (408) 941-1301


1 9 9 2 1 9 9 3 1 9 9 4 1 9 9 5 1 9 9 6 1 9 9 7

Sales 15 19 57 70 63 70

Employees 48 47 60 106 145 180


TriTech Microelectronics designs and markets innovative integrated circuits for telemedia applications whichrequire the combination of multimedia and communications capabilities. TriTech’s ICs are offered as application-specific standard products (ASSPs) or as ASICs from the company’s comprehensive proprietary library of analog,mixed-signal, digital, and memory cells.

Since its founding in 1990, TriTech has focused on the design of complex analog and mixed-signal products,making this a core technology strength of the company. Its expertise in this area has enabled the company to beadept at designing mixed-signal chips in cost-effective, single-poly bulk CMOS processes. The company alsouses its cell-based design approach to quickly turn new products into the market.

TriTech is a member of Singapore Technologies Semiconductors, a strategic business unit of SingaporeTechnologies.

http://www.tritechmicro.com


Rest of World Company Profiles TriTech Microelectronics

Management

Marc Birnkrant PresidentBettina Briz Vice President, Worldwide MarketingAlden Chauvin Vice President, Worldwide SalesMichael Harkins Director, Worldwide Regional MarketingChong Lim Neoh Vice President, Business and Technology Development


TriTech’s products are targeted at telemedia applications for the PC, including computer games and complexgraphical interfaces; PC communications via e-mail, fax, and remote access; and communications/processorplatforms for Internet appliances. Audio codecs are a flagship line, with nearly 40 million shipped since thecompany’s founding. The Pyramid3D graphics processor, introduced in 1996, provides workstation-levelgraphics on a PC, making three-dimensional multimedia affordable for business and entertainment applications.

In addition, deep-submicron CMOS wafer foundry services and packaging, assembly, and test services are offeredthrough sister companies Chartered Semiconductor and ST Assembly Test Services (STATS), respectively.


TriTech is a fabless IC supplier; its products are manufactured by Chartered Semiconductor.

Key Agreements

• In March 1998, TriTech announced that Microsoft will license its bump-mapping technology.

• In November 1997, TriTech and Sebring Systems partner on ASIC process for family of PCI bus accelerationproducts.

• In June 1997, TriTech entered into a partnership with InnovaCom to become the ASIC supplier forInnovaCom’s DVImpact single chip MPEG-2 compressed video encoder.

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TSMC Rest of World Company Profiles

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TSMC)

Taiwan Semiconductor Manufacturing Co., Ltd.No. 121, Park Avenue III

Science-Based Industrial ParkHsinchu 300, Taiwan, ROC

Telephone: (886) (3) 578-0221Fax: (886) (3) 578-1546

Web Site: www.tsmc.com.tw



North America: TSMC, USA • San Jose, CaliforniaTelephone: (408) 437-8762 • Fax: (408) 441-7713

Europe: TSMC, Europe • Amsterdam, The NetherlandsTelephone: (31) (20) 305-9900 • Fax: (31) (20) 305-9911


1 9 9 2 1 9 9 3 1 9 9 4 1 9 9 5 1 9 9 6 * 1 9 9 7 *

Sales 258 465 730 1,092 1,416 1,593Net Income 46 160 320 572 697 638R&D Expenditures 5 12 21 32 54 47Capital Expenditures 108 147 270 574 845 866

Employees 1,893 2,294 2,681 3,412 4,117 5,600

*28.14NTD/USD

Ownership: Publicly held. TSE (Taiwan Stock Exchange) and TSM (New York Stock Exchange).


Taiwan Semiconductor Manufacturing Company (TSMC) is the world’s largest pure integrated circuit foundry andoffers a set of IC fabrication processes, including processes to manufacture CMOS logic, mixed-mode, volatile andnon-volatile memory, embedded memory, and BiCMOS chips. TSMC does not design its own brandname IC endproducts or second-source its customers’ products.

http://www.tsmc.com.tw


Rest of World Company Profiles TSMC

Taiwan Semiconductor Manufacturing Company (TSMC) was founded as a joint venture of the TaiwanDevelopment Fund, Philips Electronics of the Netherlands, and private-sector investors in Taiwan. It is 19 percentowned by the government of Taiwan, 29.5 percent owned by Philips, and 48.5 percent owned by privateinvestors and employees.

Since its founding, the company has been dedicated to providing manufacturing services for advanced ICs.TSMC believes its customers have the ability to bring their products to market faster, more cost effectively, andwithout the large capital expenditures necessary for state-of-the-art manufacturing facilities. TSMC serves over300 worldwide customers, many of them located in the U.S. and about two-thirds fabless. TSMC customers rangefrom IC design houses, vertically-integrated IC firms, systems companies, and world leading IC companies.

United States42%

Asia39%

1997 Sales by Geographic Region

Japan11%

Europe8%

Taiwan Semiconductor Manufacturing Company’s global growth of the market for its customer-made foundrymicrochips will grow 23 percent in 1998 to $6 billion NTD.

In mid-1995, TSMC began offering customers an option to guarantee long-term wafer capacity throughprepayments. The deposits are allowing the company to accelerate its fab facility construction. Customers thathave entered into the option agreement include Acer Labs, Analog Devices, Oak Technology, S3, TridentMicrosystems, and ISSI.

Management

Morris Chang, Ph.D. Chairman and PresidentRick Tsai Executive Vice President, OperationsQuincy Lin Senior Vice President, Corporate DevelopmentStephen T. Tso Senior Vice President, World-Wide Sales & MarketingKok-Choo Chen Senior Vice President and General CounselHarvey Chang Senior Vice President and Chief Financial OfficerY.C. Huang Spokesman and Special Assistant to ChairmanJyan-Bang Chen Vice President, North SiteShang-Yi Chiang Vice President, Research and DevelopmentPing Yang Vice President, Corporate MarketingChe-Chia Wei Vice PresidentRonald Norris President, TSMC USA

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TSMC’s state-of-the-art CMOS and other process technologies in production are as follows:

Logic: 1.2µm, 1,0µm, 0.8µm, 0.6µm, 0.5µm, 0.35µm, 0.30µm, 0.25µmMixed-mode: 1.0µm, 0.8µm, 0.6µm, 0.5µm, 0.35µm, 0.25µmBiCMOS: 1.5µm, 1.0µm, 0.8µmMask ROM: 0.6µm, 0.45µmDRAM: 0.5µm, 0.35µm, 0.32µm, 0.25µmSRAM: 0.5µm, 0.45µm, 0.35µm, 0.3µmFLASH: 0.8µm, 0.7µm, 0.5µmEPROM: 0.8µm, 0.7µm, 0.5µmEEPROM: 0.5µm

In new processes, TSMC provides logic-based EmbDRAM and memory-based EmbDRAM technology. Logic-based EmbDRAM process enables the integration of logic and DRAM circuits together on the same chip.Memory-based EmbDRAM combines traditional DRAM processes with additional metal layers. For example, the0.25µm logic-based EmbDRAM technology offers high performance transistors based on TSMC’s 0.25µm logicprocess; and the memory-based EmbDRAM technology is structured around a 0.25µm DRAM plus three extrametal layers.

In the fourth quarter of 1997, TSMC started to offer EmbFlash with the state-of-the art 0.5µm technology. Thetechnology is suited to products using low to medium density nonvolatile memory, such as MCU and DSP.

Currently, technologies under development include 0.18µm logic/ASIC, 0.25µm mixed-signal, 0.18µm SRAM,0.25µm embedded FLASH, and 0.25µm embedded DRAM processes. In mid-1998, TSMC will begindevelopment of 0.15µm generation process technology.

In addition to providing IC wafer manufacturing service, TSMC offers ASIC design services, mask making services,wafer probing services, and assembly and test services. To stay ahead of the swift upgrades in technology, TSMCcontinuously introduces next-generation processes to its production facilities.


In November 1995, TSMC announced plans to build WaferTech, a $1.2 billion joint venture company, with Altera,Analog Devices, and ISSI. The company will be dedicated to providing wafer manufacturing services and is one ofthe first U.S.-based dedicated foundries, located in Camas, Washington. The facility underwent construction inJuly 1996, and will have a capacity of 7,500 200mm wafers per week when production starts in 2H98.

In early 1997, TSMC announced its long-term plans for future wafer manufacturing facilities. The companyannounced its commitment to the Taiwanese government to invest approximately $14.5 billion over the next fiveyears to build one 200mm and six 300mm wafer manufacturing facilities in a new Science-based industrial park inthe southern part of Taiwan.


Rest of World Company Profiles TSMC

TSMC will begin construction 2Q98 on Taiwan’s first 12-inch wafer fabrication facility.

TSMC, Ltd. TSMC, Ltd.Building 67, No. 195, Section 4 No. 121, Park Avenue IIIChung-Hsing Road Science-Based Industrial ParkChu-Tung, Hsinchu, Taiwan, ROC Hsinchu, Taiwan, ROCTelephone: (886) 3582-1240 Telephone: (886) 3578-0221Fab I Fab IIACleanroom size: 29,060 square feet Cleanroom size: 100,730 square feetCapacity (wafers/week): 5,000 Capacity (wafers/week): 9,750Wafer size: 150mm Wafer size: 150mmProcesses: CMOS, BiCMOS Processes: CMOS, mixed-modeProducts: Foundry services Products: Foundry servicesFeature sizes: 0.8µm-2.0µm Feature sizes: 0.5µm, 0.6µm

TSMC, Ltd. TSMC, Ltd.No. 121, Park Avenue III No. 9, Creation Road IScience-Based Industrial Park Science-Based Industrial ParkHsinchu, Taiwan, ROC Hsinchu, Taiwan, ROCTelephone: (886) 3578-0221 Telephone: (886) 3578-1688Fab IIB Fab IIICleanroom size: 100,730 square feet Cleanroom size: 113,915 square feetCapacity (wafers/week): 9,875 Capacity (wafers/week): 9,250Wafer size: 150mm Wafer size: 200mmProcesses: CMOS, mixed-mode Process: CMOSProducts: Foundry services Products: Foundry servicesFeature sizes: 0.5µm, 0.6µm Feature sizes: 0.25µm, 0.35µm, 0.5µm

TSMC, Ltd. TSMC, Ltd.Hsinchu, Taiwan Hsinchu, TaiwanFab IV Fab VSame address as Fab III same address as Fab IICapacity (wafers/week): 7,500 Capacity (wafers/week): 8,750Wafer size: 200mm Wafer size: 200mmProcess: CMOS Process: CMOSProducts: Foundry services Products: Foundry servicesFeature sizes: 0.25µm, 0.35µm, 0.5µm Feature sizes: 0.25µm, 0.35µm (0.18µm capable)

(.18µm capable) (Scheduled to start-up in 1Q98).

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WaferTech, LLCCamas, WashingtonCapacity (wafers/week): 7,500Wafer size: 200mmProcess: CMOSProducts: Foundry servicesFeature sizes: 0.25µm, 0.35µm (0.18µm capable)(Scheduled to start up in 2H98. Joint venture withAltera, Analog Devices, and ISSI).

Key Agreements

• In March 1998, TSMC signed intellectual property agreements with San Jose based Artisan Components tocreate embedded memories and standard cells and I/O for it’s 0.25 micron logic process. This technology willbe offered to its foundry customers exclusively. TSMC will be using Artisan’s Process Perfect HS300 (highspeed 300MHz) single- and dual- port memory generators and process-perfect standard cell libraries.

• In February 1998, Taiwan Semiconductor Manufacturing Company formed a multi-year strategic partnershipwith NVIDIA Corporation. TSMC will assist in the manufacturing of all future NVIDIA products starting with RIVA128ZX™. TSMC will provide NVIDIA with deep sub-micron process technology.

• In November 1997, TSMC and Avant! Corporation signed a marketing and development partnershipagreement that will provide Galax!’s library technology to TSMC’s foundry customers. This partnership willcreate and support a comprehensive set of logic library cells, standard and special I/Os, memory compilers,datapath compilers, place and route kits and technology run sets for design rule checking tools.

• In July 1997, QuickLogic entered into a manufacturing agreement with TSMC enabling the co-development ofa 0.35µm four-layer metal CMOS process for 8 inch wafers using the company’s ViaLink antifuse technology.The agreement is effective for three years and is renewable annually as a rolling three-year agreement. Theagreement guaranteed certain capacity availability and requires that a minimum percentage of the total numberof wafers required by the company in any one year are purchased from TSMC (excluding wafers purchasedfrom Cypress and certain other wafer requirements), and requires “take or pay” volume commitments.

• In March 1997, Taiwan Semiconductor Manufacturing Company announced a wafer manufacturing agreementwith Quantum Effect Design, Inc. (QED). TSMC will provide 0.35 and 0.25 micron capacity to meet QED’scustomer requirements.

• In November 1995, TSMC announced plans to build WaferTech, a $1.2 billion joint venture company, withAltera, Analog Devices, and ISSI. WaferTech will provide wafer manufacturing services and is one of the firstU.S.-based dedicated foundries. Construction of WaferTech began mid-1996 and is scheduled to commencein 1998.

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Rest of the World Company Profiles U-Jin Electronics Company, Ltd.

U-JIN ELECTRONICS COMPANY, LTD.

U-Jin Electronics Company, Ltd.478-17 Mangwon-dong

Mapo-gu, SeoulKorea

Telephone: 880-31-74-0050Fax: 880-31-74-0038



U-Jin Electronics Company, Ltd. produces LED display, lamp dot matrix, infrared LED, photo T/R, photo diode,and photo interrupters. The company is also involved in optoelectronics.

Management

Jae Chun Yoo President

Semiconductor Facilities

U-Jin Electronics Company, (BD) Ltd.SS-5 Bldg., Export Processing zone,Chittagong, BangladeshTelephone: 880-31-74-0050Fax 880-31-74-0038Products: Led Display, Lamp Dot Matrix, Infrared LED, Photo T/R,

Photo diode, Photo Interrupter, Optoelectronic.

5-78


UMC Rest of World Company Profiles

UNITED MICROELECTRONICS (UMC)

United Microelectronics CorporationNo. 3, Industry East Road


Telephone: (886) (3) 5773131Fax: (886) (3) 5774767

Web Site: www.umc.com.tw



USA: United Microelectronics Corporation • Sunnyvale, CaliforniaTelephone: (408) 733-8881 • Fax: (408) 733-8090

Japan: United Microelectronics Corporation K.K. • Minato-Ku, Tokyo, JapanTelephone: (81) (3) 3455-8306 • Fax: (81) (3) 3455-8307

Europe: United Microelectronics (Europe) B.V. • Br. Amsterdam Zuidoost, The NetherlandsTelephone: (31) (20) 697-0766 • Fax: (31) (20) 697-7826


1 9 9 2 1 9 9 3 1 9 9 4 1 9 9 5 1 9 9 6 1 9 9 7

Sales 257 376 567 900 825 883Capital Expenditures 56 53 255 570 600 162R&D Expenditures 20 37 40 52 66 62

Employees 1,770 1,968 2,275 2,982 2,750 2,751


United Microelectronics Corporation (UMC) is a dedicated semiconductor foundry company. UMC’s range offoundry services include IC fabrication, design support, mask making, wafer probing, packaging and testing. Thecompany offers CMOS technologies that include logic, mixed-signal, SRAM, DRAM, flash and embedded memoryprocesses. These technologies are offered in linewidths ranging from 0.25µm to 1.0µm (and greater) and arecapable of up to six levels of metal interconnections.

http://www.umc.com.tw


Rest of World Company Profiles UMC

Memory ICs27%

Computer ICs13%

1997 Sales by Product Type (est.)

Foundry Services50%

Commercial ICs6%

Communication ICs4%

With four 8 inch IC fabs and one 6 inch fab, the UMC Group boasts a foundry capacity that is amongst the highestin the industry. The UMC Group plans to triple its capacity over the next five years to assure its customers withvirtually unlimited access to leading-edge semiconductor manufacturing capacity.

A key to UMC’s strategy toward its continued expansion of foundry capacity is through the formation of jointventures with strategic partners. A proven popular business model that renders customers as partner/owners, thejoint venture fabs provide guaranteed capacity to the foundry partner/customers as well as allowing for theirsharing in the ventures’ profits. United Semiconductor Corporation (USC), United IC Corporation (UICC) andUnited Silicon Inc. (USIC) are joint venture fabs within the UMC Group that work together in joint support of thefoundry customers.

Company Background

During its 17 years as the leading IC product company in Taiwan, UMC has developed an extensive range ofproducts that include memory ICs, PC chipsets, microcontrollers, DSPs and communication devices. Theseproduct divisions have been completely divested from the company. The spun-off companies are IntegratedTechnology Express, Davicom, AMIC, NovaTek and MediaTek. All these companies are independent companiesin which UMC maintains only a minority and declining stake. With the transition to a dedicated IC foundry completeand the concern of any potential competition with its customers removed, UMC now devotes all its resources tomaintaining world-class foundry services to its customers.

Management

Bob Tsao ChairmanDon Brooks Chief Executive Officer, International OperationsJohn Hsuan Chief Executive Officer, Domestic OperationsIng-Dar Liu Chief Operating Officer, Expansion ProjectsGary Tseng Chief Financial OfficerJ.S. Aur Chief Administrative OfficerH.J. Wu President, UMCPeter Chang President, USCC.Y. Shu President, UICCFrank Wen President, USIC

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UMC Rest of World Company Profiles


United Microelectronics Corporation United Microelectronics CorporationScience-Based Industrial Park Science-Based Industrial ParkNo. 3, Industrial East Road No. 3, Industrial East RoadHsinchu, Taiwan Hsinchu, TaiwanFab IC2 Fab IC3Cleanroom size: 47,600 square feet Cleanroom size: 57,800 square feetCapacity (wafers/week): 12,000 Capacity (wafers/week): 6,250Wafer size: 150mm Wafer size: 200mmProcesses: CMOS, NMOS Processes: CMOSProducts: Dedicated foundry services Products: Dedicated foundry servicesFeature sizes: 0.4µm-1.0µm Feature sizes: 0.25µm-0.5µm

United Semiconductor Corporation (USC) United Silicon Inc. (USIC)Science-Based Industrial Park Science-Based Industrial ParkNo. 3, Industrial East Road No. 3, Industrial East RoadHsinchu, Taiwan Hsinchu, TaiwanUSC Fab 1C3B USIC Fab 1Cleanroom size: 55,600 square feet Cleanroom size: 55,600 square feetCapacity (wafers/week): 8,500 Capacity (wafers/week): 6,250Wafer size: 200mm Wafer size: 200mmProcess: CMOS Process: CMOSProducts: Dedicated foundry services Products: Dedicated foundry servicesFeature sizes: 0.25µm, 0.35µm, 0.5µm Feature sizes: 0.25µm-0.5µm

(Scheduled to begin production in 1Q98).

United Integrated Circuits Corporation (UICC)Science-Based Industrial ParkNo. 3, Industrial East RoadHsinchu, TaiwanUICC Fab 1Cleanroom size: 55,600 square feetCapacity (wafers/week): 6,250Wafer size: 200mmProcess: CMOSProducts: Dedicated foundry servicesFeature size: 0.25µm-0.5µm(Scheduled to begin production in 1Q99).


Rest of World Company Profiles UMC

Key Agreements

• In March 1998, UMC and Virtual Silicon Technology, Inc., announced that they had entered into a multi-yearjoint marketing and technology development agreement. The agreement calls for UMC to endorse VirtualSilicon’s Diplomat-25 design rules. Chip designers utilizing UMC’s 0.25 micron manufacturing processes will beable to embed large Intellectual Property (IP) cores into their system-on-silicon designs using Virtual Silicon’shigh quality Diplomat-25 standard cell libraries.

• In October 1997, Xilinx, Inc. in partnership with UMC announced the first FPGA product built with 0.25 micronprocess technology.

• In early 1996, UMC purchased a 10 percent stake in Catalyst Semiconductor as part of a foundry agreement.Also under the agreement, UMC and Catalyst will jointly develop 0.5µm and 0.35µm process technologies,geared for flash memory products. The first 0.5µm flash devices were shipped in 4Q96.

• In 4Q95, Alliance Semiconductor granted UMC a license to produce for itself a certain number of AllianceDRAM products in return for DRAM manufacturing capacity.

• UMC’s joint venture IC foundry, United Semiconductor Corporation (USC), was announced in 1995 inpartnership with Alliance Semiconductor and S3 Inc. The fab began production in 3Q96 of 200mm wafers forUMC, Alliance, S3, and other semiconductor firms. UMC owns 50 percent of the venture.

• UMC’s second joint venture foundry fab, United Integrated Circuits Corporation (UICC), is a partnership with ATITechnologies, ESS Technology, Integrated Silicon Solution Inc., Lattice Semiconductor, Oak Technology,OPTi Inc., and Trident Microelectronics. The 200mm wafer fab began production in mid-1997. UMC owns 50percent of the venture.

• UMC’s third joint venture fab, United Silicon Inc. (USI), is a partnership with Alliance Semiconductor, CirrusLogic, and Xilinx. The 200mm wafer fab is expected to begin production in 1Q98. UMC will own 50 percent ofthe venture.

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Valence Semiconductor Rest of World Company Profiles

VALENCE SEMICONDUCTOR

Valence Semiconductor Design Ltd.Units 1-7, 19/F., Apec Plaza

49 Hoi Yuen Road, Kwun TongKowloon, Hong Kong

Telephone: (852) 2656-1151Fax: (852) 2652-2301

Fabless IC Supplier


1 9 9 2 1 9 9 3 1 9 9 4 1 9 9 5 1 9 9 6 1 9 9 7 *

Sales 18 24 32 40 48 —

Employees 35 40 42 45 50 —

*Company did not disclose.


Valence started in 1985 designing chips for clients overseas, who were often large multinational companies. Overthe years, Valence has gained crucial experience in state-of-art chip design process and design flow.

Valence has over thirty ASIC engineers, which is the largest IC design team in Hong Kong. Valence’s engineersdesign projects in system development and user-interface in new applications.

Valence designs and manufactures application-specific system-on-a-chip semiconductor components formultimedia and consumer products, and also sells its own chips. Moreover, it has licensed designs to multi-national companies in U.S.A., Europe, Korea, Taiwan, and Singapore.

Management

Thomas Wan Chief Executive OfficerRaymond Choi President

Products Under Development

ASICs for telecommunications, PC system, consumer and multimedia applications.


Rest of World Company Profiles Vanguard International Semiconductor

VANGUARD INTERNATIONAL SEMICONDUCTOR (VIS)

Vanguard International Semiconductor CorporationScience-Based Industrial Park

123 Park Avenue IIIHsinchu 30077, Taiwan

Telephone: (886) (3) 5770355Fax: (886) (3) 5785026

Web Site: www.vis.com.twE-mail: [email protected]

[email protected]



North America: VIS Micro Inc. • San Jose, CaliforniaTelephone: (408) 577-1833 • Fax: (408) 895-5595

Europe: Vanguard Microelectronics, Ltd. • Blisworth, Northants, U.K.Telephone: (44) 2604-859-543 • Fax: (44) 1604-859-542

Asia: Daiwa Sanko • Tokyo, JapanTelephone: 44-2604-859-543 • Fax: 44 -1604-859-542

Marubun Corporation • Tokyo, JapanTelephone: 03-3639-9977 • Fax: 03- 5645-5330

Vision Memory Co., LTD. • Kowloon, Hong KongTelephone: 852-2344-1964 • Fax: 852-2344-5712


1 9 9 7

Net Revenue 344Net Income (2)

Employees 1,891

Ownership: 30 percent Taiwan government, 27 percent TSMC, 43 percent private investors.

http://www.vis.com.tw

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Vanguard International Semiconductor Rest of World Company Profiles


Vanguard International Semiconductor (VIS) is focused on the research, development, design, manufacture,packaging, testing, and marketing of standard and application-specific memory ICs, as well as related componentsand system products.

VIS was formed in 1994, as the result of privatization of the Sub-Micron CMOS Process Technology DevelopmentProject, a four-year research project sponsored by the Taiwanese government under the Electronics Researchand Service Organization (ERSO) of the Industrial Technology Research Institute (ITRI). Among the devicesdeveloped by the project were 4M and 16M DRAMs and 4M SRAMs. In mid-1994, a local consortium led by TSMCbought the lab’s assets, including a small-scale 200mm wafer fab. VIS is now owned 27 percent by TSMC, 30percent by the Taiwanese government, and the remainder by local investors.

VIS sells its products primarily to customers in the local market, but its customers can also be found in otherSoutheast Asian countries, Europe, and the United States. International sales represented approximately one-third of total revenues in 1996.

VIS is aggressively planning the set-up of a second fab. Their short term goal is to start mass production of 64MbDRAM by 1998, and to develop niche products. In addition to DRAM products, VIS will attempt to developSynchronous DRAM, Logic, and other memory products as well. In the next two to three years, VIS plans to enterthe market of logic products.

Management

Morris Chang, Ph.D. ChairmanFeng-Churng Tseng, Ph.D. PresidentS.J. Paul Chien Vice President, Sales and MarketingRobert Hsieh Vice President, FinanceC.Y. Lu, Ph.D. Vice President, OperationsSteve Pletcher Managing Director, VIS Micro Inc.


VIS’s semiconductor products include DRAMs, SRAMs, and application-specific memories (ASMs), but its fabcurrently produces mostly 16M DRAMs using 0.4µm and 0.37µm process technologies.

In March 1996, Vanguard claimed to be the first Taiwanese IC company to develop and show a fully functional 64MDRAM. The prototype part is based on a 0.4µm process, but the company plans to migrate the device down to0.35µm in the near future. The earliest 64M device is expected to begin shipping in 1998. An 8M SGRAM for 3Dgraphics is also said to be under development.

DRAM SIMM and DRAM DIMM are part of the VIS product line. The non-DRAM portion of VIS’ product line arechips for speech recognition.


Rest of World Company Profiles Vanguard International Semiconductor

The research and development of VIS will work on the next generation products — 64Mb DRAM and 256MbDRAM — to provide the system industry with more advanced products and efficient services.


VIS completed the expansion of Fab 1A and the construction of a second fab (Fab 1B) in Hsinchu. Fab 1B beganproduction of 16M DRAMs on 200mm wafers in 2Q97 and plans to move to 64M DRAMs in 1998.

VIS VISScience-Based Industrial Park Science-Based Industrial ParkHsinchu, Taiwan Hsinchu, TaiwanFab 1A Fab 1BCleanroom size: 62,540 square feet Cleanroom size: 100,640 square feetCapacity (wafers/week): 4,000 Capacity (wafers/week): 8,250Wafer size: 200mm Wafer size: 200mmProcess: CMOS Process: CMOSProducts: DRAMs, SRAMs Products: DRAMsFeature sizes: 0.37µm, 0.4µm (0.35µm capable) Feature size: 0.35µm (0.25µm capable)

(Began production in 1Q97).

VIS-America, a design center in the Silicon Valley, California, U.S.A., provides additional product developmentand design.

Key Agreements

• In mid-1997, Vanguard International Semiconductor and Texas Instruments announced a ten-year worldwidesemiconductor cross-license patent agreement. This agreement enables both companies to use each other’spatents involved in making semiconductor products. This is the first semiconductor patent between aTaiwanese company (VIS) and TI.

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VIA Technologies Rest of World Company Profiles

VIA TECHNOLOGIES

VIA Technologies, Inc.8F, 533, Chung-Cheng Rd.

Hsin-Tien, TaipeiTaiwan, R.O.C.

Telephone: (886) (2) 218-5452Fax: (886) (2) 218-5453

Web Site: www.via.com.tw

Fabless IC Supplier


North America: VIA Technologies • Fremont, CaliforniaTelephone: (510) 683-3300 • Fax: (510) 683-3301


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Chipset Sales 140 169.5 —Capital — — 700

Employees — — 180

1997 operating growth was reportedly at 100 percent over 1996.


Founded in 1987, VIA Technologies Inc. is a privately held company with funding support through membership inTaiwan’s Formosa Plastics Group, a $10 billion multinational conglomerate.

Using a fabless approach, VIA designs and develops increasingly integrated, high-performance, PC-centric,desktop and portable computer system logic and peripheral controller chips. Based on shipment revenues, VIAranked number one in the worldwide PC chipset market in 1997, second in 1996, and third in 1995. The companyclaims to be the top supplier of Socket-7 chipsets and is a major supplier of Slot-1 chipsets.

VIA Technologies, Inc. is moving a wide range of previously board-resident PC system functions onto chips. Inproducing core logic and peripheral controller chips, VIA relies on its proprietary expertise in IC design andestablished IC foundry relationships. The company’s goal is to become the recognized alternative to Intel for PC-centric core logic ICs.

VIA’s customers include Compaq Computer and NeoSystems (using VIA’s VP2 chipset for its Modular DigitalArchitecture PC concept) in the U.S. and Taiwan’s First International Computer (FIC) and Shin Ming.

http://www.via.com.tw


Rest of World Company Profiles VIA Technologies

In addition to direct sales programs in Europe, North America, and the Far East, VIA Technologies usesmanufacturers’ representatives on a worldwide basis.

Management

Shir Wang ChairmanWen-Chi Chen President and Chief Executive OfficerTzu-Mu Lin Vice President, EngineeringDean Hays Vice President, Marketing, U.S. OperationsFrank Jeng Manager, Marketing Section


VIA has foundry relationships with Toshiba and Taiwan Semiconductor Manufacturing Corporation. VIA is usingadvanced CMOS and bipolar technologies from these foundries.

One of VIA’s core proprietary technologies is its Virtual Clock Synchronization (VCS). VCS refers to the use ofdelay-lock-loop (DLL) to enable synchronous and pseudo-synchronous operation of the processor and DRAM,AGP and PCI buses. The pseudo-synchronous setting allows the CPU and memory buses to be set at differentspeeds. VIA claims advantage of this is that non-PC100 main memory can be set to run stable at more traditionalbus speeds even when the CPU bus is running at 100MHz.

VIA offers six Socket-7 chipsets (including the 100MHz Apollo VP2/97), one Slot-1 chipset, one 10/100 BaseTand two PCI 10 BaseT network controllers, and the following peripherals: PCI-to-USB bridge, PCMCIA socketcontroller, PCMCIA controller, clock generator, two real-time clocks, and a keyboard controller.

In January 1998, VIA announced that the Apollo MVP3 was in mass production and had a customer base of 20leading OEMs. VIA claims the MVP3 is the first 100MHz core logic chipset available in mass production quantities.The predecessor VP3 was the first to support AGP, as does the MVP3. The MVP3 is positioned to deliverperformance comparable to current Pentium II-based systems. VIA’s VCS technology, noted above, was the keyenabler for the MVP3. The chipset supports all Socket-7 designs including IDT’s WinChip C6.

Key Agreements

• In February 1998, VIA hosted a seminar for Cyrix’s (a National Semiconductor company) announcement of itsnext generation MediaGX microprocessor, the MXi. VIA appears to be supplying Cyrix with key technology forthe MXi which is due in the Q4 1998 and is targeted at the sub-$1000 PC market. VIA has worked with Cyrix fora number of years to support their line of processors along with those of other Intel competitors.

• In February 1997, VIA announced a licensing agreement with Advanced Micro Devices (AMD). The agreementlicenses VIA’s VT82C590 Apollo VP2/97 chipset architecture to AMD. The VP2/97 supports Microsoft PC97and features a two-chip design with up to 2Mb Cache, support for all Socket-7-level processors and up to512Mb of mixed combination SDRAM, EDO and FPM DRAMs. AMD write allocation and Cyrix/IBM linear burstmode are also supported.

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VIA Technologies Rest of World Company Profiles

• The relationship with AMD has been ongoing for several years and had some problems in 1996, due tochannel conflict with mutual customer Compaq Computer, as well as foundry partner TSMC. Most of theproblems were attributed to poor communications between the companies which were resolved by 1997.

• Partnering with several chipset makers, Samsung began working mainly with VIA in 1996, to develop a chipsetto support Samsung's bi-directional, center DQ design of a 200MHz DDR SDRAM. The relationship hasprogressed from an x-16 configuration to development of an x-32 configuration.

• In August of 1996, VIA was among several companies which joined forces to form a new open standardorganization called the PC Common Architecture. The standard will push ISA device users to migrate to PCIbus systems in order to accelerate system I/O. The goal is to provide full support of legacy components, bettersystem performance, lower cost, and the ability to mix peripherals.


Rest of World Company Profiles Winbond Electronics

WINBOND ELECTRONICS

Winbond Electronics CorporationScience-Based Industrial Park

Number 4, Creation Road III Hsinchu, Taiwan

Telephone: (886) (3) 5770066Fax: (886) (3) 5792668

Web Site: www.winbond.com.tw



North America: Winbond Micro Electronics Corporation • San Jose, CaliforniaTelephone: (408) 943-6666 • Fax: (408) 943-6668


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Sales 120 185 330 676 450 462Net Income — 12 81 342 170 120R&D Expenditures 12 19 25 31 35 51Capital Expenditures — 55 150 254 350 374

Employees 1,310 1,630 1,940 2,390 2,400 3,000


Winbond Electronics was established in 1987, to design, produce, and market VLSI products to personalcomputer, telecommunications, and consumer electronics industries. Its primary IC products include DataCommunication ICs, Foundry Services, Memory ICs, Microcontroller ICs, Multimedia ICs, Personal Computer ICs,Speech ICs, Telephony ICs, and Visual Communication ICs. In addition, Winbond boosted its foundry businesswith its 1997 opening of Fab IVA and B, which now runs 15K, 8 inch wafers per month at full capacity. Thecompany is building another 8 inch fab, scheduled to be on-line mid-1999.

http://www.winbond.com.tw

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Winbond Electronics Rest of World Company Profiles

Management

Ding-Yuan Yang, Ph.D. PresidentChing-Chu Chang Executive Vice President, DRAM IC Business GroupYung Chin Vice PresidentMichael Liao Assistant Vice PresidentArchie Yeh Assistant Vice PresidentIn-Skek Hsu Assistant Vice President and Director of Sales


Winbond’s IC products include memory ICs (64K to 4M high-speed SRAMs, low-power SRAMs, EPROMs, andflash memories), PC I/O controllers, LAN controllers (including Fast Ethernet controllers), telephone dialers,speech synthesizer ICs, 4-bit and 8-bit microcontrollers, MPEG-1 and MPEG-2 decoders, and JPEG decoders.The company also provides foundry services for 3.3V and 5.0V CMOS logic, embedded SRAM and flash memory,and embedded DRAM (starting in 1998). Details on these products are as follows.

Data Com IC’s

• ISDN – Internet access and telecommuter applications• 128Kbps data rate with built in FIFO and one or two channel HDLC controllers

• LAN Network – Multiport repeater controller, fast Ethernet controller with PCI and MII interface• WVM TX fast Ethernet transceiver

Memory

• High Speed CMOS SRAM• (256K to 4Mbit @ 3.3V, 12 to 20ns)• (64K to 4Mbit @ 5V, 12 to 20ns)

• Synchronous High Speed SRAM (1Mbit to 4Mbit @ 3.3V, 4ns to 6ns)

• Slow Speed CMOS SRAM• (64K to 1Mbit @ low power, 70ns)• (128K to 1Mbit @ 5V, 25 to 35ns)• (256K to 1Mbit @ super low power, 3V (70ns), 5V (55ns)

• NVRAM CMOS Flash Memory (512Kbit to 2Mbit)

• EEPROM (256Kbit to 1Mbit)

Microcontrollers

• 4 or 8-bit ROMless (1Mbit to 2 Mbit RAM)• 4 or 8-bit MTPROM (32K to 256K MTPROM, with 1Mbit to 2Mbit RAM)• 4 or 8-bit MASROM (32Kbit to 256K MaskROM with 1Mbit to 2Mbit RAM)



Multimedia

• MPEG-1 and MPEG-2 Audio Decoder, Video Decoder, A/V System Decoder• Video DACs (8-bit DAC-MOX with Genlock PLL)

PC ICs

• PC Chipsets• Real time clocks• USB Doners• Serial and parallel port controller• CD-ROM Chipsets• Hardware Memory

Speech ICs

• Voice Recorder Series (Reference Information Storage Devices)• Speech Synthesis ICs

Telephony ICs

• Telephone Dialer ICs• D-TAD• Cordless• Pagers

In addition, Winbond offers monitor controller ICs and visual communication ICs (i.e. video conferencing, etc.).

Winbond had previously planned to enter the DRAM market during 1997, with a 16M part, but announced itsdecision to bypass development of 16M DRAMs and move directly to 64M DRAMs. Winbond licensed both 16Mand 64M DRAM technology from Toshiba. DRAM production will be run in Winbond’s new Fab IV.

Currently, Winbond’s consumer products are manufactured using 0.8µm CMOS process technologies. Thecompany’s SRAM products are fabricated with 0.4µm and 0.6µm CMOS processes. DRAM processes arecurrently using 0.25µm technology with plans to migrate to 0.18µm after 2000.


In October 1997, Winbond’s Fab III was shut down due to fire damage. The site will be used to build their new FabV, to be in production by 3Q99. Meanwhile, construction continues on Fab IV, which will share production withToshiba (see Key Agreements).

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Winbond Electronics Rest of World Company Profiles

Winbond Electronics Corporation Winbond Electronics CorporationScience-Based Industrial Park Science-Based Industrial ParkNumber 4, Creation Road III Number 4, Creation Road IIIHsinchu, Taiwan Hsinchu, TaiwanFab I Fab II Cleanroom size: 11,680 square feet (Class 10) Cleanroom size: 35,000 square feet (Class 1)Capacity (wafers/week): 5,000 Capacity (wafers/week): 8,100Wafer size: 125mm Wafer size: 150mmProcess: CMOS Process: CMOSProducts: Consumer, foundry services Products: SRAMs, NVRAM, consumer, computer,Feature sizes: 0.8µm foundry services.

Feature sizes: 0.4µm-0.6µm

Winbond Electronics Corporation Winbond Electronics CorporationNumber 4, Creation Road III Number 4, Creation Road IIIScience-Based Industrial Park Science-Based Industrial ParkHsinchu, Taiwan Hsinchu, TaiwanFab IV (Startup in 1998) (Class 1) Fab IV B (Class 1)Capacity (wafers/week): 5,800 Capacity (wafers/week): 3,500Wafer size: 200mm Wafer size: 200mmProcess: CMOS Process: CMOSProducts: Embedded DRAMs Products: DRAMsFeature sizes: 0.35µm, (0.25µm future) Feature sizes: 0.25µm, (0.18µm future).

Production beginning 1999.

Key Agreements

• In July 1997, Winbond and Information Storage Devices, Inc. (ISD) announced a research and developmentalliance to produce flash-based memory products. The chipcorder technology and ISD will be the basis for newdesigns, allowing single chip voice recording capabilities without A/D or D/A conversion. Applications willinclude cellular phones, pagers, personal voice recorders, phone recorders, fax machines, printers andPCMCIA cards.

• In April 1997, Winbond announced the signing of a memorandum of understanding (MOU) with AsianSemiconductor Manufacturing Corporation (ASMC) to assist ASMC’s investment and preparatory team inestablishing a new semiconductor foundry. ASMC’s main shareholder, China Development, invited Winbondto join the investment project to provide the necessary technical assistance to help establish ASMCsemiconductor foundry in the shortest possible timeframe. Production is slated for the second half of 1998.Total fab investment will be about ten billion NT Dollars (approximately $355M). Two billion NT Dollars will becontributed by China Development, Winbond Electronics, and Syntek Design Technology.

• In 1997, Winbond made a 20 percent equity investment in Taiwanese start-up, Worldwide SemiconductorManufacturing Co. (WSMC), valued at $73 million. As part of the agreement, Winbond will provide technologyand funding for WSMC’s first wafer fab, a dedicated wafer foundry, in return for wafer capacity.



• In 1996, Winbond licensed Aspec Technology Inc.’s Open Design Implementation Technology (DIT). Thelicense includes use of Aspec’s gate array architecture, the EDA design kit, and custom compilers forWinbond’s 0.5µm process. Winbond will use the DIT technology to produce PC chipsets, multimediaproducts, and HP PA/RISC-based microcontrollers.

• Winbond and Toshiba entered into an alliance in late 1995 for the manufacture and cooperative developmentof leading-edge semiconductor memory products. The agreement calls for Toshiba to provide Winbond withproduction technologies for 16M DRAMs and next generation 1M high-speed SRAMs. In addition, Toshiba willuse Winbond as a foundry for a portion of its 16M and 64M DRAM capacity. Production will take place inWinbond’s new 200mm Fab IV, 0.35µm fab, which is under construction and will begin operations in 1998.Winbond will also market the DRAMs under its own logo.

• Winbond increased its ownership of Symphony Laboratories from 58 percent to 100 percent. Under the termsof the agreement, Symphony became a division of Winbond, changing its name to Winbond SystemsLaboratory.

• Winbond acquired flash technology from Silicon Storage Technology and the two companies are developinglow-voltage EPROM chips.

• Winbond licensed Hewlett-Packard's PA-RISC microprocessor technology and has the right to design,manufacture, and sell the chips for use in low-priced, high-volume products such as X-terminals, printers, andmultimedia applications.

Noteworthy News

• In February 1998, the U.S. Department of Commerce issued a Final Schedule of SRAM company penaltiesagainst Taiwanese and Korean memory manufacturers. As part of the schedule, Winbond must pay duties of102.88 percent.

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Worldwide Semiconductor Manufacturing Corp. Rest of the World Company Profiles

WORLDWIDE SEMICONDUCTOR MANUFACTURIN G CORPORATION

Worldwide Semiconductor Manufacturing Corporation999 East Arques Avenue

Hsinchu, TaiwanTelephone: (408) 822-0100

Fax: (408) 822-0199Web Site: www.wsmc.com.tw


Ownership: Privately held; 20 percent Winbond; 34 percent China Development Corp., Hambrecht and Quistand other financial institutions; 27 percent Yue Loong Group, China Steel and other investors; 13percent employees.


Worldwide Semiconductor Manufacturing Corporation (WSMC) is an IC wafer foundry, formerly named AsianSemiconductor Manufacturing Corporation. This new company is in the process of erecting their first waferfabrication facility in Hsin-Chu, Taiwan.

The Company will use Winbond’s 0.35-micron logic process that has been licensed in exchange for providingfoundry work to Winbond. In addition to this agreement, WSMC and Winbond have agreed to codevelop a 0.25micron process. WSMC also has established a relationship with Toshiba to produce Toshiba’s logic ICs, static RAMchips, and embedded-DRAM technology.

Management

Kuang-Yi Chiu PresidentLanny Ross Chief Executive Officer and ChairmanWayne Liang Vice President, Marketing


Worldwide Semiconductor Manufacturing Corporation is constructing a 0.35/0.25-micro fab in the Science-basedIndustrial Park that will produce its first silicon in July 1998, and to be in full production by the end of 1999.Expected wafer capacity will be approximately 25,000 wafers per month. The construction of the fab is to becompleted in April or May 1998.

WSMC has aggressive plans to become a major competitor in the wafer foundry business. Future plans to build asecond line of 20,000 8 inch wafers per month is scheduled for in 1999. A 12 inch wafer fab at a new science parkin the southern Taiwan city of Tainanm, is also planned for 1999.

http://www.wsmc.com.tw


Rest of the World Company Profiles Worldwide Semiconductor Manufacturing Corp.

Key Agreements

• Worldwide Semiconductor Manufacturing and Winbond made an agreement to have 150 Winbond employeesto move permanently to WSMC in exchange for foundry services for Winbond. As part of the agreement,WSMC will repay Winbond for the technology and employee transfers after Worldwide’s own revenue stream isestablished. WSMC has licensed Winbond’s 0.35 micron logic process. Also under a separate agreement, thetwo companies will codevelop a 0.25 micron process.

• In December 1997, Worldwide Semiconductor Manufacturing purchased Promis Systems’ ManufacturingExecution (MES) and Automation Systems and associated services. Promis Systems develops and marketsan integrated set of functionally-rich software products and services which help semiconductor and precisionelectronics manufacturers plan, monitor, automate and control production.

WaferTech LLC (see TSMC

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