VIRTUAL CORPORATIONS: THE COLLABORATE TO INNOVATE IMPERATIVEAlberto Sangiovanni-VincentelliThe Edgar L. and Harold H. Buttner Chair of EECS University of California at Berkeley Co-Founder, CTA and Member of the Board Cadence Design Systems

Collaborate to Innovate

Firms will focus more sharply on what they do best, and they will enlist a growing diversity of suppliers for the rest. Organizations will increasingly look outside their walls not just to reduce costs but for innovation in processes, product and service differentiation to free up resources, transform their businesses, and facilitate sustainable competitive advantage. As supply networks become more global and complex, winning will depend on transparency, trustworthiness, and reciprocity. In a word: collaboration. (Alan McCormack et al. (HBS)) The ideal collaboration model is the Virtual Corporation where the different firms involved in collaboration act as if they were division of the same corporation (or even better!!).

OUTLINEThe Innovation collaborative landscape today Examples of collaboration The need of deeper collaboration for the future Necessary components of collaboration

Silicon Valley: The land of Innovation

Silicon Valley: The land of Innovation

Pasteurs QuadrantConsiderations of Use?NO Pure Basic Research (Bohr) YES Use-Inspired Basic Research (Pasteur)

YES

Quest for Fundamental Understanding?NO Pure Applied Research (Edison)

D. Stokes

Organizing for High-Impact R&DShared Vision: The Moon Shot

Sponsor

Sponsor

Group

Group

Project

Project

Project

Project

The role of VCs in the Industrial Innovation Landscape As a complementary lens on technological and market change VCs see the world differently

As a window on global technology development Technology is global and driven by local/regional needs

As a supplement to or portfolio hedge against internal R&D programs Not even the best and biggest corporate R&D can cover all possibilities

To drive new/expanded market development or other strategic (non-R&D) objectives (Intel; Microsoft) Must be very well defined

Explicitly to develop risky new ideas that will initially flourish better outside the corporation (Cisco) A form of outsourcing of innovation

OUTLINEThe Innovation-Research Landscape Examples of collaboration The need of deeper collaboration for the future Necessary components of collaboration

Challenge: Design Chain IntegrationAutomotive IndustryAutomakers 2005 Revenue $1.1T CAGR 2.8% (2004-2010)

Tier 1 Suppliers90%+ of revenue from automotive

2004 Revenue ~$200B CAGR 5.4% (2004-2010)

IC Vendors~15% of revenue from automotive

2005 revenue $17.4B CAGR 10% (2004-2010)Source: Public financials, Gartner 2005

The refuse-to-collide car!

Digital Short Range V2V communication

The Tire of the FutureNew materials: enhanced performances, reduced rolling resistance, lower noise, reduced puncture risk, nanotechnologies, new compounds, new tread design, self sealing technologies. New design technologies: virtual engineering for reducing time to market & engineering costs.

New electronics technologies inside the tire: pressure monitoring, friction, slip, tire consumption, contact force, health check-up information extraction & transmission.... The Tire as an Intelligent Sensor!

Cyber Tyre Intelligent Tire System

Vehicle dynamics control system

User Applications

Processing unit

Receivers

CyberTyre CyberTyre

Cyber Tyre Intelligent Tire System

Major broadcast channel in Italy

Vehicle dynamics control system

User ApplicationsMarco Tronchetti Provera Chairman of Pirelli & C. S.p.A.

Processing unit

Receivers

CyberTyre CyberTyre

Experimental TestsWide database Different tires Different sensor positioning Different speeds Different tracks Steering pad Straight line Braking Acceleration ...

Tyre inside Accelerometers

Different conditions Dry Wet Ice

Tread Length Estimation Tread length60q6500c ap0derp0 - Segnale filtrato -Tangenziale Centrale -Giro:1

Minimum of the tangential component signal: tread area entry Maximum of the tangential component signal: tread area exit

PL = Np / c Rrot

100

50

[m/s 2]

0

-50

PL : tread lengthRrot : rolling radius : angular speed c : sampling rate100 200 300 400 500 600 700 [punti] 800 900 1000 1100

-100

-150

Np

CyberTyre Development PartnersPolitecnico di MilanoFeature Extraction, Kinematics pre-conditioner

Politecnico di TorinoPrototype Vehicle Integration, Engineering Support

Valtronic Technologies SAPower Management RX/TX antenna Pico-radio communication block Data processing and computing Energy Scavenging

UMCIP and chip manufacturing

assembly and packaging technologies

Encrea S.r.L.Breakthrough energy supply and power management technologies

University of California, BerkeleyUltra low power radio Advanced new communication protocols

Physical properties sensoring system (e.g. pressure, temperature, acceleration)

Accent S.p.A.acquisition, processing and advanced architectural technologies

Collaborating to Create the iPhoneSST SST25VF080B 1 MB Serial Flash SAMSUNG Application Processor and DDR SDRAM ST MICROELECTRONICS LIS331 DL Accelerometer INFINEON SMP3i SMARTi Power Management IC SKYWORKS SKY77340 Power Amp. Module INFINEON UMTS Transceiver

NATIONAL SEMICONDUCTOR LM2512AA Display Interface

TRIQUINT TQM666032 WCDMA/HSUPA Power Amp. TRIQUINT TQM676031 WCDMA/HSUPA Power Amp. TRIQUINT TQM616035 WCDMA/HSUPA Power Amp. INFINEON Digital Baseband Processor

BROADCOM BCM5974 Touchscreen Controller

WOLFSON WM6180C Audio Codec INFINEON PMB2525 Hammerhead II GPS LINEAR TECHNOLOGY LTC4088-2 Battery Charger/ USB Controller NXP Power Management

NUMONYX PF38F3050M0Y0CE 16 MB NOR + 8 MB Pseudo - SRAM

Collaborating to Create the iPhoneSST SST25VF080B 1 MB Serial Flash SAMSUNG Application Processor and DDR SDRAM ST MICROELECTRONICS LIS331 DL Accelerometer INFINEON SMP3i SMARTi Power Management IC

INFINEON Digital Baseband ProcessorSKYWORKS SKY77340 Power Amp. Module INFINEON UMTS Transceiver

NATIONAL SEMICONDUCTOR LM2512AA Display Interface

TRIQUINT TQM666032 WCDMA/HSUPA Power Amp. TRIQUINT TQM676031 WCDMA/HSUPA Power Amp. TRIQUINT TQM616035 WCDMA/HSUPA Power Amp. INFINEON Digital Baseband Processor

BROADCOM BCM5974 Touchscreen Controller

WOLFSON WM6180C Audio Codec INFINEON PMB2525 Hammerhead II GPS LINEAR TECHNOLOGY LTC4088-2 Battery Charger/ USB Controller NXP Power Management

NUMONYX PF38F3050M0Y0CE 16 MB NOR + 8 MB Pseudo - SRAM

Collaboration on Mixed-Signal and RF Chip Design for Medical Application Challenge: create technology solution to accurately track and identification large volumes of blood sample tubes Who: Silicon Valley startup company How: revolutionary antenna-on-chip wireless technology Tagent No Battery Active Tag Uses Ultra Wide Band (UWB) to Collaboration efficiently send tag data Mixed-Signal design by Cadence Fabrication by IBM SiGe processLocates tag within 1 meter or less Completed Tag size 2mm X 2mm IBM 180nm SiGe process

OUTLINEThe Innovation-Research Landscape Examples of collaboration The need of deeper collaboration for the futureBrain-machine interfaces Energy-Efficient Buildings

Necessary components of collaboration

The Emerging IT SceneInfrastructural core

Sensory swarm

Mobile accessSource: J. Rabaey

Exponentials Bound to Continue

EE Times, January 07, 2008

5 Billion people to be connected by 2015 (Source: NSN) The emergence of Web2.0 The always connected community network

7 trillion wireless devices serving 7 billion people in 2017 (Source: WirelessWorldResearchForum (WWRF) 1000 wireless devices per person?[Courtesy: Niko Kiukkonen, Nokia]

The Birth of Societal IT Systems*:Looking Beyond the Devices

Complex collections of sensors, controllers, compute and storage nodes, and actuators that work together to improve our daily lives

Source: J. Rabaey

*Also known as SiS

Brain-Machine Interfaces The Ultimate in Immersion

Example: Emotiv, IncSource: J. Rabaey

Brain-Machine InterfacesThe Application of Neuroscience Examples Cochlear implants, Deep-brain stimulation for Parkinsons disease Spinal cord injuries/amputees (upper-limb prosthesis) Estimated population 200,000 people in the US 11,000 new cases in the US every year

[ Nicolelis, Nature, 2001]

[Lebedev, SA, 2006][Sources: National Institutes of Health, Neurology journal]

ECoG (Electrocortigography) A Great Learning and Instrumentation ToolSpectral Contents: 0-140 Hz

Courtesy: B. Knight, UCB Neuroscience Institute

Building Energy Demand Challenge Buildings consume 39% of total U.S. energy 71% of U.S. electricity 54% of U.S. natural gas

Energy Breakdown by Sector

Building produce 48% of U.S. carbon emissions Commercial building annual energy bill: $120 billion The only energy end-use sector showing growth in energy intensity 17% growth 1985 - 2000 1.7% growth projected through 2025Sources: Ryan and Nicholls 2004, USGBC, USDOE 2004

Energy Intensity by Year Constructed

28

Systems of Systems Approach to Energy EfficiencyConsider Buildings as Composition of SubsystemsBuildings Design Energy and Economic Analysis Windows and Lighting HVAC Domestic/International Policies, Regulation, Standards, Markets Demonstrations, Benchmarking, Operations and Maintenance Sensors, Controls, Performance Metrics Power Delivery and Demand Response Building Materials, Misc. Equipment Natural Ventilation, Indoor Environment Networks, Communications, Performance Database

Integration: The Whole is Greater than the Sum of the Parts

Building Systems Integration ChallengesComplex* interconnections among building components HETEROGENEITY Components do not necessarily have mathematically similar structures and may involve different scales in time or space

SIZE The number of components may be large/enormous

DISTRIBUTED NETWORKED SYSTEMST. Oden and L. Petzold, Appled Mathematics at the U.S. Department of Energy: Past, Components can be connected in a variety Present and a View to the Future, DOE Report, LLNL-TR-401536, May 2008. of ways, most often nonlinearly and/or via a network. Local and system wide phenomena may depend on each other in complicated ways * D.L. Brown, J. Bell, D. Estep, W. Gropp, B. Hendrickson, S. Keller-McNulty, D. Keyes, J.

EMERGING BEHAVIOR IN COMPOSITION Overall system behavior can be difficult to predict from the behavior of individual components. May evolve along qualitatively different pathways that may display great sensitivity to small perturbations at any stage

Full Facility Subsystems and their Interconnection (Sketch)Building Operating Conditions Cost Utilities Weather

Safety & Security Envelope Structure Information Management

Fire / Smoke Detection and Alarm

Video

Facility access

Building Geometry

Building Insulation

Building Management System

IT Network

Loads

Office Equipment

Water Heating

Other Loads

Lighting

Motion Sensors

Lights & Fixtures Information

Heating, Ventilation, Air Conditioning

Thermostat

Heating & AC Equipment

Distribution (Fans, Pumps)

Thermal Power

Electrical

On-Site Gen Distribution Grid

Interface that is exploited

Engineering Tomorrows DesignsSynthetic Biology The creation of novel biological functions and tools by modifying or integrating well-characterized biological components into higher-order systems using mathematical modeling to direct the construction towards the desired end product.Building life from the ground up (Jay Keasling, UCB) Keynote presentation, World Congress on Industrial Biotechnology and Bioprocessing, March 2007.

Development of foundational technologies: Tools for hiding information and managing complexity Core components that can be used in combination reliably32

Pioneering Synthetic Biology

Moving from ad-hoc to structured design[Reference: Scientific American, June 2006]

OUTLINEThe Innovation-Research Landscape Examples of collaboration The need of deeper collaboration for the future Necessary components of collaboration

The Design Integration NightmareSpecification: Implementation:

P. Picasso, Blue Period P. Picasso Femme se coiffant 1940

Collaboration in Flexible Platforms with Integration EmphasisDebug

OMAP 3 platform architecture

Up to 4 heterogeneous processors Dozens of peripherals Aggressive power requirements

OMAP 3

SONICS Interconnect

ARM

MPEGImage Processing

3D GFX Data Movers Event Handlers

Collaboration challenges Teams spread across 3 continents Many IP suppliers ARM, Imagination, Mentor Graphics, Sonics, Synopsys, TI

Internal Memory Security

W-CDMA

Integration platform solutions Interface-based design using OCP socket Sonics communication network

Image courtesy of Sonics, Inc. [Source: Texas Instruments]

Market Drives Cross-Domain Solutions that REQUIRE COLLABORATIONCommunication ApplicationMedical Entertainment Navigation Automotive Structural Wired Radio Optical

ImplementationHardware Software Mechanical Chemical Biological

Even common devices require collaboration in design

Analog/RF Mixed signal Digital

Collaboration requires standardization of models and interfaces for design handoff

Todays models and interfaces are mainly low level

Need to raise the level of abstraction to enable collaboration

To Enable CollaborationWe need an integration platform To deal with heterogeneity: Where we can deal with Hardware and Software Where we can mix digital and analog Where we can assemble internal and external IPs Where we can work at different levels of abstraction

To handle the design chain To support integration tool integration IP integration

The integration platform must subsume the traditional design flow, rather than displacing it

Designing Platforms: the IC Company ViewApplication Spacee

Ideal Architectural Platform

Using Platforms: the System Company View

Ideal Application Platform

Application Space

Architectural Space

The Platform Concept Meet-in-the-Middle Structured methodology that limits the space of exploration, yet achieves good results in limited time A formal mechanism for identifying the most critical hand-off points in the design chain A method for design re-use at all abstraction levels

Texas Instruments OMAP

An intellectual framework for the complete electronic design process!

Platform-Based DesignApplication Space Architectural SpacePlatform Instance Application Instance

Platform Mapping

Platform Design-Space Export

Platform: library of resources defining an abstraction layer Resources do contain virtual components i.e., place holders that will be customized in the implementation phase to meet constraints Very important resources are interconnections and communication protocols

Fractal Nature of DesignPlatform Instance Function Space Platform Design-Space Export Platform (Architectural) Space

Mapped

Function Instance

Platform Instance

Function Space Function Instance

Mapped

Platform (Architectural) Space

Platform Instance

The Design SCIENCE Dilemma

Raffaello Sanzio, The Athens School

Systems of Systems Co-Design: Using a Unified MethodNew design paradigms: Integrated multi-domain models analyzed in multiple levels topology mechanical/electrical systems multi-scale controls sensors and networks BMSBuilding Siting Mechanical and Electrical Systems Architecture

specifications constraintsMechanical and Electrical Systems

Program Research Thrusts Choice of Layers Design Flow/Methodology Co-simulation Environment Pilot Studies

Control Architecture

specifications constraintsControl Design Network DesignCommunication Latency0.0014 0.0012 0.001 seco nds 0.0008 0.0006 0.0004 0.0002 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Packet # No bitstuffing Extact bit stuff. worst-case

Courtesy UTC

specifications

Final implementation

Platform-based Design Environment for Synthetic Biological SystemsDouglas Densmore (EECS), J.Christopher Anderson (Bioengineering), Alberto Sangiovanni-Vincentelli (EECS)

Clotho (Greek: ) the "spinner" spun the threads of life with her distaff to bring a being into existence. Clotho is a design environment for the creation of biological systems from standardized biological parts. Composed of views, connectors, interfaces and tools Separation of concerns methodology.

BioBricks

iGEM 2008 Winner Best Software Tool and Gold Medal iGEM jamboree in November. Alpha version available at biocad-server.eecs.berkeley.edu/wiki.GSRC Annual Symposium

SynBio Tool LandscapeComputation/Simulation Tools Tinkercell (UW) Viz-a-Brick (DavidsonMissouri Western) BioJADE (UCB) BioMortar (Waterloo) Gene Designer (DNA 2.0) GenoCAD (VTech) BioStudio (Johns Hopkins)

Parts Registry (MIT) Data Management Tools

APE (Utah)

Design/Analysis Tools

More info: http://biocad-server.eecs.berkeley.edu/wiki/index.php/Related_Work

Educational Challenge

The Way Forward

Electronic and System Industry facing an array of complex problems from design to manufacturing involving complexity, power, reliability, reconfigurability, integration, embedded software Design Methods and Tools lacking: active research field Innovation of this magnitude is difficult to achieve Collaboration is needed between government, IC, and system industry, otherwise the situation is bound to become more critical. Not an issue of languages or point tools!

The Way Forward

Electronic Industry facing an array of complex problems from design to manufacturing involving complexity, power, reliability, reconfigurability, integration, embedded software Design Methods and Tools lacking: active research field EDA vendors have to extend their reach into the system space Innovation of this magnitude is difficult to achieve Collaboration is needed between government, IC, and system industry, otherwise the situation is bound to become more critical. Not an issue of languages or point tools!

Collaborate to Innovate