Yole Intel RealSense 3D camera module and STM IR laser 2015 teardown reverse costing report...

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 1

Electronic Costing & Technology Experts

www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]

September 2015 – written by David Le Gac

http://www.systemplus.fr/index.php?lang=ge&page=home.php

http://www.systemplus.fr/index.php?lang=ge&page=home.php

mailto:[email protected]

mailto:[email protected]

RealSense 3D Camera Module

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1. Overview/Introduction 3– Introduction

– Company Profile : Intel

– Reverse Costing Methodology

2. Physical Analysis 7 RealSense DK Teardown

RealSense 3D Camera Module Views

RealSense 3D Camera Module Teardown

Electronic Boards• Main Board – Top Side – Global View

• Main Board – Top Side – High Definition Photo

• Main Board – Top Side – Components Markings

• Main Board – Top Side – Components Identification

• Main Board – Bottom Side – Global View

• Main Board – Bottom Side – High Definition Photo

• Main Board – Bottom Side – Markings

• Sensors Board

• IR Laser Projector Board

3. Cost Analysis 33– Accessing the BOM

– Estimation of the cost of the PCBs

– Estimation of the Cost of the Intel S419NN68

– Estimation of the Cost of the Aptina Visible Sensor

– Estimation of the Cost of the Torex IR Sensor

– BOM Cost - Main Board

– BOM Cost - Sensors Board

– BOM Cost – IR Laser Projector Board

– Material Cost Breakdown

– Accessing the Added Value (AV) cost

– Main Board Manufacturing Flow

– Details of the Main Board AV Cost

– Details of the 3D Camera Module Assembly AV Cost

– Added Value Cost Breakdown

– Manufacturing Cost Breakdown

4. Estimated Price Analysis 62– Estimation of the Manufacturing Price - Intel

Contact 65


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This Reverse Costing analysis has been conducted in several phases :

• The initialization of the analysisPictures of the elements to be studied.Identification of the components.

• Description of the material in the “SYScost+” softwareCreation of an “estimation project” of the studied board with SYScost+ software.Construction of the Bill of Material (BOM).

• Assessing the materialSearching for the price of each reference among distributors and manufacturers.Assessing the cost of the PCB and of the unaccounted references (unknown by distributors)The BOM is valued with SYScost+ : price simulation according to the requested quantities.

• Assessing the assembling and test phasesAssembly and test lines are modeled with the SYScost+ software.The assembly and tests costs are estimated.

• Production cost & selling priceEstimation of the production cost & selling price.

• ReportA report is edited.

SYScost+©, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. Moreinformation on the software can be found at www.systemplus.fr.

http://www.systemplus.fr/


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IR CameraFull HD 1080p Image Sensor

Power Led Indicator

IR Laser Projector

Front view.

Rear view.

Side view.

Shielding

Thermal Paste Sheet

110mm

12

.5m

m


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September 2015 – Version 1 – Written by Sylvain HALLEREAU


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Glossary1. Overview / Introduction 4

– Executive Summary

– Reverse Costing Methodology

2. Company Profile 8– STMicroelectronics

3. Physical Analysis 13– Synthesis of the Physical Analysis

– Physical Analysis Methodology

– RealSense F200 15

– IR Laser Projector 18

– Package Views, Dimensions & Pin Out

– Lens Line

– Laser Diode

– Resonant Micro-Mirror 30

– View, Dimensions & Marking

– Opening

– Resonant Micro-Mirror

– Comb

– Thickness

– Bonding

4. Manufacturing Process Flow 45– Global Overview

– Micro-Mirror Process Flows

– IR Sensor Wafer Fabrication Unit

– Packaging Process Flows

– Package Fabrication Unit

5. Cost Analysis 56– Main steps of economic analysis

– Yields Hypotheses

– Micro-Mirror Front-End Cost

– Micro-Mirror Front-End Step Cost

– Micro-Mirror Die Cost

– Packaging Cost

– Component Cost

6. Estimated Price Analysis 74– Manufacturer Financial Ratios

– Estimated Selling Price

Contact 77


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• This full reverse costing study has been conducted to provide insight on technology data,

manufacturing cost and selling price of the IR Laser Projector which is included in the Realsense F200

from Intel.

• The IR Laser Projector has been found in the Realsense F200, it emits a structured pattern of class 1

infrared light used to determine the dimensional characteristics of objects by the depth camera. The

module can be integrated in the laptop, tablets or added at a PC.

• The IR Laser Projector is built around a low power class 1 IR laser diode and the PM53A Micro-Mirror.

• The PM53A is a new resonant Micro-Mirror from STMicroelectronics for Consumer applications.

• Based on complete physical analysis of the resonant Micro-Mirror and the IR laser projector, this

report provides the manufacturing cost of the infrared laser projector.

• The analysis of the RealSense F200 module is performed in a second report.


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F200 module IR Laser Projector

Housing


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Cap

back view Lateral view

The IR Laser Projector is encapsulated in a metal and plastic package.

X pins per package: X pins for the laser and X pins for the resonant micro-mirror by a flex.

Dimensions : XXmmx XXmm x XXmm

Metal frame

IR Window: X x X x Xmm

Window Flex, connected to the micro-mirror

xxmm

xxmm

XXmm

2 pins, connected to the laser


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XXmm

XX

mm

Resonant Micro-Mirror Die Overview

PGDW: Potential Good Dies per Wafer

• Die Area: XXmm²(XX x XXmm)

• Nb of PGDW per 8-inch wafer: XX– Assuming scribe line of 100µm

• Pad number: 3

– Connected: 3


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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimatescompleted by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on themanufacturing cost (if all parameters are cumulated).

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

• Consulting and Specific Analysis

– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]

– Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.Email: [email protected]

– RoW: Jean-Christophe Eloy, President & CEO, Yole DéveloppementEmail: [email protected]

• Report business

– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]

– Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service Email: [email protected]

– Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.Email: [email protected]

– Korea: Hailey Yang, Business Development Manager, Korean OfficeEmail: [email protected]

• Financial services

– Jean-Christophe Eloy, CEO & PresidentEmail: [email protected]

• General

– Email: [email protected]

Yole Intel RealSense 3D camera module and STM IR laser 2015 teardown reverse costing report...

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Transcript of Yole Intel RealSense 3D camera module and STM IR laser 2015 teardown reverse costing report...