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Transcript of Silicon Semiconductor Solutions for Wireless Technology · Silicon Semiconductor Solutions for...
IBM, Systems and Technology Group, Microelectronics Division, 200mm Specialty Foundry
David Harame, IBM Fellow, IEEE Fellow
Silicon Semiconductor Solutions for Silicon Semiconductor Solutions for Wireless TechnologyWireless Technology
© 2011 IBM CorporationD. Harame, November 7, 2012, ISA CXO Conclave, Bangalore, India
IBM, Essex Junction, Vermont
David Harame, IBM Fellow, IEEE Fellow
IBM, Systems and Technology Group, Microelectronics Division, 200mm Specialty Foundry
Future Trends in Wireless Devices
75,000
100,000
125,000Source: iSuppli Wireless Systems Q1 2011 Market Tracker
� Semiconductor Industry being fueled by the internet connectivity of things
© 2011 IBM CorporationD. Harame, November 7, 2012, ISA CXO Conclave, Bangalore, India2
0
25,000
50,000
2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015
Cordless Phones 1G/2+G 3G
4G Gray Market Handsets Media Tablets
Mobile Wireless Broadband Access Fixed Wireless Broadband Access Wireless LAN Client Access
Wireless LAN Access Point/Router Mobile Comm Infrastructure Battery Chargers for Mobile Comm.
Other Wireless Communications
IBM, Systems and Technology Group, Microelectronics Division, 200mm Specialty Foundry
2G2G 3G3G
Cellular Transmission StandardsGSM = Global Systems for Mobile CommunicationsEDGE = Enhanced Data rates for GSM Evolution
Multiple Bands needed to accommodate mobility vs. data rate
UMTS = Universal Mobile Telecommunication SystemCDMA = Code Division Multiple AccessHSPA = High Speed Packet Access
LTE = Long Term Evolution
© 2011 IBM CorporationD. Harame, November 7, 2012, ISA CXO Conclave, Bangalore, India3
802.11ac
2G2G 3G3G
4G4G
LTE = Long Term Evolution
IBM, Systems and Technology Group, Microelectronics Division, 200mm Specialty Foundry
Explosive Growth in Mobile Data TrafficNetworks struggling to keep up
Informa Telecoms & Media“in North America 86% of mobile data traffic is currently generated by smartphone users, notably those using an iPhone or high-end Android devices," notes Malik Kamal-Saadi, principal analyst at Informa Telecoms & Media.
Average traffic per (smartphone) user (ATPU) -will increase by a staggering 700% over the next five years.
Worldwide Phenomenon: Developed Developing
Smart Phone
© 2011 IBM CorporationD. Harame, November 7, 2012, ISA CXO Conclave, Bangalore, India4
Worldwide Monthly Mobile Data Traffic
Worldwide Phenomenon: Mobile Broadband Traffic Doubles Every Year
Developed CountriesData services (e.g. iPhone) 3G WiMAX, LTE deployments X10 increase capacity per base station + more stations
Developing CountriesGrowth of mobile users worldwideAdditional billion users added in 2 years
� Driven by consumer demand for data vs. voice (social networking, internet, media)
� Multiple radios
� Multiple Power Amplifiers (PA)
� Multiple antennas
� Complex Power Management
� Sensors
IBM, Systems and Technology Group, Microelectronics Division, 200mm Specialty Foundry
Specialty Foundry Focus Segments
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© 2011 IBM CorporationD. Harame, November 7, 2012, ISA CXO Conclave, Bangalore, India5
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IBM, Systems and Technology Group, Microelectronics Division, 200mm Specialty Foundry
Microelectronics revenue by market segment
OEM Semiconductor Revenue History
70%
80%
90%
100%
Per
cent
of R
even
ue
A&D
© 2011 IBM CorporationD. Harame, November 7, 2012, ISA CXO Conclave, Bangalore, India66
0%
10%
20%
30%
40%
50%
60%
70%
2003 2004 2005 2006 2007
Per
cent
of R
even
ue
A&DConsumerCommunicationsITBase
IBM, Systems and Technology Group, Microelectronics Division, 200mm Specialty Foundry
Analog & Mixed Signal– Differentiate with New Devices, Structures and Design Kits not LithographyProcessors�Scale with lithography �CMOS device innovation for
performance
Analog & Mixed Signal Circuits � Do not always shrink with
lithography� Integration of discrete functions
into Silicon � New structures for higher voltage,
© 2011 IBM CorporationD. Harame, November 7, 2012, ISA CXO Conclave, Bangalore, India7
�Lower voltage and new materials for lower power
�Circuit simulation models for extreme numbers of transistors and high levels of integration
� New structures for higher voltage, power management
� Circuit simulation models focused on precision for RF accuracy
� Client Collaboration
IBM, Systems and Technology Group, Microelectronics Division, 200mm Specialty Foundry
IBM Specialty Foundry Segment Alignment
RF CMOS
SiGeBiCMOS
5HPE5HP/AM/5HP/AM/DM/PA
8RF 9RF
IPD
High Performance RF/AMS
6WL
6HP/DM
6RF 7RF
7HP
7WL 8WL
8HP/8XP* 9HP*
7TG
1KW5PAe 1KW5PAe 5PAe
5PA
© 2011 IBM CorporationD. Harame, November 7, 2012, ISA CXO Conclave, Bangalore, India8
90 nm90 nm130 nm130 nm250 nm250 nm 180 nm180 nm350 nm350 nm
RF CMOS
RF SOI
CMOS
HV CMOS
6SF 7SF
8RF
8SFG
9RF
9SF 9LP
Technologynode
Tech
nolo
gy
*In developmentQualified
PA/FEMs & Transceivers HV & Power Management
7HV
7RF SOI
6RF 7RF 7TG
CMOS Foundation
500+ nm500+ nm
IBM, Systems and Technology Group, Microelectronics Division, 200mm Specialty Foundry
IBM’s 200mm Fabrication Strategy� Special Technologies including RFCMOS, SiGe BiCMOS, Sensors,
High Voltage CMOS, and ASICs� Development and Manufacturing in the same facility� Based on n-1 Lithography nodes for commodity
© 2011 IBM CorporationD. Harame, November 7, 2012, ISA CXO Conclave, Bangalore, India9
Semiconductor Manufacturing Facility
Essex Junction, Vermont, USA
IBM, Systems and Technology Group, Microelectronics Division, 200mm Specialty Foundry
IBM technologies for smartphone applications
Power control
Cellular transceivers /
Switch
PA
PA
PA
PA
Antenna tuner
Single-pole/multi-throw switchRF SOI
Cellular front-end moduleintegration opportunitiesRF SOI
Antenna tunersRF SOI, RF MEMS
Cellular power ampsRF SOI, SiGe, RF CMOS
Cellular transceivers
Power controlRF CMOS
IBM technologies
� Today the cellular market is driving technology directions and growth
© 2011 IBM CorporationD. Harame, November 7, 2012, ISA CXO Conclave, Bangalore, India10
Applications processors
Digital baseband processors
Memory
Cellular transceivers /Analog baseband
TV tuner
Wireless SoC transceiver
(GPS, BT, Wi-Fi)
Wi-Fi switch /
LNA
PA
Pow
erm
anagement Memory
Application processors Technology Development Alliance/ Common Platform technology
Wi-Fi RF switch, LNARF SOI
Wi-Fi power ampsSiGe
Wi-Fi front-end moduleintegration opportunitiesSiGe, RF SOI
Processor integration opportunities
TV tuner SiGe, RF CMOS
Power managementHV CMOS
Wireless SoC transceiver (GPS, Bluetooth, Wi-Fi)
RF CMOS, CMOS
Cellular transceiversRF CMOS, SiGe
IBM, Systems and Technology Group, Microelectronics Division, 200mm Specialty Foundry
What is the Front End Module?• Primary Transmit/Receive
interface to the radio antenna of any mobile or fixed telemetry device
• Consists of four primary components
– PA core: GaAs, CMOS, SiGe
– DC-DC converter: CMOS
– RF Switch: SOI, GaAs, SOS
Typical Handset Radio Board
PA Core
DC Controller
RF Switch
© 2011 IBM CorporationD. Harame, November 7, 2012, ISA CXO Conclave, Bangalore, India111111
SOS
– Filters, Duplexers & Passives
IBM Offering• 7RFSOI, SiGe 5PAE• Utilizes 180nm and 350nm Lithography
PA/FEM Modules
Filters/DuplexersPassives
IBM, Systems and Technology Group, Microelectronics Division, 200mm Specialty Foundry
RF Front End Module Schematic Representation
Receiver
Data
Low NoiseReceive Amp
narrow
5 GHz BPF
Rx A - LAN
Rx B - LAN
Tx A - LAN
Bas
eban
d IC
� Primary TX/RX interface to the antenna of any mobile or fixed telemetry device
� Includes� Transmit power amp� Receive low noise amplifier� RF switches� PA Controller� Filters
© 2011 IBM CorporationD. Harame, November 7, 2012, ISA CXO Conclave, Bangalore, India12
Data Modulator
Power Amp
narrow band filter
Simple FEM:walkie talkiecordless head setone band WiFi
Intermediate Complexity FEM:2G cell phoneDual band WiFi
2.4 GHz BPFTx B - LAN
Bluetooth
Bas
eban
d IC
Complex FEM:4G smartphone
IBM, Systems and Technology Group, Microelectronics Division, 200mm Specialty Foundry
ANT
How did IBM address the RF-Switch
� Approach: Adapt or merge existing technologies to solve the problem
� Kery Parametrics:�Low on resistance so no signal loss�Low off capacitance so no RF signal “leaks” around it when it is off
� Solution: Take the best characteristics of SOI for processors and RF Bulk Technology for handling the RF
© 2011 IBM CorporationD. Harame, November 7, 2012, ISA CXO Conclave, Bangalore, India13
RX
TX Pf0Ron
Coff
and RF Bulk Technology for handling the RF
IBM, Systems and Technology Group, Microelectronics Division, 200mm Specialty Foundry
mmWave for Gbps Communication Links
E-band E-band60GHz
71-76 and 81-86 GHz E-band is attractive for high data rate communication backhaul and “Last mile” internet connectivity
© 2011 IBM CorporationD. Harame, November 7, 2012, ISA CXO Conclave, Bangalore, India14
56 66 71 76 81 86Freq [GHz]
mmWave range is defined at 30-300GHz (L= 10 mm to 1mm)• 60GHz and E-Band (70 & 80GHz) spectrum availability enables high capacity wide bandwidth applications • 10GHz (2 x 5GHz) of spectrum available in E-Band with light licensing requirements in many regions• Data speeds from 1GBit/s to 10GBits/s for short hop links (1-2km)
Commercial E-Band Small Cell Solution
56MHz 5GHz
Channel bandwidth comparison:Microwave vs mmWave
38 71 76
IBM, Systems and Technology Group, Microelectronics Division, 200mm Specialty Foundry
050
100150200250300350400
0.01 0.10 1.00 10.00 100.00
freq
(G
Hz)
fTfmax
\
SiGe BiCMOS adapted to RequirementsSiGe NPN
Transistor
© 2011 IBM CorporationD. Harame, November 7, 2012, ISA CXO Conclave, Bangalore, India15
Ic (mA)
Silicon
CA Oxide / NitrideSilicide
Metal
Back side Metal
Si substrate
T
S
V���
���
��
�
��
LowerInductance
ImproveGain
IBM, Systems and Technology Group, Microelectronics Division, 200mm Specialty Foundry
Integrated Circuit Design System
Frequency Domain ADS, Golden Gate, Eldo Harmonic BalanceSpectre RF Compatible
Schematic CaptureVirtuoso-XL Schematic
LayoutParameterized Cells (PCells)Virtuoso-XL LayoutEditor
Res
imul
atio
n
Mixed-SignalVerilog-A/MS templateCadence AMS Designer
Simulation Environment
Cadence Analog Artist
Device-level TransientSpectre, HSpice, PowerSpice
MOSFETs (RF & Digital)BJTsResistorsCapacitorsVaractorsDiodesInductorsESD DevicesTransnission LinesParasitics
Design Environment Simulators Device Models
© 2011 IBM CorporationD. Harame, November 7, 2012, ISA CXO Conclave, Bangalore, India16
Spectre RF CompatibleVirtuoso-XL LayoutEditor
Parasitic ExtractionLVS Extraction with
Cadence Assura RCXSequence Columbus RFSynopsys Star RCX
Design VerificationLVS/DRCHierarchical Checking Calibre, Hercules, Assura
Res
imul
atio
n
GDS II
Parasitics
FastHSIM, UltraSIM
Skew File
IBM, Systems and Technology Group, Microelectronics Division, 200mm Specialty Foundry
IBM Specialty Foundry Enable Multiple End Markets
DigitalCameras
Game platforms
GPS
Set-top Box
Optical Transceivers
Laptops /Tablets
Satellite
© 2011 IBM CorporationD. Harame, November 7, 2012, ISA CXO Conclave, Bangalore, India17
DTV/HDTV
Cell phones
Digital Video Cameras
WLANAccess Point/Femtocells
PMPs
AutomotiveBase stations /Networking
MIDsSmartphones
Smart Meters