Product End-of-Life Disassembly Instructionsh22235.€¦ · HP Laptop PC 17 Purpose: The document...

EL-MF877-00 Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions Product Category: Notebooks and Tablet PCs

Marketing Name / Model [List multiple models if applicable.] HP Laptop PC 17

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description Notes Quantity of items included in product

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

With a surface greater than 10 sq cm M/B

1

Batteries All types including standard alkaline and lithium coin or button style batteries Main battery

1

Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries

0

Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm

Includes background illuminated displays with gas discharge lamps 17.3''

1

Cathode Ray Tubes (CRT) 0 Capacitors / condensers (Containing PCB/PCT) 0 Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height

0

External electrical cables and cords Power cords 1 Gas Discharge Lamps 0 Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)

0

Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent chambers, and service stations.

0

Components and waste containing asbestos 0 Components, parts and materials containing 0

http://standards.corp.hp.com/elclass/AMF87701.htm

EL-MF877-00 Template Revision B

PSG instructions for this template are available at EL-MF877-01

refractory ceramic fibers Components, parts and materials containing radioactive substances

0

2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if

applicable) Electric screwdriver (Cross) #1, Cross ODD BRKT support fixture Support fixture 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Follow steps described in Disassembly instruction (file attached) 2. If parts can be removed without using a tool, remove it first 3. Use correct screwdriver and torque value before unlock the screw. 4. 5. 6. 7. 8.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).

http://standards.corp.hp.com/elclass/AMF87701.htm

MANUFACTURING PROCESS INSTRUCTIONS

MECHANICAL ASSEMBLY MODEL : Harry Potter 17”

Tabulator：Chang Nevil Auditor：Lee Chung-Sheng

Standard Operation Procedure

Document No. : Harry Potter 17” (Snape / Dumbledor) FA SOP Station :

Name : Ver. : Date :

Step：

Holding fixture list (holding fixture standard) Qty Holding fixture list (holding fixture standard Qty

Notes : If finding anything uncommon, notice foreman or assistant at once.

Tabulator： Department： Lee Chung-Sheng NPSU-PIE Auditor ： Chang Nevil

1. Loosen screws M2.5x6 *4

Loosen screws 1.00 2018/3/20

2

1 4

3

1(1/1)

Electric screwdriver #1 1




Step：




Remove Rubber

1. Remove Rubber

Rear

Front

下殼腳墊選用配置

D cover Front rubber Rear rubber

DF Jet Black 6054B2049301 6054B2049401

Snow White 6054B2049302 6054B2049402

FF

Smoky Grey 6054B2049303 6054B2049403

Sapphire Blue 6054B2049304 6054B2049404

Velvet Burgundy 6054B2049305 6054B2049405

Serenity Mint 6054B2049306 6054B2049406

FF+

Natural Silver 6054B2049307 6054B2049407

Pale Gold 6054B2049308 6054B2049408

Scarlet Red 6054B2049309 6054B2049409

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2(1/1)




Step：




1. Loosen screws M2.5x6 *6 。

Loosen screws

1 5

2

4 3

6

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3(1/1)





Step：




1. Disassemble ODD(Fig2) 2. Loosen screws M2x2*2 (Fig.1) 3. Disassemble ODD Bezel

Disassemble ODD

Fig1

1

2

Fig2

1.01 2018/3/8

4(1/1)





Step：




1. Put ODD on the support fixture (Fig1/Fig2)。

2. Loosen M2x2.5* 1 , and disassemble ODD BRKT

(Fig1/Fig2)。

Disassemble ODD BRKT


ODD BRKT support fixture 1

Fig1

Fig2

螺絲拆解孔鐵件定位孔

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5(1/1)




Step：




1. Disassemble D cover

Disassemble D cover

Fig1

1

2 2

3 3

1.00 2018/3/20

6(1/1)




Step：




Loosen battery screws

1. Loosen batteryscrews M2x3*4 (Fig1)

Fig1

1 4

3 2

1.00 2018/3/20

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Step：




1. Disassemble DDR(Fig1) 2. Disassemble battery(Fig2)

Disassemble DDR & BATT

Fig1

DIM

M1

DDR

Fig2

1.00 2018/3/20

8(1/1)




Step：




1. Disconnect WLAN Antenna cable

terminal (Fig1)

Disconnect Antenna cable

Fig1

1.00 2018/3/20

9(1/1)




Step：




1. Remove Antenna Cable (Fig1)

Remove Antenna cable

Fig1 Fig2

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Step：




1. Loosen SSD, WLAN Module screws M2x3 *2(Fig1 ~3)

2. Disassemble SSD & WLAN Module

Loosen SSD、WLAN Module screws


Fig1

Fig2

Fig3

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Step：




Disassemble SSD/B

SSD bracket 1. Disconnect SSD/B FFC CNTR from M/B

(Fig1)

2. Loosen screws M2x3*2(Fig2) 3. Disassemble SSD/B & SSD BRKT

、

Fig1


Fig2 2

1

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Step：




HDD

1. Disconnect HDD FFC CNTR from M/B(Fig2) 2. Disassemble HDD from C Cover, (Fig1) 3. Disassemble HDD Bumper(6051B1243301)

Disassemble HDD

Fig1

OK NG NG

Fig2

Fig3

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Step：




1. Disconnect eDP Cable CNTR from M/B (Fig1)

2. Remove eDP cable(Fig1) 3. Disconnect ODD/B FFC CNTR

Disconnect EDP & ODD/B FFC CNTR

Fig1

Fig2

Fig3

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Step：




1. Open the machine to 135degrees and place it on the fixture

2. Loosen Hinge screws M2.5x6*4 in the order 1 2 3 4

Disassemble Hinge hp

Fig2

Fig1

Support fixture 1


Fig3

Fig4

1

2

3

4

1.00 2018/3/20

15(1/1)




Step：




1. Disconnect FFC & Pick Button CNTR，(Fig1)

Disconnect pick button FFC CNTR

Fig1

1.00 2018/3/20

16(1/1)




Step：




1. Disconnect TP PCB CNTR，(Fig1) 2. Disconnect KB BL FPC CNTR only for BL

SKU(Fig1)

Disconnect TP & KB backlight FFC

Fig2

Fig1

1.00 2018/3/20

17(1/1)




Step：




1. Disconnect USB FFC CNTR， (Fig1) 2. Disconnect KB membrane CNTR上(Fig2)

Disconnect USB FFC&KB CNTR

Fig1

背膠

背膠

Fig2

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Step：




1. Loosen FAN screw M2x3*2(Fig1) 2. Loosen MB screw M2x3*1(Fig2) 3. Loosen Hook screw M2x3*1(Fig.3)


Loosen FAN /Hook screws

Fig1

Fig2

1

2

3

4

Fig3

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19(1/1)




Step：




1. Disconnect Speaker Cable CNTR(Fig1) 2. Tear off the tape 3. Disconnect FAN CNTR(Fig2) 4. Disassemble Fan

Disconnect Speaker & FAN CNTR

Fig1

Fig2

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20(1/1)




Step：




1. Loosen Thermal Module screws (Fig1/2) M2*3(6052A0035101)*4 (UMA) M2*3(6052A0035101)*6 (Discrete) M2*3(6052A0035101)*4 (Fan-less) 2. Disassemble Thermal Module or Fan-

less BRKT (Fig2/Fig1)


Loosen screws

Fig1

1

2

3

4

6

5

Fig2

1

2

3

4

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Step：




1. Loosen M/B screws M2x3*4(Fig1)

Loosen MB screws

Fig1

1

2

4

3


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Step：




1. Fan-less SKU Tear off the Mylar(6054B2058101)(Fig1)

2. Disassemble DC-In Jack and M/B

Fig1

Fig1

缺口對齊

Disassemble MB 1.00 2018/3/20

24(1/1)




Step：




1. Disconnect USB/B FFC (Fig1)

2. Disconnect DC-in Cable

Disconnect USB/B FFC & DC-in cable

Fig1

6035B0184001 Cvilux

6035B0186001 玖東

Fig2

DC-in Cable FOXCONN(富士康) 6017B0738701

Singatron(信音) 6017B0738801

實盈 6017B0738901

TE(泰科) 6017B0739001

1.00 2018/3/20

25(1/1)

Product End-of-Life Disassembly Instructionsh22235.€¦ · HP Laptop PC 17 Purpose: The document...

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