HP Environment: Product End-of-Life Disassembly instructionsh22235.€¦ · HP Z840 Workstation...
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EL-MF877-00 Page 1 Template Revision B PSG instructions for this template are available at EL-MF877-01 Product End-of-Life Disassembly Instructions Product Category: Workstations Marketing Name / Model [List multiple models if applicable.] HP Z840 Workstation Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE). NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact. 1.0Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Item Description Notes Quantity of items included in product Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) With a surface greater than 10 sqcm Yes 4 Batteries All types including standard alkaline and lithium coin or button style batteriesYes 1 Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm Includes background illuminated displays with gas discharge lamps Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB/PCT) Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height Delta 1125W PSU 6 External electrical cables and cords Gas Discharge Lamps Plastics containing Brominated Flame Retardantsweighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)
Transcript of HP Environment: Product End-of-Life Disassembly instructionsh22235.€¦ · HP Z840 Workstation...
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions Product Category: Workstations
Marketing Name / Model [List multiple models if applicable.]
HP Z840 Workstation
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE). NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description Notes
Quantity of items included in product
Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)
With a surface greater than 10 sqcm Yes
4
Batteries All types including standard alkaline and lithium coin or button style batteriesYes
1
Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm
Includes background illuminated displays with gas discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height
Delta 1125W PSU 6
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardantsweighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing refractory ceramic fibers
Components, parts and materials containing radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if applicable)
Screwdriver T-15
Screwdriver PH2
Screwdriver
Micro shear 170II
Solder iron
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove/disengage any security devices that prohibit opening the workstation 2. Disconnect the power cord from the electrical outlet and then from the workstation. 3. Disconnect all peripheral device cables from the workstation. 4. Remove the access panel.(see Figure 1 below) 5. Remove the internal parts.(see Figure 2-4 below) 6. Disconnect Graphics Power Cable.(See Figure 5 below) 7. Disconnect Front USB3.0/ Front UI/ Front Audio Cable.(See Figure 6 below) 8. Disconnect SATA cables from the MB.(see Figure 7-8 below) 9. Disconnect Fan cables from MB.(See Figure 9-10 below) 10. Disconnect all power cables from the MB.(see Figure 11-15 below) 11. Remove HDD/ODD from chassis.(see Figure 16-19 below) 12. Remove the graphic card/ memory/ CPU heatsink/ CPU from MB.(See Figure 20-24 below) 13. Remove the battery from the MB .(see Figure 25 below) 14. Remove the speaker from chassis.(see Figure 26-28 below) 15. Release the hood sensor cable from clip.(see Figure 29 below) 16. Remove all fan from chassis and duct.(see Figure 30-37 below) 17. Remove the MB from chassis.(see Figure 38 below) 18. Remove Right side panel from chassis and cut all cable tie.(see Figure 39-41 below) 19. Remove Front USB3.0/ Front UI/ Front Audio Cable from chassis.(see Figure 42 below) 20. Remove HDD power cable from chassis.(see Figure 43 below) 21. Remove all other power cable from chassis.(see Figure 44 below) 22. Remove FIO assebly from chassis.(see Figure 45-46 below) 23. Remove PSU cover and side (see Figure 47-49 below) 24. Remove main PCB.(see Figure 50-52 below) 25. Remove Fan.(see Figure 53 below) 26. Remove componet from PCB.(see Figure 54-57 below) 27. Dispose of all removed components according to regulatory requirements.
EL-MF877-00 Page 3
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PSG instructions for this template are available at EL-MF877-01
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 4
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PSG instructions for this template are available at EL-MF877-01
Figure1 Remove the Access Panel.
Figure2 Remove the PCIe Card Retender.
Figure3 Remove the Memory Fan Duct.
Figure4 Remove the Memory Fan Housing Guide.
Figure5 Disconnect the Graphics Power Cable.(3 pcs) Figure6 Disconnect the Front Audio Cable/ Front UI cable/ Front USB3.0 Cable from MB.
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Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure7 Disconnect the HDD SATA Cable from MB.(4 pcs)
Figure8 Disconnect the ODD SATA Cable from MB.
Figure9 Disconnect the Front Fan Cable from MB.(2pcs)
Figure10 Disconnect the Rear System Fan Cable from MB.
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PSG instructions for this template are available at EL-MF877-01
Figure11 Release the PCI Card Guide from front chassis.
Figure12 Disconnect the P1 Power Connector from MB.
Figure13 Disconnect the P3 Power Connector from MB.
Figure14 Disconnect the P2 Power Connector from MB.
Figure15 Disconnect the P4 Power Connector from MB.
Figure16 Release the HDD Tray from HDD Bay.(4 pcs)
EL-MF877-00 Page 7
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure17 Remove the HDD from HDD Tray.
Figure18 Disconnect Power Cable& SATA cable from ODD.
Figure19 Press up the ODD latch and push out the Slim ODD and Mid/ Btm ODD Filler.
Figure20 Remove the Graphic Card from MB by pushing the PCIe Retainer.
Figure21 Remove the memory from MB.
Figure22 Remove the CPU0 Heatsink from MB.
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PSG instructions for this template are available at EL-MF877-01
Figure23 Rotate the CPU ILM handle (2pcs) and open it up.
Figure24 Remove the CPU from the ILM.
Figure25 Remove the Battery by pressing the sheet metal.
Figure26 Remove the PSU by pull the handle.
Figure27 Disconnect the Speaker cable.
Figure28 Remove the Speaker from Chassis.
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Figure29 Release the Hood Sensor Cable from clip.
Figure30 Remove the screw from Rear System Fan.(8pcs)
Figure31 Separate the Fan Guard from Rear System Fan.
Figure32 Remove Front System Fan from PCI Card Guide.
Figure33 Remove Memory Fan Duct Outer Cover from 2 sides.
Figure34 Cut the cable tie and disconnect all the fan cable from memory fan main connector.
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Figure35 Drag all fan cable out and remove memory fan main connector.
Figure36 Remove all fan from Memory Fan Duct.(5pcs)
Figure37 Separate CPU0 Fan Guard.
Figure38 Cut the cable tie of Front USB3.0/ Front IO/ Front UI cable and remove MB from chassis.
Figure39 Loosen the screw on foot rubber and remove the Right Side Panel from chassis.
Figure40 Cut all the power cable tie.(4 pcs)
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Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure41 Cut front IO cable tie and P4 power cable tie.
Figure42 Disconnect Front USB3.0/ Front UI/ Front Audio and remove them.
Figure43 Disconnect HDD power cable, and remove them with screw driver.
Figure44 Release the Main Power Connector from chassis, and remove all of the power cable out.
Figure45 Loosen screws from Front Panel.(4pcs)
Figure46 Remove the FIO Assembly from chassis.
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PSG instructions for this template are available at EL-MF877-01
Figure47 Loosen the PSU case screws.(11 pcs)
Figure48 Cut the cabled tie for C3 wire.
Figure49 Release housing C1&C2&C3 from case side
Figure50 Cut the cable tie for LN wire, FAN wire.
Figure51 Loosen main PCB screw. (5 pcs)
Figure52 Cut L/N wire
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Template Revision B
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Figure53 Loosen fan screw.(8 pcs)
Fig 54 Cut the output wire & led wire
Figure55 Remove capacitors use solder iron
Figure56 Remove capacitors in main PCB (C1A,C1B,C1C diameter or height are more than 25mm)
Figure57 Remove capacitors in main PCB (C952, C953, C955 diameter or height are more than 25mm).
C1C C1A C1B
C952 C955 C953
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Template Revision B
PSG instructions for this template are available at EL-MF877-01
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