NEPP ETW 2018: Can Chip Polymer Tantalum Capacitors ......Workshop, Greenbelt, MD, June 2018 AC...
Transcript of NEPP ETW 2018: Can Chip Polymer Tantalum Capacitors ......Workshop, Greenbelt, MD, June 2018 AC...
Can Chip Polymer Tantalum Capacitors Manufactured to AEC-Q200 Requirements
be used for Space Applications?
Alexander TeverovskyAS&D, Inc.
Work performed for Parts, Packaging, and Assembly Technologies Office,
NASA GSFC, Code [email protected]
NASA Electronic Parts and Packaging (NEPP) Program
List of Acronyms
To be presented by A.Teverovsky at the NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop, Greenbelt, MD, June 2018
AC alternative current HTS high temperature storage
AEC automotive electronic council MC molding compound
C capacitance NT new technology
COTS commercial off the shelf OCM original component manufacturer
CPTC chip polymer tantalum capacitors QA quality assurance
DF dissipation factor RT room temperature
ESR equivalent series resistance S&Q screening and qualification
FPGA field-programmable gate array SCD source control drawing
HALT highly accelerated life testing WGT Weibull grading test
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Abstract
To be presented by A.Teverovsky at the NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop, Greenbelt, MD, June 2018
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This presentation analyses quality assuranceapproaches used by automotive industry and usingpolymer tantalum capacitors as an example, reviewspossible ways of COTS insertion in space systems.Specifics of polymer tantalum capacitors in comparisonwith traditionally used MnO2 tantalum capacitors arediscussed.
Outline
Significance of COTS and automotive industry components for space applications.
What are polymer tantalum capacitors? Specifics of CPTCs as compared to MnO2 capacitors.
How to assure reliability for parts with degrading parameters? (ESR degradation in CPTCs)
Anomalies in behavior of CPTCs. How to mitigate risks of using CPTCs for space?
To be presented by A.Teverovsky at the NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop, Greenbelt, MD, June 2018
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Processes of AEC-Q Parts Insertion
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Are automotive parts COTS components? COTS = non-MIL? or COTS = non-SCD? Automotive parts = parts compliant with AEC-Q?
Two approaches for COTS insertion:1. Reliability of COTS is inferior to MIL parts, and to qualify for space
extensive testing per the existing requirements are necessary.• The major concern is cost and time of qualification rather than
technical issues.2. COTS are NT devices.
• New mechanisms might require new testing techniques.• Existing procedures for S&Q have to be evaluated and adjusted.
“COTS as NT” approach requires understanding of new degradation mechanisms, specific reliability issues, and development of adequate S&Q procedures.
The consistency of COTS quality still remains a problem.
Components for Space are Coming from the COTS World
To be presented by A.Teverovsky at the NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop, Greenbelt, MD, June 2018
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Future cars will be sensors and computers on wheels.
The cost of cars will be mostly dueto electronics.
Automotive components is the fastest growing market, ~10%/year.(→ Current shortage of components; OCMs are running at full capacity.)
Requirements for automotive components are comparable to MIL and these parts are the first choice for selection for space.
Temp from -40 ºC to +165 ºC Vibration 0-2000Hz Acceleration up to 50g Life time 10-15 years (mostly non-operational);
self-driving cars: 1-2 years intensive operation
A. Aal, Volkswagen, IRPS’17
http://green-electronic-tutorial.blogspot.com/2018/04/.html
What Components are Used in Cars?
To be presented by A.Teverovsky at the NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop, Greenbelt, MD, June 2018
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B. Knoell, AEC chair: there is a need to use an appropriate mixture of qualification methodologies:
●Stress Test per AEC-Q Specs. ●Step-stress testing. ● Application-Specific tests.●Physics-of-Failure approaches. ●Sequential Stress Tests. ●Board Level Reliability.
A. Aal, Volkswagen: reliability issues should be resolved by working together with components’ manufacturers. AEC-Q is only one aspect of the total quality management system. Detailed analysis of QA of manufacturing process. 30-50% of failures were due to material/process changes (notification process). Multi-mode stresses, rather than operation hours kill lifetime. Assembly affects parameters of thin dielectric ICs.
Using AEC-Q Components for Space
To be presented by A.Teverovsky at the NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop, Greenbelt, MD, June 2018
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Automotive industry does not use AEC-Q parts without substantial additional testing and analysis working with OCMs.
Car manufacturers have significant leverage, but require high reliability for low price.
Space community might not have a similar leverage, but we do not have cost as a priority.
We can benefit from AEC-Q by using compliant part as a baseline and developing a knowledge-based system for parts’ selection, S&Q.
Why CPTCs?
To be presented by A.Teverovsky at the NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop, Greenbelt, MD, June 2018
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Major benefits: Better volumetric efficiency (smaller case sizes); Higher operating voltages (up to 125V); Lower ESR (milliohm range); A relatively safe failure mode (no ignition). CPTCs are less likely to fail short circuit and are more likely to pass life testing
per MIL-PRF-55365 compared to MnO2 COTS capacitors.
Major drawbacks: Effect of environments: both, excessive and insufficient amount of moisture
might be detrimental; vacuum can be a benefit or a hazard. The core element of S&Q for MnO2 capacitors, WGT, is not applicable. ESR might degrade with time at high temperatures (HTS testing for QA). New phenomena: anomalous transients.
Substantial efforts have been made to demonstrate compliance of CPTCs with AEC-Q200. Currently: Tstorage up to 150ºC and 85ºC/85% RH/1000hr biased.
Breakdown in MnO2
capacitors
What are CPTCs?
To be presented by A.Teverovsky at the NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop, Greenbelt, MD, June 2018
10 No significant differences in design except for cathode materials.
Lead frame
MnO2
MnO2
Ta
Lead frame
carbon
PEDOT:PSS
Ag paint
polymer
Ta2O5
Nardes et.al 2008
Specific of CPTCs: ESR Degradation
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Contrary to MnO2, CPTCs might degrade substantially during HTS. Can compliance to AEC-Q200 guarantee end-of-life ESR values?
0
50
100
150
200
250
300
0 200 400 600 800 1000
ESR
, mO
hm
time, hr
HTS 150C CWR29FC686KBGA, DC0703, ESR_max=275 mohm
1.E+1
1.E+2
1.E+3
1.E+4
0 4000 8000 12000
ESR,
moh
m
time, hr
HTS125
CPTC-1
CPTC-2
1.E+1
1.E+2
1.E+3
1.E+4
0 4000 8000 12000
ESR,
moh
m
time, hr
HTS100
CPTC-1
CPTC-2
MnO2 polymer
0
20
40
60
80
100
120
0 200 400 600 800 1000
ESR
, moh
m
time, hr
220uF 10V Mfr.B at 85C 85%RH
0
20
40
60
80
100
120
140
0 200 400 600 800 1000
ESR,
moh
m
time, hr
85C 85% RH
CPTC-G2
CPTC-G3
Mfr.
m
argi
nde
sign
er
mar
gin
Modeling of ESR Degradation
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Simulations allow for the end-of-life predictions. More complex models might be necessary for lots having
different degradation inception times.
Approximations: ( )τtESRESR exp0 ×=
−−=
β
ηττ exp1)(P
Polymer Ta 10uF 25V at HTS
tau, hr
cumula
tive p
robab
ility, %
10 1000000100 1000 10000 1000001
5
10
50
90
99
use level55C
100C125C
150C175C
5000hr
990hr
300hr
150hr
1.E+1
1.E+2
1.E+3
1.E+4
1.E+5
0 1000 2000 3000 4000 5000
ESR
, moh
m
time, hr
Polymer Ta 10uF 25V at HTS100C125C150C175C
τ =
To be presented by A.Teverovsky at the NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop, Greenbelt, MD, June 2018
Ea = 0.72eV
𝜏𝜏 = 𝜏𝜏0 × 𝑒𝑒𝑒𝑒𝑒𝑒 �𝐸𝐸𝑎𝑎𝑘𝑘𝑘𝑘
Mechanism of ESR Degradation
To be presented by A.Teverovsky at the NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop, Greenbelt, MD, June 2018
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ESR degradation is due to thermo-oxidative processes in conductive polymers → better stability in vacuum.Contrary to MnO2 capacitors, cracks in CPTCs are more likely to
cause ESR failures. Quality of packaging is critical for reduction of ESR degradation. Parts manufactured to AEC-Q200 have a better packaging control.
CPTCs after HTSDiscoloration of MC indicates the pass
of O2 causing decomposition.Oxygen penetrates along the lead
frame-MC interface.Parts with less decomposition around
Ta slug have less degradation.Cracks accelerate ESR degradation.
crack
Decomposition of MC
Specific of CPTCs: Life Testing
To be presented by A.Teverovsky at the NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop, Greenbelt, MD, June 2018
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Reliability of CPTCs during life testing is comparable or better than for MnO2 parts.
Contrary to MnO2 caps that might fail short circuit, CPTCs are more likely to cause current spiking (not addressed by the existing S&Q).
1.E-07
1.E-06
1.E-05
1.E-04
1.E-2 1.E-1 1.E+0 1.E+1 1.E+2
curre
nt, A
time, hr
220uF 16V HALT at 165C, VR
1.E-07
1.E-06
1.E-05
1.E-04
0.01 0.1 1 10 100
curre
nt, A
time, hr
33uF 25V HALT at 165C, VR
1.E-07
1.E-06
1.E-05
1.E-04
0.01 0.1 1 10 100
curre
nt, A
time, hr
22uF 35V HALT at 165C, VR
No short circuit failures during step stress life test up to 165 ºC
0.E+0
1.E-6
2.E-6
3.E-6
4.E-6
5.E-6
0 50 100 150 200
curre
nt, A
time, hr
33uF 35V at 85C 35V
1.E-7
1.E-6
1.E-5
0 200 400 600 800 1000
curre
nt, A
time, hr
100uF 20V at 125C 20V
0.0E+0
5.0E-7
1.0E-6
1.5E-6
2.0E-6
0 20 40 60 80 100
curr
ent,
A
time, hr
68uF 10V at 85C, 10V
Spiking of the current that might cause noise generation
Specifics of CPTCs: Anomalous Transients
To be presented by A.Teverovsky at the NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop, Greenbelt, MD, June 2018
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0
5
10
15
20
25
30
35
0
0.5
1
1.5
2
2.5
3
0 0.2 0.4 0.6 0.8 1cu
rren
t, A
curr
ent,
A
time, msec
100uF 10V
HUMBAKE SN2BAKE SN3
1.E-8
1.E-7
1.E-6
1.E-5
1.E-4
10 100 1000cu
rren
t, A
time, sec
33uF 35V CPTC-1
240hr 125C240hr 85-85virg
1.E-9
1.E-8
1.E-7
1.E-6
1.E-5
1.E-4
1.E-3
1.E-2
-80 -60 -40 -20 0 20 40 60 80 100 120 140
curr
ent@
1000
s, A
temperature, deg.C
22uF 25V
HUM
virgin
BAKE
0.3eV
1.E-9
1.E-8
1.E-7
1.E-6
1.E-5
1.E-4
1.E-3
0.0025 0.003 0.0035 0.004 0.0045 0.005
curr
ent,
A
1/T, 1/K
CPTC 10uF 35V
1wk 125C1wk 85-85virgin
Preconditioning affects transient currents from milliseconds to hours. Behavior of CPTCs with moisture is similar to MnO2 caps. At RT dry CPTCs might have currents >103 times greater than humidified caps. Contrary to MnO2 capacitors, leakage currents at low
temperatures in dry CPTCs might increase up to 106 times.
Effect of Vacuum
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0.0001
0.001
0.01
0.1
1
-55 -25 5 35 65 95 125
curre
nt, A
temperature, deg.C
22uF 35V
10 msec
1 sec
1.E-4
1.E-3
1.E-2
1.E-1
1.E+0
0.001 0.01 0.1 1 10
curre
nt, A
time, sec
33uF 25V -55C -45C-35C -25C-15C -5C+5C +20C+35C +45C+55C +65C+85C +105C+125C
1.E-5
1.E-4
1.E-3
1.E-2
1.E-1
1.E+0
0.01 0.1 1 10 100
curre
nt, m
A
time, min
33uF 25V
+20C, init100hr at 20C350hr 20C, 260hr 85C400hr 20C, 700hr 85C
1.E-5
1.E-4
1.E-3
1.E-2
1.E-1
1.E+0
0.01 0.1 1 10 100
curre
nt, m
A
time, min
150uF 10V in vacuum
init100hr at 20C350hr 20C, 260hr 85C400hr 20C, 700hr 85C
1.E-4
1.E-3
1.E-2
1.E-1
1.E+0
0.01 0.1 1 10 100
curr
ent,
mA
time, min
150uF 10V, 2000hr in vac
-50C -35C-20C 0C 20C 35C 50C 85C
Anomalous transients appear with time in vacuum. Inverse temperature dependence of leakage currents.
Short- and long-term transients might have different mechanisms.
Anomalies in AC Characteristics
To be presented by A.Teverovsky at the NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop, Greenbelt, MD, June 2018
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25
30
35
40
45
50
0 5 10 15 20 25 30 35 40
capa
cita
nce@
1kHz
, uF
voltage, V
CPTC-1 33uF 35V
240hr 125C
240hr 85-85
0
0.5
1
1.5
2
2.5
0 5 10 15 20 25 30 35 40
ESR@
1kHz
, oh
mvoltage, V
CPTC-1 33uF 35V
240hr 125C
240hr 85-85
0.1
1
10
100
1 10 100 1000
DF, %
time, sec
CPTCs after vacuum storage
33uF 25V330uF 6.3V220uF 16V
y = 58.031x-0.62
0.1
1
10
100
1 10 100 1000
DF, %
time, sec
10uF 35V after bake
CPTC-9, 0VCPTC-9, 35VCPTC-4, 35VCPTC-4, 0V
Similar to MnO2 caps, wet CPTCs have stable AC characteristics.C, ESR, and DF are increasing with voltage in dry CPTCs. DF in CPTCs after drying can increase well above 10% and then decrease gradually with time.
Anomalous Transients: Effect of Part Type
To be presented by A.Teverovsky at the NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop, Greenbelt, MD, June 2018
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00.5
11.5
22.5
33.5
44.5
5
0 0.2 0.4 0.6 0.8 1
curre
nt, A
time, msec
CPTC after 2000hr in vacuum
220uF 16V 33uF 25V330uF 6.3V 10uF 35V22uF 35V
0.2eV
1.E-9
1.E-8
1.E-7
1.E-6
1.E-5
1.E-4
0.0025 0.003 0.0035 0.004 0.0045
curre
nt, A
1/T, 1/K
10uF 35V after 150hr at 125C
modified
standard
Different part types have substantially different levels of transient currents.
Currently, no specific tests evaluate the level of transients. Modification of polymers can practically eliminate anomalies in
behavior of CPTCs.
Conclusions and Future Work
19To be presented by A.Teverovsky at the NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop, Greenbelt, MD, June 2018
To use CPTCs that are compliant with AEC-Q200 for space:Designers should be aware of possible degradation and
anomalies in the parts and determine acceptable levels.The level of degradation, current spiking and anomalous
transients is limited by adequate S&Q procedures.Voltage derating should be 50% instead of 80% suggested by
manufacturers. Future work on CPTCs: Kinetics of moisture sorption and desorption at different temperatures; Modeling of ESR degradation; Effect of long-term exposure to vacuum and HTS on current spiking and
anomalous transients; Radiation hardness. Guidelines for applications and parts’ selection.