Multi-Chip Module/High Density Interconnect PCB …...Multi-Chip Module/High Density Interconnect...

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Bruker ContourSP Multi-Chip Module/High Density Interconnect PCB Substrate High Volume Inspection for Process Monitoring 1

Transcript of Multi-Chip Module/High Density Interconnect PCB …...Multi-Chip Module/High Density Interconnect...

Page 1: Multi-Chip Module/High Density Interconnect PCB …...Multi-Chip Module/High Density Interconnect PCB Substrate High Volume Inspection for Process Monitoring 1 Overview • Introductions

Bruker ContourSP Multi-Chip Module/High Density Interconnect PCB Substrate High Volume Inspection for Process Monitoring

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Overview

• Introductions

• Multichip Module High Volume Inspection • Industry Problem: Smaller features, higher density – yield challenge • Bruker Solution: ContourSP for substrate panel metrology • Example Applications: Provide some examples of features, metrology

• Summary/Q&A

3/26/2014 2 Bruker Confidential

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Introductions Bruker Nano Surfaces Division

3/26/2014 3 Bruker Confidential

• Scanning Probe

Microscopy • 3D Optical Microscopy • Stylus Profilometry

• Tribology and Mechanical Testing

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Introductions Bruker Stylus and Optical Metrology

3/26/2014 4 Bruker Confidential

• Technology Leadership • 60+ Patents • 3 R&D 100 Awards • 6 Photonics Circle of Excellence

Awards

• Manufacturing Excellence

• Lean, six sigma-based process • >100 systems/quarter capacity • Rapid production ramp capability

Bruker NSD SOM is part of Bruker Materials (BMAT), a division of Bruker

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Introductions Speaker

Matt Novak, Ph.D. Director, Technology and Applications Stylus and Optical Metrology

• Joined Bruker 2011 (3 years)

• Industry experience (17 years) optical engineering, fabrication and metrology

• Earned Ph.D. while working in private sector metrology capital equipment (instrument design/assembly/test)

3/26/2014 5 Bruker Confidential

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• People interested in fast, non-contact metrology to quantify production quality of relevant features for PCB substrate manufacture

• Those unfamiliar with PCB substrate/multi-chip modules will have gain a basic understanding of this technique for saving space and also how Bruker’s ContourSP can help in their production

• Those looking for metrology to monitor changes in surface topography from nm to µm scales with accuracy and repeatability for other process monitoring will see a specific example for a market area with common needs

Who Will Benefit? Intended Webinar Audience

3/26/2014 6 Bruker Confidential

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What is a PCB?

• A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive trace, pads and other features etched from copper sheets laminated onto a non-conductive dielectric

3/26/2014 7 Bruker Confidential

PCB

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PCB vs. Substrate

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Substrate is the interface between PCB and IC Chip, the most advanced technology among PCB industry

Bruker SP systems only sold to Substrate Manufacturer

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Types of PCB

• Conventional PCB • Single Sided • Double Sided • Multilayers

• HDI PCB

• Rigid–Flex PCB

3/26/2014 9 Bruker Confidential

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HDI (High Density Interconnector)

• HDI PCB is defined as a PCB with a higher wiring density per unit area than conventional PCB.

• HDI PCB has finer lines and spaces, is made through Micro Via (< 150um diameter) and buried vias, sequential lamination with insulation materials and conductor wiring for higher density of routing

3/26/2014 10 Bruker Confidential

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3/26/2014 11 Bruker Confidential

HDI – MCM Advanced substrate technology enables MCM

High Density Interconnect, Multi-Chip Modules are… • Multiple chips, dies, discrete elements • All on one substrate, attached to PCB

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Challenge: Smaller means High Density Increased Demands on Metrology Tools

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Convergence / Integration • Mobile Ubiquity • Higher Quality Display, U/I • Cost / yielded Product

Metrology Capability • Smaller/denser features • Thinner boards • Expanding range of

measurements, GR&R

Cost / Measured Panel • Higher Throughput • Max. Up-time MTBF • Minimum recipe/

deployment time • Maximize operator efficiency

Higher I/O Density • Thermal Management • Z-axis constraints • Cost / yielded Part

Smaller/Higher Density Features • Greater complexity (more layers, fiber

reinforcement, etc) • Increasingly thin • Increased Cost / yielded

bumped, singulated board

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Trend Towards Finer Features Increased Value/Chip – Drives Metrology Demand

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Semi Growth forecast: CAGR of 4.1 per cent from 2011-2016, reaching $368 billion in 2016 (IDC Jan 13).

IC Knowledge 2012

Trend to larger wafers, finer features Value/chip increases due to finer scale Cost of scrap increases – pushes demand for metrology

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3/26/2014 14 Bruker Confidential

MultiTrace Surface Anchor

Pad Clearance

Auto Alignment & CD

Overlay

Complex Via

Circle Connect

Trace

Defects and CD Variations of Any Layer Can Decrease Performance, Lower Yields, and Increase End of Line Scrap and Product Cost

ContourSP HDI PCB Substrate Metrology Comprehensive High Volume HDI/MCM Substrate Analysis

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26 March 2014 15 Bruker Confidential

Trace Analysis

• Width, height, and spacing of traces on a flat substrate

• Needle density calculations (similar to anchor calculations)

Ra Surface Roughness

• Accurate & repeatable 3D Ra • Inner-Core, build-up, Dielectric

and other important process layers

ContourSP HDI PCB Substrate Metrology Comprehensive High Volume HDI/MCM Substrate Analysis

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Surface Anchor Ra Analysis

• Number of anchor regions • Area of each region • Anchor region depth • Anchor volume

Overlay Analysis

• Measure relative concentricity to detect shifts in layer alignment

• 3D analysis used to avoid focus variation problems

Bruker Confidential

ContourSP HDI PCB Substrate Metrology Comprehensive High Volume HDI/MCM Substrate Analysis

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• Finds and measure center and diameter of circular features

• Measure lines extending from or connecting circles

Advanced VIA Analysis

• Depth, top and bottom diameter • Roughness of anchor & via regions • Dynamic Signal Segmentation for

accuracy in Presence of Fiber Layers

Circle Connect Analysis

Bruker Confidential

ContourSP HDI PCB Substrate Metrology Comprehensive High Volume HDI/MCM Substrate Analysis

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Auto Alignment & Critical Dimension Analysis

• Easy set-up of a large variety of fiducials for automated alignment

• Optional s/w ensures fast, accurate location of desired features

• Calculates the gap (clearance) between the edge pads and the closest panel feature

Pad Clearance Analysis

Bruker Confidential

ContourSP HDI PCB Substrate Metrology Comprehensive High Volume HDI/MCM Substrate Analysis

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• Dimensions and heights of mask, pads and substrate within the mask

• Displays the relative heights of all features the x and y dimensions or diameter of the mask and pad features

Panel Recess (Dimple) Analysis

• Measurement of “dimples” on the central features

• Depth of recess of the dimple • Thickness of the pad on which the

dimple is located

Solder Mask & Opening Analysis

Bruker Confidential

ContourSP HDI PCB Substrate Metrology Comprehensive High Volume HDI/MCM Substrate Analysis

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• Patent-pending method uses enhanced signal from interferometry

• Separates out Signals from • Substrate

• Fiber Layer

• Bottom Beneath the Fibers

• Calculates • Shelf Depth

• Shelf Width

• Bottom Diameter

• Length of Residual Fiber

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Provides Most Accurate Bottom VIA Diameter and Residual Fiber Length Analysis For Re-enforced PCB Substrates

Dynamic Signal Segmentation

Bruker Confidential

Dynamic Signal Segmentation Bruker’s Fiber Reinforced Via Metrology Solution

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• Streamlined, Easy to Use Software Interface

• 64 bit multi-core processing • Enhanced Ease of Use and

Stage Automation Creation • Recipe Copy Exact on EVERY

Tool • Fastest set up of Panel

Automation • Overall enhanced system for

most efficient operation 3/26/2014 21 Bruker Confidential

with Vision64®

ContourSP HDI PCB Substrate Metrology High Efficiency, Streamlined Next Generation Metrology

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ContourSP HDI PCB Substrate Metrology Interface Display Key Features

3/26/2014 22 Bruker Confidential

Live video

PanelCam View

Color Coded Pass Fail Log Result

Database

Active Gallery

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ContourSP Performance Critical Panel Metrology Specifications – Features + Uptime

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with Vision64®

Performance Metric ContourSP Spec E-MCBF Availability (supplier dependent uptime) [Per SEMI E10]

3000 > 98%

P/T Repeatability P/T Reproducibility

<20% <30%

Min Trace Width Min Trace Height Min Trace Spacing

5 µm +/- 2 µm 10 µm +/- 3 µm 5 µm +/- 2 µm

Cu Roughness ABF Roughness Solder Roughness

200 nm +/- 50 nm 300 nm +/- 50 nm 60 nm +/- 20 nm

Min Alignment <dX, dY> < 20 µm Min Via Top Diameter Min Via Depth Max Via Recess

30 µm +/- 5 µm 20 µm +/- 6 µm 10 µm

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ContourSP Performance Critical Panel Metrology Specifications – Throughput

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Committed Performance (82 Total Scans)

ContourSP Spec

Default Recipe Measure 13 Unit per Side: A. Five features per unit 1. Trace 2. Cu Roughness 3. Solder Resist Openings 4. Via Recess 5. Via Depth B. Sixteen (16) Alignment Coupons C. One notch ID vision measurement

TPT < 30 minutes (2 Panel Sides Per Hour Runrate for Default Recipe) 200% faster than previous generations!

with Vision64®

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ContourSP Performance Further Feature and Differential Capabilities

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• Able to Measure Panels with Warp up to 6 mm • Automated Notch ID read for Panel Identification

(Option) • Advanced custom fixture designs

• Over 20 years experience developing optimized fixture solutions for customer’s specific requirements

• Latest custom design delivers >5X improvement on feature GR&R

• Integrated ESD protection

with Vision64®

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Value to Business ContourSP and Applications

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High pin count DSP’s, Network Processors and Micro Processors Packaging / Assy Houses Substrate Providers Intel Renessas Amkor NanYa AMD , IBM Sharp Stats ChipPAC Unimicron Texas Instruments Fujitsu ASE Ibiden Freescale STM Shinko Cavium Networks Infineon AT&S Apple, Qualcomm NXP SPIL Nvidia, Broadcom Samsung TSMC

ContourSP Applications • Measurement of HDI / MCM PCB substrates for features and surface characterization

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Bruker BNS – SOM BU Worldwide Presence - World Class Support

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Bruker Corporation Headquarters

BNS Mfg. Santa Barbara

BNS Mfg. Tucson

BNS Singapore

BNS Hsinchu BNS

Bangkok

BNS Penang

BNS Shanghai

BNS Beijing

BNS Palaiseau

BNS Cambridge

BNS Karlsruhe

BNS Malvern

BNS Mfg. Campbell

BNS India BNS

Brasil

Bruker Confidential

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3/26/2014 28 Bruker Confidential

ContourSP Summary + Q&A Comprehensive Metrology for HVM HDI/MCM PCB Substrates

with Vision64®

• Moore’s law + advanced packaging enabling higher density / higher functionality System On Chip (SoC) IC’s

• In-line HDI/MCM PCB substrate metrology critical to ensure functionality and performance of high-value products

• Bruker’s 5th generation ContourSP provides… • Comprehensive portfolio of HDI/MCM PCB substrate

measurement and analysis capability in Vision software

• Highly accurate, gage-capable measurement performance with new vibration tolerant design

• Bruker’s global sales, service and support network as a key value to users offered in this market

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Questions?

[email protected] [email protected]

3/26/2014 29 Bruker Confidential

mailto:[email protected]
mailto:[email protected]
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© Copyright Bruker Corporation. All rights reserved.

www.bruker.com

3/26/2014 30 Bruker Confidential


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