Lec3 Semiconductor physics

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Lecture7 Semiconductor physics V Carrier Transport Phenomenon 1

Transcript of Lec3 Semiconductor physics

Page 1: Lec3 Semiconductor physics

Lecture7

Semiconductor physics VCarrier Transport Phenomenon

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Carrier Transport The net flow of the electrons and holes in a semiconductor

will generate currents.

Transport:The process by which these charged particles move

Three transport mechanisms

Thermal Motion: the movement of charge due to temperature gradients. It decreases with technology scaling.

Carrier drift(漂移电流): the movement of charge due to electric fields

Carrier diffusion(扩散电流): the flow of charge due to density gradients

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Thermal Motion

In thermal equilibrium, carriers are not sitting still:

Undergo collisions with vibrating Si atoms (Brownian motion)

Electrostatically interact with each other and with ionized

(charged) dopants

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Characteristic time constant of thermal motion:

⇒ mean free time between collisions

≡ collision time [s]

In between collisions, carriers acquire high

velocity: vth ≡ thermal velocity [cms−1 ]

c

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Characteristic length of thermal motion:

λ ≡ mean free path [cm]

th cv

Put numbers for Si at room temperature:

1310 sc

7 -110 cmsthv

For reference, state-of-the-art production MOSFET:

⇒ Carriers undergo many collisions as they travel through

devices

0.01μm

0.1μmgL

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Carrier Drift Apply electric field to semiconductor:

E ≡electric field [V cm-1]

⇒ net force on carrier

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Between collisions, carriers

accelerate in the direction of the

electrostatic field:

Newton's laws of motion-Second law

a- acceleration rate; m-mass of the body

,n p

qEv t a t t

m

F qE

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But there is (on the average) a collision every

and the velocity is randomized: c

The average net velocity in direction of the field:

This is called drift velocity [cm s-1]

, ,2 2

cd c

n p n p

qqEv v E

m m

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Define the mobility of electrons or holes:

2 -1 -1

,

,

mobility[cm V s ]2

cn p

n p

q

m

d

d

for electrons

for holes

n n

p p

v E

v E

I L

1 1 1

:the mobility due to the ionized impurity

scattering process.

:the mobility due to the lattice scattering

process.

I

L

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Mobility is a measure of ease of carrier drift

• If ↑, longer time between collisions ⇒ ↑

• If ↓, “lighter” particle ⇒ ↑

At room temperature, mobility in Si depends on doping:

c

The total ionized

impurity concentration

in the semiconductor.

3/2

I

I

T

N

I d aN N N

m

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• For low doping level, the mobility is limited by collisions with

lattice. As Temp ->INCREASES; mobility -> DECREASES

3/2

L T

Electron and hole motilities are functions of temperature.

p-typen-type

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Velocity saturation:

The linear relationship between drift velocity and

electric field breaks down when the electric field is high

enough that the drift velocity approaches

-an important phenomenon for accurate

modeling of VLSI devices characteristics .

710 cm/ssatv

• For medium doping and high doping level, mobility

limited by collisions with ionized impurities

• Holes “ heavier” than electrons

– For same doping level, n p

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Fig Carrier drift velocity versus electric field for high-

impurity silicon. germanium, and gallium arsenide.

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Fig Energy-band structure for gallium

arsenide showing the upper valley and

lower valley in the conduction band.

As the E-field increases. the energy of the

electron increases and the electron can be

scattered into the upper valley

In the lower valley, the small effective

mass leads to a large mobility.

The larger effective mass in the upper

valley yields a smaller mobility.

This intervalley transfer mechanism results

in a decreasing average drift velocity of

electrons with electric field, or the

negative differential mobility characteristic.

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Drift Current

Net velocity of charged particles

⇒ electric current:

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p drift pJ qp E

n drift nJ qn E ,for dn p satv v

Drift current denstity carrier drift velocity

carrier concentration

carrier charge

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The total drift current density is obtained by combining the

drift current density of positive carriers and negative carriers.

( )drift p nJ q p n E

It is a form of Ohm’s law

1

( )p nq p n

with the resistivity

σ≡ conductivity [J-1 • cm-1]

ρ≡ resistivity [J • cm]

EJ E

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Fig Electron concentration and conductivity versus

inverse temperature for silicon with Nd=1015 cm -3

At higher T, ni

increases and

begins to dominate

n and conductivity.

In the mid T range,

or extrinsic range,

complete ionization

means the constant

dn N

In the lower T ,

freeze-out begins

to occur, n

decrease with 1/T.

2 exp expgc

i c c

EE En N N N N

kT kT

2

2

02 2

d a d ai

N N N Nn n

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Resistivity is commonly used to specify the doping level

Sheet resistance

1n

d n

L L LR R

Wt qN t W W

1

d n

RqN t

If impurity atoms are

completely ionized

Technology-dependent

1, n-type semiconductor

1, p-type semiconductor

n

d n

p

a p

qN

qN

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Example:

Time to drift through

the length L=0.1 um

Fast!

16 -3

2

16 -3

6

d

d

3 2

Si with =3 10 cm at room temperature

1000cm /V s

0.21Ω cm

3 10 cm

Apply E=1kV/cm

10 cm/s

4 10 A/cm

d

n

n

n th

drift

n n n

drift

n

N

n

v v

EJ qnv qn E E

J

d

10psd

n

Lt

v

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Example:Consider a gallium arsenide sample at T = 300 K with doping

concentrations of Na =0 and Nd = 1016 cm-3. Assume complete

ionization and assume electron and hole mobility are 1350

cm2/v-s and 480 cm2/v-s, respectively.

Calculate the drift current density if the applied electric field is

E = 10V/cm

Since Nd > Na , the semiconductor is n type and the majority carrier electron

concentration is

Solution

The minority carrier hole concentration is

For this extrinsic n-type semiconductor the drift current density is

2

2 16 -310 cm2 2

d a d ai

N N N Nn n

262

4 -3

16

1.8 103.24 10 cm

10

in

n

2136A/cmdrf n p n dJ e n p E e N E

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Homework6

Given that a dose is implanted into

p-type silicon, which a junction depth

of , estimate the sheet resistance of

this n-type layer.

12 210 cmdQ

400nmjx

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Carrier DiffusionDiffusion = particle movement (flux) in response to

concentration gradient

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If the concentration of free

electrons is higher in one part of

the piece of silicon than in another,

then electrons will diffuse from the

regions of high concentration to the

regions of low concentration.

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Elements of diffusion:

• A medium (Si Crystal)

• A gradient of particles (electrons and holes) inside the

medium

• Collisions between particles and medium send

particles off in random directions

– Overall result is to erase gradient

Fick’s first law- Key diffusion relationship

Flux ≡ number of particles crossing a unit area per unit time [cm-2 • s-1]

Diffusion flux - concentration gradient

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The mean-free path of an electron,

that is, the average distance an

electron travels between

collisions is th cnl v

At any given time, one half of

the electrons at x=-l will be

traveling to the right and one

half of the electrons at x=+l will

be traveling to the left.

The diffusion flux

By Taylor expansion

1 1 1

2 2 2n th th thF n l n l n l n l

1 d d

0 02 d d

n th

n nF n l n l

x x

d

dn th

nF l

x

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Dp is diffusion coefficient or diffusivity of holes

Dn is diffusion coefficient or diffusivity of electrons

D measures the ease of carrier diffusion in response to a

concentration gradient: D ↑⇒ Fdiff ↑

D is limited by vibration of lattice atoms and ionized dopants.

The negative sign reflects the fact

that particles diffuse from regions

of high concentration toward

regions of low concentration.

d,for electrons

d

d,for holes

d

n n

p p

nF D

x

pF D

x

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Diffusion Current

p p

dpJ qD

dx n n

dnJ qD

dx

Check signs

Driffusion current destity = charge carrier flux

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Total Current Density

In general, total current can flow by drift and

diffusion separately.

Total current density:

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d

d

d

d

drift diff

n n n n n

drift diff

p p p p p

total n p

nJ J J qn E qD

x

pJ J J qp E qD

x

J J J

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GRADED IMPURITY DISTRIBUTIONHow a nonuniformly doped semiconductor reaches thermal equilibrium

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Induced Electric Field

Fig Energy-band diagram for a

semiconductor in thermal equilibrium with a

nonuniform donor impurity concentration

The doping concentration in n-type material

decreases as x increases.

There will be a diffusion of majority

carrier electrons with positively charged

donor ions left.

The separation of positive and negative

charge induces an electric field which

prevents the diffusion of electrons.

=> Balance

0lnFi F

i

pE E kT

n

Recall

0

ln cc F

NE E kT

n

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The electric potential

The induced electric field for the one-dimensional situation is

defined as

If we assume a quasi-neutrality condition

1

F FiE Ee

dd 1

d d

Fix

EE

x e x

0 exp

ln

dd

d d

F Fii d

d

F Fi

i

dFi

d

E En n N x

kT

N xE E kT

n

N xE kT

x N x x

d1

d

d

x

d

N xkTE

e N x x

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In thermal equilibrium, the net current is zero.

If we assume quasi-neutrality so that

Substitute

e is also denoted as q

d0

dn n x n

nJ en E eD

x

d

0d

d

n n d x n

N xJ e N x E eD

x

d1

d

d

x

d

N xkTE

e N x x

d d10

d d

d d

n d n

d

N x N xkTe N x eD

e N x x x

n

n

D kT

e

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Einstein relation

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pnT

n p

DD kTV

q

In semiconductors

kT/q ≡ thermal voltage VT (25 mV at room temperature)

Einstein relationship D kT

q

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Summary of Key Concepts

Electrons and holes in semiconductors are mobile and charged

–⇒ Carriers of electrical current!

• Drift current: produced by electric field

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• Diffusion current: produced by concentration gradient

• Diffusion and drift currents are sizeable in modern devices

• Carriers move fast in response to fields and gradients

d

d

drift drift

n nJ E Jx

d d

d d

diffusion

n

n pJ

x x