InvenSense ICM20789: High Performance 6-Axis Motion Sensor ... · combo sensors from InvenSense is...

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Transcript of InvenSense ICM20789: High Performance 6-Axis Motion Sensor ... · combo sensors from InvenSense is...

  • COMPLETE TEARDOWN

    WITH:

    • Detailed photos

    • Precise measurements

    • Material analysis

    • Manufacturing process flow

    • Supply chain evaluation

    • Manufacturing cost analysis

    • Estimated sales price

    • Comparison between InvenSense’s previous custom IMUs in the iPhone 7, in the iPhone 6S and the ICM-30630 device

    InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sensor Combo

    Title: InvenSense ICM-

    20789 – 7-Axis Combo

    Pages: 175

    Date: October 2017

    Format: PDF & Excel file

    Price: Full report:

    EUR 3,490

    World’s first ‘7-Axis’ motion tracking device targeting drone applications

    together a 6-axis IMU and a pressure sensor, moving it into droneapplications.

    The ICM-20789 7-axis combo sensor released by InvenSense features a 6-axisdevice, incorporating a 3-axis gyroscope and a 3-axis accelerometer, and abarometric pressure sensor previously developed by Sensirion in the samepackage. Compared with the stand-alone sensor hub, this approach eliminatesa package and minimizes board area requirements.

    The pressure sensor’s MEMS capacitive architecture provides the industry’slowest noise at the lowest power. Combined with the motion-tracking 6-axisinertial sensor in a small footprint, the device is ideal for a wide range ofmotion tracking applications.

    The inertial MEMS sensor is fabricated with a minimal number of masks and isdirectly assembled on the application-specific integrated circuit (ASIC) byeutectic bonding. Using knowledge obtained by acquiring Sensirion’s pressuresensor division, InvenSense was able to design its own pressure sensor. Thedevice is shipped in a 4 mm x 4 mm x 1.37 mm land grid array (LGA) package.

    This report includes a detailed technology and cost analysis of the ICM-207897-axis motion tracking device. A comparison with the previous generation ofcombo sensors from InvenSense is also included in the report.

    Having supplied Apple for many years,InvenSense (TDK) is a leader in the inertialmeasurement unit (IMU) market. It has alarge market share, competing with Boschand others. This year, with the acquisition ofSensirion’s barometric pressure sensordivision, InvenSense has entered a newmarket area. It has now released of its first‘7-axis’ motion tracking combo, bringing

  • TABLE OF CONTENTS

    Overview / Introduction

    Company Profile and Supply Chain

    Physical Analysis

    • Package

    Package views and dimensions, opening and cross-section

    • Pressure Sensor Die

    View, dimensions, and marking Delayering and process Cross-section

    • MEMS Die

    View, dimensions and marking Cap removed Sensing area Cross-sections of the sensor, cap,

    and seal

    • ASIC Die

    View, dimensions, and marking Delayering and process Cross-section

    Manufacturing Process Flow

    • ASIC front-end process and wafer fabrication unit

    • Pressure sensor process flow and wafer fabrication unit

    • MEMS process flow and wafer fabrication unit

    • Packaging process flow and assembly unit

    Cost Analysis

    • Yield hypotheses• Pressure sensor front-end cost• Pressure sensor back-end 0:

    probe test and dicing• Pressure sensor front-end cost

    per process steps• Pressure sensor wafer and die

    cost• ASIC front-end cost• ASIC back-end 0: probe test and

    dicing• ASIC wafer and die cost• MEMS front-end cost• MEMS back-end 0: probe test

    and dicing• MEMS front-end cost per

    process steps• MEMS wafer and die cost• Back-end: packaging cost• Back-end: packaging cost per

    process steps• Back-end: final test cost• IMU component cost

    Estimated Price Analysis

    Comparison with InvenSenseIMU MP-67B, Sensor Hub ICM-30360 and iPhone 7 Plus OIS IMU

    Performed by

    Performed by

    AUTHORS:

    ANALYSIS PERFORMED WITH OUR COSTING TOOLS MEMS COSIM+ AND IC PRICE+

    MEMS CoSim+

    IC Price+

    System Plus Consulting offers

    powerful costing tools to evaluate

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    price from single chip to complex

    structures.

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    Cost simulation tool to evaluate

    the cost of any MEMS process or

    device:

    From single chip to complex

    structures.

    IC Price+

    The tool performs the necessary

    cost simulation of any Integrated

    Circuit: ASICs, microcontrollers,

    DSP, memories, smartpower…

    to set up its laboratory. Hepreviously worked at AtmelNantes Technological AnalysisLaboratory and at HirexEngineering in Toulouse.

    YvonLe Goff (Lab)

    Yvon joined SystemPlus Consulting in 2011

    StéphaneElisabeth

    Stéphane has a deepknowledge of materials

    characterizations and electronicssystems. He holds an EngineeringDegree in Electronics andNumerical Technology, and a PhDin Materials for Micro-electronics.

    previously worked in micro-electronics R&D for CEA/LETI inGrenoble and for STMicro-electronics in Crolles.

    NicolasRadufe (Lab)

    Nicolas is in charge ofphysical analysis. He

  • ANNUAL SUBSCRIPTION OFFER

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    Accelerometer - Compass - Display /Optics - Environment - Fingerprint -Gyroscope - IMU/Combo - Light -Microphone - Oscillator - Pressure sensor

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    3D Packaging - Embedded - SIP - WLP

    More than 60 reports released each year on the following topics (considered for 2017):

    Performed by

    RELATED REPORTS

    6-Axis OIS IMUs: STMicroelectronics LSM6DSM

    6-Axis OIS IMUs: InvenSense IMU in iPhone 7 Plus

    Bosch BME680 Environmental Sensor with Integrated Gas

    Sensor

    STMicroelectronics has releasedthe LSM6DSM, providing a smallerdevice with a footprint of2.5x3mm.

    In the iPhone 7 Plus, Apple uses anew custom version of theInvenSense ICM-20600 in a 3x3mm16-pin package compared to a2.5x3mm 14-pin package.

    The world's first environmentalsensor combining gas, pressure,humidity and temperature sensingfunctions in a 3mm x 3mm footprintpackage.

    Pages: 136Date: December 2016Full report: EUR 3,290*

    Pages: 155Date: December 2016Full report: EUR 3,290*

    Pages: 152Date: July 2017Full report: EUR 3,490*

    Bundle of 2 reports + detailed comparison: EUR 5,500*

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