Introduction to Georgia Tech PRC and Its Industry ... · Prof. Rao R. Tummala Joseph M. Pettit...

Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair

Professor in ECE & MSEDirector, 3D Microsystems Packaging Research Center

Georgia Institute of Technology – Atlanta, GA [email protected]

Introduction to Georgia Tech PRC and Its Industry Consortium in NAE

Greetings from Georgia Tech PRC

1 | Georgia Tech PRC Prof. Rao R. Tummala

GT Seminar in Silicon Valley: Summary

GT PRC was Funded as NSF ERC with a Paradigm in:• Research to SOP• Education to X-disciplinary individual• Industry collaborations; complete supply chain eco-system

It is Setting up a Large-scale Industry Consortium in NAE• 100-person Team with $10M budget

SV Plays the Most Critical Role in NAE GT Can Help SV Companies in 3 Ways:

• Leading-edge R&D beyond 3-5 year horizon• Supply large number of the best-educated students• Provide an accelerated path from R&D to commercialization


Summary of GT Presentations

Agenda• The New Era of Automotive Electronics: The Ultimate

Electronics System – Prof. Rao Tummala • Glass Packaging and 2.5D Glass BGA Interposer for Ultra-high

Bandwidth Computing – Dr. Venky Sundaram• Power Packaging for Computer Applications – Dr. P. M. Raj• 5G Communications with Glass Embedding and Fanout –

Prof. Manos Tentzeris, Dr. Venky Sundaram• Devices and 3D Glass Fanout Package for Next Generation

Radar, Lidar and Camera – Dr. Venky Sundaram • High-power Devices, High-temperature Materials and Packaging

for Electric Cars – Dr. Vanessa Smet, Prof. Shyh-Chiang Shen


Outline

Introduction to Georgia Tech PRC NAE Industry Consortium @GT


Research Focus:

Georgia Tech PRC Mission & Vision

Past Focus SOC

More of Moore

Current Focus 2.5D MCM 3D ICs SIP

MEMSDNA

ImageRF

ProcessorMemory

More Than Moore

Mission:Produce Best System-level and Interdisciplinary Packaging Engineers &

Leading-edge System Technologies to Supply to the Global Industry

Next Focus SOP−SOC−3D ICs with TSV

System MooreLogic

3D Memory

Glass Substrate


IC2µm

Package 80µm400µm

PWBDigitalOptical

RFPower

MEMSSensors

SOP

Why System-on-Package (SOP)?

SYSTEM-ON-PACKAGEConvergent Computing, Communication, Consumer, Automotive and Biomedical

DigitalOptical

RFPower

MEMSSensorsEmbeddedPackage


Education: Inter-disciplinarity of Electronics

IC IC

Power Power Signal

Package

Power Planes

Signals

Electrical SciencesSignal IntegrityPower Integrity

Material SciencesDielectricsConductorsMagneticsEncapsulantsC,L,R, Antennas

Mechanical SciencesThermo-Mechanical

Reliability– Fatique & Creep– Warpage

Heat Transfer

Chemical Sciences Lithographic ProcessesMicrostructure vs.

Properties


GT PRC Started with the 1st NSF ERC in US in System Scaling and Integration to SOP

WA

CA

AZ

CO KS

TN

GASC

FL

VA

MINY

MD

MA

IL

Georgia Inst. of TechnologyPackaging Research Center

Clemson UniversityAdv. Engineering ofFibers & Films

Georgia Inst. of TechnologyCenter for the Engineeringof Living Tissue

Virginia Polytechnic InstitutePower Electronic Systems

MITBiotechnology Process Engineering Center

Johns Hopkins UniversityComputer-Integrated Surgical Systems & Technology

Vanderbilt UniversityBioengineering Educational Technology

Univ. of FloridaParticle Science & Technology

Northeastern UniversitySubsurface Sensing & Imaging Systems

Colorado State Univ.ERC for Extreme UltravioletScience & Technology

Univ. of KansasCenter for Environmentally Beneficial Catalysis

Univ. of MassachusettsCollaborative Adaptive Sensing of the Atmosphere

Univ. of MichiganReconfigurable Manufacturing Systems

Univ. of MichiganWireless Integrated MicroSystems

SUNY BuffaloMultidisciplinary Center for Earthquake Eng. Research

Univ. of IllinoisMid-America Earthquake Center

California Inst. of TechnologyNeuromorphic Systems Engineering

Univ. of Southern CaliforniaIntegrated Media Systems

Univ. of Southern CaliforniaBiomimetic MicroElectronicSystems

UC, BerkeleyPacific EarthquakeEngineering Research Center

Univ. of WashingtonEngineered Biomaterials

Univ. of ArizonaEnvironmentally Benign Semiconductor Manufacturing


Georgia Tech’s Vision of Digital Convergence by 1000X Started in 1993

Digital + Analog + RF + Optical + Sensors

Computing/Internet Digital Audio Digital Imaging/Video Cellular/Wireless GPS/Satellite Sensors And, of course, timekeeping!


Outcomes of Georgia Tech’s NSF ERC & Model

Research & Infrastructure

System Scaling for Smart phones 2000 ground-breaking publications 20 Faculty and 150 grad students 100 Best Paper Awards $40M SOA Laboratories

Education

Interdisciplinary Engineers Ph.D ~600,MS ~570,BS ~340

Created 20 new courses 1st undergrad & 1st Grad. book

Global IndustryCollaborations

150 US, 25 Jap., 10 Eu, 10 Korean 10 Spin-off and spin-in companies 70 Patents, and 166 IP licenses 97 Technology transfers

Funds Raised

Raised $250M for Research $350M to State of Georgia’s

Economy

DisruptiveTechnology:

SystemScaling


Outline

Introduction to Georgia Tech PRC NAE Industry Consortium @GT


3 Main Reasons for NAE

1. Reducing Human Fatalities 94% of 33,000 Deaths in the U.S., and 1.3M globally due to

human error2. Improving Driving – Energy Efficiency3. Improving Human ProductivityMany, many more

Mercedes-Benz F 015 Luxury in Motion Research Car


Evolution and Grand Challenges in New Era of Automotive Electronics (Ford)

MP3 and ConnectivityCruise ControlTelematics Satellite

Flex FuelBattery Vehicles

Hybrid

H2 Fuel Cell

1850 1900 1925 1950 1975 2000 2006 2025

Displays analog LEDs LCDs Flex OLED ???

Software 0(1000) 0(1M) 0(10M) ???

Networks 1 2 4 6 ???

ECUs 1 80 ???

RF AM FM Cellular Sat. 4G ???

Length of wires ~50 meters ~2 kilometers ???

Power ~200 Watts ~2000 Watts ???

Autonomous Driving Collison avoidance ???

NAEGrand

Challenge

Battery lead acid NiMH Li-ion / Li-poly ???


New Era of Automotive Electronicsthe Most Complex Heterogeneous Electronic System

Sensing Electronics Radar LiDAR

Cameras Integrated Radar &

Camera

High-speed & High-power

Electronics with SiGe, SiC and GaN Devices

High-temp Electronics Healthcare

ElectronicsIOTs

Computing & Communications Electronics Wireless Electronics Sensor Electronics Camera Electronics

4G LTE Digital Electronics Power Electronics

NAE: Most Complex Heterogeneous Electronics System


Move to Autonomy is Happening

Adapted from: Dave McNamara, Magna

Auto

mat

ion

/ Ass

ista

nt L

evel

Year1920 1930 1940 1950 1960 1970 1980 1990 2000 2010 2020

Auto timingAutomatic Transmission

Automatic Choke

Cruise Control

Auto-on Lamps

Traction ControlSensing Wipers

Navigation

Break Assist

Lane departure prevention

Park assist Rear traffic alert Drowsiness detection Collison mitigation Blind spot mirror Rear cameras Traffic Jam Assist


ADAS is Highly Heterogeneous System Requiring SOP Concept

Technologies ECU Collision Mitigation ADAS Domain ControlACC

RADAR Brake AssistLIDAR Blind Spot

Ultrasonic Park Assist

Lane AssistCamera Pedestrian Det.- Mono Traffic Sign Rec.- Stereo Auto High Beam- ToF Dynamic Lighting- IR Surround View

Night Vision

Map Data Navigation Source: Strategy AnalyticsV2V/V2X etc. Telematics

2010 2015 2020

Multifunction Camera

Highly Automated Driving Assistance based on fusion of

comprehensive environment information

Sensor Fusion

Courtesy: Dave McNamara, Magna

Highly automated driving by sensor

fusion


SE USA Becoming a Global Automotive Alley

ALMS

TN NC

SC

FL

GA

KY


Georgia Tech's Program in NAE

New Technologies Educated Workforce Global Manufacturing Supply Chain Heterogeneous Integration Roadmaps Standards

Georgia Tech Forming Partnerships with SEMI, IEEE CPMT, IMAPS and iNEMI

~ 50 Global Tier 1, Tier 2 and OEM Companies

&


Progress in Transistor Scaling vs. Package Scaling in the Last 5 Decades

Courtesy: S.S. Iyer, IBM

Nod

e di

men

sion

(nm

)

100

10,000

1,000

0

bump pitch(um

)

100

1,000

10

• High Power>100KW• HPC: Cognitive,

Networking,5G and Beyond

• Self-driving Electronics

Package Scaling (I/O Pitch)

Transistor Scaling (Node)

Year1970 20001980 1990 20101960 2020


Packaging Evolution to Next Paradigm

1970s

Leadframe

1980s

Ceramics

1990s

Build-up Laminate & WLP

Large Panel & High Throughput Packaging Glass Laminate

Wafer Packaging Si Interposer Pkg. Wafer Fan-out


Why Inorganics Such as Glass?

Good Fair Poor

Ideal PropertiesMaterials

Glass SC Si Organic Metal CeramicPoly SiCharacteristic

Electrical

Physical

Thermal

Mechanical

Chemical

TPV and RDL CostReliability

Cost/mm2

High resistivity Low loss and low k Smooth surface finish Large area availability Ultra thin High Conductivity

High strength & modulus Low warpage Resistance to process

chemicals Low cost Via formation

and metallization CTE matched to Si and

PWB At 25µm I/O pitch


Why Inorganic Such as Glass?

Si-Like BEOL to Close Interconnect Gap

Ultra-miniaturized High-temp. Stability Hermetic Reliability Ultra-low loss and Ultra-

high Resistivity Minimum Warpage Excellent Surface

Smoothness High Moisture Resistance Large Panel

Via over Line

Glass(Via and Line Same)


Homogenous Integration Multi-Die SOC

xPU

xPU

xPU

xPU

Interposer

2.5D

Interposer

xPU

DR

AM

Challenges with SOC

32nm 14nm20nm28nm

Yield

Mask CountDefect Density 1/(x^2)

Large SOC

Heterogenous by 3D IC Stack

MEMSDNA

ImageRF

ProcessorMemory

3D SOP Architecture with SOC and 3D ICs

30µm

Logic

3D Memory

Glass Substrate

1µm Cu at 2µm pitch Thermal vias

Optical viasPower vias

IC-Package Strategy from SOC to 2.5D MCM & 3DICs to 3D SOP


GT Paradigm; 3D SOP Architecture

Applications Digital: Cognitive, Cloud, Networking, THz RF 5G and Beyond Power Optical Sensors IOTs Etc.


Georgia Tech Programs in NAE

5G &mm-Wave

RF (WLAN & LTE)

Integrated Voltage

Regulator

2.5DGlass

Interposer

Radar, Camera

with GFO

High-power &

Reliability

High-tempMaterial &Reliability


Georgia Tech Faculty in the Industry Consortium

System Integration

Prof. TummalaTechnology Integration

I&A

Prof. AntoniouSintered Cu

Dr. SmetNon-solder

Passives

Dr. RajRF & Power

Dr. SharmaPassives

Devices: SiGe, GaN, MEMS and Sensors

Prof. ShenGaN

Prof. CresslerSiGe

Prof. DupuisGaN

Prof. HeskethSensors

Materials

Prof. LosegoDielectrics

Prof. WongEncapsulants

Substrates

Dr. SundaramGlass

Dr. LiuRDL

Design

Prof. ChangOptical

Prof. SitaramanMechanical

Prof. SwaminathanPower

Prof. JoshiThermal

Prof. GrahamThermal

Prof. TentzerisRF 5G


Industry Consortia Members from US, Europe, Japan, Korea and Taiwan


Environmental Testing Shared User Labs

Plating Facility Substrate Cleanroom Assembly Facility

300mm Cleanroom Pilot Facility and Labs


Package Foundry

GT Strategy: Close Interconnect Gap With Glass Panel

Lith

ogra

phy

Gap

Pitc

h (µ

m)

50

200

100

020

WaferFoundry

Lithography350 10 1 .1.3

PWB

HDI PWB

BEOL

HDIInterposer


Digital - HPCDigital - MobileRFPower/Analog

Ultimate Promise of Embedding & Fan-outR

elat

ive

Waf

er, P

anel

, PW

B a

nd L

CD

Siz

e (m

m)

Wafer(300mm)

LCD(1000mm)

PWB(600mm)

Panel(400-

500mm)

Lithographic Ground Rule (µm)

120 51050

LargePanel

PWB

SmallPanel

Wafer

Fraunhofer ePFO

AT&S ePFO

Schweizer ePFO

eWFO – OSATs

TDK ePFO

eWFO –TSMC

eWFO –SWIFT

ePFO –OSATs Panel

Samsung ePFO

GT GFO

eWFO –BEOL

EMIB -Intel

Ultra-low

Low

Medium

Relative C

ost

High


GT Seminar in Silicon Valley: Summary

GT PRC was Funded as NSF ERC with a Paradigm in:• Research to SOP• Education to X-disciplinary Individual• Industry collaborations; Complete Supply Chain Eco-system

It is Setting up a Large-scale Industry Consortium in NAE• 100-person Team with $10M budget

SV Plays the Most Critical Role in NAE GT Can Help SV Companies in 3 Ways:

• Leading-edge R&D beyond 3-5 year horizon• Supply large number of the best-educated students• Provide an accelerated path from R&D to commercialization

[email protected]

Thank you

Introduction to Georgia Tech PRC and Its Industry ... · Prof. Rao R. Tummala Joseph M. Pettit...

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